Novel software development board

Abstract

The utility model discloses a novel software development board, which comprises a development board body and a heat dissipation unit, the heat dissipation unit comprises a pair of clamping mechanisms which are symmetrically arranged and respectively sleeved on two opposite edges of the development board body, a connecting mechanism used for enabling the pair of clamping mechanisms to be close to each other, and at least one heat dissipation fan, each clamping mechanism comprises a mounting arm, a pair of clamping pieces slidably assembled on the mounting arm and a mounting plate fixedly connected with the mounting arm through a connecting arm, clamping grooves are formed in the clamping pieces, and the cooling fan is adjustably assembled on the mounting plate of the pair of clamping mechanisms through a plurality of first mounting bolts; the heat dissipation unit is clamped on the edge of the development board body through a plurality of clamping pieces to fix the heat dissipation unit, the heat dissipation unit can be recycled, the universality is high, the cost is low, the clamping pieces can slide on the mounting arms to avoid circuit elements mounted on the development board body, and the mounting of the circuit elements cannot be affected.

Description

Technical Field

[0001] This utility model relates to the field of software development technology, specifically to a novel software development board. Background Technology

[0002] A development board is a circuit board used for embedded system development. It includes a series of hardware components such as a central processing unit, memory, input devices, output devices, data paths / buses, and external resource interfaces. Development boards are generally customized by embedded system developers according to their development needs, or users can research and design them themselves.

[0003] Chinese patent application CN202221587968.5, entitled "Development Board for Software Development," discloses a development board for software development, including a board body. A cover plate is rotatably connected to the board body, and a pad rod is fixedly connected to the cover plate. A horizontal groove is formed on the cover plate, and a connecting rod is fixedly connected to the horizontal groove. A slider is slidably connected to the connecting rod, and a spring is sleeved on the connecting rod. An air vent is formed on the slider, and a motor-driven fan is installed at the bottom of the slider. A limiting component is provided on the slider to limit its movement.

[0004] However, the above-mentioned patent still has the following shortcomings. Although the fan can cool the circuit components, the cover plate is rotatably connected to the board. After the development board has been used, it is inconvenient to disassemble the heat dissipation-related components for use on other development boards. The cost is high and the versatility is low. In addition, the pads will affect the installation of the circuit components. The circuit components need to be kept away from the pads. Therefore, a new type of software development board needs to be designed. Utility Model Content

[0005] To address the aforementioned technical problems, the purpose of this utility model is to overcome the issues of high cost, low versatility of heat dissipation components, and impact on the installation of circuit elements in the prior art.

[0006] To achieve the above objectives, this utility model provides a novel software development board, comprising: a development board body and a heat dissipation unit mounted on the development board body, wherein the heat dissipation unit includes a pair of symmetrically arranged snap-fit ​​mechanisms respectively fitted onto opposite edges of the development board body, a connecting mechanism for bringing the pair of snap-fit ​​mechanisms closer to each other, and at least one cooling fan.

[0007] The snap-fit ​​mechanism includes a mounting arm parallel to the edge corresponding to the development board body, a pair of snap-fit ​​components slidably mounted on the mounting arm, and a mounting plate fixedly connected to the mounting arm via a connecting arm. The snap-fit ​​component has a recessed slot on the edge of the development board body on the side away from the mounting arm. The cooling fan is adjustablely mounted on the mounting plate of the pair of snap-fit ​​mechanisms via several first mounting bolts.

[0008] Preferably, the mounting plate is provided with a plurality of spaced and parallel strip-shaped slots, the length direction of the strip-shaped slots is perpendicular to the length direction of the mounting arm, the mounting plate is parallel to the development board body, and each of the first mounting bolts passes through the corresponding strip-shaped slot.

[0009] Preferably, a circular through hole is provided through the middle of one of the connecting arms, and an irregularly shaped through hole is provided through the middle of the other connecting arm;

[0010] The connecting mechanism includes an adjusting bolt passing through a circular through hole and a positioning rod passing through an irregular through hole and coaxially arranged with the adjusting bolt. The end of the positioning rod away from the adjusting bolt is provided with a flange portion that abuts against the corresponding connecting arm. A threaded through hole is coaxially provided on the positioning rod for the end of the adjusting bolt to be screwed in.

[0011] Preferably, the head sidewall of the adjusting bolt is provided with anti-slip texture.

