Temperature control device for chip testing

Abstract

The utility model provides a temperature control device for chip testing, which comprises a temperature control seat assembly, a plurality of groups of temperature control seats for providing a chip testing environment are arranged in the temperature control seat assembly, and one end, close to the center of the temperature control seat assembly, of each group of temperature control seats is fixedly connected with a group of temperature control pipes. Compared with the prior art, the temperature control base assembly and the cover plate assembly are additionally arranged, different chips are arranged on different temperature control bases and control the semiconductor chilling plate to complete different temperature adjustment, cold air is guided into the temperature control bases through the temperature control pipe, and heat generated by the semiconductor chilling plate is guided out in a centralized mode through the heat conduction pipe. According to temperature monitoring of the temperature control module, temperature auxiliary adjustment is carried out through the heat source auxiliary pipe, temperature auxiliary adjustment is also completed through the cold source auxiliary pipe, the cover plate assembly seals the opening of the temperature control base, the chip test temperature control convenience can be improved, and the chip in the single temperature control base can be taken by adding the cover plate assembly.

Description

Technical Field

[0001] This utility model belongs to the field of chip testing technology, and specifically relates to a temperature control device for chip testing. Background Technology

[0002] Chip testing refers to the process of verifying the functionality, performance, and reliability of a chip to ensure it meets design specifications and functions correctly in practical applications. Various chip testing methods and approaches exist, each capable of performing different performance tests to ensure compliance with the operating environment and requirements. The electrical performance, reliability, and stability of chips (especially integrated circuits) are highly sensitive to temperature. The core objective of temperature control is to verify performance indicators and screen for potential defects by simulating the temperature environments a chip may face throughout its entire lifecycle. Temperature control devices adjust the chip to the temperature environment under test for testing at different temperatures. Traditional temperature control devices, relying on water cooling, have complex overall structures, consume water resources due to circulation, and cannot easily distinguish between different temperature control zones, hindering convenient temperature control operations during chip testing.

[0003] In summary, we hope to propose a new structure to solve the aforementioned technical problems. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a temperature control device for chip testing, and solve the problems mentioned in the background art.

[0005] This utility model is achieved through the following technical solution: a temperature control device for chip testing, comprising: a temperature control base assembly, wherein the temperature control base assembly is provided with a plurality of temperature control bases for providing a chip testing environment, each set of temperature control bases is fixedly connected to a set of temperature control tubes at one end near the center of the temperature control base assembly, a semiconductor cooling chip for providing precise temperature control is installed inside the temperature control tubes, a guide fan for guiding cold air is also installed inside the temperature control tubes at one end near the temperature control base, a set of heat source auxiliary tubes for assisting temperature control is fixedly connected to one end of each set of temperature control bases away from the center of the temperature control base assembly, a set of cold source auxiliary tubes for assisting temperature control is fixedly connected to the outer side of the end of each set of heat source auxiliary tubes near the temperature control base, and a cover plate assembly is provided above the temperature control base, wherein the cover plate assembly is provided with a plurality of cover plate bodies.

[0006] In a preferred embodiment, a base is fixedly connected below the temperature control base, and a heat pipe for dissipating heat from the hot end of the thermoelectric cooler is fixedly connected to the center of the upper surface of the base. The heat pipe is interconnected with several sets of temperature control tubes. The thermoelectric cooler precisely adjusts the cooling temperature and guides it to the temperature control base through a flow fan. The heat generated by the thermoelectric cooler is concentratedly dissipated through the heat pipe.

[0007] In a preferred embodiment, the heat pipe is also interconnected with several sets of heat source auxiliary pipes. Each set of heat source auxiliary pipes and cold source auxiliary pipes is equipped with a set of solenoid valves for controlling the opening and closing of the pipes. The heat source auxiliary pipes and cold source auxiliary pipes are also interconnected.

