Chip removal channel combined structure and coated abrasive tool
By designing a connected chip removal channel structure and an anti-clogging coating for the coated abrasive, the problem of insufficient chip removal performance during grinding is solved, achieving efficient chip removal and extended abrasive life, and making it suitable for various grinding conditions.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-21
- Publication Date
- 2026-04-03
AI Technical Summary
Existing coated abrasives have insufficient chip removal performance during grinding, especially under conditions without a negative pressure dust collection system, which leads to chip accumulation, affecting grinding quality and abrasive life.
Design a chip removal channel combination structure, including at least two types of chip removal channels with different directions, which are interconnected and unobstructed. The centerlines of adjacent channels intersect to form an intersection point. The channels are straight or curved. Combined with an anti-clogging coating, the abrasive is adsorbed onto the base adhesive by electrostatic or gravity sand planting.
It improves chip removal efficiency, prevents chip accumulation, extends grinding wheel life, enhances grinding performance, and is suitable for various grinding conditions.
Smart Images
Figure CN224074145U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of coated abrasive technology, and in particular to a chip removal channel combination structure and a coated abrasive. Background Technology
[0002] In the grinding process, timely and effective removal of grinding chips is crucial for improving grinding quality and extending the service life of grinding tools. Existing coated abrasives have made progress in improving chip removal performance, such as adding anti-clogging coatings, physically drilling holes in the coated abrasive or incorporating mesh in the substrate, and using modular designs of different shapes.
[0003] In actual grinding processes, there are many conditions where negative pressure dust collection systems are not yet used. When using vibratory, rotary, or belt grinding machines, the original chip removal schemes with chip removal holes cannot fully play their chip removal role during grinding. Adding anti-clogging coatings is not effective in all conditions and also increases production and processing costs. Different shaped module designs focus more on the shape of the module clusters, which are mostly relatively simple and regular, and still have shortcomings in terms of actual chip removal effect and corresponding grinding accuracy.
[0004] The information disclosed in this background section is intended only to enhance the understanding of the general background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content
[0005] This invention provides a chip removal channel assembly structure and a coated abrasive, thereby effectively solving the problems in the background art.
[0006] To achieve the above objectives, the technical solution adopted by this utility model is: a chip removal channel assembly structure, comprising:
[0007] At least two types of chip removal channels with different numbers of directions, one of which is at least three-way, the chip removal channels being disposed between the abrasive particles and interconnected without obstruction;
[0008] The centerlines of adjacent chip removal channels intersect to form an intersection point, and the chip removal channels between adjacent intersection points are either straight lines or curves.
[0009] Furthermore, the chip removal channel includes a three-way chip removal channel and a six-way chip removal channel. The centerlines of the three-way chip removal channels intersect each other at 120°, and the centerlines of the six-way chip removal channels intersect each other at 60°.
[0010] Furthermore, the three-way chip removal channels and the six-way chip removal channels are arranged alternately, and the intersection of the three-way chip removal channels is connected to the intersection of three six-way chip removal channels, and the intersection of the six-way chip removal channels is connected to the intersection of six three-way chip removal channels.
[0011] Furthermore, the length of the channel between the intersection of two adjacent chip removal channels is 0.1~60mm, preferably 0.5~30mm; more preferably 2~15mm;
[0012] The width of the channel between the intersection of two adjacent chip removal channels is 0.1~20mm; preferably 0.2~10mm; more preferably 0.5~5mm.
[0013] Furthermore, the width of the chip removal channel includes one or more width specifications.
[0014] This utility model also includes a coating abrasive, comprising:
[0015] A substrate and an adhesive disposed on at least one surface of the substrate;
[0016] The base adhesive avoids the chip removal channel assembly structure as described above, and the base adhesive is provided with abrasive.
[0017] The adhesive layer covers the chip removal channel assembly and the abrasive.
