Silicon controlled rectifier heat dissipation structure, control panel and household appliance
By setting a large-area heat-dissipating copper foil layer on the bottom surface of the PCB substrate and directly electrothermally coupling it with the thyristor device, and combining it with conductive pins to expand the heat dissipation path, the problem of poor heat dissipation of thyristors in household appliances is solved, realizing an efficient and simple heat dissipation structure and improving the stability and reliability of household appliances.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-18
- Publication Date
- 2026-04-03
AI Technical Summary
Existing thyristor cooling technology has problems such as poor heat dissipation, high cost, complex structure, difficult maintenance and poor adaptability in household appliances. In particular, water cooling systems are difficult to apply in household appliances with limited space.
A heat dissipation copper foil layer with an area larger than the projected area of the thyristor device is set on the bottom surface of the PCB substrate. The heat dissipation pins of the thyristor device are directly electrothermally coupled to the heat dissipation copper foil layer. By utilizing the low thermal resistance conduction path and planar thermal diffusion effect of the heat dissipation copper foil layer, combined with the electrothermal coupling connection between the conductive pins and the heat dissipation copper foil layer, the heat dissipation path is expanded, and the heat dissipation copper foil layer is divided for independent heat dissipation.
It achieves efficient and simple heat dissipation, reduces production costs and assembly difficulty, improves production efficiency, avoids electrical interference, ensures stable operation of thyristor devices, and enhances the stability and reliability of household appliances.
Smart Images
Figure CN224083777U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of thyristor heat dissipation structure technology, and more specifically, to a thyristor heat dissipation structure, a control board, and a household appliance. Background Technology
[0002] As a power electronic device widely used in many electrical control fields, the thyristor generates a large amount of heat during operation due to its switching between on and off states. Effective heat dissipation is crucial for ensuring the stable operation of the thyristor, extending its service life, and ensuring the reliable performance of electrical equipment.
[0003] Currently, in the field of thyristor heat dissipation technology, a separate heat dissipation device is required to ensure the reliable operation of the thyristor. Two common heat dissipation methods are adding heat sinks and using a water cooling system. Adding heat sinks increases the contact area between the thyristor and the surrounding air to promote heat dissipation. However, this method has some limitations. First, in the limited space of household appliances, the size and shape of the heat sink are significantly restricted, affecting its heat dissipation effect. Second, the material and design of the heat sink have a crucial impact on heat dissipation performance. Achieving ideal heat dissipation performance usually requires high-precision manufacturing processes and complex heat sink structures, which undoubtedly increases manufacturing costs and assembly difficulty.
[0004] Water cooling utilizes a circulating coolant to remove the heat generated by the silicon controlled rectifier (SCR). While water cooling performs well in cooling some high-power devices, its size and space constraints make it difficult to apply in household appliances, and it also has significant drawbacks. Water cooling systems are relatively complex, requiring multiple components such as pumps, coolant piping, and radiators, which increases the overall size and cost of the system. Furthermore, water cooling systems are more difficult to maintain, and the risk of coolant leakage poses a threat to the safe operation of electrical equipment. Additionally, water cooling systems have poor adaptability to different operating environments; for example, in low-temperature environments, the coolant may freeze, affecting the normal operation of the cooling system.
[0005] Given the shortcomings of existing thyristor heat dissipation technologies, developing a thyristor heat dissipation structure that is simple in structure, low in cost, highly efficient in heat dissipation, and widely applicable is of significant practical importance. The thyristor heat dissipation structure involved in this patent is proposed against this backdrop, aiming to provide a more effective and practical solution to the thyristor heat dissipation problem through innovative design concepts. Utility Model Content
[0006] In view of this, the purpose of this utility model is to provide a thyristor heat dissipation structure, control board and household appliance, which has a simple structure, low product cost and high production efficiency.
[0007] To achieve the above objectives, in a first aspect, this application provides a thyristor heat dissipation structure, comprising:
[0008] A PCB substrate having a top surface and a bottom surface, wherein a heat-dissipating copper foil layer is disposed on the bottom surface; and
[0009] A silicon controlled rectifier (SCR) device is mounted on the bottom surface, and its heat dissipation pins are directly electrothermally coupled to the heat dissipation copper foil layer.
