Chemical mechanical planarization equipment

Abstract

The utility model provides chemical mechanical planarization equipment, and relates to the technical field of semiconductor equipment. The chemical mechanical planarization equipment comprises a first planarization module and a second planarization module which are adjacent to each other, and a conversion manipulator arranged between the first planarization module and the second planarization module, the first planarization module and the second planarization module respectively comprise a cleaning unit and a grinding unit; two rows of stations are arranged in the cleaning unit; the row of stations close to the adjacent edge comprises a conduction station and a temporary storage station which are arranged in sequence, and the row of stations far away from the adjacent edge comprises a cleaning station, a brush brushing station and a drying station which are arranged in sequence; two transmission manipulators are arranged between the two rows of stations; the adjacent edges are the adjacent edges of the first planarization module and the second planarization module, the conduction station and the drying station are arranged on the side away from the grinding unit, and the temporary storage station and the cleaning station are arranged on the side close to the grinding unit. According to the utility model, the wafer processing efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor equipment, especially relates to a chemical mechanical planarization equipment. BACKGROUND

[0002] In the semiconductor manufacturing process, chemical mechanical planarization (CMP) is a key surface planarization technology, which is widely used for removing the excess material layer on the wafer surface. With the rapid reduction of wafer line width, the quality requirement of wafer surface is also getting higher and higher. In order to remove various contaminant particles such as organic matter and inorganic matter that may be generated in the cleaning process, it is usually necessary to go through multiple cleaning processes such as spraying, ultrasonic, chemical liquid, drying, etc. Each cleaning process is carried out in different stations, and the wafer needs to be transmitted between the stations. Therefore, it is very important to ensure the production efficiency of the wafer

[0003] When the related chemical mechanical planarization equipment processes the wafer, a robot is usually used to transmit the wafer between the stations. However, each robot usually needs to transmit the wafer between multiple stations, which has a large transmission range and multiple processes, and is easy to cause congestion of the wafer, thereby reducing the processing efficiency of the wafer. SUMMARY

[0004] The utility model embodiment provides a kind of chemical mechanical planarization equipment to improve the processing efficiency of wafer.

[0005] The first aspect of the utility model embodiment provides a kind of chemical mechanical planarization equipment, including adjacent first planarization module and second planarization module, and conversion robot is set between the first planarization module and the second planarization module;The first planarization module and the second planarization module include cleaning unit and grinding unit respectively;

[0006] Two rows of stations are provided in the cleaning unit;The station close to adjacent side includes sequentially arranged transmission station and temporary storage station, and the station away from adjacent side includes sequentially arranged cleaning station, brush scrubbing station and drying station;First transmission robot and second transmission robot are further included between the two rows of stations;Wherein, the adjacent side is the adjacent side of the first planarization module and the second planarization module, the transmission station and the drying station are arranged on the side away from the grinding unit, and the temporary storage station and the cleaning station are arranged on the side close to the grinding unit;The first transmission robot is further arranged between the conversion robot and the transmission station, and the second transmission robot is further arranged between the conversion robot and the temporary storage station;

[0007] The conducting station is used for receiving wafers to be processed; the transfer robot is used for transferring the wafers to be processed from the conducting station to the temporary storage station; the temporary storage station is used for placing the wafers to be processed waiting for grinding and the wafers after grinding; the grinding unit is used for grinding the wafers to be processed sent in; the cleaning station is used for cleaning the wafers after grinding transferred by the second transfer robot; the brush scrubbing station is used for scrubbing the wafers after cleaning transferred by the first transfer robot; and the drying station is used for drying the wafers after scrubbing transferred by the first transfer robot.

[0008] In one embodiment, the brush scrubbing station is provided with a moisturizing device for moisturizing the wafers in the brush scrubbing station.

[0009] In one embodiment, the grinding unit comprises a grinding robot, a plurality of sequentially arranged loading stations and a plurality of sequentially arranged grinding stations.

[0010] The grinding robot is arranged on one side parallel to the axis along which the loading stations are arranged, and is used for transferring wafers between the temporary storage station and the loading stations.

[0011] The grinding stations are arranged on the other side parallel to the axis along which the loading stations are arranged, and each grinding station is adjacent to at least one loading station.

[0012] In one embodiment, the first grinding robot of the first planarization module and the second grinding robot of the second planarization module are adjacent.

