Automatic tin spraying machine

Abstract

The utility model relates to the field of tin spraying machines, and discloses an automatic tin spraying machine which comprises a feeding assembly used for horizontally placing a PCB and conveying the PCB to a preset position; the overturning assembly is used for lifting the PCB reaching the preset position and overturning the PCB to a vertical state; the feeding assembly is used for clamping the PCBs in the vertical state and transferring the PCBs to the tin spraying station and the discharging station in sequence. The tin spraying assembly is used for spraying tin on the PCBs transferred by the feeding assembly; the discharging assembly is used for clamping the PCBs transferred by the feeding assembly and placing the PCBs on a discharging table; and the discharging table is used for placing the PCBs conveyed by the discharging assembly and transferring the PCBs to the next working procedure. Compared with the prior art, the PCB is directly conveyed to the tin spraying assembly for tin spraying through the overturning assembly, a special tin feeding assembly is not needed to be arranged for clamping the PCB, conveying the PCB for tin spraying and then conveying the PCB back, and therefore operation steps are simpler and more convenient, and meanwhile the overall structure is simpler.

Description

Technical Field

[0001] This utility model relates to the field of tin spraying machines, and more specifically, to an automatic tin spraying machine. Background Technology

[0002] Authorization announcement number CN220284190U, entitled "An Automated Tin Spraying Machine," discloses the overall structure of the tin spraying machine. In operation, the PCB board is conveyed from the roller conveyor to a suitable position. A flipping assembly flips the PCB board from a horizontal to a vertical position and raises it to a certain height. A clamping mechanism holds the PCB board, and a clamping rotation assembly transfers it to the next station. At this point, a soldering assembly catches the PCB board and lowers it to a certain position for solder spraying. After completion, the soldering assembly raises it back to its original position, where it is held by the clamping mechanism and transferred by the clamping rotation assembly to the unloading assembly at the next unloading station. The unloading assembly removes the unloading component and places it on a conical guide wheel.

[0003] In this automated tin spraying machine, when the clamping and rotating component sends the PCB board to the tin spraying station, the tinning component also needs to clamp it and send it down. After tin spraying, it rises again and is clamped by the clamping mechanism. This operation is quite cumbersome. In addition, a separate tinning component is required, which makes the overall structure complex. The PCB board is clamped back and forth between the clamping mechanism and the tinning component, which is prone to errors and has low efficiency. Utility Model Content

[0004] To address the shortcomings of the existing technology, this utility model provides an automatic tin-spraying machine with a relatively simple overall structure and convenient operation steps.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: an automatic soldering machine, comprising: a feeding component for horizontally placing a PCB board and conveying it to a predetermined position; a flipping component for lifting the PCB board that has reached the predetermined position and flipping it to a vertical position; a feeding component for clamping the vertically positioned PCB board and sequentially transferring it to a soldering station and an unloading station; a soldering component for soldering the PCB board transferred by the feeding component; an unloading component for clamping the PCB board transferred by the feeding component and placing it on an unloading table; and an unloading table for placing the PCB board sent by the unloading component and transferring it to the next process.

[0006] Furthermore, the feeding assembly includes: a support frame mechanism that can rotate along a vertical axis; and a clamping mechanism that is mounted on the support frame mechanism and can move up and down along the support frame mechanism, for clamping the upper edge of the PCB board in a vertical state on the flipping assembly, and rotating sequentially with the support frame mechanism to the solder spraying station and the unloading station.

[0007] Furthermore, the clamping mechanism has four sets and is evenly arranged around the upright mechanism, and each set of clamping mechanisms can move up and down independently along the upright mechanism.

[0008] Furthermore, the loading component, the solder spraying component, and the unloading platform are arranged around the feeding component, with the loading component and the unloading component facing each other. The solder spraying component is located between the loading component and the unloading component, the flipping component is located between the loading component and the feeding component, and the unloading component is located between the unloading platform and the feeding component.

[0009] Furthermore, the support mechanism includes a column, a third driving member for driving the column 31 to rotate, and a lifting mechanism on the column that is the same number as and corresponds one-to-one with the clamping mechanism. The lifting mechanism is fixedly connected to a slide rail on the column in the vertical direction, a slider is slidably connected to the slide rail, and a driving mechanism for driving the slider to slide along the slide rail. The clamping mechanism is fixedly connected to the slider.