[0010] Wherein, the area of the heat dissipation copper foil layer is larger than the projected area of the thyristor device mounted thereon, and the heat dissipation copper foil layer is configured as follows:
[0011] By establishing a low thermal resistance conduction path and utilizing the planar thermal diffusion effect of the heat dissipation copper foil layer to reduce the local thermal density of the thyristor device, a highly efficient heat dissipation effect can be achieved.
[0012] The above technical solution utilizes a heat-dissipating copper foil layer on the bottom surface of the PCB substrate, which is directly electrothermally coupled to the heat dissipation pins of the thyristor device. This allows for rapid heat transfer from the thyristor to the copper foil layer. Due to the large area of the copper foil layer, heat is effectively dispersed, reducing the local heat density of the thyristor through planar thermal diffusion. This prevents localized overheating from affecting the performance and lifespan of the thyristor, achieving highly efficient heat dissipation. This structure eliminates the need for additional complex heat sinks or water-cooling systems, removing the manual assembly process between the thyristor and the heat sink. It enables automated assembly of thyristors, reducing production costs and assembly difficulty, and improving production efficiency. Simultaneously, it reduces the product's size, facilitating the use of less waterproof adhesive for thyristor encapsulation, improving waterproof performance, and ensuring rapid heat dissipation while maintaining the thyristor's conductivity.
[0013] In conjunction with the first aspect, the area of the heat dissipation copper foil layer is greater than 1.5 times the projected area of the thyristor device.
[0014] In conjunction with the first aspect, the heat dissipation copper foil layer is electrically and thermally coupled to a wire, which conducts heat away from the heat dissipation copper foil layer in a low thermal resistance manner.
[0015] Through the above technical solution, the connection of the wires further expands the heat dissipation path, allowing heat on the heat-dissipating copper foil layer to be quickly dissipated through the wires. This low thermal resistance conduction method can more efficiently transfer heat to other heat dissipation components or the environment, enhancing the heat dissipation effect and ensuring that the temperature of the thyristor device is effectively controlled during long-term operation, further improving the performance and reliability of the entire heat dissipation structure.
[0016] In conjunction with the first aspect, a further technical solution is provided, wherein the thyristor device includes a first thyristor and a second thyristor spaced apart, the heat dissipation copper foil layer is divided into an electrically isolated first heat dissipation copper foil and a second heat dissipation copper foil, the first thyristor is electrically and thermally coupled to the first heat dissipation copper foil, and the second thyristor is electrically and thermally coupled to the second heat dissipation copper foil.
[0017] In household washing machines, two thyristors are needed to control forward and reverse rotation. The aforementioned technical solution divides the heat-dissipating copper foil layer into electrically isolated first and second heat-dissipating copper foils, which are then electrically and thermally coupled to the first and second thyristors, respectively. This allows for independent heat dissipation for multiple thyristor devices, avoiding potential electrical interference between different thyristors due to conductivity of the heat-dissipating copper foil layer. Simultaneously, each thyristor device has a dedicated heat dissipation area, enabling more precise heat dissipation control, improving heat dissipation efficiency, and ensuring stable operation of each thyristor device.
[0018] In conjunction with the first aspect, a further technical solution also includes a first conductive pin and a second conductive pin, wherein the first conductive pin is electrically and thermally coupled to the first heat-dissipating copper foil, and the second conductive pin is electrically and thermally coupled to the second heat-dissipating copper foil.
[0019] The above technical solution provides a new heat dissipation path for the first and second conductive pins on the heat-dissipating copper foil layer. The conductive pins are electrically and thermally coupled to the heat-dissipating copper foil layer, allowing heat to be quickly conducted to the leads, other heat dissipation components, or directly dissipated into the surrounding environment. This further optimizes the heat dissipation structure, improves heat dissipation efficiency, and also provides greater flexibility in the design of the entire heat dissipation system.
