Conductive adhesive tape and production line
By introducing a positioning layer and setting through holes in the conductive tape, the positioning problem of the conductive tape when used with external equipment is solved, improving the convenience and accuracy of application and ensuring processing precision.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-08
- Publication Date
- 2026-04-03
AI Technical Summary
Existing conductive tapes lack positioning functionality when used with external devices, resulting in insufficient ease and accuracy of application.
A conductive tape is designed, comprising a positioning layer, a release layer and a conductive layer stacked sequentially along a first direction. The positioning layer has through holes for positioning with external devices, and the conductive layer includes a conductive adhesive layer and a conductive dielectric layer. The positioning function of the positioning layer is realized through the through holes.
This improves the ease of use of conductive tape and the accuracy of the conductive layer's adhesion to the substrate, ensuring processing precision.
Smart Images
Figure CN224077280U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of conductive tape technology, and more particularly to a conductive tape and a production line. Background Technology
[0002] Conductive tape is a product that makes a conductive medium into a conductive strip. In practical applications, conductive tape forms a conductive bridge, enabling electrical bonding of the adhered materials and electrical sealing of gaps. It is widely used in production lines that require electrical connections.
[0003] However, despite the excellent conductivity of conductive tape, in practical applications, the lack of positioning function of conductive tape makes it difficult to position the conductive tape when used with external equipment, affecting the convenience and accuracy of bonding the conductive tape to the materials being adhered. Utility Model Content
[0004] In view of the above problems, embodiments of this application provide a conductive tape and a production line, which overcomes or at least partially solves the above problems.
[0005] According to one aspect of the present application, a conductive tape is provided, comprising a positioning layer, a release layer and a conductive layer stacked sequentially along a first direction. The positioning layer is provided with a through hole that penetrates the positioning layer along the first direction and is used for positioning with an external device. The conductive layer comprises a conductive adhesive layer and a conductive dielectric layer stacked along the first direction, and the conductive adhesive layer is adhered to the release layer.
[0006] In one alternative approach, the thickness of the positioning layer along the first direction is between 80 micrometers and 90 micrometers.
[0007] In one alternative embodiment, the conductive dielectric layer comprises a copper foil layer.
[0008] In one alternative embodiment, the peel force between the conductive layer and the release layer is greater than the peel force between the release layer and the positioning layer.
[0009] In one alternative approach, there are multiple through holes distributed in the positioning layer.
[0010] In one alternative approach, the thickness of the conductive layer along the first direction is between 25 micrometers and 35 micrometers.
[0011] In one alternative embodiment, the release layer includes a mesh release layer on the side facing the conductive layer, the mesh release layer being adhered to the conductive adhesive layer.
[0012] In one alternative embodiment, the release layer further includes a second antistatic layer, a second substrate layer, and a third antistatic layer, wherein the third antistatic layer, the second substrate layer, the second antistatic layer, and the mesh release layer are stacked sequentially.
[0013] In one alternative embodiment, the conductive tape further includes a dustproof layer, wherein the positioning layer, release layer, conductive layer and dustproof layer are stacked sequentially along the first direction, and the side of the dustproof layer away from the conductive layer includes a first antistatic layer.
[0014] According to one aspect of the embodiments of this application, a production line is provided, including the aforementioned conductive tape.
[0015] The beneficial effects of this application embodiment include: providing a conductive tape comprising a positioning layer, a release layer, and a conductive layer stacked sequentially along a first direction; the positioning layer having through holes penetrating the positioning layer along the first direction and used for positioning with an external device; the conductive layer comprising a conductive adhesive layer and a conductive dielectric layer stacked along the first direction, the conductive adhesive layer being adhered to the release layer. With this conductive tape and the positioning layer, when using the conductive tape, the positioning layer can be positioned with the external device through the through holes, thereby improving the convenience of using the conductive tape and the accuracy of the conductive layer's adhesion to the bonded material, ensuring processing precision. Attached Figure Description
[0016] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.
[0017] Figure 1 This is a cross-sectional view of the conductive tape provided in the embodiments of this application;
[0018] Figure 2 This is a cross-sectional view of another implementation of the conductive tape provided in the embodiments of this application;
[0019] Figure 3 This is a cross-sectional view of another implementation of the conductive tape provided in the embodiments of this application.
