Gripping device
By designing a gripping device that includes a basket, alignment mechanism, and lifting mechanism, the problem of silicon wafers being easily missed and broken in traditional robot gripping was solved, achieving efficient and stable gripping and transfer of silicon wafers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2026-03-31
AI Technical Summary
Traditional automated robots often cause problems such as missed or broken silicon wafers when grasping them, especially when the wafers are misaligned or bent, which affects production efficiency and product quality.
Design a gripping device comprising a basket, an alignment mechanism, a lifting mechanism, and a gripping mechanism. The alignment mechanism pushes the silicon wafer horizontally, the lifting mechanism moves vertically to ensure the silicon wafer is aligned and straight, and the gripping mechanism uses vacuum suction to achieve accurate gripping.
It improves the accuracy and efficiency of silicon wafer gripping, reduces the risk of missed gripping and breakage, and ensures the integrity and stability of silicon wafers during the transfer process.
Smart Images
Figure CN224069081U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of photovoltaic power generation technology, specifically providing a gripping device. Background Technology
[0002] In current automated production, robotics technology is widely used in the gripping and conveying of silicon wafers. Traditional automated robots often grip curved silicon wafers from the wafer tray by gripping them downwards. However, because the wafers in the tray are often curved, and due to transport jitter or human error during loading, the wafers may shift positionally, causing significant deviations. This makes it easy for the suction cup to miss or break wafers, increasing the proportion of reworked wafers and severely impacting production efficiency and product quality.
[0003] Therefore, a new technical solution is needed in this field to solve the above problems. Utility Model Content
[0004] The present invention aims to solve the above-mentioned technical problems, namely, to solve the problems of silicon wafers being missed or broken when grasping silicon wafers.
[0005] This utility model provides a gripping device, comprising:
[0006] The flower basket is provided with multiple layers of support frames at intervals along the vertical direction, and each layer of the support frame is suitable for carrying the corresponding silicon wafer;
[0007] An alignment mechanism is provided on one side of the flower basket, and the alignment mechanism is capable of pushing the silicon wafer to move in the horizontal direction;
[0008] A lifting mechanism, capable of abutting against the bottom surface of the silicon wafer, and capable of moving vertically to lift the silicon wafer; and
[0009] A gripping mechanism capable of gripping and moving the silicon wafer.
[0010] In the preferred embodiment of the above-mentioned grasping device, the alignment mechanism includes a first driving mechanism and a clapper. The clapper is connected to the output end of the first driving mechanism, the clapper extends in the vertical direction, and the first driving mechanism can drive the clapper to move in the horizontal direction.
[0011] In the preferred embodiment of the gripping device described above, the lifting mechanism includes a second driving mechanism and a lifting member adapted to correspond one-to-one with each of the silicon wafers. The second driving mechanism can drive the lifting member to move in a vertical direction to lift the silicon wafers.
[0012] In the preferred embodiment of the above-mentioned gripping device, the lifting members are arranged at intervals along the vertical direction on the clapper, and the output end of the second driving mechanism is fixedly connected to the bottom end of the clapper. The second driving mechanism can drive the clapper to move along the vertical direction, thereby driving the lifting members to move along the vertical direction.
[0013] In the preferred embodiment of the gripping device described above, the gripping device further includes a slide rail, and the bottom of the second driving mechanism is provided with a slide groove. The slide groove is slidably connected to the slide rail, and the slide rail is adapted to be disposed near the center of the silicon wafer in the horizontal direction. The first driving mechanism can drive the slide groove to move on the slide rail, so as to drive the clapper to move in the horizontal direction.
[0014] In the preferred embodiment of the above-mentioned gripping device, the gripping mechanism includes a third driving mechanism, a vacuum generator, and a suction plate adapted to correspond one-to-one with each of the silicon wafers. The third driving mechanism can drive the suction plate to abut against the top surface of the silicon wafer. The suction plate is provided with a plurality of suction holes, and the plurality of suction holes are all connected to the vacuum generator. The suction plate can pick up the corresponding silicon wafer.
[0015] In the preferred embodiment of the above-mentioned gripping device, the flower basket includes four support rods arranged vertically, the four support rods are arranged in a rectangular array, each layer of the support frame includes four support rods respectively arranged on the four support rods, and the four support rods are located at the same horizontal position, and the four support rods can respectively abut against the bottom surface of the four corners of the corresponding silicon wafer.