[0020] In conjunction with the first aspect, a further technical solution is provided in which both the first conductive pin and the second conductive pin are disposed on the top surface. The first conductive pin passes through the PCB substrate and is electrically and thermally coupled to the first heat dissipation copper foil, and the second conductive pin passes through the PCB substrate and is electrically and thermally coupled to the second heat dissipation copper foil.
[0021] By placing the conductive pins on the top surface of the PCB substrate and connecting them through the substrate to the heat dissipation copper foil layer, this design makes full use of the PCB substrate's spatial structure. On the one hand, the conductive pins on the top surface can be easily connected to other heat dissipation components or circuits, resulting in a more stable structure and facilitating effective heat dissipation. On the other hand, this layout makes the entire heat dissipation structure more compact, saving space and facilitating integration into various electrical devices.
[0022] In conjunction with the first aspect, a further technical solution is that the areas of the first heat-dissipating copper foil and the second heat-dissipating copper foil are each greater than 1.5 times the projected area of the corresponding thyristor.
[0023] The above technical solution ensures that the first and second heat-dissipating copper foils have sufficiently large areas to receive and dissipate the heat generated by the corresponding SCR devices. The design, with an area greater than 1.5 times the projected area of the SCR, effectively enhances the heat dissipation capability of the copper foil layer, further reduces the local heat density of the SCR device, ensures the stability and reliability of heat dissipation, and thus better protects the SCR device and extends its service life.
[0024] Secondly, this application provides a control board, including the thyristor heat dissipation structure described in the first aspect.
[0025] By applying the aforementioned innovative thyristor heat dissipation structure to the control board, the heat dissipation performance of the control board can be significantly improved. This control board can effectively control the temperature during operation, ensuring the stable operation of the thyristors and other components on the board, improving the reliability and service life of the control board, while reducing the manufacturing cost and production difficulty.
[0026] In conjunction with the second aspect, a further technical solution is provided where components are disposed on the top surface, and the top surface is covered with silicone potting compound, which covers all the pins of the components.
[0027] Through the above technical solution, the use of silicone potting compound can protect the component pins on the top surface of the control board, providing insulation, moisture protection, and dust protection. Simultaneously, the silicone potting compound has certain thermal conductivity, which can assist in heat dissipation, further optimizing the heat dissipation effect of the control board and ensuring stable operation of the entire control board under various complex working environments.
[0028] Thirdly, this application provides a household appliance that includes the control panel of the second aspect.
[0029] By applying this highly efficient heat dissipation control board to household appliances using the above technical solution, problems such as performance degradation and shortened lifespan caused by heat generation from thyristor devices during operation can be effectively solved. Optimizing the heat dissipation structure improves the stability and reliability of household appliances, enhancing the user experience.
[0030] In conjunction with the third aspect, a further technical solution is that the household appliance is a washing machine.
[0031] Through the above technical solution, the control board of this application, designed for common household appliances such as washing machines, can effectively meet the heat dissipation requirements of the thyristor devices during motor control and other processes. During operation, the washing machine's motor frequently starts and stops, and rotates forward and backward, resulting in significant load changes on the thyristor devices and generating heat. The heat dissipation structure of this application can effectively ensure the stable operation of the thyristor devices, thereby ensuring the normal operation of the washing machine and improving its lifespan and energy efficiency.
[0032] In summary, this application has at least one of the following beneficial technical effects:
[0033] 1. The thyristor heat dissipation structure of this application sets a heat dissipation copper foil layer with an area larger than the projected area of the thyristor device on the bottom surface of the PCB substrate, and directly electrothermally couples the heat dissipation pins of the thyristor device to the heat dissipation copper foil layer. By utilizing the low thermal resistance conduction path and good planar heat diffusion effect of the heat dissipation copper foil layer, the heat generated by the thyristor device can be dissipated quickly and effectively, achieving a high-efficiency heat dissipation effect. Compared with traditional heat sinks or water cooling methods, the structure is simpler, reduces production costs and assembly difficulty, and improves production efficiency by more than 20%.
