Efficient vacuum film dehumidification device based on semiconductor temperature control technology

Abstract

The utility model relates to an efficient vacuum membrane dehumidification device based on a semiconductor temperature control technology, which aims to solve the problem that the existing membrane dehumidification device is low in dehumidification efficiency and comprises a membrane pressing assembly, a supporting assembly, a vacuum membrane assembly, a membrane bearing assembly and a heat exchange assembly. According to the device, the air temperature is reduced and the relative humidity is increased through the synergistic effect of the cold end of the semiconductor chilling plate, the water cooling jacket and the fin type heat exchanger, so that the dehumidification efficiency is improved, and water molecules in a water vapor selective permeable membrane are quickly released to the permeation side through the synergistic effect of the hot end of the semiconductor chilling plate and the heat pipe layer bottom plate; and the dehumidification efficiency is further improved.

Description

Technical Field

[0001] This utility model relates to the field of device dehumidification, specifically to a high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology. Background Technology

[0002] Currently, condensation dehumidification and adsorption dehumidification methods have many problems. Condensation dehumidification has low efficiency at low temperatures, is prone to frosting requiring frequent defrosting, while adsorption dehumidification suffers from adsorbent saturation, resulting in high replacement or regeneration costs, poor dehumidification when saturated, and ineffective removal of trace amounts of moisture, making it difficult to meet the needs of high humidity scenarios. Existing dehumidification equipment also has insufficient heat exchange and energy utilization. Vacuum membrane dehumidification technology utilizes a vacuum pump to create a chemical potential difference across a membrane, selectively allowing water vapor to pass through, thus dehumidifying the air. Currently, high-efficiency vacuum membrane dehumidification technology based on semiconductor temperature control technology is rarely used in the HVAC field. Utility Model Content

[0003] Technical issues:

[0004] This invention provides a high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology, which solves the problem of low dehumidification efficiency in existing membrane dehumidification devices.

[0005] Technical solution:

[0006] This utility model discloses a high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology, comprising a membrane pressing assembly, a support assembly, a vacuum membrane assembly, a membrane bearing assembly, and a heat exchange assembly.

[0007] The membrane pressing assembly includes an insulating top plate, a rectangular upper frame of the vacuum membrane, and a vacuum membrane upper frame pad; the support assembly includes a support pad and a support rod; the vacuum membrane assembly includes a water vapor selectively permeable membrane and a porous support thin layer; the membrane bearing assembly includes a first vacuum membrane lower frame pad, a rectangular lower frame of the vacuum membrane, a second vacuum membrane lower frame pad, and a heat pipe layer bottom plate; the heat exchange assembly includes a semiconductor refrigeration chip, a water-cooled jacket, and a finned heat exchanger.

[0008] The membrane pressing assembly is located on the upper surface of the support assembly, the heat insulation top plate is located at the top of this vacuum membrane dehumidification device, the support assembly is located on the lower surface of the heat insulation top plate, the vacuum membrane rectangular upper frame is located on the lower surface of the support assembly, and the vacuum membrane upper frame pad is tightly attached to the lower surface of the vacuum membrane upper frame.

[0009] The vacuum membrane assembly is located on the upper surface of the membrane support assembly. The water vapor selectively permeable membrane is in close contact with the upper surface of the first vacuum membrane lower frame pad. The first vacuum membrane lower frame pad is located on the upper surface of the vacuum membrane rectangular lower frame. The vacuum membrane rectangular lower frame is located on the upper surface of the second vacuum membrane lower frame pad. The second vacuum membrane lower frame pad is located on the upper surface of the heat pipe layer bottom plate.

[0010] The heat exchange component is located on the lower surface of the membrane support component. The hot end surface of the semiconductor refrigeration chip faces upward and is tightly connected to the lower surface of the heat pipe layer bottom plate. The cold end surface of the semiconductor refrigeration chip faces downward and is connected to the surface of the water cooling jacket. The water cooling jacket is located at the lowest end of the dehumidification device. The finned heat exchanger is located at the air inlet of the vacuum membrane dehumidification device.