[0013] In one embodiment, the first planarization module comprises a first temporary storage station and a plurality of first loading stations; and the second planarization module comprises a second temporary storage station and a plurality of second loading stations.

[0014] The first grinding robot is used for transferring wafers between the first temporary storage station and the first loading stations, and between the second temporary storage station and the second loading stations.

[0015] The second grinding robot is used for transferring wafers between the first temporary storage station and the first loading stations, and between the second temporary storage station and the second loading stations.

[0016] In one embodiment, the first grinding robot or the second grinding robot is also used for transferring wafers between the first loading stations and the second loading stations.

[0017] In one embodiment, the grinding unit further comprises a high-pressure flushing device.

[0018] The high-pressure rinsing device is used for cleaning the wafer moving between the loading station and the grinding station.

[0019] In one embodiment, the conducting stations in the first planarization module and the second planarization module are arranged side by side or vertically layered, and the temporary storage stations in the first planarization module and the second planarization module are arranged side by side or vertically layered.

[0020] In one embodiment, the chemical mechanical planarization device further comprises a front-end module, the front-end module comprising a first front-end robot, a second front-end robot and a transfer unit;

[0021] The first planarization module and the second planarization module are located on one side of the first front-end robot and the second front-end robot, and the conducting stations and the drying stations in the first planarization module and the second planarization module are adjacent to the first front-end robot and the second front-end robot;

[0022] The transfer unit is located on the other side of the first front-end robot and the second front-end robot;

[0023] The transfer unit is used for transferring the wafer to be processed and the dried wafer;

[0024] The first front-end robot is used for transferring the wafer to be processed in the transfer unit to the conducting station;

[0025] The second front-end robot is used for transferring the dried wafer in the drying station to the transfer unit.

[0026] In one embodiment, the transfer unit comprises at least one wafer cassette;

[0027] The wafer cassette is used for placing the wafer to be processed and / or the dried wafer.

[0028] The embodiment of the utility model discloses the first planarization module and the second planarization module between increase conversion mechanical hand, through conversion mechanical hand complete the wafer of first planarization module and the wafer of second planarization module of handling, can utilize one conversion mechanical hand to complete the wafer of two planarization module simultaneously, reduce the volume of equipment, through setting up first transmission mechanical hand and second transmission mechanical hand in cleaning unit, can utilize first transmission mechanical hand and second transmission mechanical hand only wafer transmission between cleaning station, brush scrubbing station and drying station, divide the transmission in the process of planarization module and wafer cleaning of handling wafer, reduce the work of each mechanical hand, avoid the occupation conflict between mechanical hand, namely the wafer congestion of the internal formula setting and other factors of grinding unit or cleaning unit, because one mechanical hand is responsible for the wafer congestion of multiple work and leads to the further aggravation condition, can guarantee the processing efficiency of wafer through the cooperation between each mechanical hand. And, through setting up two adjacent planarization module, can make two planarization module handle wafer simultaneously, further improve the processing efficiency of wafer. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical scheme in the embodiment of the utility model, the drawings needed to be used in the embodiment or prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without creative labor.

[0030] Figure 1 It is the structure schematic diagram of the first chemical mechanical planarization equipment provided by the embodiment of the utility model;

[0031] Figure 2 It is the structure schematic diagram of the second chemical mechanical planarization equipment provided by the embodiment of the utility model;

[0032] Figure 3 It is the structure schematic diagram of the third chemical mechanical planarization equipment provided by the embodiment of the utility model;

[0033] Figure 4 It is the structure schematic diagram of the fourth chemical mechanical planarization equipment provided by the embodiment of the utility model;

[0034] Figure 5 It is the structure schematic diagram of the fifth chemical mechanical planarization equipment provided by the embodiment of the utility model. DETAILED DESCRIPTION

[0035] In the following, the technical solutions in the embodiments of the present application will be described clearly in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those of ordinary skill in the art without creative work should belong to the scope of protection of the present application.

[0036] The terms "include", "comprise" and any other variants thereof in the specification and the claims of the present application and the above-described accompanying drawings mean "including but not limited to", and are intended to cover non-exclusive inclusion, and are not limited to the examples listed in the text. In addition, the terms "first" and "second" and the like are used to distinguish different objects, and are not used to describe a specific order.

