Detection mechanism on wafer chamfering equipment
By designing an inspection mechanism on the wafer chamfering equipment and employing laser displacement sensors, ultrasonic sensors, and optical microscope sensors for comprehensive multi-parameter inspection, the problems of low inspection efficiency and insufficient accuracy of existing equipment are solved, improving the accuracy and consistency of inspection and ensuring the quality of semiconductor products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-24
- Publication Date
- 2026-03-31
AI Technical Summary
Existing wafer chamfering equipment lacks efficient and accurate testing methods, resulting in low testing efficiency, test results that are easily affected by human factors, and difficulty in achieving comprehensive, multi-parameter testing, which affects the quality of semiconductor products.
A detection mechanism for a wafer chamfering device has been designed, including a fixed support, a wafer motion component, a wafer adsorption and fixing component, and a sensor detection component. It utilizes a laser displacement sensor, an ultrasonic sensor, and an optical microscope sensor to perform multi-parameter detection, thereby achieving all-round detection of the wafer.
It achieves efficient and accurate wafer chamfer inspection, enabling timely detection of potential quality problems, improving the accuracy and consistency of inspection, and ensuring the overall quality of semiconductor products.
Smart Images
Figure CN224069086U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of wafer manufacturing technology, specifically a detection mechanism on a wafer chamfering device. Background Technology
[0002] In semiconductor wafer manufacturing, wafer chamfering is a crucial step. The purpose of chamfering is to remove sharp edges from the wafer, preventing defects such as chipping and cracking during subsequent processing, handling, and storage, thereby improving wafer yield and reliability. However, existing wafer chamfering equipment often lacks efficient and accurate inspection methods.
[0003] Currently, some testing methods rely on manual sampling, which is not only inefficient but also susceptible to human error, making it difficult to guarantee accuracy and consistency. While some testing equipment has achieved a degree of automation, its accuracy is limited, failing to detect minute chamfer defects. Furthermore, existing testing institutions typically only test certain parameters of the wafer, making it difficult to achieve comprehensive, multi-parameter testing of wafer chamfers. This results in potential quality issues going undetected, impacting the overall quality of semiconductor products.
[0004] To address the above issues, we have invented a testing mechanism for wafer chamfering equipment. Utility Model Content
[0005] The purpose of this utility model is to provide a detection mechanism on a wafer chamfering device in order to solve the above problems. The mechanism includes a fixed support, a wafer motion component, a wafer adsorption and fixing component, and a sensor detection component. The wafer motion component is fixedly installed on one side of the upper surface of the fixed support, the sensor detection component is fixedly installed on the other side of the upper surface of the fixed support, and the wafer adsorption and fixing component is fixedly installed on the outer wall of one side of the wafer motion component.
[0006] The above technical solution involves first fixing the support bracket in a suitable position within the wafer chamfering equipment, ensuring its stability and levelness. The wafer motion assembly is then fixed to the support bracket, connected to a drive motor, and calibrated in the XYZ directions. Next, the wafer adsorption and fixing assembly is fixed to the motion assembly, and the vacuum system is connected. The vacuum adsorption force is adjusted to ensure stable wafer adsorption without damaging the wafer surface. Multiple sensors from the sensor detection assembly are installed in their respective positions, and optical, electrical, and signal transmission connections are established. The operating parameters of each sensor are adjusted, such as the focal length of the optical microscope, the measurement range of the laser displacement sensor, and the frequency of the ultrasonic sensor, ensuring normal sensor operation and accurate data output. The chamfered wafer is placed on the wafer adsorption and fixing assembly, and the wafer motion assembly is driven to rotate the wafer more than 360 degrees. Simultaneously, each sensor activates its detection, acquiring dimensions, thickness, chamfer dimensions, errors, and identifying chamfer defects at various locations. By comprehensively evaluating this information, the quality, defect type, and location of the chamfered wafer can be determined. Qualified wafers undergo normal subsequent processing, while unqualified wafers are marked and further processed. For wafers that have not been chamfered, the initial wafer is placed on the wafer adsorption and fixing assembly, and the wafer motion assembly is driven to make the wafer rotate more than 360 degrees. The wafer thickness, wafer diameter, wafer notch corner position, and the wafer's relative spatial position coordinates are obtained and transmitted to the downstream workstations to facilitate adjustments during the wafer chamfering process.