[0011] In a preferred embodiment, the heat-insulating top plate and the supporting assembly together form an air inlet and an air outlet, the supporting rod is close to the long edge of the upper frame of the vacuum membrane rectangle and aligned with the long edge, and the supporting pads are evenly distributed on the short side of the upper frame of the vacuum membrane rectangle.

[0012] In a preferred embodiment, the membrane support assembly is placed on the upper surface of the heat pipe layer bottom plate to form a rectangular groove. The water vapor selective permeable membrane is laid flat on the upper surface of the first vacuum membrane lower frame pad and supported by the porous support thin layer. The vacuum membrane upper frame pad covers the upper surface of the water vapor selective permeable membrane and forms a sealed area with the rectangular groove in the membrane support assembly.

[0013] In a preferred embodiment, the porous support layer provides support for the water vapor selective permeation membrane, ensuring that the water vapor selective permeation membrane remains flat and stable during operation.

[0014] In a preferred embodiment, both the membrane support assembly and the heat pipe layer bottom plate have rectangular planes on one side, and the rectangular plane of the first vacuum membrane lower frame pad has an opening for connecting a vacuum pump to form a negative pressure area.

[0015] In the preferred technical solution, the components can be connected by welding or integrated precision machining.

[0016] A further technical solution involves placing the thermoelectric cooler chips evenly along the long edge of the lower surface of the heat pipe layer base plate. The hot end surface of the thermoelectric cooler chips faces upward and is tightly connected to the lower surface of the heat pipe layer base plate, while the cold end surface faces downward and is connected to the surface of the water-cooling jacket. The water-cooling jacket has an inlet and an outlet and is connected to the finned heat exchanger via pipes to form a closed and circulating water channel. The finned heat exchanger surface has closely arranged metal fins to increase the air contact area, and the fan faces the air inlet of the device.

[0017] Beneficial effects:

[0018] To reduce the inlet air temperature of this high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology and increase the relative humidity of the air, this invention uses a combination of the cold end of a semiconductor refrigeration chip and a water-cooled jacket to transfer the low temperature of the cold end to the water inside the water-cooled jacket, turning the warm water into cold water and supplying it stably to the finned heat exchanger. This provides a reliable guarantee for air cooling, resulting in a decrease in air temperature and an increase in relative humidity, which is more conducive to dehumidification. Furthermore, the cold end temperature can be controlled by adjusting the current and voltage of the semiconductor refrigeration chip, thereby precisely controlling the degree of air cooling.

[0019] In order to enable water molecules to be quickly released to the permeate side through selective permeation of water vapor, this invention uses the hot end of the semiconductor cooling chip to cooperate with the bottom plate of the heat pipe layer. The heat generated by the hot end of the semiconductor cooling chip is absorbed and diffused. The heat released by its condensation section can accelerate the evaporation of water molecules on the permeate side and increase the partial pressure of water vapor on the permeate side. The increased pressure difference with the other side makes it easier to dehumidify through the selective permeation membrane of water vapor, thus enhancing the dehumidification efficiency.

[0020] When the high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology is in operation, an opening is provided in the rectangular plane of the lower frame pad of the first vacuum membrane for connecting the vacuum pump. The vacuum pump evacuates the air below the porous support thin layer. Due to the selective permeability of the water vapor selective permeable membrane, water and a small amount of gas permeate to the area below the porous support thin layer. The humid air is then processed to form dry air and discharged into the room, thus achieving dehumidification. At the same time, the dehumidification efficiency is improved through the synergistic effect of the semiconductor cooling chip, water cooling jacket, heat pipe layer base plate, and finned heat exchanger. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology of this utility model, which includes an air inlet 1-1, a vacuum interface 1-2, an air outlet 1-3, and a finned heat exchanger 1-4.

