Power conversion device and power supply cabinet

Abstract

The embodiment of the utility model provides a power conversion device and a power supply cabinet comprising the same, and relates to the technical field of energy. The power conversion device is used for performing power conversion on input electric energy and then outputting the electric energy, the power conversion device comprises a device shell, a circuit board, a substrate, a power device, an adapter and an insulating part, and the circuit board is fixed in the device shell; the substrate is located in the device shell and fixed to the circuit board, the substrate comprises a metal layer, an insulating layer and a wiring layer, and the insulating layer is located between the metal layer and the wiring layer; the power device is arranged on the substrate and is connected with the wiring layer; the adapter is connected with the wiring layer and is partially located at the outer side of the substrate, and the part, located at the outer side of the substrate, of the adapter is connected with the circuit board; the adapter penetrates through the insulating part, and the edge, facing the circuit board, of the substrate makes contact with the insulating part.

Description

Technical Field

[0001] This application relates to the field of energy technology, and in particular to a power conversion device and power supply cabinet. Background Technology

[0002] Power devices are the core components in power conversion devices. During the operation of power conversion devices, power devices generate significant heat. Therefore, in related technologies, metal substrates are used to assist in the heat dissipation of power devices. In this case, the power devices are fixed on the trace layer of the metal substrate, and the metal substrate is fixed on the circuit board.

[0003] However, electrical connections between the trace layers of the metal substrate and the circuit board require transition structures (e.g., pins or other metal conductors). The distance between these transition structures and the metal layers of the metal substrate (where an insulating layer separates the metal layers from the trace layers) is often insufficient, creating a risk of electrical continuity. If this continuity occurs, the metal layers of the metal substrate will become charged, potentially causing arcing on the circuit board. Alternatively, other metal structures connected to the metal layers of the metal substrate may also become charged, potentially causing injury if some of these charged metal structures are exposed. Utility Model Content

[0004] This application provides a power conversion device and a power cabinet including the power conversion device, which increases the creepage distance between the adapter structure (for connecting the substrate and the circuit board) and the metal layer of the substrate.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] In a first aspect, this application provides a power conversion device for converting input electrical energy into power and outputting it. The power conversion device includes a device housing, a circuit board, a substrate, a power device, an adapter, and an insulating component. The circuit board is fixed inside the device housing. The substrate is located inside the device housing and fixed to the circuit board. The substrate includes a metal layer, an insulating layer, and a wiring layer, with the insulating layer located between the metal layer and the wiring layer. The power device is disposed on the substrate and connected to the wiring layer. The adapter is connected to the wiring layer and a portion of it is located outside the substrate. The portion of the adapter located outside the substrate is connected to the circuit board. The adapter passes through the insulating component, and the edge of the substrate facing the circuit board contacts the insulating component.

[0007] The power conversion device converts input electrical energy into power through power devices housed within its casing. A trace layer on the substrate houses the power devices, and an adapter electrically connects the trace layer to the circuit board. In other words, the power devices are electrically connected to the circuit board via the trace layer and the adapter. The insulating layer of the substrate separates the trace layer from the metal layer, reducing the possibility of interconnection between traces within the trace layer through the metal layer. The metal layer in the substrate has strong thermal conductivity, allowing heat from the power devices to be transferred outwards, effectively improving heat dissipation.

[0008] In this design, the insulating component is at least partially located between the substrate and the circuit board, with the edge of the substrate near the circuit board contacting the insulating component (i.e., ensuring no gap between the insulating component and the substrate). This increases the creepage distance between the adapter (which can be any suitable adapter structure) and the metal layer, reducing the possibility of conductivity between the adapter and the metal layer of the substrate. Furthermore, in this application, the adapter passes through the insulating component. During the assembly of the power conversion device, the adapter and the insulating component can be assembled first (with the adapter passing through the insulating component), and then the assembled component can be uniformly mounted on the substrate, reducing the complexity of assembling the power conversion device.

[0009] In one embodiment of this application, the insulating member includes a first insulating portion and a second insulating portion. A portion of the second insulating portion is located between the substrate and the circuit board, and another portion of the second insulating portion is located on the side of the substrate facing the power device. The first insulating portion protrudes from the surface of the second insulating portion away from the circuit board and contacts the surface of the substrate facing the power device. The adapter passes through the first insulating portion and the second insulating portion.

[0010] When the first and second insulating portions of the insulating component are connected, they form an L-shaped structure. During the installation of the insulating component, the second insulating portion can contact the edge of the substrate facing the circuit board, while the first insulating portion contacts the surface of the substrate facing the power device. The first and second insulating portions act as two limiting structures, facilitating the installation of the insulating component onto the substrate. If it is necessary to connect the insulating component to the substrate (e.g., adhesive bonding), the insulating component will have a larger area connected to the substrate. For example, the first insulating portion of the insulating component can be fixed to the surface of the substrate facing the power device, and the second insulating portion can be fixed to the edge of the substrate facing the circuit board, thus improving the stability of the insulating component after installation. In addition, the first insulating portion, which wraps around the adapter, also provides some protection for the adapter.

[0011] In one embodiment of this application, the first insulating portion has a groove that is recessed from the surface of the first insulating portion toward the substrate toward the side away from the substrate. The second insulating portion has a through hole, one end of the groove communicates with the through hole, and the other end of the groove passes through the first insulating portion. The adapter passes through the groove and the through hole.

[0012] The groove on the first insulating part can expose the adapter inside the first insulating part, so that the surface of the connector facing the substrate can contact the substrate, which facilitates the connection (e.g., soldering) of the adapter to the trace layer of the substrate.

[0013] In one embodiment of this application, the surface of the adapter facing the substrate is flush with the surface of the first insulating portion facing the substrate.