[0020] The attached figures are labeled as follows:
[0021] 100. Conductive tape;
[0022] 10. Positioning layer; 20. Release layer; 30. Conductive layer; 40. Dustproof layer;
[0023] 11. Positioning part; 11s. Through hole;
[0024] 101. Fourth antistatic layer; 102. Third substrate layer; 103. Second silicone pressure-sensitive adhesive layer;
[0025] 201. Third antistatic layer; 202. Second substrate layer; 203. Second antistatic layer; 204. Mesh release layer;
[0026] 301, conductive adhesive layer; 302, conductive dielectric layer;
[0027] 401. First silicone pressure-sensitive adhesive layer; 402. First substrate layer; 403. First antistatic layer. Detailed Implementation
[0028] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly attached to the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and similar expressions used in this specification are for illustrative purposes only.
[0029] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0030] Please see Figure 1 This application provides a conductive tape 100, which includes a positioning layer 10, a release layer 20, a conductive layer 30 and a dustproof layer 40 stacked sequentially along a first direction. The positioning layer 10 is used for positioning, the release layer 20 is used for release transfer, the conductive layer 30 is used for conduction, and the dustproof layer 40 is used to prevent dust from the conductive layer 30.
[0031] For the aforementioned positioning layer 10, the positioning layer 10 is provided with a positioning part 11, which is used for positioning the positioning layer 10 with external devices.
[0032] In one implementation of this application, the positioning part 11 is provided with a through hole 11s, which penetrates the positioning layer 10 along the first direction. The through hole 11s is used for positioning with the external device. For example, the positioning layer 10 is attached to the positioning post of the mold through the through hole 11s to achieve positioning.
[0033] In one implementation of this application, there are multiple through holes 11s, which are distributed in the positioning layer 10 to improve the positioning effect of the through holes 11s on the conductive tape 100 and improve the convenience and accuracy of using the conductive tape 100.
[0034] Preferably, the number of through holes 11s is 3.
[0035] It is worth noting that in some embodiments, the positioning layer 10 may not have the positioning part 11, but may directly have the through hole 11s, which can also achieve the positioning function of the positioning layer 10.
[0036] In one implementation of this application, the thickness of the positioning layer 10 along the first direction is between 80 micrometers and 90 micrometers. By limiting the thickness of the positioning layer 10, a certain rigidity is ensured, guaranteeing its ability to support the release layer 20, conductive layer 30, and dustproof layer 40 stacked upon it. If the positioning layer 10 is too thin, its ability to support the release layer 20, conductive layer 30, and dustproof layer 40 will be insufficient. If the positioning layer 10 is too thick, it will easily separate from the release layer 20, which is detrimental to the storage and use of the conductive adhesive layer 301.
[0037] In one implementation of this application, the positioning layer 10 includes a fourth antistatic layer 101, a third substrate layer 102, and a second silicone pressure-sensitive adhesive layer 103 stacked sequentially along the first direction. The second silicone pressure-sensitive adhesive layer 103 is adhered to the release layer 20, and the fourth antistatic layer 101 is disposed facing away from the release layer 20.
[0038] In one implementation of this application, the third substrate layer 102 is made of PET (Polyethylene terephthalate).
[0039] In one implementation of this application, the impedance of the fourth antistatic layer 101 is between 10 to the power of 6 and 10 to the power of 11 ohms, ensuring that the fourth antistatic layer 101 has good antistatic and dustproof functions.
[0040] For example, the impedance of the fourth antistatic layer 101 is 5.7*E6 ohms.
[0041] It is worth noting that the resistance or impedance mentioned in this application can be tested using a surface resistance meter.
[0042] In one implementation of the release layer 20 described above, the thickness of the release layer 20 along the first direction is between 95 micrometers and 105 micrometers to ensure the release function of the release layer 20.
[0043] In one implementation of this application, the release layer 20 includes a third antistatic layer 201, a second substrate layer 202, a second antistatic layer 203, and a mesh release layer 204, which are sequentially stacked along the first direction. The mesh release layer 204 is adhered to the conductive layer 30, and the third antistatic layer 201 is adhered to the positioning layer 10. When the positioning layer 10 includes a second silicone pressure-sensitive adhesive layer 103, the third antistatic layer 201 is adhered to the second silicone pressure-sensitive adhesive layer 103.