[0022] Figure 2 This is a schematic diagram of the structure of the high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology, which includes an air inlet 1-1, a vacuum interface 1-2, and an air outlet 1-3.

[0023] Figure 3 This is a schematic diagram of the vacuum membrane assembly of the high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology of this utility model, which includes a water vapor selectively permeable membrane 4-1 and a porous support thin layer 4-2.

[0024] Figure 4 This is a schematic diagram of the membrane pressing assembly of the high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology of this utility model, which includes a rectangular upper frame of the vacuum membrane 5-1 and a vacuum membrane upper frame pad 5-2.

[0025] Figure 5 This is a schematic diagram of the support assembly of the high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology of this utility model, which includes a support rod 6-1 and a support pad 6-2.

[0026] Figure 6 This is a schematic diagram of the second vacuum membrane lower frame pad of the high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology of this utility model, which includes a second vacuum membrane lower frame pad 7, a rectangular plane 7-1, and an opening 7-2 on the rectangular plane for connecting a vacuum pump.

[0027] Figure 7 This is a schematic diagram of the heat exchange components of the high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology of this utility model, which includes a heat pipe layer base plate 8-1, a semiconductor cooling chip 8-2, a water cooling jacket 8-3, a water cooling jacket inlet 8-4, and a water outlet 8-5. Detailed Implementation

[0028] The technical solutions of the present utility model will be explained and described below with reference to the accompanying drawings. However, the following embodiments are only preferred embodiments of the present utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments in the implementation methods without creative effort are all within the protection scope of the present utility model.

[0029] Example 1:

[0030] This utility model claims protection for a high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology, which includes a membrane pressing assembly, a support assembly, a vacuum membrane assembly, a membrane support assembly, and a heat exchange assembly. The membrane pressing assembly includes an insulating top plate, a rectangular upper frame of the vacuum membrane 5-1, and a vacuum membrane upper frame pad 5-2. The support assembly includes a support pad 6-2 and a support rod 6-1. The vacuum membrane assembly includes a water vapor selectively permeable membrane 4-1 and a porous support thin layer 4-2. The membrane support assembly includes a first lower frame pad of the vacuum membrane, a rectangular lower frame of the vacuum membrane, and a second lower frame pad of the vacuum membrane 7. The heat exchange assembly includes a heat pipe layer bottom plate 8-1, a semiconductor cooling chip 8-2, a water cooling jacket 8-3, and a finned heat exchanger 1-4.

[0031] The second vacuum membrane lower frame pad 7, the rectangular lower frame of the vacuum membrane, and the first vacuum membrane lower frame pad are sequentially attached to the upper surface of the heat pipe layer base plate 8-1 to form a stable membrane support assembly, ensuring that all components are tightly fitted. The porous support layer 4-2 is placed within the rectangular groove formed by the membrane support assembly and the heat pipe layer base plate 8-1, ensuring it completely covers the bottom of the groove and adheres tightly to the groove wall without wrinkles or gaps. Then, water vapor selectively permeates the membrane 4-1 over the porous support layer 4-2, again taking care to avoid scratching the membrane surface. The opening 7-2 of the second vacuum membrane lower frame pad 7 on the rectangular plane 7-1 on one side of the membrane support assembly is then connected to the vacuum pump connection pipe, preparing to form a negative pressure area.

[0032] The porous support layer 4-2 supports the water vapor selective permeable membrane 4-1, ensuring that the water vapor selective permeable membrane 4-1 remains flat and stable during operation.