[0014] The surface of the adapter facing the substrate (that is, the surface used to connect the wiring layer) and the surface of the first insulating part facing the substrate are flush with each other. When the adapter is connected to the wiring layer, the first insulating part can also contact or connect to the substrate. This allows the adapter to be connected to the wiring layer and the first insulating part to contact or connect to the substrate, reducing the possibility of interference between the adapter and the insulating part during installation and facilitating the installation of the adapter and the insulating part.

[0015] In one embodiment of this application, the insulating member further includes a third insulating portion. A portion of the second insulating portion is located on the side of the substrate away from the power device. The third insulating portion protrudes from the surface of the second insulating portion away from the circuit board. The third insulating portion is located on the side of the substrate away from the power device. The edge of the substrate facing the circuit board is located between the first insulating portion and the third insulating portion.

[0016] The edge of the substrate is positioned between the first insulating portion and the third insulating portion, and the second insulating portion is positioned between the substrate and the circuit board. By surrounding the edge of the substrate with the first insulating portion, the second insulating portion, and the third insulating portion, the creepage distance between the adapter and the metal layer is further increased, and the possibility of the adapter and the substrate becoming conductive is reduced.

[0017] In one embodiment of this application, the substrate further includes a plurality of fins, which are fixed to the surface of the metal layer away from the trace layer; the material of the plurality of fins includes metal, and a portion of the second insulating portion is located between the plurality of fins and the circuit board.

[0018] Multiple fins can assist power devices in efficient heat dissipation, improve the heat dissipation capacity of the substrate, and enable the power conversion device to operate stably. For example, after the heat from the power device is transferred to the metal layer, the heat on the metal layer will be transferred to multiple fins. Through heat exchange with the air by multiple fins, the efficiency of the substrate in dissipating heat from the power device is further improved.

[0019] Furthermore, the use of metal fins provides stronger heat dissipation, with multiple fins and metal layers working together to dissipate heat from the power devices, which helps reduce their temperature. Positioning a portion of the insulating component between the fins and the circuit board reduces the possibility of electrical continuity between them and extends the creepage distance between the adapter and the fins, further reducing the likelihood of electrical continuity between the adapter and the substrate.

[0020] In one embodiment of this application, the insulating element abuts against the circuit board.

[0021] Because the substrate contacts (e.g., abuts) the insulating element, the insulating element can support the substrate by abutting against the circuit board, making the substrate more stable when mounted on the circuit board. In addition, it also reduces the possibility of the adapter breaking due to excessive stress.

[0022] In one embodiment of this application, the insulating member further includes a third insulating portion. A portion of the second insulating portion is located on the side of the substrate away from the power device. The third insulating portion protrudes from the surface of the second insulating portion away from the circuit board and is located on the side of the substrate away from the power device. Multiple fins are arranged along the thickness direction of the circuit board. The metal layer faces the edge of the circuit board, the insulating layer faces the edge of the circuit board, the wiring layer faces the edge of the circuit board, and the fin closest to the circuit board among the multiple fins is located between the first insulating portion and the third insulating portion.

[0023] When the substrate includes multiple fins, the insulating member may also include a third insulating portion, such that the first, second, and third insulating portions form a groove-like structure. The substrate is inserted into this groove-like structure, and the portion of the substrate facing the circuit board is surrounded by the first, second, and third insulating portions, increasing the creepage distance between the adapter and the fins, and further increasing the creepage distance between the adapter and the metal layer. The above embodiment illustrates an arrangement of multiple fins.

[0024] In one embodiment of this application, the insulating member further includes a third insulating portion. A portion of the second insulating portion is located on the side of the substrate away from the power device. The third insulating portion protrudes from the surface of the second insulating portion away from the circuit board and is located on the side of the substrate away from the power device. The arrangement direction of the plurality of fins is parallel to the surface of the circuit board. The metal layer facing the edge of the circuit board, the insulating layer facing the edge of the circuit board, the wiring layer facing the edge of the circuit board, and at least one fin facing the edge of the circuit board are all located between the first insulating portion and the third insulating portion.

[0025] The above embodiment shows another arrangement of multiple fins. By surrounding the portion of the substrate facing the circuit board with the first insulating portion, the second insulating portion and the third insulating portion, the creepage distance between the adapter and the fins can be increased, and the possibility of the adapter and the substrate becoming conductive can be reduced.

[0026] In one embodiment of this application, the surface of the insulating member facing the circuit board further includes a plurality of protrusions that pass through the circuit board and are fixedly connected to it.

[0027] The protruding structure passing through the circuit board acts as a limit, reducing the amplitude of substrate movement on the circuit board and further improving the stability of substrate mounting. Furthermore, reduced substrate movement also lowers the risk of the substrate separating from the adapter, as well as the risk of the adapter breaking due to excessive stress.

[0028] In one embodiment of this application, the protruding structure is located on the side of the adapter facing the substrate, and there is a gap between the insulating member and the circuit board.

[0029] The raised structure and the adapter support create a gap between the insulating component and the circuit board, reducing the impact of the insulating component's installation on the circuit board traces and decreasing the likelihood of heat transfer from the substrate to the circuit board. Furthermore, the raised structure is located on the side of the adapter facing the substrate; that is, the raised structure and the adapter are arranged along the thickness direction of the substrate. This provides stable support to the substrate in the thickness direction, and with the gap between the insulating component and the circuit board, it reduces the possibility of the substrate tilting relative to the circuit board and bending the adapter.

[0030] A second aspect of this application provides a power supply cabinet, including a cabinet body and multiple power conversion devices, wherein the multiple power conversion devices are located inside the cabinet body and are connected in parallel.

[0031] A power conversion device is installed inside the cabinet. This device can convert the input electrical energy into power. The insulating component increases the creepage distance between the adapter and the metal layer, reducing the possibility of electrical continuity between the adapter and the metal layer of the substrate. Furthermore, the power cabinet provided in this application includes the aforementioned power conversion device. Therefore, the power cabinet provided in this application and the power conversion device of the above-mentioned technical solutions can solve the same technical problems and have the same technical effects, which will not be elaborated further here. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the structure of a power conversion device provided in an embodiment of this application;

[0033] Figure 2 This application provides a schematic diagram of the structure of a power cabinet according to an embodiment of the present application.

