High-efficiency heat dissipation structure of multi-network-port communication device

Abstract

The utility model discloses an efficient heat dissipation structure of a multi-network-port communication device, which relates to the technical field of multi-network-port communication devices and comprises a heat dissipation component and a flow guide frame component, the flow guide frame component is erected at the top of the heat dissipation component, and a heat conduction silicon plate is mounted at the bottom of the heat dissipation component. And the auxiliary supporting plates are connected to the left side and the right side of the flow guide frame component. According to the efficient heat dissipation structure of the multi-network-port communication device, the flow guide frame component is erected around the heat dissipation component, a certain degree of structural protection can be provided for the heat dissipation component and the heat conduction silicon plate at the same time through the structural characteristics of the flow guide frame component, and on the other hand, the heat dissipation component can be matched with the structural characteristics of the heat dissipation component; and the space between the two parts has a relatively narrow space structure so as to cooperate with the heat conduction of the heat conduction silicon plate and realize rapid cooling by utilizing the separation of small-opening ventilation cooling, so that an enough heat dissipation effect can be provided for components, and the influence of heat increase on the operation of equipment is avoided.

Description

Technical Field

[0001] This utility model relates to the technical field of multi-port communication devices, specifically to a high-efficiency heat dissipation structure for multi-port communication devices. Background Technology

[0002] A multi-port communication device is a communication device with multiple network interfaces, capable of connecting to multiple different network environments simultaneously to achieve data transmission and processing. This type of device is typically equipped with two or more Ethernet interfaces, supporting information sharing between different local area networks. It is suitable for scenarios requiring independent communication channels, such as industrial automation equipment, sensors, and monitoring systems.

[0003] Conventional heat dissipation structures dissipate heat by drawing heat from the surface of heat dissipation fins and other heat pipe structures through their airflow structure. However, the overall structure is relatively open, which makes it difficult for the heat conducted from the surface of heat dissipation fins and other structures to be carried away quickly, resulting in relatively limited heat dissipation effect. Utility Model Content

[0004] The purpose of this invention is to provide an efficient heat dissipation structure for a multi-port communication device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-efficiency heat dissipation structure for a multi-port communication device, comprising a heat dissipation component and a flow guiding structure component. The top of the heat dissipation component is supported by the flow guiding structure component, and the bottom of the heat dissipation component is equipped with a thermally conductive silicon plate. Auxiliary support plates are connected and installed on both the left and right sides of the flow guiding structure component. The flow guiding structure component includes a top plate, connecting piles, side plates, and inserts. Connecting piles are symmetrically arranged at the left and right ends of the bottom of the top plate, and the bottom of the connecting piles is connected to the side plates. Inserts are arranged at the bottom of the side plates.

[0006] Furthermore, the heat dissipation component includes a heat-conducting base, heat dissipation fins, a fixing base, a fixing angle plate, and a limiting groove. The top surface of the heat-conducting base is provided with heat dissipation fins, and the left and right sides of the heat-conducting base are provided with fixing bases. The front and rear sides of the heat-conducting base are provided with fixing angle plates, and the bottom surface of the heat-conducting base is provided with a limiting groove.

[0007] Furthermore, the fixing base is symmetrically welded to the side of the heat-conducting base, and the fixing angle plate and the heat-conducting base are integrally formed.

[0008] Furthermore, the heat-conducting base and the heat dissipation fins are made of the same material, and the heat-conducting base and the heat dissipation fins are integrated into a single structure.

[0009] Furthermore, the connecting piles are arranged between the top plate and the side plate, and the piles are embedded in the bottom front and rear ends of the side plate.

[0010] Furthermore, the position where the plug piles are arranged at the bottom of the side plate and the fixed seat are combined in a tightly inserted structure, and the plug piles and the side plate are integrally structured.

[0011] Furthermore, the auxiliary support plates are symmetrically arranged at the front and rear sides of the diversion structure member, and the heat dissipation member, the diversion structure member and the auxiliary support plates are movably connected to each other.