[0033] A thermoelectric cooler 8-2 is evenly attached to the long edge of the lower surface of the heat pipe layer base plate 8-1, ensuring that the hot end of the thermoelectric cooler 8-2 faces upward and is in full contact with the lower surface of the heat pipe layer base plate 8-1, and the cold end of the thermoelectric cooler 8-2 faces downward and is in full contact with the water cooling jacket 8-3. Then, the water cooling jacket 8-3 is installed at the lower end of the thermoelectric cooler 8-2, ensuring that the water cooling jacket 8-3 is tightly fitted to the cold end of the thermoelectric cooler 8-2, and the inlet 8-4 and outlet 8-5 pipes are connected, forming a circulating water circuit with the inlet and outlet of the finned heat exchanger.

[0034] The vacuum membrane upper frame pad 5-2 is attached to the lower side of the rectangular upper frame 5-1 of the vacuum membrane, ensuring a tight and leak-free fit. Then, the entire assembly is placed on the membrane support assembly, so that the vacuum membrane upper frame pad 5-2 covers the upper surface of the water vapor selective permeable membrane 4-1 and forms a sealed area within the rectangular groove of the membrane support assembly.

[0035] Attach the support assembly to the upper surface of the rectangular upper frame 5-1 of the vacuum membrane, ensuring that the support rod 6-1 is close to the long edge of the rectangular upper frame 5-1 and aligned with the long side. The support pad 6-2 should be evenly attached to the short side, ensuring a secure fit. Next, cover the support assembly with the insulating top plate, ensuring that the insulating top plate and the support assembly form the air inlet 1-1 and air outlet 1-3.

[0036] Example 2:

[0037] Another arrangement of the heat exchange assembly is to set a wider protruding rectangular plane on the heat pipe layer bottom plate 8-1, so that the heat pipe layer bottom plate 8-1 is L-shaped. Several thermoelectric cooling chips 8-2 with hot ends facing up and cold ends facing down are evenly attached to the lower surface of the heat pipe layer bottom plate 8-1. Then, a water cooling jacket 8-3 of the appropriate size is attached to the cold end of the thermoelectric cooling chip 8-2 and placed at the lower end of the thermoelectric cooling chip 8-2.

[0038] During operation, the vacuum pump is first activated to create a negative pressure zone inside the membrane support assembly. Humid air enters the device through the air inlet 1-1 of the support assembly and the insulating top plate. As it flows through the vacuum membrane assembly, the selective permeation of water vapor through the membrane allows dry air to exit through the air outlet 1-3, achieving dehumidification. Simultaneously, warm water flows through the water-cooled jacket inlet 8-4. The cold end of the semiconductor cooling chip 8-2 absorbs heat through electro-cooling, lowering the water temperature. The cold water flows from the water-cooled jacket outlet 8-5 into the finned heat exchanger 1-4. The finned heat exchanger 1-4 uses a fan to cool the air at the air inlet 1-1, increasing the relative humidity and further facilitating dehumidification. Furthermore, the heat from the hot end of the semiconductor cooling chip 8-2 is transferred to the heat pipe layer bottom plate 8-1. The water inside undergoes a phase change due to heat, and through evaporation and condensation, heat is diffused and transferred. The heat released by the condensation section of the heat pipe layer bottom plate 8-1 accelerates the evaporation of water molecules on the permeate side, allowing water molecules to be rapidly released from the selectively permeable membrane 4-1 to the permeate side, further improving dehumidification efficiency.

[0039] The preferred embodiments of this utility model have been described above, but should not be construed as limiting the scope of the claims. This utility model is not limited to the above embodiments; its specific structure may vary. Those skilled in the art can make various changes and modifications based on this utility model, and all such modifications and variations, as long as they do not depart from the spirit of this utility model, fall within the scope defined by the appended claims.

