Single-layer flexible ceramic base material leveling machine

Abstract

The utility model discloses a single-layer flexible ceramic base material leveling machine which comprises a machine frame, a feeding mechanism, a material taking mechanism and a leveling device, the feeding mechanism, the material taking mechanism and the leveling device are arranged on the machine frame, and the material taking mechanism and the feeding mechanism are located on one side of the leveling device up and down. The feeding mechanism comprises a fixed bottom plate, a feeding air cylinder, an X-axis linear guide rail, a movable bottom plate and a positioning platform. The material taking mechanism comprises an X-axis linear driving module and an L-shaped material taking device movably arranged on the X-axis linear driving module. The L-shaped material taking device comprises a Z-axis linear driving module located on the transverse section and a vacuum adsorption assembly located on the longitudinal section. The leveling device comprises a leveling power assembly, an upper leveling die and a lower leveling die, and the upper leveling die is movably located above the lower leveling die and driven by the leveling power assembly to move up and down. The leveling device is used for leveling the surface of the ceramic wafer after the ceramic wafer is punched and printed, so that the normal operation of the subsequent process and the quality of the ceramic wafer are ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to low temperature co-fired ceramic processing technical field, concretely relates to a single layer flexible ceramic substrate leveling machine. BACKGROUND

[0002] In the low temperature co-fired ceramic (LTCC) industry, after the ceramic sheet is punched and printed, the ceramic sheet needs to be stacked in up-down alignment, and then the stacked ceramic sheet is sent to subsequent processes for lamination. However, in the prior art, after the ceramic sheet is punched and printed, the printing paste at the punching position will overflow the surface of the ceramic sheet, causing the surface of the ceramic sheet to be uneven, which can adversely affect the subsequent processes. SUMMARY

[0003] The utility model aims at overcoming the defects of the prior art, providing a single layer flexible ceramic substrate leveling machine for leveling the surface of the ceramic sheet after punching and printing, ensuring the normal operation of the subsequent processes and the quality of the ceramic sheet.

[0004] The technical scheme of the utility model is as follows:

[0005] A single layer flexible ceramic substrate leveling machine comprises a rack, a feeding mechanism, a material taking mechanism and a leveling device arranged on the rack, and the material taking mechanism and the feeding mechanism are located on one side of the leveling device in up-down alignment.

[0006] The feeding mechanism comprises a fixed bottom plate, a feeding cylinder, X-axis linear guides, a movable bottom plate and a positioning platform, the feeding cylinder is arranged at the bottom of the fixed bottom plate, the X-axis linear guides are arranged in two on the fixed bottom plate in opposite directions, the movable bottom plate is movably arranged on the two X-axis linear guides, the cylinder shaft of the feeding cylinder is connected with the movable bottom plate, the positioning platform is arranged on the movable bottom plate, and the ceramic substrate is placed on the positioning platform.

[0007] The material taking mechanism comprises an X-axis linear drive module and an L-shaped material taking device movably arranged on the X-axis linear drive module, the L-shaped material taking device comprises a Z-axis linear drive module arranged on the horizontal section and a vacuum suction assembly arranged on the vertical section, the Z-axis linear drive module is movably arranged on the X-axis linear drive module, the vacuum suction assembly is movably arranged on the Z-axis linear drive module and faces the leveling device, and the vacuum suction assembly is movably arranged above the positioning platform.

[0008] The leveling device comprises a leveling power assembly, an upper leveling die and a lower leveling die, the upper leveling die is movably arranged above the lower leveling die and moves up and down by the driving of the leveling power assembly.

[0009] Further, two feeding mechanisms and material taking mechanisms are arranged on the two opposite sides of the leveling device.

[0010] Furthermore, the movable base plate is provided with a first insertion slot and a second insertion slot opposite to each other, and the two sides of the positioning platform are respectively inserted and fixed to the first insertion slot and the second insertion slot through the first insertion block and the second insertion block.

[0011] Furthermore, the bottom of the positioning platform is provided with a first positioning groove, the movable base plate is provided with a second positioning groove corresponding to the first positioning groove, and the bottom of the fixed base plate is also provided with a positioning motor. The motor shaft of the positioning motor faces upward and is connected to a positioning block. The positioning block is movably located below the movable base plate and corresponds to the second positioning groove of the movable base plate and the first positioning groove of the positioning platform.

[0012] Furthermore, a handle is provided on the outside of the positioning platform.