[0034] Figure 3 This is a schematic diagram of the internal structure of a power conversion device provided in an embodiment of this application;

[0035] Figure 4 This is a schematic diagram of the internal structure of another power conversion device provided in an embodiment of this application;

[0036] Figure 5 A schematic diagram of the structure of a substrate provided in an embodiment of this application;

[0037] Figure 6 for Figure 5 A schematic diagram of the structure in the image from the X1 perspective;

[0038] Figure 7 Schematic diagrams illustrating the creepage distance between the adapter and the metal layer in two scenarios provided in this application embodiment;

[0039] Figure 8 This is a schematic diagram of the structure of an insulating component provided in an embodiment of this application;

[0040] Figure 9 This is a schematic diagram of the structure of a groove provided in an embodiment of this application;

[0041] Figure 10 This is a schematic diagram of another insulating component provided in an embodiment of this application;

[0042] Figure 11 This is a schematic diagram of another insulating component provided in an embodiment of this application;

[0043] Figure 12 This is a schematic diagram of another insulating component provided in an embodiment of this application;

[0044] Figure 13 This is a schematic diagram of another substrate structure provided in an embodiment of this application;

[0045] Figure 14 for Figure 13 A schematic diagram of the structure in the image from the X1 perspective;

[0046] Figure 15 This is a schematic diagram of another insulating component provided in an embodiment of this application;

[0047] Figure 16 This is a schematic diagram of another insulating component provided in an embodiment of this application;

[0048] Figure 17 This is a schematic diagram of another substrate structure provided in an embodiment of this application;

[0049] Figure 18 This is a schematic diagram of a protrusion structure provided in an embodiment of this application;

[0050] Figure 19 This is a schematic diagram of a gap structure provided in an embodiment of this application.

[0051] Figure label:

[0052] 100-Power conversion device; 1-Device housing; 2-Circuit board; 3-Substrate; 31-Metal layer; 32-Insulating layer; 33-Way trace layer; 34-Fin; 4-Power device; 5-Adapter; 6-Insulating component; 61-First insulating part; 611-Groove; 62-Second insulating part; 621-Through hole; 63-Third insulating part; 7-Protruding structure; 71-Gap; 200-Power cabinet; 201-Cabinet body; 202-Circuit breaker. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0054] In this application, unless otherwise expressly specified and limited, the terms "upper", "lower", "front", "back", "left", "right", etc., indicating orientation or positional relationship may be defined relative to the orientation of the components schematically placed in the accompanying drawings. These directional terms may be relative concepts, used for relative description and clarification, and may change accordingly depending on the orientation of the components in the accompanying drawings. They should not be construed as limitations on this application.

[0055] In this application, the terms "first," "second," etc., are used for descriptive purposes only to distinguish one element from another, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0056] In this application, unless otherwise expressly stated and limited, "multiple" means two or more.

[0057] Furthermore, in this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or illustration. Any embodiment or design described as "exemplary" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0058] In the accompanying drawings of the embodiments of this application, solid structures such as components and assemblies are represented by guide lines; structures composed of multiple components are represented by guide lines with parentheses or solid arrows; and hollow structures such as openings, holes, spaces, and cavities are represented by guide lines with hollow arrows.

[0059] This application provides a power conversion device 100, which converts input electrical energy into power and outputs it. For example, the power conversion device 100 can convert direct current (DC) to alternating current (AC); or it can convert AC to DC; or it can perform voltage boosting or bucking. The power conversion device 100 can be an inverter, rectifier, on-board charger (OBC), power module (e.g., DC-DC module, AC-DC module) in a charging pile, small charging device, etc. Figure 1 An exemplary structure of a power conversion device 100 is shown, with reference to Figure 1 The power conversion device 100 can be a rectifier.

[0060] In addition, the power conversion device 100 can also be used in the power supply cabinet 200. Figure 2 An exemplary structure of a power cabinet 200 is shown. For example, the power cabinet 200 is a cabinet-type uninterruptible power supply (UPS), wherein the power cabinet 200 includes a cabinet body 201, multiple power conversion devices 100 connected in parallel, and multiple circuit breakers 202, etc. The multiple power conversion devices 100 may include multiple AC-DC modules, or the multiple power conversion devices 100 may include multiple DC-DC modules and multiple AC-DC modules. The multiple power conversion devices 100 are stacked in the cabinet body 201 along the height direction, and the multiple circuit breakers 202 are located above the multiple power conversion devices 100. As another example, the power cabinet 200 can also be a charging pile, with multiple power conversion devices 100 connected in parallel located in the cabinet of the charging pile, and the charging gun is electrically connected to the multiple power conversion devices 100 through cables.

[0061] Figure 3 An exemplary internal structure of a power conversion device 100 is shown, with reference to Figure 3 The power conversion device 100 includes a device housing 1, which can be any housing with a containing function. Furthermore, the power conversion device 100 also includes a circuit board 2, a substrate 3, and a power device 4, all located within the device housing 1. The substrate 3 is fixed to the circuit board 2 via an adapter structure, and the power device 4 is fixed to the substrate 3. For example, the power device 4 can be a surface-mount device soldered to the substrate 3.

[0062] The power conversion device 100 converts input electrical energy into power through an internal power conversion circuit. The power device 4 in the power conversion circuit is mounted on a substrate 3, and other components of the power conversion circuit, such as inductors and capacitors, are mounted on a circuit board 2. Furthermore, the circuit board 2 also contains a control circuit for controlling the power device 4. Therefore, the substrate 3 and the circuit board 2 need to be electrically connected via a connecting structure, for example, referring to… Figure 3 The power conversion device 100 also includes an adapter 5, which is fixed (e.g., soldered) to the substrate 3. The adapter 5 passes through the circuit board 2 and is electrically connected to the circuit board 2, for example, the adapter 5 is soldered to the circuit board 2. The adapter 5 can be any suitable adapter structure. For example, the adapter 5 can be a metal pin, or it can be a conductive metal post. This application does not impose any specific limitations on this.