[0008] In a preferred embodiment, a cold source branch pipe is fixedly connected below the cold source auxiliary pipe, and the cold source branch pipe is interconnected with an external cold source. A temperature control module for monitoring the temperature of the chip testing environment is installed inside the temperature control base. The temperature control module is a temperature sensor (a high-precision temperature sensor is selected, and the specific model can be any existing mature equipment on the market, as long as it meets the requirements of this utility model. Its related connection circuits and control methods all use existing technologies and will not be described in detail here). The heat source auxiliary pipe and the cold source auxiliary pipe are adjusted to introduce hot and cold air according to the temperature monitored by the temperature control module.

[0009] In a preferred embodiment, a set of electric telescopic rods for driving the cover plate assembly to rise and fall are fixedly connected to the upper surface of the base. The cover plate assembly is provided with a main seat plate, which is connected to the upper end of the electric telescopic rods.

[0010] In a preferred embodiment, a number of adjusting columns corresponding one-to-one with the temperature control seat are fixedly connected to the lower surface of the main seat plate. A cover plate body is provided below the adjusting columns. A sealing ring is fixedly connected to the outer side of the cover plate body. The chip is placed inside the temperature control seat, and the cover plate body is fitted with the temperature control seat, thereby improving the sealing performance of the sealing ring.

[0011] In a preferred embodiment, an adjusting push plate is movably disposed on the inner side of the adjusting column, and an adjusting spring is fixedly connected above the adjusting push plate.

[0012] In a preferred embodiment, a connecting column is fixedly connected below the adjusting push plate. The connecting column is fixedly connected to the cover plate body. After the chip in different temperature control seats is tested, the connecting column is pushed upward to compress the adjusting spring and cause the cover plate body to disengage from the temperature control seat.

[0013] After adopting the above technical solution, the beneficial effects of this utility model are:

[0014] 1. By adding a temperature control socket assembly and a cover plate assembly, different chips are placed in different temperature control sockets and the semiconductor cooling chip is controlled to complete different temperature adjustments. Cold air is guided into the temperature control socket through the temperature control tube, and the heat generated by the semiconductor cooling chip is concentratedly discharged through the heat conduction pipe. The temperature is assisted by the heat source auxiliary pipe and the cold source auxiliary pipe according to the temperature monitoring of the temperature control module. The cover plate assembly seals the opening of the temperature control socket, which can improve the convenience of temperature control for chip testing.

[0015] 2. By adding a cover plate assembly, the chip inside a single temperature control socket can be removed. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of a temperature control device for chip testing according to the present invention.

[0018] Figure 2 This is a schematic diagram of the temperature control base assembly in a temperature control device for chip testing according to the present invention.

[0019] Figure 3 This is a partial cross-sectional view of the temperature control base assembly in a temperature control device for chip testing according to the present invention.

[0020] Figure 4 This is a schematic diagram of the cover plate assembly in a temperature control device for chip testing according to the present invention.

[0021] Figure 5 This is a partial cross-sectional schematic diagram of the cover plate assembly in a temperature control device for chip testing according to the present invention.

[0022] In the diagram, 100-temperature control base assembly, 101-base, 102-heat pipe, 103-temperature control pipe, 104-semiconductor cooling chip, 105-airflow fan, 106-temperature control base, 107-heat source auxiliary pipe, 108-solenoid valve, 109-cold source auxiliary pipe, 110-cold source branch pipe, 111-electric telescopic rod;

[0023] 200-Cover plate assembly, 201-Main seat plate, 202-Adjusting column, 203-Adjusting spring, 204-Adjusting push plate, 205-Connecting column, 206-Cover plate body, 207-Sealing ring. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figures 1 to 5 The present invention provides a technical solution: a temperature control device for chip testing, comprising: a temperature control base assembly 100, wherein the temperature control base assembly 100 is provided with a plurality of temperature control bases 106 for providing a chip testing environment, and a set of temperature control tubes 103 are fixedly connected to one end of each set of temperature control bases 106 near the center of the temperature control base assembly 100.