[0037] The implementation of the present application will be described in detail in conjunction with the specific accompanying drawings as follows:

[0038] Figure 1 The structure of the first chemical mechanical planarization equipment provided by the embodiment of the present application is shown, only the parts related to the embodiment of the present application are shown for convenience of description, and the details are as follows:

[0039] As shown in Figure 1 The chemical mechanical planarization equipment 1 provided by the embodiment of the present application includes adjacent first planarization module 11 and second planarization module 12, and a transfer robot TR arranged between the first planarization module 11 and the second planarization module 12; the first planarization module 11 and the second planarization module 12 respectively include a cleaning unit Q and a grinding unit M.

[0040] Here, two planarization modules can be arranged in the chemical mechanical planarization equipment 1, and the planarization of the wafer is carried out at the same time. In each planarization module, the grinding unit M is used to grind the incoming wafer to be processed to realize the planarization of the wafer surface. The cleaning unit Q is used to transport the wafer, and to clean, scrub and dry the wafer after grinding, to ensure that the cleanliness of the wafer surface meets the requirements of the subsequent production process.

[0041] The cleaning unit Q is provided with two rows of stations; the row of stations close to the adjacent side includes the conducting station TS and the temporary storage station C arranged in sequence, and the row of stations away from the adjacent side includes the cleaning station L1, the brush cleaning station P and the drying station D arranged in sequence; between the two rows of stations, the first transfer robot CR1 and the second transfer robot CR2 are further included; wherein the adjacent side is the adjacent side of the first planarization module 11 and the second planarization module 12, the conducting station TS and the drying station D are arranged on the side away from the grinding unit M, and the temporary storage station C and the cleaning station L1 are arranged on the side close to the grinding unit M. The first transfer robot CR1 is further arranged between the conversion robot TR and the conducting station TS, and the second transfer robot CR2 is further arranged between the conversion robot TR and the temporary storage station C.

[0042] In one planarization module, the conducting station TS is the first station of the planarization module, used for receiving the wafer to be processed; the drying station D is the last station of the planarization module, used for drying the cleaned wafer transferred by the first transfer robot CR1, removing the moisture on the surface of the wafer, so that the wafer meets the conditions of subsequent process processing, and carrying the dried wafer. The conducting station TS and the drying station D can be arranged at the edge position in the planarization module, which is convenient for receiving and sending out the wafer.

[0043] The conversion robot TR is used for transferring the wafer to be processed from the conducting station TS to the temporary storage station C, and in the two planarization modules, the conversion robot TR can be used for transferring the wafer to be processed. Through reasonable scheduling, the conversion robot TR can be used to realize the transmission of the wafer in the two planarization modules at the same time, liberate the remaining transfer robots, reduce the busy of the remaining transfer robots, and improve the operation efficiency of the wafer transmission.

[0044] The temporary storage station C is used for placing the wafer to be processed waiting for grinding and the wafer after grinding, so as to send and take out the wafer into and out of the grinding unit M, and is a temporary storage point of the wafer before and after grinding. The cleaning station L1 is used for cleaning the wafer after grinding transferred by the second transfer robot CR2, removing the impurities and residues generated in the grinding process. The brush cleaning station P is used for cleaning the cleaned wafer transferred by the first transfer robot CR1, and the brush can be used for further cleaning the wafer to clean the surface of the wafer more thoroughly.

[0045] The temporary storage station C and the cleaning station L1 are arranged on the side close to the grinding unit M, which is convenient for transferring the wafer between the temporary storage station C and the grinding unit M, and sending the wafer after grinding into the cleaning station L1. The wafer is quickly transferred, the transmission time and distance are reduced, and the production efficiency is improved.

[0046] The wafer is transferred between the temporary station C and the cleaning station L1 by the second transfer robot CR2, and is transferred between the cleaning station L1, the brush cleaning station P and the drying station D by the first transfer robot CR1. Different robots are used before and after cleaning the wafer, so that the wafer is not polluted again by the second transfer robot CR2, and the cleanness of the wafer is ensured.

[0047] In addition, the first transfer robot CR1 and the second transfer robot CR2 only transfer the wafer between the temporary station C, the cleaning station L1, the brush cleaning station P and the drying station D, and do not need to take the wafer from outside or send the wafer to the temporary station C or the grinding unit M. The processes handled by the first transfer robot CR1 and the second transfer robot CR2 are reduced, and the wafer transfer efficiency is improved.