[0063] After the substrate 3 is mounted on the circuit board 2, the substrate 3 can be at any suitable angle to the circuit board 2. Figure 3 In the illustrated embodiment, the substrate 3 is vertically fixed to the circuit board 2, that is, the substrate 3 is fixed to the circuit board 2 in a vertical mounting manner, and any surface of the substrate 3 is perpendicular to any surface of the circuit board 2 (the "perpendicular" here is not absolute, and an error of ±10° is allowed).

[0064] In some other embodiments, the substrate 3 may also be mounted horizontally on the substrate 3, for example, Figure 4 An exemplary internal structure of another power conversion device 100 is shown, with reference to Figure 4 Any surface of substrate 3 is parallel to any surface of circuit board 2 (parallelism here is not absolute, allowing an error of ±10°). Specifically, in... Figure 4 In the illustrated embodiment, the adapter 5 can be installed with the substrate 3 and the circuit board 2 by means of bending or other methods. This application does not impose specific restrictions on the shape of the adapter 5 (e.g., long strip, bent shape, etc.).

[0065] Figure 5 An exemplary structure of a substrate 3 is shown, wherein, includes Figure 5 All subsequent figures in this application, including those including the one shown, illustrate the example of substrate 3 being vertically fixed on circuit board 2. Figure 5 In the coordinate system, the X-axis, Y-axis and Z-axis are perpendicular to each other, and the Y-axis is parallel to the thickness direction of the substrate 3.

[0066] Figure 6 An example is shown Figure 5 The structure in the image is viewed from the X1 perspective, where X1 is parallel to the X-axis. (See reference...) Figure 6The substrate 3 includes a metal layer 31, an insulating layer 32, and a wiring layer 33. The insulating layer 32 is located between the metal layer 31 and the wiring layer 33. The insulating layer 32 of the substrate 3 can separate the wiring layer 33 and the metal layer 31, reducing the possibility that the wirings in the wiring layer 33 can conduct to each other through the metal layer 31. In some embodiments, the wiring layer 33 is further covered with another insulating material, exposing the portion of the wiring layer 33 used for connecting electronic components or other structures (e.g., solder pads).

[0067] Reference Figure 6 The trace layer 33 on the substrate 3 is used to house the power device 4. For example, the power device 4 is soldered onto a corresponding pad in the trace layer 33. Furthermore, the adapter 5 is also connected to the trace layer 33 of the substrate 3. For example, the adapter 5 is soldered onto a corresponding pad in the trace layer 33. The adapter 5 electrically connects the trace layer 33 to the circuit board 2; that is, the power device 4 is electrically connected to the circuit board 2 through the trace layer 33 and the adapter 5.

[0068] Among them, the metal layer 31 in the substrate 3 has strong thermal conductivity, and the heat of the power device 4 is directly transferred to the outside through the substrate 3, which effectively improves the heat dissipation effect of the power device 4 and reduces the risk of overheating of the power device 4.

[0069] In this application, reference is made to Figure 5 and Figure 6 The power conversion device 100 also includes an insulating member 6, through which the adapter 5 passes, for example, referring to... Figure 5 In some embodiments, multiple adapters 5 and multiple insulating elements 6 are provided, with each adapter 5 passing through one insulating element 6. In other embodiments, multiple adapters 5 and multiple insulating elements 6 are provided, but the number of adapters 5 exceeds the number of insulating elements 6. That is, some adapters 5 each pass through one insulating element 6, while other adapters 5 have no insulating element 6 on their outer side, or some adapters 5 share a single insulating element 6. In still other embodiments, multiple adapters 5 and one insulating element 6 are provided, with multiple adapters 5 passing through the same insulating element 6.

[0070] Among them, reference Figure 5 and Figure 6 A portion of the insulating member 6 is located between the metal layer 31 and the circuit board 2, that is, the insulating member 6 extends to the bottom of the metal layer 31. The edge of the substrate 3 facing the circuit board 2 contacts the insulating member 6, meaning there is no gap between the insulating member 6 and the edge of the substrate 3, or in other words, the substrate 3 abuts against the insulating member 6. This increases the creepage distance between the adapter 5 and the metal layer 31, reducing the possibility of electrical conduction between the adapter 5 and the substrate 3.

[0071] Regarding the creepage distance between adapter 5 and metal layer 31 Figure 7Exemplary creepage paths between the adapter 5 and the metal layer 31 are shown in two cases for comparison. Among them, Figure 7 (a) shows the creepage distance between the adapter 5 and the metal layer 31 without the insulation 6, where the creepage distance is L1; Figure 7 (b) shows the creepage distance between the adapter 5 and the substrate 3 when the insulating member 6 is provided, where the creepage distance is L2+L3. By comparison... Figure 7 (a) and Figure 7 In (b), it can be seen more intuitively that L2+L3>L1, that is, when the power conversion device 100 includes the insulating member 6, the insulating member 6 can increase the creepage distance between the adapter 5 and the metal layer 31.

[0072] Furthermore, by adopting the technical solution of this application, during the assembly of the power conversion device 100, the adapter 5 and the insulating part 6 can be assembled first, that is, the adapter 5 passes through the insulating part 6, and then the assembly of the adapter 5 and the insulating part 6 is mounted on the substrate 3, which reduces the complexity of assembling the power conversion device 100.