[0044] In one implementation of this application, the material of the second substrate layer 202 is PET (Polyethylene terephthalate).
[0045] In one implementation of this application, the impedance of both the second antistatic layer 203 and the third antistatic layer 201 is between 10 to the power of 6 and 10 to the power of 11 ohms, ensuring that the second antistatic layer 203 and the third antistatic layer 201 have good antistatic and dustproof functions.
[0046] For example, the impedance of the second antistatic layer 203 is 7.8*E9 ohms, and the impedance of the third antistatic layer 201 is 6.4*E9 ohms.
[0047] The conductive layer 30 includes a conductive adhesive layer 301 and a conductive dielectric layer 302 stacked along the first direction. The conductive adhesive layer 301 is adhered to the release layer 20, and the dustproof layer 40 covers the conductive dielectric layer 302. When the release layer 20 includes the mesh release layer 204, the conductive adhesive layer 301 is adhered to the mesh release layer 204.
[0048] In one implementation of this application, the thickness of the conductive layer 30 along the first direction is between 25 micrometers and 35 micrometers. A thicker conductive layer 30 results in higher costs, while a thinner conductive layer 30 increases processing difficulty and affects product yield.
[0049] In one implementation of this application, the resistance of the conductive adhesive layer 301 is within 10³ ohms, which can achieve the function of low-resistance conductivity.
[0050] For example, the resistance of the conductive adhesive layer 301 is 1.3*E2 ohms.
[0051] In one implementation of this application, the peel force between the conductive adhesive layer 301 and the conductive dielectric layer 302 can reach 780.9 g / inch, ensuring the stable adhesion performance of the conductive adhesive layer 301 to the conductive dielectric layer 302.
[0052] The method for testing the peel force between the conductive adhesive layer 301 and the conductive dielectric layer 302 is as follows: the conductive adhesive layer 301 is adhered to a stainless steel plate for 20 minutes, and then peeled at 300 mm / min and 180 degrees to measure the peel force.
[0053] The conductive dielectric layer 302 described above is a functional layer possessing conductive properties. The types of the conductive dielectric layer 302 are as follows:
[0054] Metal-filled type: This type uses a polymer matrix with added metal powders or fibers such as silver, copper, and nickel. Metals possess excellent electrical and thermal conductivity, effectively forming conductive and thermal pathways. They also reflect and absorb electromagnetic waves, achieving electromagnetic shielding. For example, silver-filled epoxy resin adhesives offer excellent electrical and thermal conductivity and good electromagnetic shielding, but are more expensive. Copper-filled adhesives are less expensive, but are prone to oxidation, which affects performance, often requiring anti-oxidation treatment.
[0055] Carbon-based filled type: This type uses carbon-based materials such as carbon nanotubes, graphene, and carbon black to fill the polymer matrix. Carbon nanotubes and graphene have excellent electrical and thermal properties, which can improve the electrical and thermal conductivity of the adhesive layer. They also have a certain absorption and scattering effect on electromagnetic waves, thus achieving electromagnetic shielding. Carbon black is inexpensive and can improve electrical and thermal conductivity to some extent, but its effect is not as good as that of carbon nanotubes and graphene.
[0056] Composite type: This type combines metallic and carbon-based filler materials, or employs a multi-layer structure, to integrate the advantages of multiple materials and achieve superior electrical conductivity, thermal conductivity, and electromagnetic shielding performance. For example, a carbon-based material is used in the bottom layer to improve adhesion to copper foil and initial electrical and thermal conductivity, while a metallic filler material is used in the top layer to enhance surface conductivity and electromagnetic shielding effect.
[0057] In one implementation of this application, the conductive dielectric layer 302 includes a copper foil layer.
[0058] The thickness of the aforementioned dustproof layer 40 is between 55 and 65 micrometers to ensure that it possesses a certain degree of rigidity. If the dustproof layer 40 is too thin, it will be too soft and lack sufficient dustproof function; if it is too thick, it is prone to delamination from the conductive layer 30. By limiting the thickness of the dustproof layer 40 along the first direction to between 55 and 65 micrometers, good adhesion between the dustproof layer 40 and the surface of the conductive layer 30 is ensured, reducing the risk of air bubbles forming during adhesion.