[0026] A semiconductor cooling chip 104 for providing precise temperature control is installed inside the temperature control tube 103. A guide fan 105 for guiding cold air is also installed inside the temperature control tube 103 near the end of the temperature control base 106. A set of heat source auxiliary tubes 107 for auxiliary temperature control is fixedly connected to the end of each set of temperature control bases 106 away from the center of the temperature control base assembly 100.

[0027] Each heat source auxiliary pipe 107 is fixedly connected to a set of cold source auxiliary pipes 109 for auxiliary temperature control on the outer side of one end near the temperature control base 106. A cover plate assembly 200 is provided above the temperature control base 106, and several cover plate bodies 206 are provided in the cover plate assembly 200.

[0028] A base 101 is fixedly connected below the temperature control base 106. A heat pipe 102 for dissipating heat from the hot end of the thermoelectric cooler 104 is fixedly connected to the center of the upper surface of the base 101. The heat pipe 102 is interconnected with several sets of temperature control tubes 103. The thermoelectric cooler 104 precisely adjusts the cooling temperature and conducts it into the temperature control base 106 through the air guide fan 105. The heat generated by the thermoelectric cooler 104 is concentratedly dissipated through the heat pipe 102.

[0029] The heat pipe 102 is also connected to several sets of heat source auxiliary pipes 107. Each set of heat source auxiliary pipes 107 and cold source auxiliary pipes 109 is equipped with a set of solenoid valves 108 for controlling the opening and closing of the pipes. The heat source auxiliary pipes 107 and cold source auxiliary pipes 109 are also connected to each other.

[0030] A cold source branch pipe 110 is fixedly connected below the cold source auxiliary pipe 109. The cold source branch pipe 110 is interconnected with an external cold source. A temperature control module for monitoring the temperature of the chip testing environment is installed inside the temperature control base 106. The temperature control module is a temperature sensor (a high-precision temperature sensor is selected, and the specific model can be any existing mature equipment on the market, as long as it meets the requirements of this utility model. Its related connection circuits and control methods all use existing technology and will not be described in detail here). The heat source auxiliary pipe 107 and the cold source auxiliary pipe 109 are adjusted to introduce hot and cold air according to the temperature monitored by the temperature control module.

[0031] A set of electric telescopic rods 111 for driving the cover plate assembly 200 to rise and fall is also fixedly connected to the upper surface of the base 101. The cover plate assembly 200 is provided with a main seat plate 201, which is connected to the upper end of the electric telescopic rods 111.

[0032] Several sets of adjusting columns 202 corresponding to the temperature control seat 106 are fixedly connected to the lower surface of the main seat plate 201. A cover plate body 206 is provided below the adjusting column 202. A sealing ring 207 is fixedly connected to the outside of the cover plate body 206. The chip is placed inside the temperature control seat 106, and the cover plate body 206 is fitted with the temperature control seat 106, which improves the sealing performance of the sealing ring 207.

[0033] Please see Figures 1-4 As the first embodiment of this utility model: First, different chips are placed in different temperature control seats 106, and the temperature of the semiconductor cooling chip 104 in different temperature control tubes 103 is adjusted and controlled differently according to the test temperature of different chips. Then, the cold air is introduced into the temperature control seat 106 through the guide fan 105, so that the electric telescopic rod 111 drives the cover plate assembly 200 to move down. The cover plate body 206 is fitted with the temperature control seat 106 and the sealing ring 207 improves the sealing performance. Second, the heat generated by the semiconductor cooling chip 104 is concentratedly discharged through the heat conduction pipe 102. According to the temperature control module monitoring the temperature in different temperature control seats 106, the heat source auxiliary pipe 107 and the cold source auxiliary pipe 109 are adjusted to introduce hot and cold air, thereby improving the convenience of chip test temperature control.

[0034] An adjusting push plate 204 is movably provided inside the adjusting column 202, and an adjusting spring 203 is fixedly connected above the adjusting push plate 204.