[0073] The insulating element 6 can be made of any insulating and suitable material; for example, it can be made of plastic, and this application does not impose any specific limitations on this. Furthermore, the insulating element 6 can also be in any suitable shape, for example, Figure 8 An exemplary structure of an insulating element 6 is shown, with reference to Figure 8 The insulating member 6 includes a first insulating portion 61 and a second insulating portion 62 that are fixedly connected (e.g., integrally connected), wherein the first insulating portion 61 and the second insulating portion 62 of the insulating member 6, when connected, form an L-shaped structure. (Return to reference) Figure 6 The first insulating portion 61 is located on the side of the substrate 3 facing the power device 4, and the first insulating portion 61 contacts the surface of the substrate 3 facing the power device 4. A portion of the second insulating portion 62 is located between the substrate 3 and the circuit board 2, and another portion of the second insulating portion 62 is located on the side of the substrate 3 facing the power device 4. The first insulating portion 61 protrudes from the surface of the second insulating portion 62 away from the surface of the circuit board 2. The adapter 5 passes through the first insulating portion 61 and the second insulating portion 62.

[0074] Reference Figure 6 One end of the adapter 5 extending from the first insulating part 61 is connected to the wiring layer 33 of the substrate 3, and the other end of the adapter 5 extending from the second insulating part 62 is inserted into the circuit board 2.

[0075] During the installation of the insulating component 6, the second insulating portion 62 can contact the edge of the substrate 3 facing the circuit board 2, and the first insulating portion 61 can contact the substrate 3. The first insulating portion 61 and the second insulating portion 62 act as two limiting structures, allowing the insulating component 6 to abut against the substrate 3, facilitating the installation of the insulating component 6. Furthermore, the insulating component 6 will have a larger area connected to the substrate 3. For example, the first insulating portion 61 can be fixed (e.g., bonded) to the surface of the substrate 3 facing the power device 4, and the second insulating portion 62 of the insulating component 6 can be fixed (e.g., bonded) to the edge of the substrate 3 facing the circuit board 2. This improves the stability of the insulating component 6 after installation. In addition, the first insulating portion 61, which wraps around the adapter 5, also provides some protection for the adapter 5.

[0076] In order for the adapter 5 to pass through the insulator 6, the first insulating part 61 has a groove 611. Figure 9 An exemplary structure of a groove 611 is shown. Figure 9 The structure of the middle insulating component 6 and Figure 8 The structure of the middle insulating component 6 is the same. (Refer to...) Figure 8 and Figure 9 The groove 611 is recessed from the surface (B1) of the first insulating portion 61 facing the substrate 3 towards the side away from the substrate 3. Furthermore, the second insulating portion 62 has a through hole 621, and one end of the groove 611 (near the end of the second insulating portion 62) is recessed. Figure 8 D1) is connected to the through hole 621, and the other end of the groove 611 (the end opposite to the second insulating part 62) is connected to the through hole 621. Figure 8 D2) passes through the first insulating part 61, and the through hole 621 and groove 611 allow the adapter 5 to pass through the insulating part 6.

[0077] Reference Figure 9 The internal adapter 5 can be exposed through the groove 611 on the first insulating part 61, so that the adapter 5 can be connected to the substrate 3 (e.g., soldered) on the surface (B2) of the substrate 3, which facilitates the connection of the adapter 5 to the wiring layer 33 on the substrate 3.

[0078] In some embodiments, refer to Figure 9 The surface (B2) of the adapter 5 facing the substrate 3 is flush with the surface (B1) of the first insulating part 61 facing the substrate 3. This surface of the adapter 5 facing the substrate 3 is the same surface on which the adapter 5 connects to the wiring layer 33. Since it is flush with the surface of the first insulating part 61 facing the substrate 3, when the adapter 5 is connected to the wiring layer 33, the first insulating part 61 can also contact or connect to the substrate 3. This allows both the adapter 5 and the wiring layer 33 to connect, and the first insulating part 61 to contact or connect to the substrate 3, reducing the possibility of interference between the adapter 5 and the insulating part 6 during installation and facilitating the installation of both components on the substrate 3.

[0079] The adapter 5 can be connected to the trace layer 33 of the substrate 3 in any suitable manner. For example, the connection between the adapter 5 and the trace layer 33 of the substrate 3 can be achieved using surface mount technology (SMT). The adapter 5 is flush with the surface (B1) of the first insulating portion 61, allowing the adapter 5 to be connected to the substrate 3 using SMT soldering.

[0080] In some embodiments, the widths of the first insulating portion 61 and the second insulating portion 62 may be different, that is, the insulating member 6 may be stepped. For example, refer to Figure 9 In some embodiments, the dimension of the first insulating portion 61 in the X-axis direction is smaller than the dimension of the second insulating portion 62 in the X-axis direction, meaning the second insulating portion 62 is wider. In other embodiments, the dimension of the first insulating portion 61 in the X-axis direction is larger than the dimension of the second insulating portion 62 in the X-axis direction, meaning the first insulating portion 61 is wider. In still other embodiments, the dimension of the first insulating portion 61 in the X-axis direction is equal to the dimension of the second insulating portion 62 in the X-axis direction, meaning the widths of the first insulating portion 61 and the second insulating portion 62 are equal. It should be noted that this application does not impose specific limitations on the dimensions of each part of the insulating member 6.

[0081] In some other embodiments, the insulating element 6 may not be configured in an "L" shape; instead, it may be an insulating block structure, for example, Figure 10 An exemplary diagram shows the structure of another insulating element 6, with reference to Figure 10 The insulating member 6 is located between the substrate 3 and the circuit board 2, with the edge of the substrate 3 facing the circuit board 2 in contact with the insulating member 6. This insulating member 6 also increases the creepage distance between the adapter 5 and the metal layer 31. Figure 10 The other layer structures of substrate 3 besides metal layer 31 (e.g., insulating layer 32 and wiring layer 33, etc.) are not explicitly shown. Other layer structures can be found in [reference needed]. Figure 6 This will not be elaborated upon here. Figure 10 Insulating component 6 and Figure 9 Compared to the insulating component 6 in the middle, it is equivalent to Figure 10 The insulating component 6 in the middle only includes Figure 9 The second insulating part 62 of the middle insulating component 6.