[0016] In the preferred embodiment of the gripping device described above, a buffer layer is provided on the side of the clapper that contacts the silicon wafer.
[0017] In the preferred embodiment of the above-mentioned gripping device, the lifting member is rod-shaped or plate-shaped, and / or
[0018] The lifting component is made of ceramic.
[0019] In the preferred embodiment of the above-mentioned gripping device, a sensor is also provided on the basket. The sensor is connected to the alignment mechanism and the lifting mechanism respectively, and the sensor can detect the position of the silicon wafer.
[0020] Those skilled in the art will understand that the present invention provides a gripping device, comprising: a basket, an alignment mechanism, a lifting mechanism, and a gripping mechanism. The basket has multiple layers of support frames spaced vertically, on which multiple silicon wafers can be correspondingly mounted. The alignment mechanism is located on one side of the basket (in the assembled state, i.e., on one side of the multiple silicon wafers) and can push the silicon wafers to move horizontally. The lifting mechanism abuts against the bottom surface of the multiple silicon wafers and can move vertically to lift them. The gripping mechanism can grip and transfer multiple silicon wafers. By using the alignment mechanism to push the silicon wafers horizontally, it ensures that all silicon wafers are in the correct position before gripping, ensuring consistent positioning and improving the accuracy and efficiency of silicon wafer gripping. In addition, the lifting mechanism raises the silicon wafer to a suitable gripping height while ensuring that the wafer remains flat after being lifted. This avoids problems such as missed gripping and breakage due to wafer bending that may occur when gripping the wafer directly downwards, thus further improving the gripping efficiency of the silicon wafer. Attached Figure Description
[0021] The preferred embodiments of this utility model are described below with reference to the accompanying drawings, in which:
[0022] Figure 1 This is a schematic diagram of the gripping device of this utility model. Figure 1 ;
[0023] Figure 2 This is a schematic diagram of the gripping device of this utility model. Figure 2 ;
[0024] Figure 3 This is a schematic diagram of the structure of the flower basket of this utility model;
[0025] Figure 4 This is a structural schematic diagram of the alignment mechanism and lifting mechanism of this utility model;
[0026] Figure 5 This is a schematic diagram of the gripping mechanism of this utility model.
[0027] List of reference numerals in the attached diagram:
[0028] 100. Silicon wafers;
[0029] 1. Flower basket; 11. Support frame; 111. Support rod; 12. Support rod;
[0030] 2. Alignment mechanism; 21. First drive mechanism; 22. Clapper;
[0031] 3. Lifting mechanism; 31. Second drive mechanism; 32. Lifting component;
[0032] 4. Gripping mechanism; 41. Third drive mechanism; 42. Suction plate;
[0033] 5. Slide rail;
[0034] 6. Slide groove. Detailed Implementation
[0035] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention. For example, although the following embodiments are described in conjunction with a silicon wafer, the gripping device provided by the present invention is equally applicable to other products that need to solve problems such as missed gripping and fragility.
[0036] It should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly, for example, they can refer to a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0037] In light of the background art, when gripping silicon wafers, it is easy to miss or break the wafers. This utility model provides a gripping device that aims to effectively solve the problems of missing or breaking silicon wafers when gripping them by setting up an alignment mechanism and a lifting mechanism to align multiple silicon wafers and straighten them.
[0038] like Figures 1 to 3 As shown, this utility model provides a gripping device, including: a basket 1, an alignment mechanism 2, a lifting mechanism 3, and a gripping mechanism 4. The basket 1 has multiple layers of support frames 11 spaced vertically, each layer of support frame 11 suitable for carrying a corresponding silicon wafer 100; the alignment mechanism 2 is located on one side of the basket 1 and can push the silicon wafer 100 to move horizontally; the lifting mechanism 3 can abut against the bottom surface of the silicon wafer 100 and can move vertically to lift the silicon wafer 100; the gripping mechanism 4 can grip and transfer multiple silicon wafers 100.
[0039] The basket 1 serves as a storage and transportation container for the silicon wafers 100. Multiple layers of support frames 11 are arranged vertically at intervals along the basket 1. These support frames 11 are used to support the silicon wafers 100 respectively, ensuring that each silicon wafer 100 has a stable and independent support surface. This design not only improves space utilization but also facilitates layered management and operation of the silicon wafers 100, ensuring the stability and orderliness of the silicon wafers 100.