[0048] Through the above arrangement, the two rows of stations in the cleaning unit Q and the grinding unit M form a "U" shaped process flow, so that the wafer is more smoothly transferred from the cleaning unit Q (the transfer station TS) to the grinding, and then to the cleaning, the brush cleaning and the drying, and then to the drying station D. The waiting time in the planarization process is reduced, and the production efficiency is improved.

[0049] Optionally, the cleaning station L1 can be a megasonic cleaning station. A plurality of cleaning stations can be arranged in the cleaning unit Q, for example, two cleaning stations (see Fig. 2) are arranged in series. Figure 2 Another cleaning station L2 can be arranged after the cleaning station L1, so that the wafer is cleaned twice by the megasonic cleaning, and then is cleaned by the brush.

[0050] Here, the second transfer robot CR2 can be used to transfer the wafer between the two cleaning stations (L1 and L2).

[0051] Optionally, the brush cleaning station P is provided with a moisturizing device, which is used to moisturize the wafer in the brush cleaning station P.

[0052] In this embodiment, the wafer is moisturized by the moisturizing device, so that the wafer is not oxidized during the waiting process, and the next operation is ensured to be smoothly performed.

[0053] In addition, the brush cleaning station P and the cleaning station L can be a closed environment, which is provided with a pneumatic or electrically controlled door and a moisturizing device, so that the pollution of the wafer by the environment in the equipment is reduced, and the influence of the moisturizing device on the environment in the equipment is also avoided. The door can be automatically opened and closed during the wafer taking and placing process.

[0054] In one embodiment, the conducting stations in the first and second planarization modules are arranged side by side or vertically layered, and the temporary storage stations in the first and second planarization modules are arranged side by side or vertically layered.

[0055] In the present embodiment, referring to the first and second planarization modules 11 and 12 in Figure 1 , two conducting stations TS are arranged side by side, and two temporary storage stations C are arranged side by side. The two planarization modules are symmetrically and independently arranged, and the planarization modules or the stations therein can be quickly and conveniently replaced.

[0056] The temporary storage station C can include a first temporary storage layer and a second temporary storage layer at different heights; the height of the first temporary storage layer is higher than that of the second temporary storage layer; the first temporary storage layer is used for placing the wafer to be processed; and the second temporary storage layer is used for placing the wafer after polishing.

[0057] In the present embodiment, the wafer to be processed is a dry wafer, and the wafer after polishing is a wet wafer. The wafer to be processed as a dry wafer is placed on the upper first temporary storage layer, and the wafer after polishing as a wet wafer is placed on the lower second temporary storage layer. The dry wafer and the wet wafer can be separated, and the influence of the wet wafer on the dry wafer is avoided. The wafer not subjected to polishing is effectively protected, so as not to affect the subsequent polishing process of the wafer to be processed.

[0058] Referring to the first and second planarization modules 11 and 12 in Figure 2 , the conducting stations TS in the first and second planarization modules 11 and 12 are vertically layered, and the temporary storage stations C in the first and second planarization modules 11 and 12 are vertically layered.

[0059] The conducting station includes a first conducting layer and a second conducting layer at different heights; the height of the first temporary storage layer is higher than that of the second temporary storage layer; the first conducting layer is used for placing the wafer to be processed of the first planarization module; and the second conducting layer is used for placing the wafer to be processed of the second planarization module.

[0060] The temporary storage station includes a first temporary storage layer, a second temporary storage layer, a third temporary storage layer and a fourth temporary storage layer (from top to bottom) at different heights; the first temporary storage layer is used for placing the wafer to be processed of the first planarization module; the second temporary storage layer is used for placing the wafer after polishing of the first planarization module; the third temporary storage layer is used for placing the wafer to be processed of the second planarization module; and the fourth temporary storage layer is used for placing the wafer after polishing of the second planarization module. Each of the temporary storage layers can also be closed to prevent interference between the wafers. Humidifying devices can be arranged in the second and fourth temporary storage layers.

[0061] In addition, the above is only an example of two specific cases, and other combinations can also be selected for the arrangement of the transfer stations TS and the temporary storage stations C, for example, two transfer stations TS arranged side by side and two temporary storage stations C arranged in vertical layers.