[0007] In a preferred embodiment, the wafer motion assembly further includes an X-axis moving assembly, which is fixedly mounted on one side of the upper surface of the fixed support. A Y-axis moving assembly is fixedly mounted on the upper surface of the X-axis moving assembly, a Z-axis moving assembly is fixedly mounted on one side of the Y-axis moving assembly, and a circumferential rotation assembly is fixedly mounted on one side of the Z-axis moving assembly.
[0008] Through the above technical solution, the circumferential rotation component can drive the wafer to rotate circumferentially, enabling the sensor detection component to detect the chamfer of the entire circumference of the wafer. By adjusting the Z-axis movement component, the position and height of the wafer relative to the sensor can be adjusted to ensure that the wafer is at the optimal detection distance of the sensor. By driving and adjusting the X-axis and Y-axis movement components, the relative position of the sensor and the wafer can be adjusted to detect information at different wafer positions, while also being compatible with wafers of different sizes and shapes.
[0009] In a preferred embodiment, the wafer adsorption and fixing assembly further includes a vacuum system, which is fixedly installed on the top of the circumferential rotating assembly. A vacuum pipe is fixedly installed at the output end of the vacuum system, and a vacuum suction cup is fixedly installed on the top of the vacuum pipe. The wafer is adsorbed on the upper wall of the vacuum suction cup.
[0010] With the above technical solution, when the wafer is placed on the vacuum chuck, the vacuum system operates to firmly fix the wafer on the vacuum chuck, preventing displacement of the wafer due to movement or rotation during inspection. After inspection is completed, the vacuum system breaks the vacuum and removes the wafer to the next process.
[0011] In a preferred embodiment, the sensor detection assembly further includes a sensor mounting bracket, which is fixedly installed on the other side of the upper surface of the mounting base. A laser displacement sensor, an ultrasonic sensor, and an optical microscope sensor are fixedly installed on the upper outer wall of the sensor mounting bracket.
[0012] Through the above technical solutions, the laser displacement sensor mainly measures the wafer contour dimensions, such as chamfer radius and angle. It calculates the distance by emitting a laser beam and measuring the time difference of the reflected light, thereby accurately obtaining dimensional information. The ultrasonic sensor mainly detects whether there are defects such as micro-cracks inside the wafer. It emits ultrasonic waves to the detection position and judges whether there is damage inside the wafer by the change of the reflected wave generated by the ultrasonic waves encountering defects when they propagate inside the wafer. The optical microscope sensor can perform microscopic observation of the wafer surface and can detect defects such as micro-chipping and scratches. At the same time, it can obtain clear chamfer images by adjusting the focus.
[0013] In a preferred embodiment, the fixed support is connected to the main body of the wafer chamfering device.
[0014] In a preferred embodiment, the vacuum suction cup is a ceramic suction cup, a circular suction cup, a microporous suction cup, or a rubber suction cup.
[0015] In summary, due to the adoption of the above technical solutions, the beneficial effects of this utility model are: this utility model proposes a detection mechanism on a wafer chamfering device.
[0016] The chamfered wafer is placed on the wafer clamping and fixing assembly. The wafer motion assembly is driven to rotate the wafer more than 360 degrees. Simultaneously, various sensors are activated to detect dimensions, thickness, chamfer dimensions, errors, and identify chamfer defects at various locations. By combining the above information, the quality, defect type, and location of the chamfered wafer can be determined. Qualified wafers undergo normal subsequent processing, while unqualified wafers are marked and further processed. For wafers that have not been chamfered, the initial wafer is placed on the wafer clamping and fixing assembly, and the wafer motion assembly is driven to rotate the wafer more than 360 degrees. The wafer thickness, wafer diameter, wafer notch corner position, and relative spatial coordinates of the wafer are acquired. This information is transmitted to downstream workstations to facilitate adjustments during the wafer chamfering process. Attached Figure Description
[0017] Figure 1 This is the front view of the present invention;
[0018] Figure 2 This is a schematic diagram of the wafer motion component in this utility model;
[0019] Figure 3 This is a schematic diagram of the wafer adsorption and fixation assembly in this utility model;
[0020] Figure 4 This is a schematic diagram of the sensor detection component in this utility model.