[0012] Preferably, the head of the adjusting bolt is recessed with a polygonal groove.

[0013] Preferably, both ends of the mounting arm are fitted with limit shims via second mounting bolts.

[0014] According to the above technical solution, the novel software development board provided by this utility model has the following beneficial effects when used:

[0015] Firstly, the heat dissipation unit is fixed to the edge of the development board body by several clips, which makes it easy to remove the heat dissipation unit and assemble it on other development boards. It can be reused, has strong versatility and low cost.

[0016] Secondly, the clip can slide on the mounting arm to avoid the circuit components mounted on the development board body, without affecting the installation of the circuit components.

[0017] Third, the spacing between a pair of mounting arms can be adjusted, allowing the heat dissipation unit to be mounted on development boards of different specifications, thus improving the versatility of the heat dissipation unit.

[0018] Other features and advantages of this utility model will be described in detail in the following detailed description section; and all parts not covered in this utility model are the same as or can be implemented using existing technology. Attached Figure Description

[0019] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the following detailed description to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0020] Figure 1 This is a three-dimensional structural diagram of a novel software development board provided in this utility model;

[0021] Figure 2 This is a three-dimensional structural diagram of the heat dissipation unit of a novel software development board provided in this utility model. Figure 1 ;

[0022] Figure 3 This is a three-dimensional structural diagram of the heat dissipation unit of a novel software development board provided in this utility model. Figure 2 ;

[0023] Figure 4 This is a partial three-dimensional structural diagram of the heat dissipation unit of a novel software development board provided in this utility model.

[0024] Explanation of reference numerals in the attached figures

[0025] 1. Development board body; 2. Cooling fan; 3. Mounting arm; 4. Snap-fit ​​component; 5. Connecting arm; 6. Mounting plate; 7. Slot; 8. First mounting bolt; 9. Strip-shaped through slot; 10. Circular through hole; 11. Irregular through hole; 12. Adjusting bolt; 13. Positioning rod; 14. Flange; 15. Threaded through hole; 16. Anti-slip texture; 17. Multi-angled groove; 18. Limiting washer. Detailed Implementation

[0026] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of this utility model.

[0027] In this utility model, unless otherwise stated, directional words such as "upper," "lower," "inner," and "outer" included in the terminology only represent the orientation of the term in its conventional use or are common terms understood by those skilled in the art, and should not be regarded as limitations on the term.

[0028] like Figure 1-4 As shown, a novel software development board includes: a development board body 1 and a heat dissipation unit mounted on the development board body 1. The heat dissipation unit includes a pair of symmetrically arranged snap-fit ​​mechanisms that are respectively fitted onto opposite edges of the development board body 1, a connecting mechanism for bringing the pair of snap-fit ​​mechanisms closer to each other, and at least one cooling fan 2.

[0029] The snap-fit ​​mechanism includes a mounting arm 3 parallel to the edge corresponding to the development board body 1, a pair of snap-fit ​​parts 4 slidably mounted on the mounting arm 3, and a mounting plate 6 fixedly connected to the mounting arm 3 via a connecting arm 5. The snap-fit ​​part 4 has a recessed slot 7 on the edge of the development board body 1 on the side away from the mounting arm 3. The cooling fan 2 is adjustablely mounted on the mounting plate 6 of the pair of snap-fit ​​mechanisms via several first mounting bolts 8.

[0030] The snap-fit ​​4 can slide on the mounting arm 3, and the snap-fit ​​4 can be adjusted on the mounting arm 3 to avoid electronic components mounted on the development board body 1. The spacing between a pair of mounting arms 3 can be adjusted so that the heat dissipation unit can be mounted on development board bodies 1 of different specifications, thereby improving the applicability of the heat dissipation unit.

[0031] The mounting plate 6 has a plurality of parallel strip grooves 9 spaced apart. The length direction of the strip grooves 9 is perpendicular to the length direction of the mounting arm 3. The mounting plate 6 is parallel to the development board body 1. Each of the first mounting bolts 8 passes through the corresponding strip groove 9.

[0032] When the distance between a pair of mounting arms 3 is changed, the first mounting bolt 8 is loosened so that the first mounting bolt 8 can slide in the strip groove 9. After the distance between a pair of mounting arms 3 is adjusted, the first mounting bolt 8 is tightened.

[0033] One of the connecting arms 5 has a circular through hole 10 through its middle, and the other connecting arm 5 has an irregular through hole 11 through its middle.