[0062] In the embodiment of the utility model, the conversion mechanical hand is added between the first planarization module and the second planarization module, the wafer transmission in the first planarization module and the second planarization module is completed through the conversion mechanical hand, the wafer transmission in the two planarization modules can be completed simultaneously by using one conversion mechanical hand, the volume of the equipment is reduced, the first transmission mechanical hand and the second transmission mechanical hand are arranged in the cleaning unit, the wafer transmission between the cleaning station, the brush scrubbing station and the drying station is completed by using the first transmission mechanical hand and the second transmission mechanical hand, the wafer transmission in the planarization module and the wafer cleaning process are separated, the work of each mechanical hand is reduced, the occupation conflict between the mechanical hands is avoided, when the wafer is congested due to the internal formula setting of the polishing unit or the cleaning unit, the wafer congestion is further intensified due to the multiple work of one mechanical hand, the wafer processing efficiency can be ensured through the cooperation between the mechanical hands. In addition, the two adjacent planarization modules are arranged, the wafer can be processed simultaneously by the two planarization modules, and the wafer processing efficiency is further improved.

[0063] In one embodiment, the polishing unit includes a polishing mechanical hand, a plurality of sequentially arranged loading stations and a plurality of sequentially arranged polishing stations. Figure 3 As shown in the structure of the third chemical mechanical planarization equipment, the polishing unit M of the first planarization module 11 includes a first polishing mechanical hand PR1, a plurality of first loading stations WD1 and a plurality of first polishing stations PX1; the polishing unit M of the second planarization module 12 includes a second polishing mechanical hand PR2, a plurality of second loading stations WD2 and a plurality of second polishing stations PX2.

[0064] The polishing mechanical hand is arranged on one side parallel to the axis of the loading station arrangement, and is used for transmitting the wafer between the temporary storage station and the loading station; the polishing station is arranged on the other side parallel to the axis of the loading station arrangement, and each polishing station is adjacent to at least one loading station.

[0065] In the embodiment, the loading station and the polishing station are specific working areas for wafer polishing, wherein the loading station is used for carrying and transmitting the wafer in different polishing steps, and the polishing station is used for polishing the wafer in different steps. The polishing mechanical hand is responsible for the transmission of the wafer between the polishing unit and the cleaning unit Q.

[0066] The polishing mechanical hand is arranged on one side of the loading station, which can be conveniently moved between the temporary storage station C and the loading station, and is convenient for wafer transmission operation.

[0067] The grinding station is arranged on the other side of the loading station, so that the wafer can be conveniently and quickly transferred from the loading station to the grinding station for grinding operation.

[0068] Optionally, each grinding station comprises a grinding pad and a grinding head, such as Figure 3 As shown in the third chemical mechanical planarization device, the first grinding station PX11 in the grinding unit M of the first planarization module 11 can comprise a first grinding pad PL1 and a first grinding head H1.

[0069] By rotating the grinding head above the loading station, the wafer can be loaded from the loading station by the grinding head, and then the wafer can be rotated above the grinding pad for grinding by rotating the grinding head. After grinding, the wafer can be placed on the loading station by rotating the grinding head for the next step.

[0070] During the grinding process, the polishing liquid and deionized water can also flow out, and the grinding pad can also be repaired to ensure the continuous use of the grinding pad.

[0071] Optionally, the grinding unit M further comprises a high-pressure flushing device, which is used to clean the wafer moving between the loading station and the grinding station, so as to keep the grinding head and the wafer clean, improve the polishing rate, and reduce the scratch and pollution rate of the wafer.

[0072] In one embodiment, the first grinding robot PR1 of the first planarization module 11 and the second grinding robot PR2 of the second planarization module 12 are adjacent.

[0073] In this embodiment, the first grinding robot PR1 of the first planarization module 11 and the second grinding robot PR2 of the second planarization module 12 are adjacent, so that the grinding unit M of the first planarization module 11 and the grinding unit M of the second planarization module 12 form a symmetrical structure, thereby the first planarization module 11 and the second planarization module 12 are symmetrically distributed, which is beneficial to reduce the design workload of the whole machine, improve the installation, debugging and maintenance efficiency, and greatly improve the interchangeability of parts and modules.

