Capacitor module assembly structure with submerged installation of pins

Abstract

The utility model relates to the technical field of bathroom equipment, in particular to a capacitor module assembly structure with submerged installation of pins, a capacitor module is composed of at least two capacitor monomers which are connected in series or in parallel, the capacitor monomers are connected through respective electrode pins, the electrode pins are provided with welding salient points, and the welding salient points are connected with the capacitor monomers in series or in parallel. The capacitor module is provided with a cathode pin and an anode pin; the capacitor module is carried on the first circuit board, the first circuit board is provided with an avoiding part used for avoiding the welding salient points, and the avoiding part is an open hole or a groove. According to the utility model, the avoiding part is arranged at the specified packaging position of the module to avoid the salient points welded by the capacitor module, so that the welding points can sink into the PCB when the capacitor module is assembled on the circuit board, the capacitor module can be stably placed on the PCB, the skew caused by the salient points of the device is avoided, and meanwhile, a plastic support is omitted to reduce the cost.

Description

Technical Field

[0001] This utility model generally relates to the field of bathroom equipment technology, and more specifically, to a capacitor module assembly structure with pin recessed mounting. Background Technology

[0002] In the current field of smart products, most products are equipped with backup power to cope with sudden power outages. Common backup power sources include batteries and supercapacitors, such as modules composed of two supercapacitors.

[0003] During the production of this capacitor module, the electrodes of two supercapacitors need to be connected in series or parallel. A pin structure that can be spot-soldered to the circuit board is widely used due to its high structural stability. However, the pin soldering process creates bumps at the soldering points. When the capacitor module is assembled onto the PCB, the presence of these bumps causes the capacitor module to float, meaning it cannot fit tightly against the PCB. This, in turn, leads to problems such as capacitor module skewing and uneven stress, and in severe cases, results in poor product quality.

[0004] To address the issue of capacitor module misalignment, adding plastic supports to straighten it can solve the assembly problem to some extent, but it also introduces new problems such as increased material costs.

[0005] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0006] The present invention includes a series of simplified concepts, which will be further explained in detail in the detailed description section. This present invention is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0007] One of the main objectives of this invention is to overcome at least one of the defects of the prior art and provide a capacitor module assembly structure with pin recessed mounting.

[0008] To achieve the above-mentioned objectives, the present invention adopts the following technical solution:

[0009] According to one aspect of the present invention, a capacitor module assembly structure with recessed pin mounting is provided, comprising:

[0010] A capacitor module is composed of at least two capacitor cells connected in series or in parallel. The capacitor cells are connected to each other through their respective electrode pins, and the electrode pins have solder bumps. The capacitor module is provided with a negative pin and a positive pin.

[0011] The first circuit board, on which the capacitor module is mounted, has a relief portion for avoiding the soldering protrusions, the relief portion being an opening or a groove.

[0012] According to one embodiment of the present invention, the first circuit board is further provided with at least one second through hole for inserting positive and / or negative pins, and the positive and negative pins on both sides of the capacitor module are fixed on the first circuit board after passing through the second through hole.

[0013] According to one embodiment of the present invention, a second circuit board is included, and the electrode pins are connected to each other by soldering to the second circuit board; the second circuit board is provided with at least one first through hole, and the electrode pins are soldered to the second circuit board after passing through the first through hole, and the soldering bump is located on the side of the second circuit board close to the first circuit board.

[0014] According to one embodiment of the present invention, the avoidance part is disposed between two second through holes.

[0015] According to one embodiment of the present invention, the first circuit board and the second circuit board are stacked together.

[0016] According to one embodiment of the present invention, the capacitor module is encapsulated as a whole by an encapsulation layer.

[0017] According to one embodiment of the present invention, the area of ​​the avoidance portion is not greater than the area of ​​the second circuit board.

[0018] According to one embodiment of the present invention, the adjacent electrode pins of the two adjacent capacitor cells are connected by soldering guide pins.

[0019] As can be seen from the above technical solution, the advantages and positive effects of the pin-recessed capacitor module assembly structure of this utility model are as follows:

[0020] This invention avoids the protrusions of capacitor module soldering by creating a clearance part at a designated position in the module package. This allows the solder joints of the capacitor module to sink into the PCB board when it is assembled onto the circuit board, thus making it stable on the PCB board and avoiding the skewing caused by the protrusions of the components. At the same time, it eliminates the need for plastic supports, thereby reducing costs. Attached Figure Description

[0021] The various objectives, features, and advantages of this invention will become more apparent from the following detailed description of preferred embodiments in conjunction with the accompanying drawings. The drawings are merely illustrative of the invention and are not necessarily drawn to scale. In the drawings, the same reference numerals always denote the same or similar parts. Wherein:

[0022] Figure 1 This is a schematic diagram of the overall structure of a pin-recessed capacitor module assembly according to an exemplary embodiment. Figure 1 .

