Dispensing equipment for integrated circuit chip

Abstract

The utility model discloses dispensing equipment for an integrated circuit chip. The dispensing equipment comprises a bottom plate, when the chip dispensing device is used for dispensing a chip, the chip is placed on the top of the placing frame, the electric cylinder drives the linkage plate, the lifting plate and the lifting column to move upwards, the lifting column drives the overturning block to overturn towards the inner side, the overturning block drives the rotating plate to overturn towards the inner side and simultaneously drives the pressing block to move downwards, and when the pressing block is in contact with the top of the chip, the chip is placed on the top of the placing frame. A motor drives a transmission screw to drive a moving block to move left and right, the moving block drives an electric telescopic column and a dispensing pipe to move left and right, and the electric telescopic column drives the dispensing pipe to move front and back to dispense the chip, so that the beneficial effect of facilitating chip dispensing is achieved; through cooperative use of the linkage lifting mechanism and the overturning pressing mechanism, the chip can be rapidly pressed and fixed, the chip does not deviate during dispensing, and the dispensing time of the chip is shortened.

Description

Technical Field

[0001] This utility model relates to the field of circuit chip packaging technology, specifically to a dispensing device for integrated circuit chips. Background Technology

[0002] An integrated circuit chip is an electronic component comprising a silicon substrate, a circuit, a fixed sealing ring, a grounding ring, and a protective ring. Its structure includes a circuit with output / input pads, a fixed sealing ring surrounding the circuit and the output / input pads, a grounding ring between the silicon substrate and the output / input pads and electrically connected to the fixed sealing ring, and a protective ring on the silicon substrate surrounding the output / input pads for electrical connection to the fixed sealing ring. Patent publication number CN216818280U discloses a dispensing device for integrated circuit chip packaging, including an operating table. Vertical plates are fixedly connected to both ends of the top of the operating table. A first linear motor is fixedly connected to one end of the two vertical plates away from the operating table. A second linear motor is slidably connected to one side of the first linear motor, and a dispensing frame is slidably connected to the top of the second linear motor. This invention proposes a dispensing device for integrated circuit chip packaging. The device comprises a dispensing pump, a mounting base, and an adjusting screw. The mounting base facilitates the installation and fixation of the dispensing pump, while the adjusting screw moves the dispensing pump via the mounting base, thereby adjusting the distance between the two dispensing pumps. This allows for adjustment of the distance between the two dispensing pumps according to the size of the integrated circuit chip, broadening the device's applicability. Furthermore, it enables simultaneous dispensing from both sides, resulting in improved efficiency.

[0003] The existing technical solutions described above have the following drawbacks: When dispensing adhesive to a chip, the chip is placed on top of the worktable, and a motor drives the dispensing frame to move. The dispensing frame then drives the dispensing tube to dispense adhesive to the chip. Since the chip is placed directly on top of the worktable during the dispensing process, it may shift during the dispensing process, leading to dispensing failure. The chip must then be repositioned and the dispensing process repeated, which is inconvenient and increases the dispensing time. Utility Model Content

[0004] To address the problems mentioned in the background art, the purpose of this utility model is to provide a dispensing device for integrated circuit chips, which has the advantage of facilitating dispensing. It solves the problem that when dispensing chips, the chip is placed directly on top of the worktable, and a motor drives the dispensing frame to move, which in turn drives the dispensing tube to dispense the chip. During the dispensing process, the chip is placed directly on top of the worktable, which can cause misalignment and dispensing failure. This necessitates repositioning the chip and re-dispensing, increasing the dispensing time and causing inconvenience.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a dispensing device for integrated circuit chips, comprising a base plate, a fixing frame fixedly connected to the top of the base plate, a motor fixedly installed on the top left side of the fixing frame, a transmission screw fixedly connected to the output end of the motor, a moving block threadedly connected to the surface of the transmission screw, an electric telescopic column fixedly connected to the front side of the moving block, a dispensing tube fixedly connected to the front side of the electric telescopic column, a placement frame fixedly installed on the top of the base plate, a linkage lifting mechanism provided on the inner side of the placement frame, and a flipping and pressing mechanism provided on the outer side of the linkage lifting mechanism;

[0006] The linkage lifting mechanism is used to drive the flipping and pressing mechanism to flip;

[0007] The flipping and clamping mechanism is used to clamp the chip.