[0013] Furthermore, the single-layer flexible ceramic substrate leveling machine also includes an adhesive tape separation mechanism, which includes an unwinding assembly and a rewinding assembly. The unwinding assembly and the rewinding assembly are arranged opposite each other on both sides of the leveling power assembly. The unwinding assembly releases the adhesive tape through the bottom surface of the upper leveling mold to the rewinding assembly for winding.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model provides a single-layer flexible ceramic substrate leveling machine, which is used to level the surface of ceramic sheets after drilling and printing. It includes a feeding mechanism, a picking mechanism, and a leveling device. The feeding mechanism is used to place the drilled and printed ceramic sheets and is responsible for loading and unloading the ceramic sheets. The picking mechanism is used to send the ceramic sheets on the feeding mechanism to the leveling device. The leveling device levels the surface of the ceramic sheets through the upper leveling mold and the lower leveling mold, and compacts the slurry overflowing from the drilling position of the ceramic sheet, making the slurry inside the drilling of the ceramic sheet more compact, ensuring the normal operation of subsequent processes and ensuring the quality of the ceramic sheets. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A schematic diagram of the structure of a single-layer flexible ceramic substrate leveling machine provided by this utility model;

[0017] Figure 2 This is a schematic diagram of the feeding mechanism described in this utility model;

[0018] Figure 3This is a schematic diagram of the material handling mechanism described in this utility model;

[0019] Figure 4 This is a schematic diagram of the leveling device and adhesive tape separation mechanism described in this utility model. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0021] To illustrate the technical solution described in this utility model, specific embodiments are described below.

[0022] Example

[0023] Please see Figure 1 This embodiment provides a single-layer flexible ceramic substrate leveling machine, including a frame 1 and a feeding mechanism 2, a picking mechanism 3, a leveling device 4, and an adhesive tape isolation mechanism 5 disposed on the frame 1. Two picking mechanisms 3 and two feeding mechanisms 2 are arranged opposite each other, positioned vertically on either side of the leveling device 4. The feeding mechanism 2 is used to place the punched and printed ceramic sheet and is responsible for loading and unloading the ceramic sheet. The picking mechanism 3 is used to feed the ceramic sheet from the feeding mechanism 2 to the leveling device 4. The leveling device 4 levels the surface of the ceramic sheet using an upper leveling mold 42 and a lower leveling mold 43, compacting the slurry overflowing from the punched locations of the ceramic sheet, making the slurry inside the punched holes more compact, ensuring the normal operation of subsequent processes and guaranteeing the quality of the ceramic sheet. The adhesive tape isolation mechanism 5 covers the bottom surface of the upper leveling mold 42 with adhesive tape, preventing damage to the surface of the ceramic sheet during the leveling process without affecting the leveling operation.

[0024] Specifically, in combination Figure 2As shown, the feeding mechanism 2 includes a fixed base plate 21, a feeding cylinder 22, an X-axis linear guide rail 23, a movable base plate 24, a positioning platform 25, and a positioning motor 26. The feeding cylinder 22 and the positioning motor 26 are located at the bottom of the fixed base plate 21. Two X-axis linear guide rails 23 are provided and are arranged opposite each other on the fixed base plate 21. The movable base plate 24 is movably mounted on the two X-axis linear guide rails 23. The cylinder shaft of the feeding cylinder 22 is connected to the movable base plate 24. The positioning platform 25 is mounted on the movable base plate 24. After drilling and printing, the ceramic substrate is placed on the positioning platform 25. Under the action of the feeding cylinder 22, the positioning platform 25 can move along the X-axis linear guide rail 23 for loading and unloading. In this embodiment, the movable base plate 24 has a first insertion slot 241 and a second insertion slot 242 arranged opposite each other. The two sides of the positioning platform 25 are respectively connected by a first insertion block 251 and a second insertion block 252. The positioning platform 25 is fixed by plugging into the first insertion slot 241 and the second insertion slot 242. A handle 27 is provided on the outside of the positioning platform 25. This structural design allows the positioning platform 25 to be disassembled to facilitate the loading and unloading of ceramic sheets on the positioning platform 25. A first positioning slot 253 is opened at the bottom of the positioning platform 25, and a second positioning slot 243 corresponding to the first positioning slot 253 is opened on the movable base plate 24. The motor shaft of the positioning motor 26 faces upward and is connected to a positioning block 28. The positioning block 28 is movably located below the movable base plate 24 and corresponds to the second positioning slot 243 of the movable base plate 24 and the first positioning slot 253 of the positioning platform 25. The positioning platform 25 is positioned under the action of the positioning motor 26 and the positioning block 28.