[0010] Furthermore, the solder spraying component is placed next to the feeding component and its position is lower than that of the feeding component.

[0011] Furthermore, the feeding assembly includes: a feeding platform for horizontally placing the PCB board and conveying the PCB board to a predetermined position; and a positioning mechanism disposed on the feeding platform for blocking the PCB board and placing it in a predetermined position. The positioning mechanism can adjust its position on the feeding platform to adjust and limit the predetermined position.

[0012] Furthermore, the flipping assembly includes: a first rotating arm that can rotate between a horizontal state and a vertical state, and is positioned below a predetermined position of the feeding assembly in the horizontal state; a lifting mechanism disposed on the first rotating arm for supporting the edge of the PCB board near the axis of the first rotating arm; and a first driving member for driving the first rotating arm to rotate.

[0013] Furthermore, the unloading assembly includes: a second rotating arm that can rotate between a horizontal state and a vertical state, and is positioned below the unloading table surface in the horizontal state; a gripping mechanism disposed on the second rotating arm for gripping the PCB board transferred by the feeding assembly; and a second driving component for driving the second rotating arm to rotate.

[0014] In summary, the advantages of this utility model are as follows: The flipping component of this utility model vertically flips up the PCB board at the predetermined position of the feeding component, the feeding component clamps the PCB board and sends it to the solder spraying component for solder spraying, and finally the unloading component picks it up and places it on the unloading table; compared with the prior art, this utility model directly sends the PCB board to the solder spraying component for solder spraying by the flipping component, without the need to set up a special soldering component to pick up the PCB board, send it to the solder spraying component and then send it back, so the operation steps are simpler, and the overall structure is also simpler. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the tin spraying machine of this utility model from one angle;

[0016] Figure 2 This is a three-dimensional structural schematic diagram of the tin spraying machine of this utility model from another angle;

[0017] Figure 3 This is a three-dimensional structural diagram of the flipping component of this utility model;

[0018] Figure 4 This is a three-dimensional structural diagram of the feeding component of this utility model;

[0019] Figure 5 This is a three-dimensional structural diagram of the feeding component of this utility model.

[0020] Reference numerals: 1. Feeding assembly; 10. PCB board; 11. Feeding platform; 12. Feeding impeller; 13. Positioning mechanism; 2. Tilting assembly; 21. First rotating arm; 22. Pallet; 23. First drive motor; 24. Pulley; 25. First drive component; 3. Feeding assembly; 31. Column; 331. Second drive motor; 34. Third drive component; 332. Synchronous pulley seat; 333. Belt; 351. Bracket; 352. Fixed plate; 353. Movable plate; 354. Pushing component; 4. Tin spraying assembly; 5. Unloading assembly; 51. Second rotating arm; 52. Second drive component; 53. Chuck; 54. Cylinder; 6. Unloading platform. Detailed Implementation

[0021] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0022] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly or indirectly attached to that other component. When a component is referred to as being "connected to" another component, it can be directly or indirectly connected to that other component.

[0023] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0025] Figure 1 and Figure 2 The automatic soldering machine shown has a main structure including a loading assembly 1, a flipping assembly 2, a feeding assembly 3, a soldering assembly 4, an unloading assembly 5, and an unloading table 6. The loading assembly 1 is used to horizontally place the PCB board 10 and transport it to a predetermined position. The flipping assembly 2 is used to lift the PCB board 10 that has reached the predetermined position and flip the PCB board 10 from a horizontal state to a vertical state. The feeding assembly 3 is used to clamp the PCB board 10 in the vertical state and transfer it to the soldering station and the unloading station in sequence. The soldering assembly 4 is used to solder the PCB board 10 transferred from the feeding assembly 3. The unloading assembly 5 is used to clamp the PCB board 10 transferred from the feeding assembly 3 and place it on the unloading table 6. The unloading table 6 is used to place the PCB board 10 sent by the unloading assembly 5 and transfer it to the next process.

[0026] The tin spraying machine directly sends the PCB board 10 to the tin spraying component 4 via the flipping component 2 for tin spraying. There is no need to set up a special tinning component to clamp the PCB board 10 and send it to the tin spraying component, and then send it back to the flipping component 2. Therefore, the operation steps are simpler and the overall structure is also simpler.