[0074] Optionally, as shown in Figure 4As shown, the first planarization module 11 comprises a first temporary storage station C1 and a plurality of first loading stations WD1; the second planarization module 12 comprises a second temporary storage station C2 and a plurality of second loading stations WD2. The first polishing robot PR1 is used to transfer wafers between the first temporary storage station C1 and the first loading stations WD1, and between the second temporary storage station C2 and the second loading stations WD2; the second polishing robot PR2 is used to transfer wafers between the first temporary storage station C1 and the first loading stations WD1, and between the second temporary storage station C2 and the second loading stations WD2.

[0075] In the embodiment, the first polishing robot PR1 can be responsible for transferring wafers to be processed and processed wafers between the first temporary storage station C1 and the first loading stations WD1, and the second polishing robot PR2 can be responsible for transferring wafers to be processed and processed wafers between the second temporary storage station C2 and the second loading stations WD2.

[0076] Since the first polishing robot PR1 and the second polishing robot PR2 are adjacent, when one of the polishing robots is damaged, the normal polishing robot can be used to realize the function of the polishing robot in the other planarization module to ensure the normal operation of the two planarization modules. For example, when the second polishing robot PR2 is damaged, the first polishing robot PR1 can be used to transfer wafers to be processed and processed wafers between the second temporary storage station C2 and the second loading stations WD2.

[0077] In order to further ensure the cleanliness of the wafers to be processed, the first polishing robot PR1 and the second polishing robot PR2 can be respectively used for transferring wafers to be processed and transferring processed wafers. For example, the first polishing robot PR1 can be used to transfer wafers to be processed from the first temporary storage station C1 to the first loading stations WD1, and from the second temporary storage station C2 to the second loading stations WD2; the second polishing robot PR2 can be used to transfer processed wafers from the first loading stations WD1 to the first temporary storage station C1, and from the second loading stations WD2 to the second temporary storage station C2.

[0078] Correspondingly, when the temporary storage stations in the first planarization module 11 and the second planarization module 12 are vertically layered, the first polishing robot PR1 and the second polishing robot PR2 can take wafers to be processed from the corresponding temporary layers of the temporary storage stations, and transfer processed wafers to the corresponding temporary layers of the temporary storage stations.

[0079] Optionally, the first polishing robot PR1 or the second polishing robot PR2 is also used to transfer wafers between the first loading stations WD1 and the second loading stations WD2.

[0080] In the embodiment, when the polishing of the wafer requires high quality and two planarization modules are needed to polish the wafer, one of the polishing robots can be used to send the wafer polished by one planarization module into another planarization module, and the polishing of the wafer can be completed through the cooperation of the two planarization modules.

[0081] In one embodiment, as shown in the fifth chemical mechanical planarization device structure, Figure 5 The chemical mechanical planarization device 1 further comprises a front-end module, which comprises a first front-end robot FR1, a second front-end robot FR2 and a transmission unit 131. The first planarization module 11 and the second planarization module 12 are located on one side of the first front-end robot FR1 and the second front-end robot FR2, and the transmission station TS and the drying station D in the first planarization module 11 and the second planarization module 12 are adjacent to the first front-end robot FR1 and the second front-end robot FR2. The transmission unit 131 is located on the other side of the first front-end robot FR1 and the second front-end robot FR2.

[0082] The transmission unit 131 is used for transmitting the wafer to be processed and the dried wafer; the first front-end robot FR1 is used for transmitting the wafer to be processed in the transmission unit 131 to the transmission station TS; and the second front-end robot FR2 is used for transmitting the dried wafer in the drying station D to the transmission unit 131.

[0083] In the embodiment, the front-end module is arranged at the front end of the chemical mechanical planarization device 1 and is used for the wafer to be sent in and out. The transmission unit 131 is used for carrying the wafer to be processed and the dried wafer, and the first front-end robot FR1 and the second front-end robot FR2 are used for transmitting the wafer between the transmission unit 131 and the cleaning unit Q, so as to realize the wafer to be sent in and out.

[0084] Here, the first front-end robot FR1 and the second front-end robot FR2 are two arms of a robot, and the two front-end robots move together under the control of the main body but can rotate and work independently.

[0085] Optionally, the first front-end robot FR1 and the second front-end robot FR2 can be two arms of a double-arm robot. The first front-end robot FR1 and the second front-end robot FR2 can be consistent in other actions except the grabbing and releasing actions of the wafer.

