Multifunctional IC support structure for mobile phone
By designing a multifunctional IC bracket structure, the problems of forgetting IC cards and overheating mobile phones were solved, realizing the functions of fixing IC cards and dissipating heat, and expanding the applicability of mobile phone brackets.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-09
- Publication Date
- 2026-04-03
AI Technical Summary
Current mobile phones do not come with IC card holders, making it easy to forget or lose IC cards. They also cannot prevent the phone from repeatedly reading IC cards, which can cause pop-up windows. In addition, they lack heat dissipation functions.
A multifunctional IC bracket structure is designed, comprising a bracket body, a phone case, a card-connecting structure, a limiting structure, and a heat dissipation structure. The IC card is fixed by elastic clamps and limiting clamps, a partition prevents it from falling off, a cooling fan dissipates heat, and it can rotate to form a phone bracket.
It effectively prevents IC cards from being forgotten or lost, prevents IC cards from being dropped, avoids repeated reading pop-ups on the phone, and dissipates heat when the phone overheats, thus expanding the device's applicability.
Smart Images

Figure CN224083566U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of bracket structure technology, specifically a multifunctional IC bracket structure for mobile phones. Background Technology
[0002] An integrated circuit, or IC for short, also known as a microcircuit, microchip, or chip, is an electronic component that integrates a large number of microelectronic components onto a tiny semiconductor chip. By miniaturizing circuits, it enables electronic devices to operate efficiently, compactly, and reliably. With the continuous development of society, people frequently use various IC cards in their daily lives, such as identity cards, access control cards, and public transportation cards. However, due to lifestyle habits and personal preferences, many people often forget to carry their IC cards, causing inconvenience in their work and daily life. Most current mobile phones do not have a holder for storing IC cards, and encrypted IC cards that cannot be read by mobile phones are easily forgotten or lost.
[0003] Therefore, this utility model provides a multifunctional IC bracket structure for mobile phones. Utility Model Content
[0004] To address the shortcomings of existing technologies, the purpose of this invention is to provide a multifunctional IC card holder structure for mobile phones, thereby solving the problems mentioned in the background. This invention allows the holder body to be installed on the mobile phone via a phone case, and the IC card can be placed inside the holder body to prevent forgetting or losing the IC card. The IC card can be fixed in place using a card-attaching structure and a limiting structure to prevent it from falling out. A partition can prevent the phone from repeatedly reading the IC card and causing pop-up windows. It can also dissipate heat when the phone is overheating. Furthermore, rotating the holder body forms a phone stand to support the phone, expanding the applicability of the device.
[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: a multifunctional IC bracket structure for mobile phones, including a bracket body, a mobile phone shell mounted on one side of the bracket body, a snap-fit structure mounted inside the bracket body, an IC card mounted inside the bracket body, the snap-fit structure including multiple elastic clamps, the IC card corresponding to the elastic clamps, a limiting structure mounted on the bracket body, the limiting structure including multiple limiting clamps, the limiting clamps corresponding to the IC card, a partition fixedly snapped on the side of the bracket body near the mobile phone shell, and a heat dissipation structure mounted on the bracket body.
[0006] Furthermore, a first rotating shaft is fixed on both sides of the bracket body, and a rotating frame is fixed on the phone case, with the rotating frame rotatably connected to the first rotating shaft.
[0007] Furthermore, the bracket body has a placement slot, which corresponds to the IC card, and the elastic clamp is located on the periphery of the placement slot.
[0008] Furthermore, the elastic clamp is fixedly connected to the inner wall of the placement groove, and the elastic clamp has an arc-shaped structure.
[0009] Furthermore, the bracket body has multiple grooves, and a second rotating shaft is fixed on the limiting clamp, with the grooves corresponding to the second rotating shaft.
[0010] Furthermore, the second rotating shaft is rotatably fitted into the groove, and a torsion spring is installed between the second rotating shaft and the groove.
[0011] Furthermore, the bracket body is provided with a sliding groove and a slot, the partition is slidably connected to the sliding groove, and the slot corresponds to the partition.
[0012] Furthermore, the heat dissipation structure includes a cooling fan, a protective shell and multiple support rods are fixed on the bracket body, and the cooling fan is located inside the protective shell.
[0013] The beneficial effects of this utility model are as follows: This utility model provides a multifunctional IC bracket structure for mobile phones, which includes a bracket body; a mobile phone case; an IC card; a limiting structure; a partition; and a heat dissipation structure.
[0014] A phone case is installed on one side of the stand body, allowing the stand body to be mounted on the phone. An IC card can be placed inside the stand body to prevent it from being forgotten or lost. A snap-fit structure and a limiting structure are installed inside the stand body to secure the IC card and prevent it from falling out. A partition is installed on the side of the stand body near the phone case to prevent the phone from repeatedly reading the IC card and triggering pop-up windows. A heat dissipation structure is installed on the stand body to cool the phone when it overheats. Rotating the stand body forms a phone stand to support the phone, expanding the device's applicability. Attached Figure Description
[0015] Figure 1 This is a three-dimensional assembly diagram of the overall structure of a multifunctional IC bracket for mobile phones according to this utility model.
[0016] Figure 2 This is an exploded view of the bracket body in a multifunctional IC bracket structure for mobile phones according to this utility model;
[0017] Figure 3 This is a three-dimensional structural diagram of the assembly of the bracket body and the IC card in a multifunctional IC bracket structure for mobile phones according to this utility model.
[0018] Figure 4 This is a three-dimensional structural diagram of the assembly of the bracket body and the protective shell in a multifunctional IC bracket structure for mobile phones according to this utility model.