[0034] 2. By dividing the heat dissipation copper foil layer into multiple electrically isolated parts, and connecting them to multiple thyristor devices that are spaced apart, independent heat dissipation of multiple thyristor devices is achieved, effectively avoiding electrical interference problems, improving heat dissipation efficiency and the stability of thyristor device operation, and making it suitable for various application scenarios with multiple thyristor devices.
[0035] 3. By introducing conductive pins and electrothermal coupling with the heat dissipation copper foil layer, and placing the conductive pins on the top surface of the PCB substrate, the heat dissipation path is further expanded, allowing heat to be quickly dissipated through the conductive pins. This optimizes the design of the heat dissipation system, improves heat dissipation efficiency and reliability, and at the same time, this layout makes the entire heat dissipation structure more compact, saves space, and facilitates integrated applications.
[0036] 4. Applying the above heat dissipation structure to control boards and home appliances, especially washing machines and other home appliances that require high stability and reliability, can effectively solve the performance and lifespan problems caused by the heat generated by the thyristor devices, improve the overall performance, reliability and lifespan of home appliances, reduce the manufacturing cost of home appliances, enhance market competitiveness, and provide users with a more stable, efficient and economical home appliance product. Attached Figure Description
[0037] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0038] Figure 1 A three-dimensional structural diagram of a prior art silicon controlled rectifier heat dissipation structure;
[0039] Figure 2 This is a schematic diagram of the structure of a conventional control board.
[0040] Figure 3 This is a schematic diagram of the first embodiment of the thyristor heat dissipation structure of this application;
[0041] Figure 4 This is a schematic diagram of the second embodiment of the thyristor heat dissipation structure of this application;
[0042] Figure 5 This is a schematic diagram of the control board structure of this application;
[0043] Figure 6 This is a top view of the control board of this application.
[0044] Figure label:
[0045] 1. PCB substrate; 11. Top surface; 12. Bottom surface; 2. SCR device; 21. Heat dissipation pin; 22. First SCR; 23. Second SCR; 3. Heat sink; 4. Heat dissipation copper foil layer; 41. First heat dissipation copper foil; 42. Second heat dissipation copper foil; 5. Terminal; 6. Socket; 61. First conductive pin; 62. Second conductive pin. Detailed Implementation
[0046] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0047] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0048] In the description of this application, it should be understood that the terms "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0049] Please see Figure 1 In existing technologies, the heat dissipation structure of the thyristor 2 involves fixing the thyristor 2 to a heat sink 3. The thyristor 2 transfers heat to the heat sink 3, which then dissipates the heat. To increase the heat dissipation area of the heat sink 3, it is vertically mounted on the PCB substrate 1, resulting in a relatively large space requirement. Furthermore, the thyristor 2 and heat sink 3 need to be secured with screws to maintain a tight connection and increase heat transfer efficiency. However, screwing the thyristor 2 to the heat sink 3 requires manual installation, making automated assembly impossible.
[0050] Example 1
[0051] Please see Figure 2 and Figure 3 This embodiment provides a thyristor heat dissipation structure, mainly used in home appliance control boards. The specific structure includes a PCB substrate 1 with a thickness of 1.6mm and dimensions of 100mm × 80mm, having a top surface 11 and a bottom surface 12. The top surface 11 is used for mounting components, and the bottom surface 12 is used for wiring. A continuous heat-dissipating copper foil layer 4 is disposed on the bottom surface 12 of the PCB substrate 1. This heat-dissipating copper foil layer 4 has a thickness of 35μm and an area of approximately 30mm × 20mm, offering the advantage of fast heat transfer. The thyristor device 2 is surface-mounted on the heat-dissipating copper foil layer 4 on the bottom surface 12 of the PCB substrate 1, and its heat dissipation pins 21 are directly electrothermally coupled to the heat-dissipating copper foil layer 4 via soldering. The projected area of the thyristor device 2 is approximately 15mm × 10mm, and the area of the heat-dissipating copper foil layer 4 is larger than the projected area of the thyristor device 2 on the surface of the heat-dissipating copper foil layer 4. Preferably, the area of the heat-dissipating copper foil layer 4 is greater than 1.5 times the projected area of the thyristor device 2.