[0008] As a preferred embodiment of this utility model, the linkage lifting mechanism includes an electric cylinder and a linkage plate. The output end of the electric cylinder is fixedly connected to the top of the linkage plate. A support frame is fixedly connected to the surface of the electric cylinder. The top of the support frame is fixedly connected to the top of the inner side of the placement frame. Lifting plates are fixedly connected to both the front and rear sides of the bottom of the linkage plate. A limit block is provided at the bottom of the lifting plate. The bottom of the limit block is fixedly connected to the top of the base plate.

[0009] In a preferred embodiment of this utility model, the flipping and pressing mechanism includes a flipping block and a pressing block. The bottom of the inner side of the flipping block is fixedly connected to the top of the pressing block. A rotating plate is movably connected to the outer side of the flipping block via a pin. A fixing block is movably connected to the bottom of the inner side of the rotating plate via a pin. The inner side of the fixing block is fixedly connected to the top of the outer side of the placement frame. A lifting column is movably connected to the inner side of the outer side of the flipping block via a pin. The bottom of the lifting column is fixedly connected to the top of the outer side of the lifting plate.

[0010] As a preferred embodiment of this invention, a sponge pad is fixedly installed at the bottom of the clamping block, and the bottom of the sponge pad contacts the top of the chip.

[0011] As a preferred embodiment of this invention, a rubber pad is fixedly installed on the top of the placement rack, and the top of the rubber pad contacts the bottom of the chip.

[0012] As a preferred embodiment of this invention, a reinforcing sleeve is fixedly connected to the surface of the output end of the electric cylinder, and the bottom of the reinforcing sleeve is fixedly connected to the top of the linkage plate.

[0013] As a preferred embodiment of this utility model, a triangular reinforcing plate is fixedly connected to the bottom of the fixing block, and the inner side of the triangular reinforcing plate is fixedly connected to the outer side of the placement frame.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] 1. This utility model, when dispensing adhesive to a chip, places the chip on top of a placement rack, drives an electric cylinder, which moves a linkage plate upward, which in turn moves a lifting plate upward, which in turn moves a lifting column upward, which in turn moves a flipping block inward, and the flipping block moves a rotating plate inward while simultaneously moving a pressing block downward. When the pressing block contacts the top of the chip, the chip is pressed and fixed. A motor drives a transmission screw to move a moving block left and right, which in turn moves an electric telescopic column and a dispensing tube left and right, and the electric telescopic column moves the dispensing tube back and forth to dispense adhesive to the chip. This provides the advantage of convenient chip dispensing. Through the combined use of the linkage lifting mechanism and the flipping pressing mechanism, the chip can be quickly pressed and fixed without shifting during dispensing, reducing the dispensing time.

[0016] 2. By setting up a linkage lifting mechanism, this utility model can drive the flipping and pressing mechanism to flip, effectively avoiding the situation where the flipping and pressing mechanism cannot move during use, effectively improving the stability of the flipping and pressing mechanism and making it easier for users to use. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a perspective view of the placement rack of this utility model;

[0019] Figure 3 This is a perspective view of the lifting plate of this utility model.

[0020] In the diagram: 1. Base plate; 2. Fixing frame; 3. Motor; 4. Transmission screw; 5. Moving block; 6. Electric telescopic column; 7. Dispensing tube; 8. Placement rack; 9. Linkage lifting mechanism; 91. Electric cylinder; 92. Linkage plate; 93. Support frame; 94. Lifting plate; 95. Limiting block; 10. Tilting and pressing mechanism; 101. Tilting block; 102. Pressing block; 103. Rotary plate; 104. Fixing block; 105. Lifting column; 11. Sponge pad; 12. Rubber pad; 13. Reinforcing sleeve; 14. Triangular reinforcing plate. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figures 1 to 3 As shown, the present invention provides a dispensing device for integrated circuit chips, including a base plate 1, a fixed frame 2 fixedly connected to the top of the base plate 1, a motor 3 fixedly installed on the top left side of the fixed frame 2, a transmission screw 4 fixedly connected to the output end of the motor 3, a moving block 5 threadedly connected to the surface of the transmission screw 4, an electric telescopic column 6 fixedly connected to the front side of the moving block 5, a dispensing tube 7 fixedly connected to the front side of the electric telescopic column 6, a placement frame 8 fixedly installed on the top of the base plate 1, a linkage lifting mechanism 9 provided inside the placement frame 8, and a flipping and pressing mechanism 10 provided outside the linkage lifting mechanism 9.