[0040] Preferably, such as Figure 3As shown, the flower basket 1 includes four support rods 12 arranged vertically. The four support rods 12 are arranged in a rectangular array. Each layer of the support frame 11 includes four support rods 111 respectively set on the four support rods 12. The four support rods 111 are located at the same horizontal position. The four support rods 111 can respectively abut against the bottom surface of the four corners of the corresponding silicon wafer 100.
[0041] The flower basket 1 includes four vertically arranged support rods 12, which constitute the main structure of the flower basket 1. The four support rods 12 are arranged in a rectangular array to ensure the stability and symmetry of the flower basket 1 structure.
[0042] Each support frame 11 includes four support rods 111 respectively mounted on four support rods 12. The four support rods 111 are located at the same horizontal position, so that they can jointly support the silicon wafer 100 at the same height. The design of the support rods 111 allows them to abut against the bottom surface of the four corners of the silicon wafer 100, thereby achieving stable support for the silicon wafer 100.
[0043] Preferably, the flower basket 1 is also equipped with a sensor (not shown in the figure), which is connected to the alignment mechanism 2 and the lifting mechanism 3 respectively, and the sensor can detect the position status of the silicon wafer 100.
[0044] The sensor is connected to the alignment mechanism 2 and the lifting mechanism 3 via signals, enabling real-time information transmission. When the sensor detects a change in the position of the silicon wafer 100, it immediately sends a signal to the alignment mechanism 2 and the lifting mechanism 3. Upon receiving the sensor signal, the alignment mechanism 2 can activate and adjust the position of the silicon wafer 100 to ensure correct alignment. Similarly, the lifting mechanism 3 can also operate based on the sensor signal to lift the silicon wafer 100, straightening it, thus facilitating the gripping mechanism 4 to grip the silicon wafer 100.
[0045] It should be noted that the sensor in this invention is a position sensor. For example, the position sensor may be a photoelectric sensor, an ultrasonic sensor, an inductive sensor, etc. This invention does not limit the specific type of position sensor.
[0046] By installing sensors on basket 1 and connecting them to alignment mechanism 2 and lifting mechanism 3, real-time detection and precise control of the position status of silicon wafer 100 are achieved. This design not only improves the automation and accuracy of the equipment but also enhances its reliability and stability, providing strong support for the efficient processing of silicon wafer 100.
[0047] like Figure 1 and Figure 2As shown, the alignment mechanism 2 is located on one side of the basket 1. During assembly, the alignment mechanism 2 is also located on one side of the silicon wafer 100. This alignment mechanism 2 can push the silicon wafer 100 to move horizontally, thereby ensuring that all silicon wafers 100 are in the correct position before being gripped, ensuring the consistency of the silicon wafers 100's position before gripping. Therefore, the alignment mechanism 2 can greatly reduce the positional deviation of the silicon wafer 100 caused by transmission jitter or human error, thereby improving the accuracy and efficiency of gripping.
[0048] The lifting mechanism 3 can abut against the bottom surface of the silicon wafer 100 and move vertically. The function of the lifting mechanism 3 is to lift the silicon wafer 100 to a suitable gripping height, while ensuring that the silicon wafer 100 remains straight after being lifted. This avoids the problems of missed gripping that may occur when gripping the silicon wafer 100 directly downwards, as well as breakage caused by bending of the silicon wafer 100, and improves gripping efficiency.
[0049] The gripping mechanism 4 is responsible for gripping the raised silicon wafer 100 and transferring it to the target position, thereby ensuring that the silicon wafer 100 is successfully transferred to the target position and improving the yield of the transferred silicon wafer 100.
[0050] Preferably, such as Figure 2 and Figure 4 As shown, the alignment mechanism 2 includes a first driving mechanism 21 and a plate 22. The plate 22 is connected to the output end of the first driving mechanism 21. The plate 22 extends in the vertical direction (in the assembled state, the plate 22 is arranged in a roughly vertical direction on one side of the plurality of silicon wafers 100). The first driving mechanism 21 can drive the plate 22 to move in the horizontal direction.