[0012] Furthermore, through holes for bolt installation are horizontally and vertically formed at the upper and lower ends of the auxiliary support plate respectively. The inner surface structure of the limiting groove matches the outer surface structure of the heat-conducting silicone plate, and the heat-conducting silicone plate is closely covered on the inner surface of the limiting groove in an embedded structure.

[0013] The utility model provides an efficient heat dissipation structure for a multi-network interface communication device, having the following beneficial effects:

[0014] 1. In the utility model, a diversion structure member is erected above the heat dissipation member. The entire diversion structure member can use the plug piles at the bottom of the side plate to be inserted and spliced with the fixed seats on both sides of the heat-conducting seat in the vertical direction, so as to achieve the rapid combination of the two structural members. Since the entire diversion structure member is in a "冂" shape covering the periphery of the heat dissipation member, on the one hand, the top plate and the side plate can provide a certain degree of structural protection for the heat dissipation member and the heat-conducting silicone plate, reducing structural damage caused by bumps. On the other hand, the surrounding structure of the diversion structure member, combined with the internal heat dissipation member, forms a relatively narrow ventilation space. When the external flowing air enters between the heat dissipation member and the diversion structure member, using the principle of small-port ventilation cooling, the air flow rate will increase at this time, the pressure will increase, resulting in an increase in air density. When the air with increased density comes into contact with the surfaces of the heat-conducting seat and the heat dissipation fins in the narrow space, it will dissipate heat through heat conduction, thereby reducing the air temperature and then taking away the heat conducted from the surface. In this way, the entire device can have sufficient heat dissipation efficiency.

[0015] 2. This utility model, by symmetrically arranging fixing angle plates 104 at both ends of the heat-conducting base 101, and using screws, can maximize the structural stability of the heat dissipation component 1. Because a limiting groove 105 is opened on the bottom surface of the heat-conducting base 101, this structural design can ensure the stability of the structural combination between the heat-conducting silicon plate 3 and the heat dissipation component 1, avoiding structural misalignment during installation and thus preventing unnecessary impact on heat conduction. Furthermore, the cooperation between the two, combined with the material properties of the heat-conducting silicon plate 3, can maintain a certain degree of shock absorption and buffering between the entire device and the circuit board after fixed installation, while also ensuring the connection stability of the overall structure to ensure the normal operation of the device. The various structures can be modularly disassembled and assembled for easy combination and selective use, thereby meeting different usage needs. The auxiliary support plate can be connected to the side of the side plate as needed, and the other end of the auxiliary support plate can be fixed to the mounting structure surface or the circuit board surface, thus providing sufficient structural support for the entire device and further ensuring its structural stability. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the main body of the high-efficiency heat dissipation structure of a multi-port communication device according to the present invention.

[0017] Figure 2 This is an exploded view of the main body of the high-efficiency heat dissipation structure of a multi-port communication device according to the present invention.

[0018] Figure 3 This is a three-dimensional structural diagram of a heat dissipation component for a high-efficiency heat dissipation structure of a multi-port communication device according to the present invention.

[0019] Figure 4 This is a three-dimensional structural diagram of the heat dissipation structure of a multi-port communication device according to the present invention.

[0020] In the diagram: 1. Heat dissipation component; 101. Heat conduction base; 102. Heat dissipation fins; 103. Fixing base; 104. Fixing corner plate; 105. Limiting groove; 2. Airflow guide structure component; 201. Top plate; 202. Connecting pile; 203. Side plate; 204. Insertion pile; 3. Heat conduction silicon plate; 4. Auxiliary support plate. Detailed Implementation

