Wafer cleaning overflow groove and wafer cleaning equipment
By employing a collection tank and a multi-pipe structure in the wafer cleaning overflow tank, the organic combination of water inlet and drainage is achieved, solving the problem of drainage residue in existing technologies and improving the stability of the water flow field and the cleaning effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2026-04-07
AI Technical Summary
In existing technologies, the construction of a stable water flow field structure fails to organically combine drainage and water inlet, which makes it easy for residues to remain in the overflow channel during drainage, affecting the drainage effect.
A wafer cleaning overflow tank is designed, which adopts a collection tank and a multi-pipe structure, including a first inlet and outlet pipe, a second inlet and outlet pipe, a main inlet pipe and a top inlet pipe. The collection tank design allows the inlet and outlet pipes to be organically combined inside the tank to form a stable water flow field and reduce the impact of water flow on the internal structure of the tank.
This improved the drainage of water inside the overflow tank, reduced water residue, and ensured the stability and efficiency of the cleaning effect.
Smart Images
Figure CN224087444U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of wafer cleaning technology, and in particular relates to a wafer cleaning overflow tank and wafer cleaning equipment. Background Technology
[0002] In semiconductor wet cleaning processes, an overflow tank is typically placed after the chemical tank to clean the chemical solution and impurities from the wafer surface. During the cleaning process, cleaning liquid is continuously injected from the bottom of the overflow tank until it is full, with excess liquid overflowing from the top. The cleaning liquid injected from the bottom of the overflow tank creates a stable water flow field across the wafer surface, thereby achieving the effect of cleaning the substances on the wafer surface.
[0003] Although existing technologies have adopted a combination of top and bottom liquid inlets to create a stable water flow field and improve the cleaning effect of the water flow, this structural design fails to organically combine drainage and water inlet. The complex water inlet structure makes it easy for residues to appear when the overflow tank drains, affecting the drainage effect. Utility Model Content
[0004] This invention provides a wafer cleaning overflow tank, which aims to solve the problem that current designs for constructing stable water flow field structures fail to organically combine drainage and water inlet, and that complex water inlet structures easily lead to residues during drainage of the overflow tank, affecting the drainage effect.
[0005] This invention is implemented as follows: a wafer cleaning overflow tank, comprising:
[0006] A trough with an opening at the top, a strip-shaped protrusion inside the trough, collection troughs on both sides of the strip-shaped protrusion, and a top pipe fixing trough near the opening of the trough;
[0007] The first and second inlet and outlet pipes are connected to each other; the bottom of the collection tank is provided with a spray pipe.
[0008] The main water inlet pipe is located inside the strip-shaped protrusion. A portion of the main water inlet pipe extends out of the strip-shaped protrusion. Both sides of the portion of the main water inlet pipe extending out of the strip-shaped protrusion are provided with nozzles, which face the collection tank.
[0009] A top water inlet pipe is installed inside a top pipe fixing groove, and an upper spray nozzle is provided on the top water inlet pipe, the upper spray nozzle pointing into the groove body;
[0010] The water inlet pipe and the water outlet pipe are connected at both ends of the first water inlet pipe and the second water inlet pipe respectively, and the main water inlet pipe and the top water inlet pipe are connected to the water inlet pipe.
[0011] Preferably, the first and second inlet / outlet pipes extend out of the tank at both ends, one end of the first and second inlet / outlet pipes extending out of the tank is connected to the inlet pipe, and the other end of the first and second inlet / outlet pipes away from the inlet pipe is connected to the drain pipe.
[0012] Preferably, one end of the top water inlet pipe extends out of the tank, and the portion of the top water inlet pipe extending out of the tank is connected to the water inlet pipe.
[0013] Preferably, the collection troughs are located on both sides of the strip-shaped protrusion, and the highest point of the collection troughs is lower than the lowest point of the strip-shaped protrusion.
[0014] Preferably, the main water inlet pipe includes a first pipe section and a second pipe section, with a partition separating the first pipe section and the second pipe section. Both ends of the first pipe section and the second pipe section extend into a trough, and the portions of the first pipe section and the second pipe section extending into the trough are connected to the water inlet pipe.
[0015] Preferably, the water inlet pipeline includes a main pipeline and six sets of branch pipelines connected to the main pipeline. Five of the six sets of branch pipelines are connected to one side of the tank, and the remaining set of branch pipelines is connected to the part of the main water inlet pipeline extending out of the tank on the other side.