[0051] The first drive mechanism 21 serves as a power source, driving the beater 22 to move horizontally. Exemplarily, the first drive mechanism 21 of this invention can be a stepper motor, a servo motor, or a cylinder, etc. This invention does not limit the specific type of the first drive mechanism 21.
[0052] The clapper 22 is in direct contact with the silicon wafer 100 and is used to push the silicon wafer 100 to an aligned state. The clapper 22 is connected to the output end of the first driving mechanism 21, so that when the first driving mechanism 21 is activated, it will drive the clapper 22 to move accordingly. The clapper 22 is set to be placed on one side of the plurality of silicon wafers 100 in a vertical direction (i.e., perpendicular to the placement direction of the silicon wafer 100). This design allows the clapper 22 to move horizontally along the edge of the silicon wafer 100, thereby effectively pushing the silicon wafer 100 to the required alignment position.
[0053] Preferably, a buffer layer is provided on the side of the clapper 22 that contacts the silicon wafer 100.
[0054] As a precision electronic material, the silicon wafer 100 has a very sensitive surface that is easily damaged by scratches, impacts, and other factors. This invention provides a buffer layer (not shown in the figure) on the side of the striking plate 22 that contacts the silicon wafer 100, which can significantly reduce the impact force generated when the striking plate 22 is in direct contact with the silicon wafer 100, thereby effectively protecting the silicon wafer 100 from damage.
[0055] For example, the buffer layer of this invention is made of a soft or elastic material, such as rubber, silicone, or foam. Thus, when the clapper 22 pushes the silicon wafer 100, the buffer layer provides better fit and friction, helping the silicon wafer 100 move more smoothly and accurately to the alignment position. Furthermore, since the buffer layer can absorb some of the impact and friction, it can also reduce wear between the clapper 22 and the silicon wafer 100, thereby extending the service life of the entire alignment mechanism 2.
[0056] Preferably, such as Figure 2 and Figure 4 As shown, the lifting mechanism 3 includes a second driving mechanism 31 and a lifting member 32 adapted to correspond one-to-one with each silicon wafer 100. The second driving mechanism 31 can drive the lifting member 32 to move in the vertical direction to lift the silicon wafer 100.
[0057] The second drive mechanism 31 is the power source of the lifting mechanism 3, responsible for providing the energy required to lift the silicon wafer 100. Exemplarily, the second drive mechanism 31 of this utility model can be a stepper motor, a servo motor, a cylinder, or other devices capable of generating vertical movement, etc. This utility model does not limit the specific type of the second drive mechanism 31.
[0058] The lifting element 32 is a component that directly contacts the silicon wafer 100 and is used to straighten a bent silicon wafer 100 for gripping. The lifting element 32 is configured to correspond one-to-one with multiple silicon wafers 100, so that there is a lifting element 32 under each silicon wafer 100. This design ensures the stability and accuracy of the lifting process.
[0059] When it is necessary to lift the silicon wafer 100, the second drive mechanism 31 is activated, driving the lifting member 32 to move vertically. Since the lifting member 32 corresponds one-to-one with the silicon wafer 100, each silicon wafer 100 is lifted uniformly, thus gradually straightening any bent silicon wafer 100. This design not only improves the stability and accuracy of the lifting process but also ensures the safety and integrity of the silicon wafer 100 during the lifting process.
[0060] Preferably, the lifting member 32 is rod-shaped or plate-shaped.
[0061] The rod-shaped or plate-shaped lifting member 32 provides stable support in the vertical direction. Whether rod-shaped or plate-shaped, they can effectively lift the silicon wafer 100 from the bottom and ensure that the silicon wafer 100 does not tilt or slip during the lifting process.
[0062] It should be noted that the rod-shaped or plate-shaped lifting member 32 can be customized according to the size and shape of the silicon wafer 100. For smaller silicon wafers 100, thinner rod-shaped lifting members 32 can be used to reduce material waste and space occupation; for larger silicon wafers 100, wider plate-shaped lifting members 32 can be used to provide better support and stability.
[0063] Preferably, the lifting element 32 is made of ceramic.
[0064] Ceramic materials are known for their high hardness, which means they possess excellent wear resistance. During the lifting process of the silicon wafer 100, the ceramic lifting component 32 can resist wear caused by the silicon wafer 100 and other potential sources of friction, thus maintaining long-term stability and precision. Furthermore, ceramic materials exhibit good stability to most chemicals and are not prone to chemical reactions with the silicon wafer 100 or other substances in the environment. This ensures that the lifting component 32 will not deteriorate or fail due to chemical reactions during prolonged use.