Claims

1. A high-efficiency vacuum membrane dehumidification device based on semiconductor temperature control technology, characterized in that The application relates to a vacuum membrane dehumidification device, which comprises a membrane pressing assembly, a support assembly, a vacuum membrane assembly, a membrane bearing assembly and a heat exchange assembly; the membrane pressing assembly comprises an insulating top plate, a vacuum membrane rectangular upper frame and a vacuum membrane upper frame cushion layer; the support assembly comprises support pads and support rods; the vacuum membrane assembly comprises a water vapor selective permeation membrane and a porous support thin layer; the membrane bearing assembly comprises a first vacuum membrane lower frame cushion layer, a vacuum membrane rectangular lower frame, a second vacuum membrane lower frame cushion layer and a heat pipe layer bottom plate; the heat exchange assembly comprises semiconductor refrigeration pieces, a water cooling jacket and a fin heat exchanger; the membrane pressing assembly is located on the upper surface of the support assembly; the insulating top plate is located at the uppermost end of the vacuum membrane dehumidification device; the support assembly is located on the lower surface of the insulating top plate; the vacuum membrane rectangular upper frame is located on the lower surface of the support assembly; the vacuum membrane upper frame cushion layer is tightly attached to the lower surface of the vacuum membrane upper frame; the vacuum membrane assembly is located on the upper surface of the membrane bearing assembly; the water vapor selective permeation membrane is tightly attached to the upper surface of the first vacuum membrane lower frame cushion layer; the first vacuum membrane lower frame cushion layer is located on the upper surface of the vacuum membrane rectangular lower frame; the vacuum membrane rectangular lower frame is located on the upper surface of the second vacuum membrane lower frame cushion layer; the second vacuum membrane lower frame cushion layer is located on the upper surface of the heat pipe layer bottom plate; the heat exchange assembly is located on the lower surface of the membrane bearing assembly; the hot end surface of the semiconductor refrigeration piece faces upwards and is tightly connected with the lower surface of the heat pipe layer bottom plate; the cold end surface of the semiconductor refrigeration piece faces downwards and is connected with the surface of the water cooling jacket; the water cooling jacket is located at the lowermost end of the dehumidification device; and the fin heat exchanger is located at the air inlet of the vacuum membrane dehumidification device. The insulating top plate and the support assembly jointly form air inlets and air outlets; the support rods are close to the long edge of the vacuum membrane rectangular upper frame and are aligned with the long edge; and the support pads are uniformly distributed at the short edge of the vacuum membrane rectangular upper frame.

2. The high-efficiency vacuum membrane dehumidifying device based on semiconductor temperature control technology according to claim 1, characterized in that: The membrane bearing assembly is arranged on the upper surface of the heat pipe layer bottom plate to form a rectangular groove; the water vapor selective permeation membrane is laid on the upper surface of the first vacuum membrane lower frame cushion layer and is supported by the porous support thin layer; the porous support thin layer can ensure that the water vapor selective permeation membrane is kept flat and stable during operation; and the vacuum membrane upper frame cushion layer covers the upper surface of the water vapor selective permeation membrane and forms a sealed area in the rectangular groove of the membrane bearing assembly.

3. The high-efficient vacuum membrane dehumidifier based on semiconductor temperature control technology according to claim 1, characterized in that: The membrane bearing assembly and the heat pipe layer bottom plate are provided with a rectangular plane on one side; and the rectangular plane of the first vacuum membrane lower frame cushion layer is provided with an opening, which is used for connecting a vacuum pump to form a negative pressure area.

4. The high-efficiency vacuum membrane dehumidifying device based on semiconductor temperature control technology according to claim 1, characterized in that: The hot end of the semiconductor refrigeration piece faces upwards and the cold end faces downwards; the semiconductor refrigeration piece is uniformly arranged along the long edge of the lower surface of the heat pipe layer bottom plate; the water cooling jacket is arranged on the lower surface of the semiconductor refrigeration piece; and the water cooling jacket is provided with a water inlet and a water outlet.

5. The high-efficient vacuum membrane dehumidifier based on semiconductor temperature control technology according to claim 1, characterized in that: The components can be connected by welding or integrated precision machining.

6. The high-efficiency vacuum membrane dehumidifying device based on semiconductor temperature control technology according to claim 1, characterized in that: ​

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