[0052] The heat-dissipating copper foil layer 4 establishes a low thermal resistance conduction path and reduces the local heat density of the SCR device 2 through its planar heat diffusion effect, thereby achieving efficient heat dissipation. Specifically, when the SCR device 2 generates heat during power-on, the heat is quickly conducted to the heat-dissipating copper foil layer 4 through the heat dissipation pin 21. Due to the large area of the heat-dissipating copper foil layer 4, the heat diffuses rapidly within its plane, reducing the local heat density and preventing local overheating of the SCR device 2, ensuring its stable operation. This structure eliminates the need for additional heat sinks or complex water-cooling systems and can be automated through surface mount technology, reducing production costs and assembly difficulty, and improving production efficiency.
[0053] Example 2
[0054] Please see Figure 4 This embodiment extends upon embodiment 1, providing another thyristor heat dissipation structure with better heat dissipation performance.
[0055] The thyristor heat dissipation structure in this embodiment also includes a PCB substrate 1, with its top surface 11 and bottom surface 12 facing each other. Unlike Embodiment 1, the heat dissipation copper foil layer 4 is electrically and thermally coupled to a terminal 5. One end of the terminal 5 is electrically and thermally coupled to the heat dissipation copper foil layer 4 via soldering, and the other end passes through the PCB substrate 1, is perpendicular to the top surface 11, and is connected to a copper wire. The terminal 5 and the copper wire conduct heat away from the heat collected by the heat dissipation copper foil layer 4 using a low thermal resistance method, further improving the heat dissipation effect. When the thyristor device 2 generates heat during operation, the heat is transferred to the heat dissipation copper foil layer 4 through the heat dissipation pin 21, and then quickly dissipated to the outside through the wire, thereby more effectively reducing the temperature of the thyristor device 2 and ensuring its stable performance under long-term high-load operation.
[0056] In this embodiment, the copper wire can transmit electrical signals while also quickly transferring heat from the heat-dissipating copper foil layer 4, eliminating the need for a separate heat dissipation device, reducing material costs, and resulting in a more compact structure.
[0057] Example 3
[0058] Please see Figure 5 and Figure 6 This embodiment provides a dual thyristor heat dissipation structure, which is suitable for control boards in large household appliances, such as washing machines.
[0059] This embodiment of the dual-thyristor heat dissipation structure includes a PCB substrate 1, on which a heat-dissipating copper foil layer 4 is disposed. The thyristor devices 2 include a first thyristor 22 and a second thyristor 23 spaced apart, each with a projected area of 15mm × 10mm. The heat-dissipating copper foil layer 4 is divided into an electrically isolated first heat-dissipating copper foil 41 and a second heat-dissipating copper foil 42 to ensure electrical non-interference. The first thyristor 22 is electrically and thermally coupled to the first heat-dissipating copper foil 41, and the second thyristor 23 is electrically and thermally coupled to the second heat-dissipating copper foil 42; both connections are made using soldering.
[0060] Please see Figure 6 The dual-thyristor heat dissipation structure in this embodiment also includes a socket 6, which is provided with a first conductive pin 61 and a second conductive pin 62, both of which are copper pins with a diameter of 2mm. The first conductive pin 61 is electrically and thermally coupled to the first heat dissipation copper foil 41, and the second conductive pin 62 is electrically and thermally coupled to the second heat dissipation copper foil 42. Both the first conductive pin 61 and the second conductive pin 62 are disposed on the top surface 11 of the PCB substrate 1, and respectively pass through the PCB substrate 1 and are electrically and thermally coupled to the corresponding heat dissipation copper foil. The other end of the conductive pin is used to connect to an external lead via a plug, such as connecting to a lead terminal 5, which further expands the heat dissipation path and improves the heat dissipation efficiency.