[0018] Furthermore, in addition to the adhesive coating at the abrasive and chip removal channel assembly structure, an anti-clogging coating is also provided.
[0019] Furthermore, the chip removal channel assembly structure occupies 8-85% of the unit area of the coated abrasive including the abrasive surface; preferably 25-70%; more preferably 30-50%.
[0020] Furthermore, the abrasive is one or more of the following: alumina, silicon carbide, zirconium corundum, diamond, cubic boron nitride, etc.
[0021] Furthermore, the abrasive is adsorbed onto the base adhesive by electrostatic or gravity-based abrasive application.
[0022] The beneficial effects of this invention are as follows: by setting the chip removal channels to be interconnected and unobstructed, the centerlines of adjacent chip removal channels intersect to form chip removal channel intersection points, and the chip removal channels between adjacent intersection points are straight lines or curves. This structure can improve chip removal efficiency, prevent grinding debris accumulation, extend grinding wheel life, and enhance grinding performance, and is suitable for various grinding conditions. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1 This is a schematic diagram of the chip removal channel;
[0025] Figure 2 This is a schematic diagram of a three-way chip removal channel;
[0026] Figure 3 This is a schematic diagram of a six-way chip removal channel. Detailed Implementation
[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0028] Example 1:
[0029] like Figure 1 As shown: A chip removal channel assembly structure, comprising:
[0030] At least two types of chip removal channels with different numbers of directions, one of which is at least three-way, the chip removal channels are located between the abrasive particles and are interconnected without obstruction;
[0031] The centerlines of adjacent chip removal channels intersect to form an intersection point, and the chip removal channels between adjacent intersection points are either straight lines or curves.
[0032] Figure 1 This is a schematic diagram of the chip removal channel for abrasive-coated surfaces, where black represents the chip removal channel.
[0033] By configuring the chip removal channels to be interconnected and unobstructed, the centerlines of adjacent chip removal channels intersect to form chip removal channel intersection points, and the chip removal channels between adjacent intersection points are either straight lines or curves. This structure can improve chip removal efficiency, prevent grinding debris accumulation, extend grinding wheel life, and enhance grinding performance, making it suitable for various grinding conditions.
[0034] like Figure 2 and 3 As shown, in this embodiment, the chip removal channel includes a three-way chip removal channel and a six-way chip removal channel. The center lines of the three-way chip removal channels intersect each other at 120°, and the center lines of the six-way chip removal channels intersect each other at 60°.
[0035] The three-way chip removal channels and the six-way chip removal channels are arranged alternately. The intersection of the three-way chip removal channels is connected to the intersection of three six-way chip removal channels, and the intersection of the six-way chip removal channels is connected to the intersection of six three-way chip removal channels.
[0036] As a preferred embodiment of the above embodiment, the length of the channel between the intersection of two adjacent chip removal channels is 0.1~60mm, preferably 0.5~30mm; more preferably 2~15mm;
[0037] The width of the channel between the intersection of two adjacent chip removal channels is 0.1~20mm; preferably 0.2~10mm; more preferably 0.5~5mm.
[0038] In this embodiment, the width of the chip removal channel includes one or more width specifications.
[0039] This embodiment also includes a coating abrasive, comprising:
[0040] A substrate and a primer disposed on at least one surface of the substrate;
[0041] The base adhesive avoids the chip removal channel assembly structure as described above, and abrasive is provided on the base adhesive;
[0042] The adhesive layer covers the chip removal channel assembly and the abrasive.
[0043] In addition to the adhesive coating at the abrasive and chip removal channel combination structure, an anti-clogging coating is also provided.
[0044] The chip removal channel assembly structure occupies 8-85% of the unit area of the coated abrasive containing the abrasive surface; preferably 25-70%; more preferably 30-50%.
[0045] As a preferred embodiment of the above, the abrasive is one or more combinations of alumina, silicon carbide, zirconium corundum, diamond, cubic boron nitride, etc.