[0016] Preferably, both the first pipe section and the second pipe section are provided with branch pipes, each branch pipe including a connecting pipe and a drain pipe. The drain pipe is connected to the branch pipe through the connecting pipe, and the drain pipe is provided with a nozzle that communicates with the tank body.
[0017] A wafer cleaning apparatus includes a wafer cleaning overflow tank as described above.
[0018] Compared with the prior art, the embodiments of this application have the following main advantages:
[0019] The wafer cleaning overflow tank provided by this utility model has a collection tank design that allows the first and second inlet and outlet pipes to meet the dual functions of water inlet and drainage. While constructing a stable water flow, the internal structure of the tank organically combines the internal drainage structure with the water inlet pipe that generates the water flow, thereby improving the degree of water removal inside the tank, reducing the impact of the water inlet pipe on the internal structure of the tank, and preventing excessive water residue inside the tank. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the structure of a wafer cleaning overflow tank provided by this utility model.
[0021] Figure 2 This is a schematic diagram of the internal structure of a wafer cleaning overflow tank provided by this utility model.
[0022] Figure 3 This is a schematic diagram of the internal water flow field structure of a wafer cleaning overflow tank provided by this utility model.
[0023] Figure 4 This is a top view of the structure of a wafer cleaning overflow tank provided by this utility model.
[0024] Figure 5 This is a schematic diagram of the main inlet pipe and branch pipe structure of a wafer cleaning overflow tank provided by this utility model.
[0025] Explanation of reference numerals in the attached figures:
[0026] 100. Tank body; 101. Top pipe fixing groove; 102. Strip-shaped protrusion; 103. Collection groove; 210. First inlet and outlet pipe; 220. Second inlet and outlet pipe; 310. Main water inlet pipe; 311. First pipe section; 312. Second pipe section; 320. Branch pipe; 321. Connecting pipe; 322. Drainage pipe; 400. Top water inlet pipe. Detailed Implementation
[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.
[0028] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0029] This utility model embodiment provides a wafer cleaning overflow tank, such as Figures 1-5 As shown, the wafer cleaning overflow tank includes:
[0030] A trough 100 with an opening at the top has a strip-shaped protrusion 102 inside, and collection grooves 103 on both sides of the strip-shaped protrusion 102. A top pipe fixing groove 101 is provided near the opening of the trough 100; the top of the trough 100 is open.
[0031] The first inlet and outlet pipe 210 and the second inlet and outlet pipe 220 are connected to the first inlet and outlet pipe 210 and the second inlet and outlet pipe 220. The bottom of the collection tank 103 is provided with a spray pipe.
[0032] The main water inlet pipe 310 is disposed inside the strip-shaped protrusion 102. A portion of the main water inlet pipe 310 extends out of the strip-shaped protrusion 102. Both sides of the portion of the main water inlet pipe 310 extending out of the strip-shaped protrusion 102 are provided with nozzles, and the nozzles face the collection tank 103.
[0033] The collection tank 103 is located on both sides of the strip-shaped protrusion 102. The highest point of the collection tank 103 is lower than the lowest point of the strip-shaped protrusion 102. During the liquid level drop, the liquid will slide along the surface of the strip-shaped protrusion 102 to the collection tank 103. The first inlet and outlet pipe 210 and the second inlet and outlet pipe 220 located at the bottom of the collection tank 103 can complete the dual tasks of liquid inlet and liquid outlet.
[0034] A top water inlet pipe 400 is provided inside the top pipe fixing groove 101. The top water inlet pipe 400 is provided with an upper spray nozzle, which points into the groove 100.
[0035] The inlet and outlet pipes are connected at both ends of the first inlet / outlet pipe 210 and the second inlet / outlet pipe 220, respectively. The inlet pipe includes a main pipe and six sets of branch pipes connected to the main pipe. Five of the six sets of branch pipes are connected to one side of the tank 100, and the remaining set of branch pipes is connected to the part of the main inlet pipe 310 extending out of the tank 100 on the other side. The outlet pipe consists of a main pipe and two sets of branch pipes connected to the main pipe. The branch pipes are connected to the first inlet / outlet pipe 210 and the second inlet / outlet pipe 220, respectively. A control valve is provided on the main outlet pipe of the outlet pipe, which is closed during the liquid inlet process.