[0023] The linkage lifting mechanism 9 is used to drive the flipping and pressing mechanism 10 to flip;

[0024] The flip-and-press mechanism 10 is used to press the chip.

[0025] refer to Figure 3 The linkage lifting mechanism 9 includes an electric cylinder 91 and a linkage plate 92. The output end of the electric cylinder 91 is fixedly connected to the top of the linkage plate 92. A support frame 93 is fixedly connected to the surface of the electric cylinder 91. The top of the support frame 93 is fixedly connected to the top of the inner side of the placement frame 8. Lifting plates 94 are fixedly connected to the front and rear sides of the bottom of the linkage plate 92. A limit block 95 is provided at the bottom of the lifting plate 94. The bottom of the limit block 95 is fixedly connected to the top of the base plate 1.

[0026] As a technical optimization of this utility model, by setting up a linkage lifting mechanism 9, the flipping pressing mechanism 10 can be driven to flip, which effectively avoids the situation that the flipping pressing mechanism 10 cannot move during use, effectively improves the stability of the flipping pressing mechanism 10 and makes it easier for users to use.

[0027] refer to Figure 3 The flipping and pressing mechanism 10 includes a flipping block 101 and a pressing block 102. The bottom of the inner side of the flipping block 101 is fixedly connected to the top of the pressing block 102. The outer side of the flipping block 101 is movably connected to a rotating plate 103 via a pin. The bottom of the inner side of the rotating plate 103 is movably connected to a fixing block 104 via a pin. The inner side of the fixing block 104 is fixedly connected to the top of the outer side of the placement rack 8. The inner side of the outer side of the flipping block 101 is movably connected to a lifting column 105 via a pin. The bottom of the lifting column 105 is fixedly connected to the top of the outer side of the lifting plate 94.

[0028] As a technical optimization of this utility model, by setting the flipping and pressing mechanism 10, the chip can be pressed, which effectively prevents the chip from shifting during dispensing, effectively improves the stability of the chip, and makes it easier to use.

[0029] refer to Figure 2A sponge pad 11 is fixedly installed at the bottom of the clamping block 102, and the bottom of the sponge pad 11 contacts the top of the chip.

[0030] As a technical optimization of this utility model, by setting the sponge pad 11, the top of the chip can be protected, effectively avoiding wear of the chip during pressing, effectively improving the chip dispensing integrity rate, and facilitating use.

[0031] refer to Figure 2 A rubber pad 12 is fixedly installed on the top of the placement rack 8, and the top of the rubber pad 12 contacts the bottom of the chip.

[0032] As a technical optimization of this utility model, by setting the rubber pad 12, the friction on the bottom of the chip can be increased, which effectively prevents the chip from shaking, effectively improves the placement stability of the chip, and makes it easier to use.

[0033] refer to Figure 2 A reinforcing sleeve 13 is fixedly connected to the surface of the output end of the electric cylinder 91, and the bottom of the reinforcing sleeve 13 is fixedly connected to the top of the linkage plate 92.

[0034] As a technical optimization of this utility model, by setting the reinforcing sleeve 13, the electric cylinder 91 and the linkage plate 92 can be reinforced, effectively preventing loosening between the electric cylinder 91 and the linkage plate 92, effectively improving the stability between the electric cylinder 91 and the linkage plate 92, and facilitating use.

[0035] refer to Figure 2 The bottom of the fixing block 104 is fixedly connected to a triangular reinforcing plate 14, and the inner side of the triangular reinforcing plate 14 is fixedly connected to the outer side of the placement frame 8.

[0036] As a technical optimization of this utility model, by setting the triangular reinforcing plate 14, the fixing block 104 can be reinforced, effectively preventing the fixing block 104 from shaking, effectively improving the stability of the fixing block 104, and making it easy to use.