[0086] In one embodiment, the transmission unit 131 comprises at least one wafer transfer box; and the wafer transfer box is used for placing the wafer to be processed and / or the dried wafer.

[0087] In the embodiment, the wafer to be processed is taken out from the wafer transfer box, and after polishing, cleaning and drying, it can be put back to the original position in the wafer transfer box. When there are multiple wafer transfer boxes, such as the first wafer transfer box F1, the second wafer transfer box F2, the third wafer transfer box F3 and the fourth wafer transfer box F4, the wafer in one of the wafer transfer boxes can be processed, and when the wafer in one wafer transfer box is processed, the wafer in the next wafer transfer box can be processed.

[0088] In addition, when there are specific requirements for the transfer of the wafer, at least two wafer transfer boxes can be provided, one of which is used to place the wafer to be processed, and the other is used to place the dried wafer.

[0089] Since the transmission unit 131 carries the incoming and outgoing wafers, the first wafer transfer box F1, the second wafer transfer box F2, the third wafer transfer box F3 and the fourth wafer transfer box F4 in the transmission unit 131 can be arranged in front of the corresponding planarization module, i.e. close to the transmission station TS and the drying station D in the planarization module.

[0090] In order to facilitate understanding, the following will be described by taking a specific application scenario as an example. As shown in Figure 5 The chemical mechanical planarization device 1 includes a first planarization module 11 and a second planarization module 12, and the polishing unit in each planarization module includes a polishing robot, a plurality of sequentially arranged loading stations and a plurality of sequentially arranged polishing stations. The transmission unit 131 includes a first wafer transfer box F1, a second wafer transfer box F2, a third wafer transfer box F3 and a fourth wafer transfer box F4.

[0091] When the two planarization modules work independently, the working process of each planarization module is the same, and the following will be briefly described by taking the first planarization module 11 as an example:

[0092] (1) The first front-end robot FR1 takes out the wafer to be processed from the first wafer transfer box F1 and sends it to the transmission station TS; the transfer robot TR takes out the wafer to be processed from the transmission station TS and sends it to the temporary storage station C, waiting for the previous wafer to be processed.

[0093] (2) The first polishing robot PR1 in the polishing unit takes the wafer to be processed from the temporary station C1 and places it on a first loading station WD1 (the first or last loading station in the series of loading stations, which can be set according to the polishing function of each polishing station, such as the first first loading station WD11); the polishing head H1 of the first first polishing station PX11 rotates above the first first loading station WD11 to load the wafer after cleaning, then rotates above the polishing disc PL1 of the first first polishing station PX11 to polish the wafer, lifts the first polishing head H1 after the polishing is completed, and rotates to the second first loading station WD12 to unload the wafer; the polishing head of the second first polishing station PX12 repeats the above steps, i.e., loading, polishing, and unloading, to unload the polished wafer to the third first loading station WD13.

[0094] (3) The first polishing robot PR1 transfers the wafer on the third first loading station PX13 to the temporary station C, and the second transfer robot CR2 takes the polished wafer from the temporary station C and sends it to the first cleaning station L1 for cleaning; the second transfer robot CR2 takes the wafer from the first cleaning station L1 and sends it to the second cleaning station L2 for cleaning.

[0095] (4) After cleaning, the first transfer robot CR1 takes the cleaned wafer from the second cleaning station L1 and sends it to the brush cleaning station P for brushing; after brushing, the first transfer robot CR1 takes the brushed wafer from the brush cleaning station P and sends it to the drying station D for drying.

[0096] (5) After drying, the second front-end robot FR2 takes the dried wafer from the drying station D and sends it back to the first wafer transfer box F1.

[0097] When the two planarization modules cooperate, after the above step (2), the polishing robot in the first planarization module 11 or the second planarization module 12, i.e., the first polishing robot PR1 or the second polishing robot PR2, can transfer the wafer on the third loading station WD1 to the first loading station WD2 of the polishing unit in the second planarization module, and repeat the above step (2) in the polishing unit of the planarization module to polish the wafer twice. After all the polishing is completed, the subsequent steps (3), (4), and (5) are performed.