[0021] The diagram shows the following components: 1-Fixed support; 2-Wafer motion assembly; 21-X-axis movement assembly; 22-Y-axis movement assembly; 23-Z-axis movement assembly; 24-Circular rotation assembly; 3-Wafer adsorption and fixing assembly; 31-Wafer; 32-Vacuum chuck; 33-Vacuum pipe; 34-Vacuum system; 4-Sensor detection assembly; 41-Sensor fixing bracket; 42-Laser displacement sensor; 43-Ultrasonic sensor; 44-Optical microscope sensor. Detailed Implementation
[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below in conjunction with the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0023] The following will combine Figure 1-4 A detailed description is provided of a detection mechanism on a wafer chamfering device according to an embodiment of the present invention.
[0024] Example:
[0025] A detection mechanism on a wafer chamfering device includes a fixed support 1, a wafer motion component 2, a wafer adsorption and fixing component 3, and a sensor detection component 4. The fixed support 1 is connected to the main body of the wafer chamfering device. The wafer motion component 2 is fixedly installed on one side of the upper surface of the fixed support 1. The wafer motion component 2 also includes an X-axis moving component 21, which is fixedly installed on one side of the upper surface of the fixed support 1. A Y-axis moving component 22 is fixedly installed on the upper surface of the X-axis moving component 21. A Z-axis moving component 23 is fixedly installed on one side of the Y-axis moving component 22. A circumferential rotating component 24 is fixedly installed on one side of the Z-axis moving component 23. The circumferential rotating component 24 can drive the wafer to rotate circumferentially, enabling the sensor detection component to detect the chamfer of the entire circumference of the wafer. By adjusting the Z-axis moving component 23, the position and height of the wafer from the sensor can be adjusted to ensure that the wafer is at the optimal detection distance of the sensor. By driving and adjusting the X-axis moving component 21 and the Y-axis moving component 22, the relative position of the sensor and the wafer can be adjusted to detect information at different wafer positions, while also being compatible with wafers of different sizes and shapes.
[0026] The sensor detection component 4 is fixedly installed on the other side of the upper surface of the fixed support 1. The wafer adsorption and fixing component 3 is fixedly installed on the outer wall of one side of the wafer movement component 2. The sensor detection component 4 also includes a sensor fixing bracket 41, which is fixedly installed on the other side of the upper surface of the fixed support 1. A laser displacement sensor 42, an ultrasonic sensor 43, and an optical microscope sensor 44 are fixedly installed on the upper outer wall of the sensor fixing bracket 41. The laser displacement sensor 42 mainly measures the wafer contour dimensions, such as chamfer radius and angle. It calculates the distance by emitting a laser beam and measuring the time difference of the reflected light, thereby accurately obtaining the size information. The ultrasonic sensor 43 mainly detects whether there are defects such as microcracks inside the wafer 31. It emits ultrasonic waves to the detection position and judges whether there is damage inside the wafer by the change of the reflected wave generated by the ultrasonic waves when they encounter defects during propagation inside the wafer. The optical microscope sensor 44 can perform microscopic observation of the wafer surface and can detect defects such as micro-chipping and scratches. At the same time, it can obtain a clear chamfer image by adjusting the focal length.
[0027] The wafer adsorption and fixing assembly 3 also includes a vacuum system 34, which is fixedly installed on the top of the circumferential rotating assembly 24. A vacuum pipe 33 is fixedly installed at the output end of the vacuum system 34, and a vacuum suction cup 32 is fixedly installed on the top of the vacuum pipe 33. The vacuum suction cup 32 can be a ceramic suction cup, a circular suction cup, a microporous suction cup, or a rubber suction cup. A wafer 31 is adsorbed on the upper wall of the vacuum suction cup 32. When the wafer 31 is placed on the vacuum suction cup 32, the vacuum system 34 operates, firmly fixing the wafer on the vacuum suction cup 32 to prevent movement or rotation during testing that could cause wafer displacement. After testing is completed, the vacuum system 34 breaks the vacuum, removing the wafer to the next process.