[0023] Figure 2 This is a schematic diagram of the overall structure of a pin-recessed capacitor module assembly according to an exemplary embodiment. Figure 2 .

[0024] Figure 3 This is a schematic diagram of a capacitor module structure with a pin-recessed mounting configuration, according to an exemplary embodiment. Figure 1 .

[0025] Figure 4 This is a schematic diagram of a first circuit board structure illustrating a pin-recessed capacitor module assembly structure according to an exemplary embodiment.

[0026] Figure 5 This is a schematic diagram of the package structure of a pin-recessed capacitor module assembly structure according to an exemplary embodiment.

[0027] Figure 6 This is a schematic diagram of a capacitor module structure with a pin-recessed mounting configuration, according to an exemplary embodiment. Figure 2 .

[0028] The reference numerals in the attached figures are explained as follows:

[0029] 100 - Capacitor module, 120 - Positive pin, 110 - Negative pin;

[0030] 200 - Capacitor cell, 210 - Electrode pin, 211 - Solder bump;

[0031] 300 - First circuit board, 310 - Clearance section, 320 - Second through hole;

[0032] 400 - Second circuit board, 410 - First through hole;

[0033] 500-Encapsulation layer. Detailed Implementation

[0034] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed description will be omitted.

[0035] The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a full understanding of embodiments of the present invention. However, those skilled in the art will recognize that the technical solutions of the present invention can be practiced without one or more of the specific details described, or other methods, components, materials, etc., can be employed. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring various aspects of the present invention.

[0036] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention.

[0037] like Figure 1As shown, this embodiment provides a capacitor module assembly structure with recessed pin mounting, including: a capacitor module 100, which consists of at least two capacitor cells 200 connected in series or parallel, the capacitor cells 200 being connected through their respective electrode pins 210, the electrode pins 210 having solder bumps 211, the capacitor module 100 having a negative electrode pin 110 and a positive electrode pin 120; a first circuit board 300, on which the capacitor module 100 is mounted, the first circuit board 300 being a circuit board for electrical circuits, the first circuit board 300 having a clearance portion 310 for avoiding the solder bumps 211, the clearance portion 310 being an opening or a groove. It can be understood that multiple capacitor cells 200 connected in series increase the withstand voltage, suitable for high-voltage circuits, etc. Multiple capacitor cells 200 connected in parallel increase the total capacity, suitable for filtering, energy storage, etc. The length and size of the electrode pins 210, positive electrode pin 120, and negative electrode pin 110 can be adjusted as needed. Its shape can be a strip, sheet, or other existing structure. In this embodiment, the clearance portion 310 is an opening. The capacitor module 100 consists of two capacitor cells 200. The adjacent electrode pins 210 of the two capacitor cells 200 are connected in series by welding. The positive pins 120 and negative pins 110 on both sides of the two capacitor cells 200 are welded to the first circuit board 300. During assembly, the capacitor cell 200 is located on the upper side of the first circuit board 300, and the welding bumps 211 fall exactly into the openings of the first circuit board 300. By opening the module package at a designated position to avoid the welding bumps of the capacitor module 100, the solder joints of the capacitor module 100 can be sunk into the first circuit board 300 when it is assembled onto the first circuit board 300, so that it is placed stably on the PCB board, avoiding the skewing caused by the bumps of the device, and eliminating the need for plastic supports to reduce costs.

[0038] In some embodiments, such as Figure 1 As shown, the first circuit board 300 is also provided with at least one second through hole 320 for inserting the positive terminal 120 and / or the negative terminal 110. The positive terminal 120 and the negative terminal 110 on both sides of the capacitor module 100 pass through the second through hole 320 and are fixed on the first circuit board 300.

[0039] In some embodiments, such as Figures 2-5 As shown, the circuit includes a second circuit board 400, with electrode leads 210 connected to it via soldering. The second circuit board 400 has at least one first through-hole 410, through which the electrode leads 210 pass and are soldered onto the second circuit board 400. Soldering bumps 211 are located on the side of the second circuit board 400 closest to the first circuit board 300. The first circuit board 300 and the second circuit board 400 are stacked abutting each other. In other embodiments, adjacent electrode leads 210 of two adjacent capacitor cells 200 are connected via soldering pins.

[0040] like Figures 2-5 As shown, the capacitor module 100 consists of two individual capacitors 200. The adjacent electrode leads 210 of the two individual capacitors 200 pass through the first through-hole 410 and are soldered onto the second circuit board 400 to achieve series connection. The positive leads 120 and negative leads 110 on both sides of the two individual capacitors 200 pass through the second through-hole 320 and are soldered onto the first circuit board 300. In this embodiment, during assembly, the individual capacitors 200 are positioned on the upper side of the second circuit board 400, and the soldering bumps 211 on the side of the second circuit board 400 that is in contact with the first circuit board 300 fall precisely into the openings of the first circuit board 300. By opening holes at designated locations in the module package to avoid the soldering bumps of the capacitor module 100, the solder joints of the capacitor module 100 can be sunk into the first circuit board 300 when assembled onto the circuit board, thus ensuring its stable placement on the PCB board and preventing skewing caused by component bumps. This also eliminates the need for plastic supports, reducing costs.