[0036] The nozzles on the first inlet / outlet pipe 210, the second inlet / outlet pipe 220, the main inlet pipe 310, and the top inlet pipe 400 constitute the water inlet port of the wafer cleaning overflow tank. The nozzle design between the five sets of pipes ensures that water is evenly delivered into the tank 100. The nozzle of the main inlet pipe 310 faces the collection tank 103, and the water flows along the strip-shaped protrusion 102 towards the collection tank 103. The nozzle at the collection tank 103 faces the top inlet pipe 400, and the water flows towards the top inlet pipe 400. The top inlet pipe 400 is angled towards the inside of the tank 100, creating two stable circulating water flows. This ensures the silicon wafers are in a stable water flow environment, preventing turbulent water flow from affecting the cleaning effect.
[0037] In this application, the design of the collection tank 103 enables the first inlet and outlet pipe 210 and the second inlet and outlet pipe 220 to meet the dual functions of water inlet and drainage. While constructing a stable water flow, the internal structure of the tank 100 is used to organically combine the internal drainage structure of the tank 100 with the water inlet pipe that generates the water flow, thereby improving the degree of water removal inside the tank 100, reducing the impact of the water inlet pipe that generates the water flow on the internal structure of the tank 100, and avoiding excessive water residue inside the tank 100.
[0038] In a preferred embodiment of this invention, both the strip-shaped protrusion 102 and the collection groove 103 are arc-shaped structures, the nozzle is located at the lowest point of the collection groove 103, and the nozzle is arranged perpendicular to the ground.
[0039] In this embodiment, during the liquid inlet process, the first inlet and drain pipe 210 and the second inlet and drain pipe 220 send the liquid from the inlet pipe into the tank 100 through the spray pipe. When drainage is required, the control valve on the drain pipe is opened, and the first inlet and drain pipe 210 and the second inlet and drain pipe 220 discharge the liquid inside the tank 100 through the spray pipe. As the liquid level drops, the residual liquid will accumulate in the collection tank 103 and will eventually be discharged from the first inlet and drain pipe 210 and the second inlet and drain pipe 220.
[0040] In a preferred embodiment of this invention, one end of the top water inlet pipe 400 extends out of the tank 100, and the portion of the top water inlet pipe 400 extending out of the tank 100 is connected to the water inlet pipeline.
[0041] In this embodiment, the top water inlet pipe 400 extends out of the tank 100 and connects to the water inlet pipe at one end, while the other end is located inside the tank 100. The top pipe fixing tank 101 has a circular cross-section with an opening on one side. The top water inlet pipe 400 connects to the inside of the tank 100 through the opening. A nozzle is provided on the part of the top water inlet pipe 400 that connects to the tank 100.
[0042] In a preferred embodiment of this invention, the main inlet pipe 310 includes a first pipe section 311 and a second pipe section 312. The first pipe section 311 and the second pipe section 312 are separated by a partition. The two ends of the first pipe section 311 and the second pipe section 312 extend into a trough 100, and the portions of the first pipe section 311 and the second pipe section 312 extending into the trough 100 are connected to the inlet pipe.
[0043] In this embodiment, the main water inlet pipe 310 is provided with two sets of water outlets, and the water delivery volume is larger than that of other water inlet pipe fittings. The first pipe section 311 and the second pipe section 312 are separated by a middle division method. The first pipe section 311 and the second pipe section 312 are supplied with water by independent water inlet pipe branch pipes to avoid insufficient water pressure on the side far from the water inlet pipe, which would affect the water delivery effect.
[0044] In this embodiment, both the first pipe section 311 and the second pipe section 312 are further provided with branch pipes 320. Each branch pipe 320 includes a connecting pipe 321 and a drain pipe 322. The drain pipe 322 is connected to the branch pipe 320 through the connecting pipe 321. The drain pipe 322 is provided with a nozzle that communicates with the tank body 100. Here, the drain pipe 322 generates a longitudinal water flow that is different from the flow direction of the first inlet / outlet pipe 210, the second inlet / outlet pipe 220, the main inlet pipe 310, and the top inlet pipe 400. The longitudinal water flow is mainly for the water flow... To avoid overly monotonous water circulation, the longitudinal water flow impacts the water flow inside the tank 100, making the internal water flow more diverse. Here, the nozzle water flow of the drain pipe 322 is much smaller than the nozzle water flow of the first inlet / drain pipe 210, the second inlet / drain pipe 220, the main inlet pipe 310, and the top inlet pipe 400, mainly producing a micro-disturbance effect rather than significantly disrupting the water circulation effect formed by the first inlet / drain pipe 210, the second inlet / drain pipe 220, the main inlet pipe 310, and the top inlet pipe 400.