[0037] The working principle and usage process of this utility model are as follows: When dispensing adhesive to a chip, the chip is placed on top of the placement rack 8. The electric cylinder 91 is driven, which drives the linkage plate 92 to move upward. The linkage plate 92 drives the lifting plate 94 to move upward. The lifting plate 94 drives the lifting column 105 to move upward. The lifting column 105 drives the flipping block 101 to flip inward. The flipping block 101 drives the rotating plate 103 to flip inward, while the flipping block 101 drives the pressing block 102 to move downward. When the pressing block 102 contacts the top of the chip, the chip is pressed and fixed. The motor 3 drives the transmission screw 4 to move the moving block 5 left and right. The moving block 5 drives the electric telescopic column 6 and the dispensing tube 7 to move left and right. The electric telescopic column 6 drives the dispensing tube 7 to move back and forth to dispense adhesive to the chip, thus providing the advantage of convenient chip dispensing.

[0038] In summary, this integrated circuit chip dispensing equipment, through the coordinated use of a base plate 1, a fixing frame 2, a motor 3, a transmission screw 4, a moving block 5, an electric telescopic column 6, a dispensing tube 7, a placement rack 8, a linkage lifting mechanism 9, and a flipping and pressing mechanism 10, solves the problem of chip misalignment during dispensing. Previously, when dispensing chips, the chip was placed directly on top of the worktable, and the motor moved the dispensing frame, which in turn moved the dispensing tube to dispense the chip. This caused dispensing failure, requiring the chip to be repositioned and the dispensing process to be repeated, which was inconvenient and increased the dispensing time.

[0039] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A dispensing apparatus for integrated circuit chips, comprising a base plate (1), characterized in that: The top of the bottom plate (1) is fixedly connected with a fixing frame (2), the top of the left side of the fixing frame (2) is fixedly installed with a motor (3), the output end of the motor (3) is fixedly connected with a transmission screw rod (4), the surface of the transmission screw rod (4) is threadedly connected with a moving block (5), the front side of the moving block (5) is fixedly connected with an electric telescopic column (6), the front side of the electric telescopic column (6) is fixedly connected with a point gluing pipe (7), the top of the bottom plate (1) is fixedly installed with a placing frame (8), the inner side of the placing frame (8) is provided with a linkage lifting mechanism (9), and the outer side of the linkage lifting mechanism (9) is provided with a turnover compression mechanism (10). The linkage lifting mechanism (9) is used for driving the turnover compression mechanism (10) to turn over; The turnover compression mechanism (10) is used for compressing the chip.

2. The point glue device for integrated circuit chip according to claim 1, characterized in that: The linkage lifting mechanism (9) comprises an electric cylinder (91) and a linkage plate (92), the output end of the electric cylinder (91) is fixedly connected to the top of the linkage plate (92), the surface of the electric cylinder (91) is fixedly connected with a support frame (93), the top of the support frame (93) is fixedly connected to the top of the inner side of the placing frame (8), and the front side and the rear side of the bottom of the linkage plate (92) are fixedly connected with lifting plates (94).

3. The point glue device for integrated circuit chip according to claim 2, characterized in that: The turnover compression mechanism (10) comprises a turnover block (101) and a compression block (102), the bottom of the inner side of the turnover block (101) is fixedly connected to the top of the compression block (102), the outer side of the turnover block (101) is movably connected with a rotating plate (103) through a pin shaft, the bottom of the inner side of the rotating plate (103) is movably connected with a fixed block (104) through a pin shaft, the inner side of the fixed block (104) is fixedly connected to the top of the outer side of the placing frame (8), and the inner side of the outer side of the turnover block (101) is movably connected with a lifting column (105) through a pin shaft.

4. The point glue device for integrated circuit chip according to claim 3, characterized in that: The bottom of the compression block (102) is fixedly installed with a sponge pad (11), and the bottom of the sponge pad (11) is in contact with the top of the chip.

5. The point glue device for integrated circuit chip according to claim 1, characterized in that: The top of the placing frame (8) is fixedly installed with a rubber pad (12), and the top of the rubber pad (12) is in contact with the bottom of the chip.

6. The point glue device for integrated circuit chip according to claim 2, characterized in that: The surface of the output end of the electric cylinder (91) is fixedly connected with a reinforcing sleeve (13), and the bottom of the reinforcing sleeve (13) is fixedly connected to the top of the linkage plate (92).

7. The point glue device for integrated circuit chip according to claim 3, characterized in that: The bottom of the fixed block (104) is fixedly connected with a triangular reinforcing plate (14), and the inner side of the triangular reinforcing plate (14) is fixedly connected to the outer side of the placing frame (8).

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