Packaging test device for chip production
By combining a drive motor to drive a threaded rod and a detection block with an infrared sensor, the chip position can be precisely adjusted, solving the alignment problem in chip packaging testing and improving testing accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-05
- Publication Date
- 2026-04-07
AI Technical Summary
In existing chip packaging testing equipment, the chip cannot be aligned with the detection block after being pushed by the first clamping plate, resulting in inaccurate test results.
A combination of a drive motor driving a threaded rod and a detection block is used to achieve lateral movement and vertical adjustment of the detection block. Combined with an infrared sensor, the chip position is accurately located to ensure that the detection block is aligned with the chip.
This improves the accuracy of packaging testing, ensures chip alignment with the test block, and enhances the accuracy of test results.
Smart Images
Figure CN224095952U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of encapsulation chip detection technology, specifically for a kind of encapsulation test device for chip production. BACKGROUND
[0002] Chip needs to be detected after encapsulation, so as to separate good products and defective products;Chip testing has many kinds, and encapsulated chip compression detection is one of chip detection contents.
[0003] Through search, the prior art with announcement number CN218691653U discloses a test device for various chip packaging forms, comprising a support, a slide rail, a chassis, a gas cylinder and a connecting plate, etc.;The two sides of the chassis in the length direction are symmetrically installed with slide rails, and the slide rails are jointly and slidably connected with the support, the support is arranged above the chassis, the gas cylinder is connected with the connecting plate through the first threaded rod, and the utility model is simple in operation and high in test efficiency. The test device can be used for various chip packaging forms.
[0004] However, the chip cannot be aligned with the detection block after being pushed by the first clamping plate, resulting in inaccurate test results, so a kind of encapsulation test device for chip production is proposed to solve the above problems. UTILITY MODEL CONTENTS
[0005] In view of the deficiencies of the prior art, the utility model provides an encapsulation test device for chip production, which has the advantages of adjusting the position of the chip and adjusting the lateral position of the detection block, and solves the problem that the chip cannot be aligned with the detection block after being pushed by the first clamping plate, resulting in inaccurate test results.
[0006] To achieve the above purpose, the utility model provides the following technical scheme: an encapsulation test device for chip production, comprising a fixed frame, a first fixed frame is fixedly connected on one side of the fixed frame, a first drive motor is fixedly installed on the right side of the first fixed frame, a third threaded rod is fixedly connected to the output end of the first drive motor, a moving frame is threadedly connected to the outer side of the third threaded rod, an encapsulation test device is arranged in the moving frame, and a chip positioning device is arranged in the fixed frame.
[0007] The encapsulation test device comprises a second drive motor fixedly installed on one side of the moving frame, a connecting plate fixedly connected to the inner wall of the moving frame, a first threaded rod fixedly connected to the output end of the second drive motor, three detection blocks threadedly connected to the outer side of the first threaded rod, and a first sliding rod slidably arranged on the upper side of the detection block.
[0008] The chip positioning device comprises a plurality of movable plates slidably connected inside the fixed frame plate, three groups of telescopic spring rods fixedly connected inside the movable plates, clamping plates fixedly connected on one side of the telescopic spring rods and three chip placing grooves opened inside the movable plates.
[0009] Further, the other side of the fixed frame plate is fixedly connected with a second fixing frame, and the inner wall of the second fixing frame is fixedly connected with a second sliding rod.
[0010] Further, the side, away from the third threaded rod, of the moving frame is slidably sleeved on the outside of the second sliding rod.
[0011] Further, the lower side of the fixed frame plate is fixedly installed with a plurality of third driving motors, and the output end of the third driving motor is fixedly connected with a second threaded rod.
[0012] Further, the outside of the second threaded rod is threadedly connected with an internal thread sleeve, and the top of the internal thread sleeve is fixedly connected to the lower side of the movable plate.
[0013] Further, the inside of the connecting plate is provided with a through hole, and the detection block passes through the through hole and extends to the outside thereof.
[0014] Further, the telescopic spring rods are arranged in two groups in the vertical direction.
[0015] Further, the upper side of the fixed frame plate is embeddedly installed with a plurality of infrared sensors, and the infrared sensors are arranged in the horizontal direction at equal intervals.