[0059] In one implementation of this application, along the first direction, the dustproof layer 40 includes a first silicone pressure-sensitive adhesive layer 401, a first substrate layer 402, and a first antistatic layer 403 stacked sequentially along the first direction. The first silicone pressure-sensitive adhesive layer 401 covers the conductive layer 30. When the conductive layer 30 includes the conductive dielectric layer 302, the first silicone pressure-sensitive adhesive layer 401 covers the conductive dielectric layer 302.
[0060] In one implementation of this application, the first substrate layer 402 is made of PET (Polyethylene terephthalate).
[0061] In one implementation of this application, the impedance of the first antistatic layer 403 is between 10 to the power of 6 and 10 to the power of 11 ohms, ensuring that the first antistatic layer 403 has good antistatic and dustproof functions.
[0062] For example, the impedance of the first antistatic layer 403 is 3.2*E7 ohms.
[0063] In one implementation of the positioning layer 10, release layer 20, conductive layer 30, and dustproof layer 40, the peel force between the dustproof layer 40 and the conductive layer 30 is less than the peel force between the release layer 20 and the conductive layer 30. This reduces the risk of the dustproof layer 40 wrinkling and deforming the conductive layer 30 when removing the dustproof layer 40, further ensuring the conductivity of the conductive layer 30.
[0064] When the dustproof layer 40 includes the first silicone pressure-sensitive adhesive layer 401, and the conductive layer 30 includes the conductive dielectric layer 302 and the conductive adhesive layer 301, the peel force between the first silicone pressure-sensitive adhesive layer 401 and the conductive dielectric layer 302 is less than the peel force between the release layer 20 and the conductive adhesive layer 301. When the release layer 20 includes the mesh release layer 204, the peel force between the first silicone pressure-sensitive adhesive layer 401 and the conductive dielectric layer 302 is less than the peel force between the mesh release layer 204 and the conductive adhesive layer 301.
[0065] In one implementation of this application, the peel force between the conductive layer 30 and the release layer 20 is greater than the peel force between the release layer 20 and the positioning layer 10. This positions the positioning layer 10 on the external device, reducing the risk of the positioning layer 10 pulling the conductive layer 30 away from its preset assembly position when the positioning layer 10 is removed.
[0066] When the conductive layer 30 includes the conductive dielectric layer 302 and the conductive adhesive layer 301, the release layer 20 includes the mesh release layer 204 and the third antistatic layer 201, and the positioning layer 10 includes the second silicone pressure-sensitive adhesive layer 103, then the peel force between the conductive adhesive layer 301 and the mesh release layer 204 is greater than the peel force between the third antistatic layer 201 and the second silicone pressure-sensitive adhesive layer 103.
[0067] In one implementation of this application, the peel force between the conductive adhesive layer 301 and the mesh release layer 204 is greater than the peel force between the third antistatic layer 201 and the second silicone pressure-sensitive adhesive layer 103; the peel force between the third antistatic layer 201 and the second silicone pressure-sensitive adhesive layer 103 is greater than the peel force between the first silicone pressure-sensitive adhesive layer 401 and the conductive dielectric layer 302; with this setting, the peel force between the third antistatic layer 201 and the second silicone pressure-sensitive adhesive layer 103... The peel force between the first silicone pressure-sensitive adhesive layer 401 and the conductive dielectric layer 302 is increased by creating a greater distance between them, reducing the risk of the conductive dielectric layer 302 being pulled up when the first silicone pressure-sensitive adhesive layer 401 is removed. At the same time, the peel force between the conductive adhesive layer 301 and the mesh release layer 204 is greater than the peel force between the third antistatic layer 201 and the second silicone pressure-sensitive adhesive layer 103, reducing the risk of the conductive layer 30 deviating from its assembly position when the positioning layer 10 is removed.
[0068] For example, the release force of the mesh release layer 204 is 2.8 g / inch, the peel force of the second silicone pressure-sensitive adhesive layer 103 is 1.1 g / inch, and the peel force of the first silicone pressure-sensitive adhesive layer 401 is 0.7 g / inch.