[0019] In the diagram: 1. Stand body; 2. Phone case; 3. Rotating frame; 4. First pivot; 5. IC card; 6. Elastic clamp; 7. Groove; 8. Second pivot; 9. Limiting clamp; 10. Card slot; 11. Partition; 12. Support rod; 13. Protective shell; 14. Cooling fan; 15. Placement slot; 16. Slide. Detailed Implementation
[0020] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.
[0021] Please see Figures 1 to 4 This utility model provides a technical solution: a multifunctional IC bracket structure for mobile phones, including a bracket body 1, a mobile phone case 2 mounted on one side of the bracket body 1, a snap-fit structure inside the bracket body 1, an IC card 5 inside the bracket body 1, the snap-fit structure including multiple elastic clamps 6, the IC card 5 corresponding to the elastic clamps 6, a limiting structure mounted on the bracket body 1, the limiting structure including multiple limiting clamps 9, the limiting clamps 9 corresponding to the IC card 5, a partition 11 snap-fitted and fixed on the side of the bracket body 1 near the mobile phone case 2, and a heat dissipation structure mounted on the bracket body 1.
[0022] In this embodiment, a first rotating shaft 4 is fixed on both sides of the bracket body 1, and a rotating frame 3 is fixed on the phone case 2. The rotating frame 3 is rotatably connected to the first rotating shaft 4.
[0023] Specifically, the bracket body 1 can be rotated so that the first rotating shaft 4 rotates within the rotating frame 3, thereby forming a triangular structure between the phone case 2 and the bracket body 1, thus forming a phone stand to support the phone.
[0024] The bracket body 1 has a placement slot 15 inside, which corresponds to the IC card 5. The elastic clamp 6 is located on the periphery inside the placement slot 15 and is fixedly connected to the inner wall of the placement slot 15. The elastic clamp 6 has an arc-shaped structure.
[0025] Specifically, the IC card 5 is placed in the placement slot 15. At this time, the IC card 5 can be clamped and fixed by the elastic clamp 6, which can prevent the IC card 5 from falling. The arc-shaped elastic clamp 6 also has a certain buffering effect.
[0026] The bracket body 1 has multiple grooves 7, and a second rotating shaft 8 is fixed on the limiting clamp 9. The grooves 7 correspond to the second rotating shaft 8, and the second rotating shaft 8 is rotatably fitted in the grooves 7. A torsion spring is installed between the second rotating shaft 8 and the grooves 7.
[0027] Specifically, the upper side of the IC card 5 can be dropped by the limiting clamp 9, which has a good limiting effect on the IC card 5. The limiting clamp 9 can be manually rotated upward to remove the limiting clamp 9 from the IC card 5.
[0028] The bracket body 1 has a sliding groove 16 and a slot 10. The partition 11 is slidably connected to the sliding groove 16, and the slot 10 corresponds to the partition 11.
[0029] Specifically, the IC card 5 can be separated by the partition 11 to prevent the mobile phone from repeatedly reading the IC card 5. The partition 11 can also act as a limit to prevent the IC card 5 from falling and being lost.
[0030] The heat dissipation structure includes a cooling fan 14, a protective shell 13 and multiple support rods 12 fixed on the bracket body 1, the cooling fan 14 is located inside the protective shell 13, and the cooling fan 14 is equipped with a USB data cable for connecting to a power bank.
[0031] Specifically, by removing the partition 11 and IC card 5, better heat dissipation can be achieved through the cooling fan 14. When heat dissipation is required, the cooling fan 14 can be connected to a power bank via a data cable, and the power bank can supply power to the cooling fan 14, thereby allowing the cooling fan 14 to blow air for heat dissipation.
[0032] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A multifunctional IC holder structure for a mobile phone, comprising a holder body (1), characterized in that, The support body (1) is provided with a mobile phone shell (2) on one side, and is provided with a clamping structure and an IC card (5) inside.
2. The multi-functional IC holder structure for a mobile phone according to claim 1, wherein: Both sides of the support body (1) are fixedly provided with first rotating shafts (4), and the mobile phone shell (2) is fixedly provided with a rotating frame (3) which is rotatably connected with the first rotating shafts (4).
3. The multi-functional IC holder structure for a handset according to claim 1, wherein: The support body (1) is provided with a placing groove (15) inside, the placing groove (15) corresponds to the IC card (5), and the elastic clamping blocks (6) are located on the circumferential side of the placing groove (15).
4. The multi-functional IC holder structure for a handset according to claim 3, wherein: The elastic clamping blocks (6) are fixedly connected with the inner wall of the placing groove (15), and the elastic clamping blocks (6) are in arc-shaped structure.
5. The multi-functional IC holder structure for a handset according to claim 1, wherein: The support body (1) is provided with a plurality of grooves (7), the limiting clamping blocks (9) are fixedly provided with second rotating shafts (8), and the grooves (7) correspond to the second rotating shafts (8).
6. The multi-functional IC holder structure for a handset according to claim 5, wherein: The second rotating shafts (8) are rotatably matched in the grooves (7), and torsional springs are arranged between the second rotating shafts (8) and the grooves (7).
7. The multi-functional IC holder structure for a handset according to claim 1, wherein: The support body (1) is provided with a sliding groove (16) and a clamping groove (10) inside, the partition plate (11) is slidably connected with the sliding groove (16), and the clamping groove (10) corresponds to the partition plate (11).
8. The multi-functional IC holder structure for a handset according to claim 1, wherein: The heat dissipation structure comprises a heat dissipation fan (14), the support body (1) is fixedly provided with a protective shell (13) and a plurality of supporting rods (12), and the heat dissipation fan (14) is located in the protective shell (13).