[0025] Specifically, in combination Figure 3 As shown, the material handling mechanism 3 includes an X-axis linear drive module 31 and an L-shaped material handling device 32 movably mounted on the X-axis linear drive module 31. The L-shaped material handling device 32 includes a Z-axis linear drive module 321 located in the transverse section and a vacuum adsorption component 322 located in the longitudinal section. The Z-axis linear drive module 321 is movably mounted on the X-axis linear drive module 31, and the vacuum adsorption component 322 is movably mounted on the Z-axis linear drive module 321 and faces the leveling device 4. The vacuum adsorption component 322 is movably positioned above the positioning platform 25. The ceramic sheet is vacuum adsorbed by the vacuum adsorption component 322, and the loading and unloading are completed on the positioning platform 25 under the action of the Z-axis linear drive module 321 and the X-axis linear drive module 31.

[0026] Specifically, in combination Figure 4As shown, the leveling device 4 includes a leveling power assembly 41, an upper leveling mold 42, and a lower leveling mold 43. The upper leveling mold 42 is movably positioned above the lower leveling mold 43 and is driven to move up and down by the leveling power assembly 41. During leveling, the ceramic sheet is fed to the lower leveling mold 43 by the material handling mechanism 3 and vacuum-adheded. Then, the upper leveling mold 42 is driven down by the leveling power assembly 41 to level the surface of the ceramic sheet. To avoid damage to the ceramic sheet during the leveling process, an adhesive tape isolation mechanism 5 is provided. The bottom surface of the upper leveling mold 42 is covered with adhesive tape, which does not affect the leveling operation and avoids damage to the surface of the ceramic sheet during the leveling process. Specifically, the adhesive tape isolation mechanism 5 includes an unwinding assembly 51 and a winding assembly 52. ​​The unwinding assembly 51 and the winding assembly 52 are arranged opposite each other on both sides of the leveling power assembly 41. The unwinding assembly 51 releases adhesive tape through the bottom surface of the upper leveling mold 42 to the winding assembly 52 for winding.

[0027] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A single-layer flexible ceramic substrate leveling machine, characterized in that: It includes a frame and a feeding mechanism, a picking mechanism and a leveling device mounted on the frame, wherein the picking mechanism and the feeding mechanism are located vertically on one side of the leveling device; The feeding mechanism includes a fixed base plate, a feeding cylinder, an X-axis linear guide, a movable base plate, and a positioning platform. The feeding cylinder is located at the bottom of the fixed base plate. Two X-axis linear guides are provided and are arranged opposite each other on the fixed base plate. The movable base plate is movably mounted on the two X-axis linear guides. The cylinder shaft of the feeding cylinder is connected to the movable base plate. The positioning platform is located on the movable base plate, and the ceramic substrate is placed on the positioning platform. The material handling mechanism includes an X-axis linear drive module and an L-shaped material handling device movably mounted on the X-axis linear drive module. The L-shaped material handling device includes a Z-axis linear drive module located in the transverse section and a vacuum adsorption component located in the longitudinal section. The Z-axis linear drive module is movably mounted on the X-axis linear drive module, and the vacuum adsorption component is movably mounted on the Z-axis linear drive module and faces the leveling device. The vacuum adsorption component is movably located above the positioning platform. The leveling device includes a leveling power component, an upper leveling mold, and a lower leveling mold. The upper leveling mold is movably located above the lower leveling mold and is driven to move up and down by the leveling power component.

2. The single-layer flexible ceramic substrate leveling machine according to claim 1, characterized in that: The leveling device has two feeding mechanisms and two unloading mechanisms arranged opposite each other on both sides.

3. The single-layer flexible ceramic substrate leveling machine according to claim 1 or 2, characterized in that: The movable base plate is provided with a first insertion slot and a second insertion slot opposite to each other. The two sides of the positioning platform are respectively connected and fixed to the first insertion slot and the second insertion slot by the first insertion block and the second insertion block.

4. The single-layer flexible ceramic substrate leveling machine according to claim 3, characterized in that: The bottom of the positioning platform is provided with a first positioning groove, and the movable base plate is provided with a second positioning groove corresponding to the first positioning groove. The bottom of the fixed base plate is also provided with a positioning motor. The motor shaft of the positioning motor faces upward and is connected to a positioning block. The positioning block is movably located below the movable base plate and corresponds to the second positioning groove of the movable base plate and the first positioning groove of the positioning platform.

5. The single-layer flexible ceramic substrate leveling machine according to claim 4, characterized in that: The positioning platform is equipped with a handle on its outer side.

6. The single-layer flexible ceramic substrate leveling machine according to claim 1, characterized in that: The single-layer flexible ceramic substrate leveling machine also includes an adhesive paper separation mechanism, which includes an unwinding assembly and a rewinding assembly. The unwinding assembly and the rewinding assembly are arranged opposite each other on both sides of the leveling power assembly. The unwinding assembly releases the adhesive paper through the bottom surface of the upper leveling mold to the rewinding assembly for winding.

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