[0034] The connecting mechanism includes an adjusting bolt 12 passing through a circular through hole 10 and a positioning rod 13 passing through an irregular through hole 11 and coaxially arranged with the adjusting bolt 12. The end of the positioning rod 13 away from the adjusting bolt 12 is provided with a flange portion 14 that abuts against the corresponding connecting arm 5. A threaded through hole 15 is coaxially provided on the positioning rod 13 for the end of the adjusting bolt 12 to be screwed in.

[0035] When adjusting the distance between a pair of mounting arms 3, loosen the adjusting bolt 12 to increase the distance between the adjusting bolt 12 and the flange 14. After the slot 7 of the snap-fit ​​part 4 is fitted onto the edge of the development board body 1, tighten the adjusting bolt 12 so that the head of the adjusting bolt 12 and the flange 14 respectively abut against the corresponding connecting arm 5. The function of the irregular through hole 11 is to prevent the positioning rod 13 from rotating.

[0036] The head side wall of the adjusting bolt 12 is provided with anti-slip texture 16.

[0037] The head of the adjusting bolt 12 is recessed with a polygonal groove 17.

[0038] Insert the tool into the polygonal groove 17 to facilitate the rotation of the adjusting bolt 12.

[0039] Both ends of the mounting arm 3 are fitted with limit shims 18 via second mounting bolts.

[0040] Loosening the second mounting bolt allows the limit shim 18 to be removed, thereby increasing or decreasing the number of clips 4 on the mounting arm 3, or removing the clips 4 and replacing them with other types of clips 4, i.e., replacing them with clips 4 of different specifications in the slot 7, so that the heat dissipation unit can be installed on the development board body 1 of different thicknesses.

[0041] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solution of the present invention, and these simple modifications all fall within the protection scope of the present invention.

[0042] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable way without contradiction. In order to avoid unnecessary repetition, this utility model will not describe the various possible combinations separately.

[0043] Furthermore, various different embodiments of this utility model can be combined in any way, as long as they do not violate the spirit of this utility model, they should also be regarded as the content disclosed by this utility model.

Claims

1. A novel software development board, characterized in that, include: The development board body (1) and the heat dissipation unit mounted on the development board body (1) include a pair of symmetrically arranged snap-fit ​​mechanisms respectively fitted on opposite edges of the development board body (1), a connecting mechanism for bringing the pair of snap-fit ​​mechanisms close to each other, and at least one cooling fan (2). The snap-fit ​​mechanism includes a mounting arm (3) parallel to the edge corresponding to the development board body (1), a pair of snap-fit ​​parts (4) slidably mounted on the mounting arm (3), and a mounting plate (6) fixedly connected to the mounting arm (3) via a connecting arm (5). The snap-fit ​​part (4) has a recessed slot (7) on the edge of the development board body (1) on the side away from the mounting arm (3). The cooling fan (2) is adjustablely mounted on the mounting plate (6) of the pair of snap-fit ​​mechanisms via several first mounting bolts (8).

2. The novel software development board according to claim 1, characterized in that, The mounting plate (6) has a plurality of slots (9) spaced apart and arranged in parallel. The length direction of the slots (9) is perpendicular to the length direction of the mounting arm (3). The mounting plate (6) is parallel to the development board body (1). Each of the first mounting bolts (8) passes through the corresponding slot (9).

3. The novel software development board according to claim 1, characterized in that, One of the connecting arms (5) has a circular through hole (10) through its middle part, and the other connecting arm (5) has an irregular through hole (11) through its middle part. The connecting mechanism includes an adjusting bolt (12) passing through a circular through hole (10) and a positioning rod (13) passing through a shaped through hole (11) and coaxially arranged with the adjusting bolt (12). The end of the positioning rod (13) away from the adjusting bolt (12) is provided with a flange (14) that abuts against the corresponding connecting arm (5). A threaded through hole (15) is coaxially provided on the positioning rod (13) for the end of the adjusting bolt (12) to be screwed in.

4. A novel software development board according to claim 3, characterized in that, The head side wall of the adjusting bolt (12) is provided with anti-slip texture (16).

5. A novel software development board according to claim 3, characterized in that, The head of the adjusting bolt (12) is recessed with a polygonal groove (17).

6. A novel software development board according to claim 1, characterized in that, Both ends of the mounting arm (3) are fitted with limit shims (18) by second mounting bolts.

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