[0046] In this embodiment, the abrasive is adsorbed onto the base adhesive by electrostatic or gravity-based abrasive application.
[0047] Example 2:
[0048] This embodiment discloses a coated abrasive, such as Figure 1 As shown, the surface containing the abrasive is equipped with interconnected and unobstructed three-way and six-way chip removal channels. The centerlines of adjacent chip removal channels intersect to form chip removal channel intersection points, and the chip removal channels between adjacent intersection points are either straight lines or curves. This structure can improve chip removal efficiency, prevent abrasive chip accumulation, extend grinding wheel life, and enhance grinding performance, making it suitable for various grinding conditions.
[0049] like Figure 2and Figure 3 As shown, the centerlines of the three-way chip removal channels intersect, and the angle between the centerlines of adjacent channels is 120°; the centerlines of the six-way chip removal channels intersect, and the angle between the centerlines of adjacent channels is 60°.
[0050] The three-way chip removal channel intersection point A and the six-way chip removal channel intersection point B are arranged alternately: the three-way chip removal channel intersection point A is connected to 3 six-way chip removal channel intersection points B, and the six-way chip removal channel intersection point B is connected to 6 three-way chip removal channel intersection points A.
[0051] The length of the channel between the intersection of two adjacent chip removal channels is 0.1~60mm; preferably 0.5~30mm; more preferably 2~15mm.
[0052] The width of the channel between the intersection of two adjacent chip removal channels is 0.1~20mm; preferably 0.2~10mm; more preferably 0.5~5mm.
[0053] The chip removal channel width has at least one specification, or can have multiple specifications; the chip removal channel is relatively unobstructed and has no obvious blockage.
[0054] The chip removal channel occupies 8-85% of the unit area of the abrasive-containing surface of the coated abrasive; preferably 25-70%; more preferably 30-50%.
[0055] The chip removal channel is achieved through a special patterned rubber roller during the base coat application process;
[0056] Coated abrasives consist of a substrate, a primer, an abrasive, and a top coat.
[0057] Coated abrasives consist of a substrate, a primer, abrasive, a top coat, and a coating layer.
[0058] The matrix can be a single layer or composed of multiple layers;
[0059] The matrix is composed of textile fibers, non-woven fibers, thin metal sheets, plastic films, sponges, etc.; it can be common fabric-based, paper-based, plastic film, non-woven fabric, sponge, steel paper, thin steel sheets, etc.
[0060] The base adhesive may be applied to at least one side of the substrate, or to multiple surfaces of the substrate; in general roll products, it is preferably applied to one side of the substrate; in sponge-like block products, it is preferably applied to four or six sides of the substrate.
[0061] The base adhesive is applied by roller coating and is not distributed in the chip removal channel;
[0062] The abrasive is adsorbed onto the base layer by electrostatic or gravity-based abrasive application; electrostatic abrasive application is preferred.
[0063] Abrasives can be single particles or combinations of multiple particles; corresponding abrasives can be one or more of the following: alumina, silicon carbide, zirconium corundum, diamond, cubic boron nitride, etc.
[0064] The abrasive particles are not clearly distributed in the chip removal channel;
[0065] The coating is applied or sprayed onto the abrasive after it is used, and it is distributed in the chip removal channel and on the surface of the abrasive.
[0066] The coating is applied by brushing or spraying after the adhesive is applied. It further enhances the anti-clogging effect.
[0067] Example 3:
[0068] This embodiment describes in detail the specific steps and methods for manufacturing and using the coated abrasive.
[0069] Method 1:
[0070] Using 110g / ㎡ blue latex paper as the substrate, and selecting a roller with a channel length of 7mm and a channel width of 0.8mm between the intersections of two adjacent chip removal channels, a 40g / ㎡ epoxy resin primer is applied, followed by 160g / ㎡ of electrostatically coated 100# high-temperature calcined alumina abrasive. The mixture is dried at 70~100℃ for 30min, then coated with 100g / ㎡ water-soluble phenolic resin, dried at 70~100℃ for 120min and then at 110℃ for 6h. Finally, a 40g / ㎡ water-based coating is applied by roller coating and dried at 70~90℃ for 20min to obtain the finished product.