[0027] In one embodiment, the feeding assembly 1 includes a feeding platform 11, which is provided with multiple sets of feeding impellers 12, which can drive the horizontally placed PCB board 10 to be conveyed to a predetermined position; the feeding platform 11 is provided with a positioning mechanism 13, which can adjust its position on the feeding platform 11 back and forth along the forward direction of the PCB board 10, so as to limit the predetermined position to accommodate PCB boards 10 of different sizes.

[0028] In one embodiment, reference is made to Figure 3The flipping assembly 2 includes a first rotating arm 21 and a first driving member 25 for driving the first rotating arm to rotate. The first rotating arm 21 can rotate between a horizontal state and a vertical state. When rotated to the horizontal state, the first rotating arm 21 is below a predetermined position of the loading assembly 1, and can lift the PCB board 10 from below when it is in the predetermined position. The first rotating arm 21 is provided with a lifting mechanism, which mainly includes a pallet 22 that can move along the first rotating arm 21, a first driving motor 23 for moving the pallet 22, and a pulley 24, so as to move the pallet 22 to abut and support the lower edge of the PCB board 10, while adjusting the position of the PCB board 10 on the first rotating arm 21.

[0029] In one embodiment, reference is made to Figure 4 The unloading assembly 5 includes a second rotating arm 51, which can rotate between a horizontal and a vertical state. In the horizontal state, it is positioned below the unloading table 6 to facilitate the placement of the PCB board 10 onto the table 6. The second rotating arm 51 is equipped with a gripping mechanism for gripping the PCB board 10 transferred from the feeding assembly 3. The second rotating arm 51 is driven to rotate by a second driving member 52. The gripping mechanism includes a chuck 53 and a cylinder 54 for driving the chuck 53 to open and close. The chuck 53 is located at the end of the second rotating arm 51 and is used to grip the upper edge of the PCB board 10 in a vertical state on the flipping assembly 2.

[0030] In one embodiment, reference is made to Figure 5 The feeding assembly 3 includes a support frame mechanism that can rotate along a vertical axis. The support frame mechanism is equipped with multiple clamping mechanisms that can move independently up and down along the support frame mechanism. Each clamping mechanism is used to clamp the upper edge of the PCB board 10 in a vertical state on the flipping assembly 2, and rotates sequentially with the support frame mechanism to the solder spraying station and the unloading station.

[0031] In a preferred embodiment, four clamping mechanisms are evenly arranged around the upright frame mechanism. The loading assembly 1, the solder spraying assembly 4, and the unloading platform 6 are arranged around the feeding assembly 3, with the loading assembly 1 and the unloading assembly 5 facing each other. The solder spraying assembly 4 is located between the loading assembly 1 and the unloading assembly 5, the flipping assembly 2 is located between the loading assembly 1 and the feeding assembly 3, and the unloading assembly 5 is located between the unloading platform 6 and the feeding assembly 3. In this embodiment, during operation, three sets of clamping mechanisms face the loading assembly 1, the solder spraying assembly 4, and the unloading platform 6. Each set of clamping mechanisms can independently complete the work at its designated position, thus improving operational efficiency.

[0032] In one embodiment, reference is made to Figure 5The support mechanism includes a column 31, a third driving member 34 for driving the column 31 to rotate, and a lifting mechanism on the column 31 that is the same number and corresponds one-to-one with the clamping mechanism. The lifting mechanism is fixedly connected to a slide rail 321 on the column 31 in the vertical direction, a slider 322 slidably connected to the slide rail 321, and a driving mechanism for driving the slider 322 to slide along the slide rail 321. The clamping mechanism is fixedly connected to the slider 322. Due to the driving mechanism, the slider 322 can move up and down, which can drive the clamping mechanism to move up and down to facilitate operation. The solder spraying assembly 4 is placed next to the feeding assembly 3 and its position is lower than the feeding assembly 3. During solder spraying, the slider 322 moves down, so that the clamping mechanism clamps the PCB board 10 into the solder spraying assembly 4. The solder spraying assembly 4 can be a conventional solder spraying furnace. The drive mechanism includes a second drive motor 331 located at the lower end of the column 31, a synchronous pulley seat 332 located at the upper end of the column 31, and a belt 333 wound around the output end of the second drive member 52 and the synchronous pulley seat 332. The belt is fixedly connected to the slider 322, that is, the drive mechanism adopts the existing mature belt 333 transmission.