[0082] In some embodiments, the creepage distance between the adapter 5 and the metal layer 31 can be further extended by wrapping the edges of the substrate 3. For example, Figure 11 An exemplary embodiment shows the structure of another insulating element 6, with reference to Figure 11The insulating member 6 also includes a third insulating portion 63. A portion of the second insulating portion 62 is located on the side of the substrate 3 facing away from the power device 4. The third insulating portion 63 is fixedly connected to the second insulating portion 62 (e.g., integrally connected). The third insulating portion 63 protrudes from the surface of the second insulating portion 62 facing away from the circuit board 2. The third insulating portion 63 is located on the side of the substrate 3 facing away from the first insulating portion 61, allowing the substrate 3 to extend between the first insulating portion 61 and the third insulating portion 63. That is, the edges of the metal layer 31, the insulating layer 32, and the trace layer 33 facing the circuit board 2 are all located between the first insulating portion 61 and the third insulating portion 63. By surrounding the edges of the substrate 3 with the first insulating portion 61, the second insulating portion 62, and the third insulating portion 63, the creepage distance between the adapter 5 and the metal layer 31 is further increased.

[0083] In this application, the dimensions of the third insulating part 63 are not specifically limited. The widths of the first insulating part 61, the second insulating part 62 and the third insulating part 63 can be different, or the widths of the first insulating part 61, the second insulating part 62 and the third insulating part 63 can be equal, etc. The dimensions of each part of the insulating member 6 can be designed according to the requirements.

[0084] In some embodiments, multiple adapters 5 are provided, and the multiple adapters 5 pass through the same insulating member 6. For example, the length of the insulating member 6 can be extended so that the multiple adapters 5 pass through the same insulating member 6. Figure 12 An exemplary embodiment shows the structure of another insulating element 6, with reference to Figure 12 The insulating member 6 includes a plurality of first insulating portions 61 and a second insulating portion 62. The plurality of first insulating portions 61 are all located on the side of the substrate 3 facing the power device 4. The second insulating portion 62 is located between the substrate 3 and the circuit board 2. The length direction of the second insulating portion 62 is parallel to the X-axis direction. The plurality of first insulating portions 61 are arranged along the X-axis direction. There is a certain distance between two adjacent first insulating portions 61. Each adapter 5 passes through the corresponding first insulating portion 61, and the plurality of adapters 5 pass through the second insulating portion 62 together.

[0085] Furthermore, when multiple adapters 5 pass through the same insulating member 6, the insulating member 6 may also include a third insulating portion 63, which surrounds the edge of the substrate 3 through the first insulating portion 61, the second insulating portion 62 and the third insulating portion 63 of the insulating member 6.

[0086] In cases where multiple adapters 5 pass through the same insulator 6, the insulator 6 can also be similar. Figure 10 The structure of the middle insulating component 6 only requires that... Figure 10 The insulating element 6 is extended so that multiple adapters 5 can pass through it.

[0087] In some embodiments, the substrate 3 further includes structures to aid heat dissipation, for example... Figure 13 An exemplary structure of another substrate 3 is shown, with reference to Figure 13 The substrate 3 also includes multiple fins 34, in Figure 13 In the illustrated embodiment, multiple fins 34 are arranged along the Z-axis, with a certain distance between adjacent fins 34. Figure 14 An example is shown Figure 13 The structure in the image is viewed from the X1 perspective, see reference. Figure 14 Multiple fins 34 are fixed (welded, bonded, or integrally connected) to the side of the metal layer 31 opposite to the wiring layer 33. These fins 34 assist in the effective heat dissipation of the power device 4, improving the heat dissipation capacity of the substrate 3. That is, after the heat from the power device 4 is transferred to the metal layer 31, the heat on the metal layer 31 is transferred to the multiple fins 34. Through heat exchange between the multiple fins 34 and the air, the efficiency of heat dissipation from the substrate 3 for the power device 4 is further improved.

[0088] exist Figure 14 In the illustrated embodiment, a portion of the insulating member 6 extends between the metal layer 31 and the circuit board 2 to increase the creepage distance between the adapter 5 and the metal layer 31. For example, the insulating member 6 includes a first insulating portion 61 and a second insulating portion 62 fixedly connected, forming an "L"-shaped structure when connected. The first insulating portion 61 is located on the side of the substrate 3 facing the power device 4, a portion of the second insulating portion 62 is located between the metal layer 31 and the circuit board 2, and the adapter 5 passes through the first insulating portion 61 and the second insulating portion 62.

[0089] In some other embodiments, the material of the plurality of fins 34 includes metal. Metal fins 34 have stronger heat dissipation capabilities and, together with the metal layer 31, dissipate heat for the power device 4, effectively reducing the heat of the power device 4. However, metal fins 34 also pose a risk of conductive contact with the adapter 5. Therefore, Figure 15 An exemplary embodiment shows the structure of another insulating element 6, with reference to Figure 15 A portion of the insulating member 6 is located between the plurality of fins 34 and the circuit board 2. That is, by extending the length of the insulating member 6 to the bottom of the plurality of fins 34, for example, the end of the second insulating portion 62 facing away from the adapter 5 is at least flush with the end of the plurality of fins 34 facing away from the metal layer 31. Alternatively, the end of the second insulating portion 62 facing away from the adapter 5 can be located on the side of the plurality of fins 34 facing away from the metal layer 31. By providing the insulating member 6 between the entire substrate 3 and the circuit board 2, the possibility of electrical continuity between the circuit board 2 and the fins 34 is reduced, and the creepage distance between the adapter 5 and the fins 34 is extended, further reducing the possibility of electrical continuity between the adapter 5 and the fins 34.