[0071] Method 2:
[0072] Using 160g / ㎡ pure cotton cloth as the base material, a rubber roller with a channel length of 20mm and a channel width of 1.2mm between the intersections of two adjacent chip removal channels was selected. A water-soluble phenolic resin primer of 90g / ㎡ was applied, followed by electrostatic sanding with 270g / ㎡ of 120# high-temperature calcined alumina abrasive. The mixture was dried at 70~100℃ for 50min, then coated with 130g / ㎡ of water-soluble phenolic resin, dried at 70~100℃ for 120min, and finally dried at 118℃ for 8h to obtain the finished product.
[0073] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.
[0074] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0075] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0076] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. A chip evacuation channel assembly, comprising: The application relates to a combination structure of chip removal channels and abrasives. At least two chip removal channels are provided, wherein one of the chip removal channels is at least three-directional, the chip removal channels are arranged between abrasives and are in communication with each other without interruption. Midlines of adjacent chip removal channels intersect to form intersection points, and the chip removal channels between adjacent intersection points are in a straight line or curve.
2. The chip escape channel combination of claim 1, wherein, The chip removal channels include three-directional chip removal channels and six-directional chip removal channels, midlines of the three-directional chip removal channels intersect each other at an angle of 120 DEG, and midlines of the six-directional chip removal channels intersect each other at an angle of 60 DEG.
3. The chip escape channel combination of claim 2, wherein, The three-directional chip removal channels and the six-directional chip removal channels are arranged alternately, the intersection points of the three-directional chip removal channels are connected with three intersection points of the six-directional chip removal channels, and the intersection points of the six-directional chip removal channels are connected with six intersection points of the three-directional chip removal channels.
4. The combination of chip escape passages according to claim 1, characterized in that The length of the channel between the intersection points of two adjacent chip removal channels is 0.1-60 mm. The width of the channel between the intersection points of two adjacent chip removal channels is 0.1-20 mm.
5. The combination of chip escape passages according to claim 1, wherein The length of the channel between the intersection points of two adjacent chip removal channels is 0.5-30 mm. The width of the channel between the intersection points of two adjacent chip removal channels is 0.2-10 mm.
6. The combination of chip escape passages according to claim 1, wherein The length of the channel between the intersection points of two adjacent chip removal channels is 2-15 mm. The width of the channel between the intersection points of two adjacent chip removal channels is 0.5-5 mm.
7. The chip escape channel combination of claim 4, wherein, The width of the chip removal channel includes one or more width specifications.
8. A coated abrasive, characterized by, The application relates to a coated abrasive tool. A base body and a primer arranged on at least one surface of the base body; The primer is arranged on the combination structure of the chip removal channels and the abrasives. A top coat arranged on the combination structure of the chip removal channels and the abrasives.
9. The coated abrasive according to claim 8, wherein, An anti-blocking coating is arranged on the combination structure of the chip removal channels and the abrasives.
10. The coated abrasive according to claim 8, wherein The combination structure of the chip removal channels accounts for 8-85% of the unit area of the abrasive tool.
11. The coated abrasive according to claim 8, wherein The combination structure of the chip removal channels accounts for 25-70% of the unit area of the abrasive tool.
12. The coated abrasive according to claim 8, wherein The combination structure of the chip removal channels accounts for 30-50% of the unit area of the abrasive tool.
13. The coated abrasive according to claim 8, wherein The abrasives are one or more combinations of alumina, silicon carbide, zirconia alumina, diamond and cubic boron nitride.
14. The coated abrasive of claim 8 wherein, The abrasives are adsorbed on the primer by electrostatic sanding or gravity sanding.