[0045] This utility model embodiment also provides a wafer cleaning device, including the wafer cleaning overflow tank described above;
[0046] The wafer cleaning equipment referred to in this embodiment should also include water pipes connected to the inlet and outlet water pipes, and structures for receiving cleaning liquid overflowing from the overflow tank. Specifically, refer to the structural components connected to the wafer cleaning overflow tank in conventional wafer cleaning equipment.
[0047] It should be noted that, for the sake of simplicity, the foregoing embodiments are all described as a series of actions. However, those skilled in the art should understand that the present invention is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to the present invention. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to the present invention.
[0048] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Although this utility model has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of this utility model according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of this utility model. These technical solutions are also within the scope of protection of this utility model.
Claims
1. A wafer cleaning overflow tank, characterized in that, include: A trough (100) with an opening at the top is provided, a strip-shaped protrusion (102) is provided inside the trough (100), a collection trough (103) is provided on both sides of the strip-shaped protrusion (102), and a top pipe fixing trough (101) is provided near the opening of the trough (100). The first inlet and outlet pipe (210) and the second inlet and outlet pipe (220) are connected to each other. The bottom of the collection tank (103) is provided with a spray pipe. The first inlet and outlet pipe (210) and the second inlet and outlet pipe (220) are connected to each other. A main water inlet pipe (310) is installed inside a strip-shaped protrusion (102). A portion of the main water inlet pipe (310) extends out of the strip-shaped protrusion (102). Spray nozzles are provided on both sides of the portion of the main water inlet pipe (310) extending out of the strip-shaped protrusion (102), and the spray nozzles face the collection tank (103). A top water inlet pipe (400) is provided inside the top pipe fixing groove (101), and an upper spray nozzle is provided on the top water inlet pipe (400), the upper spray nozzle pointing into the groove (100); The water inlet pipe and the water outlet pipe are connected at both ends of the first water inlet pipe (210) and the second water inlet pipe (220) respectively, and the main water inlet pipe (310) and the top water inlet pipe (400) are connected to the water inlet pipe.
2. The wafer cleaning overflow tank as described in claim 1, characterized in that, The first inlet and outlet pipe (210) and the second inlet and outlet pipe (220) extend out of the tank (100) at both ends. One end of the first inlet and outlet pipe (210) and the second inlet and outlet pipe (220) extending out of the tank (100) is connected to the water inlet pipe. The end of the first inlet and outlet pipe (210) and the second inlet and outlet pipe (220) away from the water inlet pipe is connected to the drain pipe.
3. The wafer cleaning overflow tank as described in claim 2, characterized in that, One end of the top water inlet pipe (400) extends out of the tank (100), and the part of the top water inlet pipe (400) extending out of the tank (100) is connected to the water inlet pipeline.
4. The wafer cleaning overflow tank as described in claim 3, characterized in that, The collection grooves (103) are located on both sides of the strip-shaped protrusion (102), and the highest point of the collection grooves (103) is lower than the lowest point of the strip-shaped protrusion (102).
5. A wafer cleaning overflow tank as described in claim 4, characterized in that, The main water inlet pipe (310) includes a first pipe section (311) and a second pipe section (312). The first pipe section (311) and the second pipe section (312) are separated by a partition. The first pipe section (311) and the second pipe section (312) extend into a trough (100) at both ends. The portion of the first pipe section (311) and the second pipe section (312) extending out of the trough (100) is connected to the water inlet pipe.
6. A wafer cleaning overflow tank as described in claim 5, characterized in that, The water inlet pipeline includes a main pipeline and six sets of branch pipelines connected to the main pipeline. Five of the six sets of branch pipelines are connected to one side of the tank (100), and the remaining set of branch pipelines is connected to the part of the main water inlet pipe (310) extending out of the tank (100) on the other side.
7. A wafer cleaning overflow tank as described in claim 6, characterized in that, Both the first pipe section (311) and the second pipe section (312) are provided with branch pipes (320). Each branch pipe (320) includes a connecting pipe (321) and a drain pipe (322). The drain pipe (322) is connected to the branch pipe (320) through the connecting pipe (321). The drain pipe (322) is provided with a nozzle that communicates with the tank (100).
8. A wafer cleaning device, characterized in that, Includes a wafer cleaning overflow tank as described in any one of claims 1-7.