[0041] This embodiment takes a capacitor module 100 composed of two capacitor cells 200 connected in series as an example. In this case, the electrode pin 210, positive pin 120, and negative pin 110 are exactly in a straight line. The adjacent electrode pins 210 of the two capacitor cells 200 are connected in series through the copper foil lines of the second circuit board 400. Similarly, when there are three or more capacitor cells 200, the multiple capacitor cells 200 are first connected in series or in parallel through the second circuit board 400, and then the positive pin 120 and negative pin 110 of the capacitor module 100 formed by them are soldered to the first circuit board 300.

[0042] In some embodiments, such as Figure 6 As shown, the positive pin 120 and the negative pin 110 first pass through the first through hole 410, then through the second through hole 320, and are then soldered onto the first circuit board 300.

[0043] In some embodiments, such as Figures 1-5 As shown, the clearance portion 310 is disposed between the two second through holes 320. Furthermore, the clearance portion 310 is located at the midpoint of the two second through holes 320, and the size of the clearance portion 310 can be precisely matched with the soldering protrusion 211 on the soldering surface of the second circuit board 400 to avoid structural redundancy.

[0044] In some embodiments, such as Figure 2 As shown, the area of ​​the clearance portion 310 is no larger than the area of ​​the second circuit board 400. It is understandable that the second circuit board 400 has a larger area, which facilitates the stacking of the second circuit board 400 on the first circuit board 300 during installation.

[0045] In some embodiments, such as Figures 1-6As shown, the capacitor module 100 is encapsulated by a packaging layer 500. It can be understood that the packaging layer 500 can enhance insulation, fix the position of individual cells, prevent moisture and dust, and improve the performance and reliability of the capacitor module 100.

[0046] It should be understood that the various examples described above can be utilized in multiple directions (e.g., tilted, inverted, horizontal, vertical, etc.) and in multiple configurations without departing from the principles of this invention. The embodiments shown in the accompanying drawings are merely examples of effective application of the principles of this invention, and the invention is not limited to any specific details of these embodiments.

[0047] Of course, upon careful consideration of the above description of the representative embodiments, those skilled in the art will readily understand that various modifications, additions, substitutions, deletions, and other changes can be made to these specific embodiments, and that such changes are within the scope of the principles of this invention. Therefore, the foregoing detailed description should be clearly understood as being given by way of illustration and example only, and the spirit and scope of this invention are defined solely by the appended claims and their equivalents.

Claims

1. A capacitor module assembly structure with recessed pin mounting, characterized in that, include: A capacitor module (100) is composed of at least two capacitor cells (200) connected in series or in parallel. The capacitor cells (200) are connected to each other through their respective electrode pins (210). The electrode pins (210) have solder bumps (211). The capacitor module (100) is provided with a negative electrode pin (110) and a positive electrode pin (120). The first circuit board (300) is provided with a relief part (310) for avoiding the solder bump (211), and the relief part (310) is an opening or a groove.

2. The capacitor module assembly structure with recessed pin mounting as described in claim 1, characterized in that: The first circuit board (300) is also provided with at least one second through hole (320) for inserting a positive pin (120) and / or a negative pin (110). The positive pin (120) and the negative pin (110) on both sides of the capacitor module (100) pass through the second through hole (320) and are fixed on the first circuit board (300).

3. The pin-recessed capacitor module assembly structure as described in claim 1 or 2, characterized in that: The circuit includes a second circuit board (400), and the electrode pins (210) are connected to each other by soldering to the second circuit board (400). The second circuit board (400) has at least one first through hole (410), and the electrode pins (210) pass through the first through hole (410) and are soldered to the second circuit board (400). The soldering bumps (211) are located on the side of the second circuit board (400) close to the first circuit board (300).

4. The capacitor module assembly structure with recessed pin mounting as described in claim 2, characterized in that: The clearance portion (310) is located between the two second through holes (320).

5. The capacitor module assembly structure with pin recessed mounting as described in claim 3, characterized in that: The first circuit board (300) and the second circuit board (400) are stacked together.

6. The capacitor module assembly structure with recessed pin mounting as described in claim 1, characterized in that: The capacitor module (100) is encapsulated by an encapsulation layer (500).

7. The capacitor module assembly structure with recessed pin mounting as described in claim 3, characterized in that: The area of ​​the avoidance part (310) is not greater than the area of ​​the second circuit board (400).

8. The pin-recessed capacitor module assembly structure as described in claim 1 or 2, characterized in that: The adjacent electrode pins (210) of two adjacent capacitor cells (200) are connected by soldering via guide pins.

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