[0021] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0022] like Figures 1 to 4As shown, a high-efficiency heat dissipation structure for a multi-port communication device includes a heat dissipation component 1 and a flow guide structure 2. The flow guide structure 2 is mounted on the top of the heat dissipation component 1, and a thermally conductive silicon plate 3 is installed at the bottom of the heat dissipation component 1. Auxiliary support plates 4 are connected and installed on both the left and right sides of the flow guide structure 2. The flow guide structure 2 includes a top plate 201, connecting pins 202, side plates 203, and insert pins 204. Connecting pins 202 are symmetrically arranged at the left and right ends of the bottom of the top plate 201, and the bottom of the connecting pins 202 is connected to the bottom of the side plates 203. Insert pins 204 are arranged at the bottom of the side plates 203. The components 202 are arranged between the top plate 201 and the side plate 203, and the inserts 204 are embedded in the bottom front and rear ends of the side plate 203. The positions of the inserts 204 at the bottom of the side plate 203 and the fixing seats 103 are tightly inserted and combined with each other. The inserts 204 and the side plate 203 are integrated. The entire flow guide structure component 2 can be inserted and spliced ​​with the fixing seats 103 on both sides of the heat conduction seat 101 in the vertical direction using the inserts 204 at the bottom of the side plate 203, so as to realize the rapid combination between the two structural components.

[0023] like Figures 1 to 4 As shown, the heat dissipation component 1 includes a heat-conducting base 101, heat dissipation fins 102, a fixing base 103, a fixing angle plate 104, and a limiting groove 105. The top surface of the heat-conducting base 101 is provided with heat dissipation fins 102, and fixing bases 103 are provided on the left and right sides of the heat-conducting base 101. Fixing angle plates 104 are provided on both the front and rear sides of the heat-conducting base 101. A limiting groove 105 is formed on the bottom surface of the heat-conducting base 101. The fixing bases 103 are symmetrically welded to the sides of the heat-conducting base 101, and the fixing angle plates 104 and the heat-conducting base 101 are integrally formed. The heat-conducting base 101 and the heat dissipation fins 102 are made of the same material and are integrally formed. An auxiliary support plate 4 is symmetrically arranged on the front and rear sides of the heat-conducting base 101. The side of the flow guide structure 2, and the heat dissipation component 1, the flow guide structure 2 and the auxiliary support plate 4 are movably connected to each other. The upper and lower ends of the auxiliary support plate 4 are respectively provided with horizontal and vertical holes for bolt installation. The inner surface structure of the limiting groove 105 matches the outer surface structure of the thermal conductive silicon plate 3, and the thermal conductive silicon plate 3 adopts an embedded structure to tightly cover the inner surface of the limiting groove 105. By symmetrically setting the fixing angle plates 104 at the front and rear ends of the heat conduction seat 101, and with the use of screws, the structural firmness of the heat dissipation component 1 can be guaranteed to the greatest extent. Since the limiting groove 105 is opened on the bottom surface of the heat conduction seat 101, the stability of the structural combination between the thermal conductive silicon plate 3 and the heat dissipation component 1 can be guaranteed, and the effectiveness of heat conduction can be guaranteed.

[0024] In summary, as Figures 1 to 4As shown, this multi-port communication device features a high-efficiency heat dissipation structure. In use, the entire thermally conductive silicon plate 3 is first embedded and tightly adhered to the inner surface of the limiting groove 105 of the heat-conducting base 101. This allows for rapid assembly of the thermally conductive silicon plate 3 and the heat dissipation component 1. Then, using the fixing angle plates 104 at both ends of the heat-conducting base 101, along with screws, the heat dissipation component 1 is fixedly installed on the mounting surface. Alternatively, the thermally conductive silicon plate 3 at the bottom of the heat-conducting base 101 can be attached to the top surface of a circuit board or chip to ensure effective subsequent heat conduction.