[0090] When the substrate 3 also includes multiple fins 34, the insulating member 6 may further include a third insulating portion 63, for example... Figure 16 An exemplary embodiment shows the structure of another insulating element 6, with reference to Figure 16 The third insulating portion 63 is fixedly connected to the second insulating portion 62, causing the substrate 3 to extend between the first insulating portion 61 and the third insulating portion 63. Specifically, the edges of the trace layer 33 facing the circuit board 2, the insulating layer 32 facing the circuit board 2, the metal layer 31 facing the circuit board 2, and the fin 34 closest to the circuit board 2 among the multiple fins 34 are all located between the first insulating portion 61 and the third insulating portion 63. By surrounding the portion of the substrate 3 near the circuit board 2 with the first insulating portion 61, the second insulating portion 62, and the third insulating portion 63, the creepage distance between the adapter 5 and the metal layer 31 is further increased.

[0091] in, Figures 13 to 16 The multiple fins 34 are arranged along the Z-axis direction (along the thickness direction of the circuit board 2). In some other embodiments, the multiple fins 34 may also be arranged in other directions, for example, Figure 17 An exemplary structure of another substrate 3 is shown, with reference to Figure 17 Multiple fins 34 are arranged along the X-axis (parallel to the surface of circuit board 2). Figure 17 In the illustrated embodiment, the insulating member 6 includes a first insulating portion 61, a second insulating portion 62, and a third insulating portion 63 fixedly connected. The first insulating portion 61 is located on the side of the substrate 3 facing the power device 4. A portion of the second insulating portion 62 is located between the substrate 3 and the circuit board 2, that is, between the wiring layer 33 and the circuit board 2, between the insulating layer 32 and the circuit board 2, between the metal layer 31 and the circuit board 2, and between at least one fin 34 and the circuit board 2, a portion of the second insulating portion 62 is located. The third insulating portion 63 is located on the side of the plurality of fins 34 away from the metal layer 31. The edge of the substrate 3 facing the circuit board 2 is located between the first insulating portion 61 and the third insulating portion 63. That is, the edge of the wiring layer 33 facing the circuit board 2, the edge of the insulating layer 32 facing the circuit board 2, the edge of the metal layer 31 facing the circuit board 2, and the edge of at least one fin 34 facing the circuit board 2 are all located between the first insulating portion 61 and the third insulating portion 63, thereby increasing the creepage distance between the adapter 5 and the metal layer 31.

[0092] It should be noted that, in Figure 17 In the illustrated embodiment, since the insulating member 6 is shorter in the X-axis direction, there may be only a small number of fins 34 (e.g., only one fin 34) between the first insulating portion 61 and the third insulating portion 63 of each insulating member 6. In other embodiments, the insulating member 6 is longer in the X-axis direction, and there may be more fins 34 between the first insulating portion 61 and the third insulating portion 63 of each insulating member 6.

[0093] In some other embodiments, Figure 17 The substrate 3 and insulating member 6 may not include the third insulating portion 63 (only including the first insulating portion 61 and the second insulating portion 62), or the insulating member 6 may not include the first insulating portion 61 and the third insulating portion 63 (only including the second insulating portion 62, similarly). Figure 10 The insulating component 6 is shown in the figure.

[0094] Furthermore, when the substrate 3 also includes multiple fins 34 (regardless of the arrangement direction of the multiple fins 34), the insulating member 6 can also be used. Figure 10 The insulating element 6 shown in the figure, or the insulating element 6 may also be made of Figure 12 The insulating element 6 is shown in the figure.

[0095] In some embodiments, the surface of the insulating member 6 facing the circuit board 2 further includes a plurality of protrusions 7. Figure 18 An exemplary structure of a protrusion 7 is shown. The protrusion 7 is fixed to the surface of the insulating member 6 facing the circuit board 2. For example, the protrusion 7 is integrally connected or bonded to the insulating member 6, and extends from the insulating member 6 toward the circuit board 2, passing through the circuit board 2. Furthermore, the protrusion 7 can be fixedly connected to the circuit board 2. The protrusion 7 passing through the circuit board 2 serves to limit the movement of the insulating member 6 and the substrate 3, reducing the amplitude of the substrate 3's wobbling on the circuit board 2 and improving the stability of the substrate 3's mounting. Furthermore, the reduced amplitude of the substrate 3's wobbling also reduces the risk of the substrate 3 separating from the adapter 5, and reduces the risk of the adapter 5 breaking due to excessive force.

[0096] Furthermore, the protruding structure 7 can also support the insulating element 6 and the substrate 3, for example, in Figure 18 After rotating the structure by 90° (as an auxiliary reference) Figure 3 (Position of the substrate 3) After the protrusion structure 7 passes through the circuit board 2, it can support the substrate 3 and the insulating component 6, reducing the possibility that the adapter 5 will break due to excessive force, causing the substrate 3 to fall off the circuit board 2.

[0097] The protruding structure 7 can be any suitable structure, such as a columnar or needle-like structure; this application does not impose any specific limitations on this. Furthermore, multiple protruding structures 7 can be provided, or only one protruding structure 7 can be provided; this application does not impose any specific limitations on this. Moreover, the material of the protruding structure 7 can be the same as or different from the material of the insulating member 6; this application does not impose any specific limitations on this.

[0098] In all the above examples, the insulating member 6 abuts against the circuit board 2. That is, the insulating member 6 is sandwiched between the circuit board 2 and the substrate 3. Since the substrate 3 contacts (e.g., abuts against) the insulating member 6, and the insulating member 6 abuts against the circuit board 2, the insulating member 6 can support the substrate 3, so that the substrate 3 can be stably mounted on the circuit board 2. In addition, it can also reduce the possibility of the adapter 5 breaking due to excessive force.