[0035] A connecting post 205 is fixedly connected below the adjusting push plate 204. The connecting post 205 is fixedly connected to the cover plate body 206. After the chip in different temperature control seats is tested, the connecting post 205 is pushed upward, so that the adjusting spring 203 is compressed and the cover plate body 206 is disengaged from the temperature control seat 106.

[0036] Please see Figure 1 and Figures 4-5 As a second embodiment of this utility model: Based on the first embodiment above, different chips have different testing times. After the chips in different temperature control seats 106 have been tested independently, the user pushes the connecting column 205 upwards, so that the adjusting spring 203 is compressed and drives the cover plate body 206 to detach from the temperature control seat 106, so that the chip in the temperature control seat 106 can be taken out independently, thereby enabling the chip in a single temperature control seat 106 to be taken out.

[0037] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A temperature control device for chip testing, comprising: The temperature control socket assembly (100) is characterized in that: the temperature control socket assembly (100) is provided with a plurality of temperature control sockets (106) for providing a chip testing environment, and each set of temperature control sockets (106) is fixedly connected to a set of temperature control tubes (103) at one end near the center of the temperature control socket assembly (100); The inner side of the temperature control tube (103) is equipped with a semiconductor cooling chip (104) for providing precise temperature control. The inner side of the temperature control tube (103) near the end of the temperature control base (106) is also equipped with a guide fan (105) for guiding cold air. Each set of temperature control bases (106) is fixedly connected to a set of heat source auxiliary tubes (107) for assisting temperature control at the end away from the center of the temperature control base assembly (100). Each heat source auxiliary pipe (107) is fixedly connected to a set of cold source auxiliary pipes (109) for auxiliary temperature control on the outer side of the end near the temperature control seat (106). A cover plate assembly (200) is provided above the temperature control seat (106), and a number of cover plate bodies (206) are provided in the cover plate assembly (200).

2. The temperature control device for chip testing as described in claim 1, characterized in that: A base (101) is fixedly connected below the temperature control seat (106). A heat pipe (102) for dissipating heat from the hot end of the semiconductor cooling chip (104) is fixedly connected to the center of the upper surface of the base (101). The heat pipe (102) is interconnected with several sets of temperature control tubes (103).

3. The temperature control device for chip testing as described in claim 2, characterized in that: The heat pipe (102) is also connected to several sets of heat source auxiliary pipes (107). Each set of heat source auxiliary pipes (107) and cold source auxiliary pipes (109) is equipped with a set of solenoid valves (108) for controlling the opening and closing of the pipes. The heat source auxiliary pipes (107) and cold source auxiliary pipes (109) are also connected to each other.

4. The temperature control device for chip testing as described in claim 3, characterized in that: A cold source branch pipe (110) is fixedly connected below the cold source auxiliary pipe (109). The cold source branch pipe (110) is connected to an external cold source. A temperature control module for monitoring the temperature of the chip test environment is installed inside the temperature control base (106).

5. A temperature control device for chip testing as described in claim 2, characterized in that: The upper surface of the base (101) is also fixedly connected to a set of electric telescopic rods (111) for driving the cover plate assembly (200) to rise and fall. The cover plate assembly (200) is provided with a main seat plate (201), and the main seat plate (201) is connected to the upper end of the electric telescopic rods (111).

6. The temperature control device for chip testing as described in claim 5, characterized in that: The lower surface of the main seat plate (201) is fixedly connected with a number of adjustment columns (202) corresponding one-to-one with the temperature control seat (106). A cover plate body (206) is provided below the adjustment column (202), and a sealing ring (207) is fixedly connected to the outside of the cover plate body (206).

7. A temperature control device for chip testing as described in claim 6, characterized in that: An adjusting push plate (204) is movably provided inside the adjusting column (202), and an adjusting spring (203) is fixedly connected above the adjusting push plate (204).

8. The temperature control device for chip testing as described in claim 7, characterized in that: A connecting column (205) is fixedly connected below the adjusting push plate (204), and the connecting column (205) is fixedly connected to the cover plate body (206).

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