[0025] Next, the entire flow guide structure 2 is inserted and spliced ​​with the fixing seats 103 on both sides of the heat conduction seat 101 in the vertical direction using the inserts 204 at the bottom of the side plate 203, so that the heat dissipation component 1 and the flow guide structure 2 can be quickly combined. After the combination is completed, the two ends of the auxiliary support plate 4 can be connected and fixed to the side plate 203 and the mounting structure surface respectively according to the use needs, and provide structural support.

[0026] When external air flows into the narrow space between the heat dissipation component 1, the airflow guide component 2, and the structure inside the heat dissipation fins 102, the air velocity will increase rapidly, and the pressure will increase, resulting in an increase in air density. When the denser air comes into contact with the surface of the heat conduction seat 101 and the heat dissipation fins 102 in the narrow space, it will dissipate heat through thermal conduction, thereby lowering the air temperature and carrying away the heat conducted from the surface, thus achieving rapid heat dissipation.

[0027] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A multi-network port communication device high-efficiency heat dissipation structure, comprising a heat dissipation component (1) and a flow guide component (2), characterized in that: The top of the heat dissipation component (1) is provided with a flow guide frame component (2), and the bottom of the heat dissipation component (1) is provided with a heat-conducting silicon plate (3), and the left and right sides of the flow guide frame component (2) are both connected with auxiliary supporting plates (4), the flow guide frame component (2) comprises a top plate (201), a connecting pile (202), a side plate (203) and a plug pile (204), the bottom of the top plate (201) is symmetrically provided with the connecting piles (202) at the left and right ends, the bottom of the connecting pile (202) is connected with the side plate (203), and the bottom of the side plate (203) is provided with the plug pile (204).

2. The high-efficiency heat dissipation structure of a multi-network port communication device according to claim 1, wherein, The heat dissipation component (1) comprises a heat-conducting seat (101), a heat dissipation fin (102), a fixing seat (103), a fixing angle plate (104) and a limiting groove (105), the top surface of the heat-conducting seat (101) is provided with the heat dissipation fin (102), the left and right sides of the heat-conducting seat (101) are provided with the fixing seat (103), the front and rear sides of the heat-conducting seat (101) are both provided with the fixing angle plate (104), and the bottom surface of the heat-conducting seat (101) is provided with the limiting groove (105).

3. The high-efficiency heat dissipation structure of a multi-network port communication device according to claim 2, wherein, The fixing seat (103) is symmetrically welded to the side edge of the heat-conducting seat (101), and the fixing angle plate (104) and the heat-conducting seat (101) are integrally arranged.

4. The high-efficiency heat dissipation structure of a multi-network port communication device according to claim 2, wherein, The heat-conducting seat (101) and the heat dissipation fin (102) are made of the same material, and the heat-conducting seat (101) and the heat dissipation fin (102) are integrally arranged.

5. The high-efficiency heat dissipation structure of a multi-network port communication device according to claim 2, wherein, The connecting piles (202) are arranged between the top plate (201) and the side plate (203), and the plug piles (204) are embedded at the bottom of the side plate (203) at the front and rear ends.

6. The high-efficiency heat dissipation structure of a multi-network port communication device according to claim 5, wherein, The position of the plug pile (204) at the bottom of the side plate (203) is tightly inserted and combined with the fixing seat (103), and the plug pile (204) and the side plate (203) are integrally arranged.

7. The high-efficiency heat dissipation structure of a multi-network port communication device according to claim 6, wherein, The auxiliary supporting plates (4) are symmetrically arranged at the side edges of the flow guide frame component (2), and the heat dissipation component (1), the flow guide frame component (2) and the auxiliary supporting plates (4) are movably connected.

8. The high-efficiency heat dissipation structure of a multi-network port communication device according to claim 2, wherein, The upper and lower ends of the auxiliary supporting plate (4) are respectively provided with hole structures for bolt installation, the inner surface structure of the limiting groove (105) is matched with the outer surface structure of the heat-conducting silicon plate (3), and the heat-conducting silicon plate (3) is tightly attached to the inner surface of the limiting groove (105) in an embedded manner.

Images