[0098] The above-described above embodiments are only used to illustrate the technical solutions of the present application, and are not limited thereto; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features therein can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A chemical mechanical planarization device, characterized in that, It includes an adjacent first planarization module and a second planarization module, and a conversion robot disposed between the first planarization module and the second planarization module; the first planarization module and the second planarization module respectively include a cleaning unit and a grinding unit; The cleaning unit has two rows of workstations. The row of workstations closest to the adjacent side includes a sequentially arranged transfer workstation and a temporary storage workstation, while the row of workstations furthest from the adjacent side includes a sequentially arranged cleaning workstation, a brush washing workstation, and a drying workstation. Between the two rows of workstations are a first transfer robot and a second transfer robot. The adjacent side is the side adjacent to the first planarization module and the second planarization module. The transfer workstation and the drying workstation are located on the side furthest from the grinding unit, while the temporary storage workstation and the cleaning workstation are located on the side closest to the grinding unit. The first transfer robot is also located between the transfer robot and the transfer workstation, and the second transfer robot is also located between the transfer robot and the temporary storage workstation. The transfer station is used to receive wafers to be processed; the transfer robot is used to transfer the wafers to be processed from the transfer station to the temporary storage station; the temporary storage station is used to place wafers to be processed awaiting grinding and wafers that have been ground; the grinding unit is used to grind the fed wafers to be processed; the cleaning station is used to clean the ground wafers transferred by the second transfer robot; the brush cleaning station is used to brush the cleaned wafers transferred by the first transfer robot; the drying station is used to dry the brushed wafers transferred by the first transfer robot.

2. The chemical mechanical planarization apparatus as described in claim 1, characterized in that, A moisturizing device is provided in the brush washing station, which is used to moisturize the wafers in the brush washing station.

3. The chemical mechanical planarization apparatus as described in claim 1, characterized in that, The grinding unit includes a grinding robot, multiple loading stations arranged in sequence, and multiple grinding stations arranged in sequence; The grinding robot is positioned on one side parallel to the axis of the loading station arrangement, and the grinding robot is used to transfer wafers between the temporary storage station and the loading station; The grinding station is located on the opposite side of the axis parallel to the axis of the loading station arrangement, and each grinding station is adjacent to at least one loading station.

4. The chemical mechanical planarization apparatus as described in claim 3, characterized in that, The first grinding robot of the first planarization module and the second grinding robot of the second planarization module are adjacent to each other.

5. The chemical mechanical planarization apparatus as described in claim 4, characterized in that, The first flattening module includes a first temporary storage station and multiple first loading stations; the second flattening module includes a second temporary storage station and multiple second loading stations. The first grinding robot is used to transfer wafers between the first temporary storage station and the first loading station, and to transfer wafers between the second temporary storage station and the second loading station; The second grinding robot is used to transfer wafers between the first temporary storage station and the first loading station, and to transfer wafers between the second temporary storage station and the second loading station.

6. The chemical mechanical planarization apparatus as described in claim 5, characterized in that, The first or second grinding robot is also used to transfer wafers between the first loading station and the second loading station.

7. The chemical mechanical planarization apparatus as described in claim 3, characterized in that, The grinding unit also includes a high-pressure rinsing device; The high-pressure flushing device is used to clean the wafers moving between the loading station and the grinding station.

8. A chemical mechanical planarization apparatus as described in any one of claims 1 to 7, characterized in that, The conduction stations in the first flattening module and the second flattening module are arranged side by side or vertically layered, and the temporary storage stations in the first flattening module and the second flattening module are arranged side by side or vertically layered.

9. A chemical mechanical planarization apparatus according to any one of claims 1 to 7, characterized in that, The chemical mechanical planarization equipment also includes a front-end module, which includes a first front-end robotic arm, a second front-end robotic arm, and a transmission unit. The first planarization module and the second planarization module are located on one side of the first front-end robotic arm and the second front-end robotic arm, and the conduction station and the drying station in the first planarization module and the second planarization module are adjacent to the first front-end robotic arm and the second front-end robotic arm. The transmission unit is located on the other side of the first front-end robotic arm and the second front-end robotic arm; The transmission unit is used to transmit wafers to be processed and wafers that have been dried. The first front-end robotic arm is used to transfer the wafer to be processed in the transmission unit to the transmission station; The second front-end robotic arm is used to transfer the dried wafers in the drying station to the transfer unit.

10. A chemical mechanical planarization apparatus as described in claim 9, characterized in that, The transmission unit includes at least one wafer transfer box; The wafer transfer box is used to place the wafers to be processed and / or the dried wafers.

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