[0061] The areas of the first heat dissipation copper foil 41 and the second heat dissipation copper foil 42 are respectively greater than 1.5 times the projected area of the corresponding thyristor, ensuring that there is enough area to receive and diffuse the heat generated by the thyristor device 2. Through the planar thermal diffusion effect, the local heat density is effectively reduced, protecting the thyristor device 2 from overheating damage.
[0062] Example 4
[0063] This embodiment discloses a control board, including the thyristor heat dissipation structure in any of the above embodiments. The top surface 11 of the control board in this embodiment is also provided with other components, such as resistors and capacitors, and the top surface 11 is covered with silicone potting compound. This silicone potting compound fully covers all the pins of the components, serving to insulate, prevent moisture, prevent dust, and assist in heat dissipation, further improving the stability and reliability of the control board.
[0064] Example 5
[0065] This embodiment discloses a household appliance, specifically a washing machine. By adopting the control board in Embodiment 4, the problem of overheating of the thyristor device during the operation of the washing machine, especially in the motor control process, is effectively solved, thereby improving the stability and service life of the washing machine, reducing the risk of failure due to overheating, and enhancing the user experience.
[0066] The above provides a detailed description of the thyristor heat dissipation structure provided by this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core idea of this utility model. It should be noted that those skilled in the art can make various improvements and modifications to this utility model without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this utility model.
Claims
1. A thyristor heat dissipation structure, characterized in that, include: A PCB substrate having a top surface and a bottom surface, wherein a heat-dissipating copper foil layer is disposed on the bottom surface; and A silicon controlled rectifier (SCR) device is mounted on the bottom surface, and its heat dissipation pins are electrically and thermally coupled to the heat dissipation copper foil layer. Wherein, the area of the heat dissipation copper foil layer is larger than the projected area of the thyristor device mounted thereon, and the heat dissipation copper foil layer is configured as follows: A low thermal resistance conduction path is established, and the planar thermal diffusion effect of the heat dissipation copper foil layer is used to reduce the local thermal density of the thyristor device.
2. The thyristor heat dissipation structure according to claim 1, characterized in that, The area of the heat dissipation copper foil layer is greater than 1.5 times the projected area of the silicon controlled rectifier (SCR) device.
3. The thyristor heat dissipation structure according to claim 1, characterized in that, The heat dissipation copper foil layer is electrically and thermally coupled to a wire, which conducts heat away from the heat dissipation copper foil layer in a low thermal resistance manner.
4. The thyristor heat dissipation structure according to claim 1, characterized in that, The thyristor device includes a first thyristor and a second thyristor spaced apart. The heat dissipation copper foil layer is divided into an electrically isolated first heat dissipation copper foil and a second heat dissipation copper foil. The first thyristor is electrically and thermally coupled to the first heat dissipation copper foil, and the second thyristor is electrically and thermally coupled to the second heat dissipation copper foil.
5. The thyristor heat dissipation structure according to claim 4, characterized in that, It also includes a first conductive pin and a second conductive pin, wherein the first conductive pin is electrically and thermally coupled to the first heat dissipation copper foil, and the second conductive pin is electrically and thermally coupled to the second heat dissipation copper foil.
6. The thyristor heat dissipation structure according to claim 5, characterized in that, The first conductive pin and the second conductive pin are both disposed on the top surface. The first conductive pin passes through the PCB substrate and is electrically and thermally coupled to the first heat dissipation copper foil. The second conductive pin passes through the PCB substrate and is electrically and thermally coupled to the second heat dissipation copper foil.
7. The thyristor heat dissipation structure according to claim 4, characterized in that, The areas of the first and second heat dissipation copper foils are each greater than 1.5 times the projected area of the corresponding thyristor.
8. A control board, characterized in that, Including the thyristor heat dissipation structure as described in any one of claims 1-7.
9. The control board according to claim 8, characterized in that, The top surface is provided with components, and the top surface is covered with silicone potting compound, which covers all the pins of the components.
10. A household appliance, characterized in that, Includes the control panel as described in claim 8 or 9.
11. The household appliance according to claim 10, characterized in that, The household appliance in question is a washing machine.