[0065] Preferably, such as Figure 4 As shown, the lifting members 32 are arranged vertically on the clapper plate 22 at intervals. The output end of the second driving mechanism 31 is fixedly connected to the bottom end of the clapper plate 22. The second driving mechanism 31 can drive the clapper plate 22 to move vertically, thereby driving the lifting members 32 to move vertically.
[0066] The output end of the second drive mechanism 31 is fixedly connected to the bottom end of the platen 22. Therefore, when the second drive mechanism 31 is activated, it directly drives the platen 22 to move vertically. Since the lifting components 32 are mounted on the platen 22, they move together with the platen 22, thereby lifting the silicon wafer 100.
[0067] By fixing the lifting component 32 to the clapper plate 22 and driving it uniformly by the second drive mechanism 31, the structure of the entire lifting mechanism 3 is simplified, thereby reducing manufacturing costs and improving the reliability and stability of the equipment.
[0068] Preferably, such as Figure 2 and Figure 4 As shown, the gripping device also includes a slide rail 5, and a groove 6 is provided at the bottom of the second drive mechanism 31. The groove 6 is slidably connected to the slide rail 5, and the slide rail 5 is arranged horizontally near the middle of the silicon wafer 100. The first drive mechanism 21 can drive the groove 6 to move on the slide rail 5, so as to drive the clapper 22 to move horizontally.
[0069] The slide rail 5 is positioned horizontally near the center of the silicon wafer 100, while the bottom of the second drive mechanism 31 is provided with a slide groove 6. The slide groove 6 and the slide rail 5 are slidably connected, thereby allowing the second drive mechanism 31 (and its connected plate 22 and lifting member 32) to move horizontally along the slide rail 5.
[0070] The first drive mechanism 21 is responsible not only for driving the paddle 22 to move horizontally (as previously described, for aligning the silicon wafer 100), but also for driving the entire second drive mechanism 31 (including its bottom groove 6) to move on the slide rail 5. This design allows the paddle 22 and the lifting member 32 to move not only vertically (for lifting the silicon wafer 100), but also horizontally (for adjusting the position of the silicon wafer 100 or performing alignment operations). This enables the gripping device to move in both horizontal and vertical directions, greatly improving the flexibility of the equipment and allowing it to adapt to more complex operational needs.
[0071] Since the most significant point of bending of the silicon wafer 100 in the basket 1 is usually located in the middle of the silicon wafer 100, the slide rail 5 is positioned horizontally close to the middle of the silicon wafer 100. The lifting member 32 can then directly contact and lift the bottom surface of the silicon wafer 100 at its middle position. When the lifting member 32 contacts and lifts the middle of the silicon wafer 100, it effectively counteracts the bending force in the middle of the silicon wafer 100, thus straightening it. After straightening the silicon wafer 100, the gripping mechanism 4 encounters fewer obstacles and deviations during the gripping process, which not only improves the success rate of gripping but also reduces the risk of breakage of the silicon wafer 100 due to bending.
[0072] Preferably, such as Figure 1 and Figure 5 As shown, the gripping mechanism 4 includes a third driving mechanism 41, a vacuum generator, and a suction plate 42 adapted to correspond one-to-one with each silicon wafer 100. The third driving mechanism 41 can drive the suction plate 42 to abut against the top surface of the silicon wafer 100. The suction plate 42 is provided with a plurality of suction holes 421, all of which are connected to the vacuum generator. The suction plate 42 can pick up the corresponding silicon wafer 100.
[0073] The third drive mechanism 41 is the power source for the gripping mechanism 4, responsible for driving the suction plate 42 to contact the top surface of the silicon wafer 100. By precisely controlling the movement of the third drive mechanism 41, it can be ensured that the suction plate 42 contacts the silicon wafer 100 with appropriate force and position, preparing for subsequent gripping operations. Exemplarily, the third drive mechanism 41 of this invention can be a stepper motor, a servo motor, or a cylinder, etc. This invention does not limit the specific type of the third drive mechanism 41.