[0099] In some other embodiments, a gap 71 may also exist between the insulating element 6 and the circuit board 2. Figure 19 An exemplary structure for a gap 71 is shown. (Refer to...) Figure 19 Both the raised structure 7 and the adapter 5 are fixedly connected to the circuit board 2 (e.g., soldered). Supported by the raised structure 7 and the adapter 5, a gap 71 is formed between the insulating member 6 and the circuit board 2. By forming a gap 71 between the insulating member 6 and the circuit board 2, the impact of the installation of the insulating member 6 on the wiring of the circuit board 2 is reduced, and the possibility of heat transfer from the substrate 3 to the circuit board 2 is also reduced.

[0100] In order to provide more stable support for the substrate 3, in some embodiments, the protrusion structure 7 is located on the side of the adapter 5 facing the substrate 3. That is, the protrusion structure 7 and the adapter 5 are arranged along the thickness direction of the substrate 3. For example, the protrusion structure 7 and the adapter 5 are arranged along the Y-axis direction, so as to provide stable support for the substrate 3 in the thickness direction of the substrate 3. When there is a gap 71 between the insulating member 6 and the circuit board 2, the possibility of the substrate 3 tilting relative to the circuit board 2 and bending the adapter 5 is reduced.

[0101] It should be noted that, Figure 18 and Figure 19 The power conversion device 100 shown includes two embodiments of the protruding structure 7. Both are based on the insulating member 6 including a first insulating portion 61, a second insulating portion 62, and a third insulating portion 63. In other embodiments, for example, the insulating member 6 adopts... Figure 14 Insulating component 6 and Figure 15 In the case of the insulating member 6, a protruding structure 7 can also be fixed on the insulating member 6, and whether there is a gap 71 between the insulating member 6 and the circuit board 2 can be determined according to requirements. Furthermore, Figure 18 and Figure 19 The power device 4 shown includes two embodiments with protrusion structure 7. Both are based on the substrate 3 including fins 34. In the case where the substrate 3 does not include fins 34, the protrusion structure 7 can also be fixed on the insulating member 6. For example, when the insulating member 6 adopts... Figure 9 Insulating component 6 Figure 10 Insulating component 6 and Figure 11In the case of the insulating member 6, a protruding structure 7 may also be fixed on the insulating member 6, and whether there is a gap 71 between the insulating member 6 and the circuit board 2 can be determined according to the requirements.

[0102] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A power conversion device for converting input electrical energy into power and then outputting it, characterized in that, The power conversion device comprises: a device shell; a circuit board fixed in the device shell; a substrate in the device shell and fixed to the circuit board, the substrate comprising a metal layer, an insulating layer and a wiring layer, the insulating layer being between the metal layer and the wiring layer; a power device arranged on the substrate and connected to the wiring layer; an adapter connected to the wiring layer and partially outside the substrate, the part of the adapter outside the substrate being connected to the circuit board; an insulating piece through which the adapter passes, the edge of the substrate towards the circuit board being in contact with the insulating piece.

2. The power conversion device of claim 1, wherein, The insulating piece comprises a first insulating part and a second insulating part, a part of the second insulating part being between the substrate and the circuit board, the second insulating part also having a part on the side of the substrate facing the power device, the first insulating part protruding from the surface of the second insulating part away from the circuit board and contacting the surface of the substrate facing the power device, the adapter passing through the first insulating part and the second insulating part.

3. The power conversion device of claim 2, wherein, The first insulating part has a groove recessed from the surface of the first insulating part towards the side away from the substrate, the second insulating part has a through hole, one end of the groove is in communication with the through hole, the other end of the groove penetrates the first insulating part, and the adapter passes through the groove and the through hole.

4. The power conversion device of claim 2, wherein, The insulating piece further comprises a third insulating part, the second insulating part also has a part on the side of the substrate away from the power device, the third insulating part protrudes from the surface of the second insulating part away from the circuit board, the third insulating part is on the side of the substrate away from the power device, and the edge of the substrate towards the circuit board is between the first insulating part and the third insulating part.

5. The power conversion device according to claim 2 or 3, characterized by The substrate further comprises a plurality of fins fixed to the surface of the metal layer away from the wiring layer; The material of the plurality of fins comprises metal, and the second insulating part also has a part between the plurality of fins and the circuit board.

6. The power conversion device of claim 5, wherein, The insulating piece further comprises a third insulating part, the second insulating part also has a part on the side of the substrate away from the power device, the third insulating part protrudes from the surface of the second insulating part away from the circuit board, and the third insulating part is on the side of the substrate away from the power device; The plurality of fins are arranged along the thickness direction of the circuit board, the edge of the metal layer towards the circuit board, the edge of the insulating layer towards the circuit board, the edge of the wiring layer towards the circuit board, and the fin closest to the circuit board among the plurality of fins are all between the first insulating part and the third insulating part.

7. The power conversion device of claim 5, wherein, The insulating piece further comprises a third insulating part, the second insulating part also has a part on the side of the substrate away from the power device, the third insulating part protrudes from the surface of the second insulating part away from the circuit board, and the third insulating part is on the side of the substrate away from the power device; The arrangement direction of the plurality of fins is parallel to the board surface of the circuit board, the metal layer is towards the edge of the circuit board, the insulating layer is towards the edge of the circuit board, the trace layer is towards the edge of the circuit board, and at least one of the fins is towards the edge of the circuit board, which are located between the first insulating part and the third insulating part.

8. The power conversion device of any one of claims 1-4, wherein, The surface of the insulating part towards the circuit board further comprises a plurality of protruding structures, and the protruding structures are fixedly connected with the circuit board through the circuit board.

9. The power conversion device of claim 8, wherein, The protruding structures are located on the side of the adapter towards the substrate, and the insulating part has a gap with the circuit board.

10. A power cabinet characterized in that, The cabinet comprises a cabinet body and a plurality of power conversion devices according to any one of claims 1-9, the plurality of power conversion devices are located in the cabinet body, and the plurality of power conversion devices are connected in parallel.

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