[0033] In one embodiment, reference is made to Figure 5 The clamping mechanism includes a bracket 351, a fixed plate 352, a movable plate 353, and a pushing member 354. The fixed plate 352 is fixedly connected to the front end of the bracket 351. The movable plate 353 is hinged to the fixed plate 352, and the lower ends of the movable plate 353 and the fixed plate 352 form a clamping jaw that can open and close as the movable plate 353 rotates relative to the fixed plate 352. The pushing member 354 is a thrust-adjustable pushing member, and its rear end is hinged to the bracket 351. The output end of the pushing member 354 is hinged to the upper end of the movable plate 353, and is used to push the movable plate 353 to reciprocate relative to the fixed plate 352. The rear end of the bracket 351 is fixedly connected to the slider 322 of the upright mechanism.

[0034] The above embodiments are merely explanations of the present utility model and are not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to the embodiments without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of the present utility model.

Claims

1. An automatic tin-plating machine, characterized in that, include: The loading assembly is used to horizontally place the PCB board and transport it to a predetermined position; A flipping component is used to lift and flip a PCB board that has reached a predetermined position to a vertical position. The feeding assembly is used to clamp the PCB board in a vertical position and transfer it sequentially to the solder plating station and the unloading station; The tin plating assembly is used to apply tin plating to the PCB boards transferred from the feeding assembly. The unloading assembly is used to pick up the PCB board transferred from the feeding assembly and place it on the unloading table; The unloading platform is used to place the PCB boards delivered by the unloading assembly and transfer them to the next process.

2. The automatic tin-plating machine according to claim 1, characterized in that, The feeding assembly includes: a support frame mechanism that can rotate along a vertical axis; The clamping mechanism, located on the upright mechanism and movable up and down along the upright mechanism, is used to clamp the upper edge of the PCB board in a vertical position on the flipping assembly, and rotates sequentially with the upright mechanism to the solder spraying station and the unloading station.

3. An automatic tin-plating machine according to claim 2, characterized in that: The clamping mechanism has four sets and is evenly arranged around the upright mechanism. Each set of clamping mechanisms can move up and down independently along the upright mechanism.

4. An automatic tin-plating machine according to claim 3, characterized in that: The loading component, the solder spraying component, and the unloading platform are arranged around the feeding component, with the loading component and the unloading component facing each other. The solder spraying component is located between the loading component and the unloading component, the flipping component is located between the loading component and the feeding component, and the unloading component is located between the unloading platform and the feeding component.

5. An automatic tin-plating machine according to claim 3, characterized in that: The support frame mechanism includes a column, a third driving member for driving the column to rotate, and a lifting mechanism on the column that is the same number as and corresponds one-to-one with the clamping mechanism. The lifting mechanism is fixedly connected to a slide rail on the column in the vertical direction, a slider is slidably connected to the slide rail, and a driving mechanism for driving the slider to slide along the slide rail. The clamping mechanism is fixedly connected to the slider.

6. An automatic tin-spraying machine according to claim 2, characterized in that: The tin plating assembly is placed next to the feeding assembly and is positioned below the feeding assembly.

7. An automatic tin-plating machine according to claim 1, characterized in that, The feeding assembly includes: a feeding table, used to horizontally place the PCB board and convey the PCB board toward a predetermined position; A positioning mechanism is provided on the feeding table and is used to block the PCB board so that it is in a predetermined position. The positioning mechanism can adjust its position on the feeding table to adjust and limit the predetermined position.

8. An automatic tin-plating machine according to claim 1, characterized in that, The flipping assembly includes: a first rotating arm that can rotate between a horizontal state and a vertical state, and is positioned below a predetermined position of the feeding assembly in the horizontal state; The lifting mechanism is located on the first rotating arm and is used to support the edge of the PCB board on the side close to the axis of the first rotating arm; The first driving component is used to drive the first rotating arm to rotate.

9. An automatic tin-plating machine according to claim 1, characterized in that: The unloading assembly includes: a second rotating arm that can rotate between a horizontal state and a vertical state, and is positioned below the unloading table surface in the horizontal state; The gripping mechanism, located on the second rotating arm, is used to grip the PCB board transferred from the feeding assembly; The second driving component is used to drive the second rotating arm to rotate.

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