[0074] The vacuum generator (not shown in the figure) is a key component of the gripping mechanism 4. It is responsible for generating negative pressure to adsorb the silicon wafer 100 onto the suction plate 42 through the suction holes 421. The vacuum generator is connected to multiple suction holes 421, which are evenly distributed on the suction plate 42 to ensure that the silicon wafer 100 can be uniformly and firmly adsorbed, reducing the risk of the silicon wafer 100 falling off or being damaged during gripping and transfer.
[0075] When the third drive mechanism 41 drives the suction plate 42 to contact the top surface of the silicon wafer 100, the vacuum generator starts working, generating negative pressure through the suction hole 421 to adsorb the silicon wafer 100 onto the suction plate 42. Subsequently, the third drive mechanism 41 can drive the suction plate 42 (and the adsorbed silicon wafer 100) to move along a predetermined path, transferring the silicon wafer 100 from its current position to a target position. After reaching the target position, the vacuum generator stops working, the suction plate 42 releases the silicon wafer 100, completing the entire gripping and transfer process.
[0076] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.
Claims
1. A gripping device, characterized in that The application relates to a flower basket (1) which is provided with multiple layers of bearing frames (11) in a vertical direction, each layer of the bearing frames (11) being adapted to bear a corresponding silicon wafer (100); an alignment mechanism (2) which is arranged on one side of the flower basket (1) and can push the silicon wafer (100) to move in a horizontal direction; a lifting mechanism (3) which can abut against the bottom surface of the silicon wafer (100) and can move in a vertical direction to lift the silicon wafer (100); and a grabbing mechanism (4) which can grab and move the silicon wafer (100). The alignment mechanism (2) comprises a first driving mechanism (21) and a paddle (22) which is connected with the output end of the first driving mechanism (21), the paddle (22) extends in a vertical direction, and the first driving mechanism (21) can drive the paddle (22) to move in a horizontal direction. The lifting mechanism (3) comprises a second driving mechanism (31) and a lifting piece (32) which is adapted to correspond to each silicon wafer (100), the second driving mechanism (31) can drive the lifting piece (32) to move in a vertical direction to lift the silicon wafer (100). The lifting piece (32) is arranged on the paddle (22) in a vertical direction, the output end of the second driving mechanism (31) is fixedly connected with the bottom end of the paddle (22), and the second driving mechanism (31) can drive the paddle (22) to move in a vertical direction to drive the lifting piece (32) to move in a vertical direction. The grabbing device further comprises a sliding rail (5), the bottom of the second driving mechanism (31) is provided with a sliding groove (6), the sliding groove (6) is slidingly connected with the sliding rail (5), and the sliding rail (5) is adapted to be arranged close to the middle part of the silicon wafer (100) in a horizontal direction, and the first driving mechanism (21) can drive the sliding groove (6) to move on the sliding rail (5) to drive the paddle (22) to move in a horizontal direction. The grabbing mechanism (4) comprises a third driving mechanism (41), a vacuum generator and a suction plate (42) which is adapted to correspond to each silicon wafer (100), the third driving mechanism (41) can drive the suction plate (42) to abut against the top surface of the silicon wafer (100), the suction plate (42) is provided with multiple suction holes (421), the multiple suction holes (421) are connected with the vacuum generator, and the suction plate (42) can suck the corresponding silicon wafer (100). 2. The gripping device according to claim 1, characterized in that 3. The gripping device of claim 1, wherein 4. The gripping device of claim 1, wherein The flower basket (1) comprises four support rods (12) arranged in a vertical direction, the four support rods (12) are arranged in a rectangular array, each layer of the supporting frame (11) comprises four supporting rods (111) respectively arranged on the four support rods (12), and the four supporting rods (111) are located at the same horizontal position, and the four supporting rods (111) can respectively abut against the bottom surface of the four corners of the corresponding silicon wafer (100).
5. The gripping device of claim 1, wherein The side of the clapper (22) in contact with the silicon wafer (100) is provided with a buffer layer.
6. The gripping device of claim 1, wherein The shape of the lifting piece (32) is rod-shaped or plate-shaped, and / or The material of the lifting piece (32) is ceramic.
7. The gripping device according to any one of claims 1 to 6, characterized in that The flower basket (1) is further provided with a sensor, the sensor is signal-connected with the alignment mechanism (2) and the lifting mechanism (3) respectively, and the sensor can detect the position state of the silicon wafer (100).