[0069] The release force of the mesh release layer 204 is tested as follows: the mesh release layer 204 is bonded to an adhesive tape (e.g., Tesa 7475 tape) for 20 minutes, and then peeled at 300 mm / min and 180 degrees to measure the release force of the mesh release layer 204.
[0070] The peel force test method for the second silicone pressure-sensitive adhesive layer 103 is as follows: the second silicone pressure-sensitive adhesive layer 103 is adhered to a stainless steel plate for 20 minutes, and then peeled at 300 mm / min and 180 degrees to measure the peel force.
[0071] The method for testing the peel strength of the first silicone pressure-sensitive adhesive layer 401 can refer to the method for testing the peel strength of the second silicone pressure-sensitive adhesive layer 103 described above.
[0072] In this embodiment, the conductive layer 30 is protected by the dustproof layer 40 in the conductive adhesive layer 301, thus preventing dust accumulation during storage or use and reducing the impact of dust on the conductivity of the conductive layer 30. Furthermore, since the peel force between the dustproof layer 40 and the conductive layer 30 is less than the peel force between the release layer 20 and the conductive layer 30, the risk of the dustproof layer 40 wrinkling or deforming the conductive layer 30 when removing it is reduced, further ensuring the conductivity of the conductive layer 30.
[0073] In addition, by setting the positioning layer 10, when using conductive tape 100, the positioning layer 10 can be positioned on the external device through the through hole 11s set in the positioning layer 10, thereby improving the convenience of using conductive tape 100 and the accuracy of the conductive layer 30 in sticking to the material, and ensuring processing precision.
[0074] It is worth noting that, in this application, if Figure 2 As shown, without the positioning layer 10, the conductive tape 100 only has a release layer 20, a conductive layer 30, and a dustproof layer 40, which can also achieve the dustproof function of the conductive tape 100; for example Figure 3 As shown, without the dustproof layer 40, the conductive tape 100 can still achieve the positioning function by only having the positioning layer 10, the release layer 20 and the conductive layer 30.
[0075] This application also provides an embodiment of a production line, which includes the conductive tape 100. For the specific structure and function of the conductive tape 100, please refer to the above embodiments; they will not be repeated here.
[0076] It should be noted that while preferred embodiments of this application are provided in the specification and accompanying drawings, this application can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are not intended to impose additional limitations on the content of this application; their purpose is to provide a more thorough and comprehensive understanding of the disclosure of this application. Furthermore, the above-described technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this application's specification. Moreover, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.
Claims
1. An electrically conductive adhesive tape, characterized by Comprising: a positioning layer, a release layer and a conductive layer stacked in sequence along a first direction, the positioning layer is provided with a through hole penetrating the positioning layer along the first direction, the through hole is used for positioning with an external device; the conductive layer comprises a conductive adhesive layer and a conductive medium layer stacked along the first direction, the conductive adhesive layer is attached to the release layer.
2. The conductive tape according to claim 1, wherein Along the first direction, the thickness of the positioning layer is between 80 microns and 90 microns.
3. The conductive tape according to claim 1, wherein The conductive medium layer comprises a copper foil layer.
4. The conductive tape according to claim 1, wherein The peeling force between the conductive layer and the release layer is greater than the peeling force between the release layer and the positioning layer.
5. The conductive tape according to claim 1, wherein The number of through holes is multiple, and multiple through holes are distributed in the positioning layer.
6. The conductive tape of claim 1, wherein Along the first direction, the thickness of the conductive layer is between 25 microns and 35 microns.
7. The conductive tape according to any one of claims 1 to 6, wherein The side of the release layer facing the conductive layer comprises a grid release layer, and the grid release layer is attached to the conductive adhesive layer.
8. The conductive tape according to claim 7, wherein The release layer further comprises a second anti-static layer, a second substrate layer and a third anti-static layer, and the third anti-static layer, the second substrate layer, the second anti-static layer, the grid release layer are stacked in sequence.
9. The conductive tape according to any one of claims 1 to 6, wherein The conductive adhesive tape further comprises a dustproof layer, and the positioning layer, the release layer, the conductive layer and the dustproof layer are stacked in sequence along the first direction, and the side of the dustproof layer away from the conductive layer comprises a first anti-static layer.
10. A production line, characterized in that, Comprising the conductive adhesive tape as claimed in any one of claims 1-9.