[0028] Working principle:
[0029] First, fix the mounting bracket 1 in a suitable position within the wafer chamfering equipment, ensuring its stability and levelness. Fix the wafer motion assembly 2 onto the mounting bracket 1, connect the drive motor, and calibrate the XYZ directions. Then, fix the wafer adsorption and fixing assembly 3 onto the motion assembly and connect the vacuum system. Adjust the vacuum adsorption force to ensure stable wafer adsorption without damaging the wafer surface. Install multiple sensors from the sensor detection assembly 4 in their respective positions and connect the optical path, circuit, and signal transmission connections. Adjust the operating parameters of each sensor, such as the focal length of the optical microscope, the measurement range of the laser displacement sensor, and the frequency of the ultrasonic sensor, ensuring they function correctly and output accurate data. Place the chamfered wafer onto the wafer adsorption and fixing assembly 3, and drive the wafer motion assembly 2 to rotate the wafer more than 360 degrees. Simultaneously, each sensor activates its detection, acquiring dimensions, thickness, chamfer dimensions, errors, and identifying chamfer defects at various locations. By comprehensively judging this information, the quality, defect type, and location of the chamfered wafer can be determined. Qualified wafers undergo normal subsequent processing, while unqualified wafers are marked and further processed. For wafers that have not been chamfered, the initial wafer is placed on the wafer adsorption and fixing component 3, and the wafer motion component 2 is driven to make the wafer rotate more than 360 degrees. The wafer thickness, wafer diameter, wafer notch corner position, and the wafer's relative spatial position coordinates are obtained and transmitted to the downstream workstation to facilitate adjustments during the wafer chamfering process.
[0030] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A detection mechanism on a wafer chamfering device, comprising a fixed support (1), a wafer movement assembly (2), a wafer adsorption and fixing assembly (3) and a sensor detection assembly (4), characterized in that: The wafer motion assembly (2) is fixedly installed on one side of the upper surface of the fixed support (1), the sensor detection assembly (4) is fixedly installed on the other side of the upper surface of the fixed support (1), the wafer adsorption and fixing assembly (3) is fixedly installed on one side of the outer wall of the wafer motion assembly (2), the wafer motion assembly (2) further comprises an X-axis moving assembly (21), the X-axis moving assembly (21) is fixedly installed on one side of the upper surface of the fixed support (1), an Y-axis moving assembly (22) is fixedly installed on the upper surface of the X-axis moving assembly (21), a Z-axis moving assembly (23) is fixedly installed on one side of the Y-axis moving assembly (22), a circumferential rotation assembly (24) is fixedly installed on one side of the Z-axis moving assembly (23), the sensor detection assembly (4) further comprises a sensor fixing support (41), the sensor fixing support (41) is fixedly installed on the other side of the upper surface of the fixed support (1), a laser displacement sensor (42), an ultrasonic sensor (43) and an optical microscope sensor (44) are fixedly installed on the outer wall of the upper end of the sensor fixing support (41).
2. The detection mechanism of a wafer beveling apparatus as recited in claim 1, wherein: The wafer adsorption and fixing assembly (3) further comprises a vacuum system (34), the vacuum system (34) is fixedly installed on the top of the circumferential rotation assembly (24), a vacuum pipeline (33) is fixedly installed on the output end of the vacuum system (34), a vacuum chuck (32) is fixedly installed on the top of the vacuum pipeline (33), and the wafer (31) is adsorbed on the upper wall of the vacuum chuck (32).
3. The detection mechanism of a wafer beveling apparatus as recited in claim 1, wherein: The fixed support (1) is connected with the wafer chamfering equipment main body.
4. The detection mechanism of a wafer beveling apparatus as recited in claim 2, wherein: The vacuum chuck (32) is a ceramic chuck, a circular chuck, a microporous adsorption or a rubber chuck.