[0016] Compared with the prior art, the packaging test device for chip production has the following beneficial effects:
[0017] 1. The packaging test device for chip production drives the three detection blocks on the outside of the first threaded rod to move horizontally through the second driving motor, and after clamping chips of different sizes, the packaging test precision can be improved.
[0018] 2. The packaging test device for chip production drives the internal thread sleeve on the outside of the second threaded rod to push the movable plate to move vertically out of the fixed frame plate through the third driving motor, so that the detection block can better test the chip in the chip placing groove, and the problem that the chip cannot be aligned with the detection block after being pushed by the first clamping plate, resulting in inaccurate test results, is solved. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 It is a structural schematic view of the utility model;
[0020] Figure 2 It is a structural side view of the moving frame of the utility model;
[0021] Figure 3 It is the side structure section view of fixed frame plate of the utility model,
[0022] Figure 4 It is the structure perspective view of first fixed frame and second fixed frame of the utility model.
[0023] In the drawing: 1 first fixed frame, 2 first drive motor, 3 moving frame, 4 second drive motor, 5 connecting plate, 6 fixed frame plate, 7 infrared inductive instrument, 8 third drive motor, 9 first threaded rod, 10 first sliding rod, 11 detection block, 12 internal thread sleeve, 13 second threaded rod, 14 telescopic spring rod, 15 chip placement slot, 16 movable plate, 17 clamping plate, 18 third threaded rod, 19 second fixed frame, 20 second sliding rod. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model. EMBODIMENT
[0025] Please refer to Figures 1 to 4 In the embodiment, the packaging test device for chip production includes fixed frame plate 6, and one side of the fixed frame plate 6 is fixedly connected with first fixed frame 1. The right side of the first fixed frame 1 is fixedly installed with first drive motor 2. The output end of the first drive motor 2 is fixedly connected with third threaded rod 18. The outer side of the third threaded rod 18 is threadedly connected with moving frame 3. The inside of the moving frame 3 is provided with packaging test device. The inside of the fixed frame plate 6 is provided with chip positioning device. The packaging test device includes second drive motor 4 fixedly installed on one side of the moving frame 3, connecting plate 5 fixedly connected with the inner wall of the moving frame 3, first threaded rod 9 fixedly connected with the output end of the second drive motor 4, three detection blocks 11 threadedly connected with the outer side of the first threaded rod 9 and first sliding rod 10 slidingly sleeved on the upper side of the detection block 11. The chip positioning device includes multiple movable plates 16 slidingly connected with the inside of the fixed frame plate 6, three groups of telescopic spring rods 14 fixedly connected with the inside of the movable plate 16, clamping plate 17 fixedly connected with one side of the telescopic spring rod 14 and three chip placement slots 15 opened in the inside of the movable plate 16.
[0026] The other side of the fixed frame plate 6 is fixedly connected with a second fixing frame 19, the inner wall of the second fixing frame 19 is fixedly connected with a second sliding rod 20, the side, away from the third threaded rod 18, of the moving frame 3 is slidingly sleeved outside the second sliding rod 20, a plurality of third driving motors 8 are fixedly installed at the lower side of the fixed frame plate 6, the output end of the third driving motor 8 is fixedly connected with a second threaded rod 13, the outer side of the second threaded rod 13 is threadedly connected with an internal thread sleeve 12, the top of the internal thread sleeve 12 is fixedly connected at the lower side of the movable plate 16, the inside of the connecting plate 5 is provided with a through hole, the detection block 11 passes through the through hole and extends to the outside, and each group of telescopic spring rods 14 is two in a group. Embodiment
[0027] Please refer to Figure 1 and Figure 3 On the basis of the first embodiment, a plurality of infrared sensors 7 are embeddedly installed at the upper side of the fixed frame plate 6, and the plurality of infrared sensors 7 are horizontally and equidistantly arranged.
[0028] By adopting the technical scheme, when the moving frame 3 moves on the upper side of the fixed frame plate 6, the infrared sensor 7 will transmit the model to the first driving motor 2 when the moving frame 3 is vertical, and the driving of the moving frame 3 is disconnected, so that the position of the movable plate 16 can be conveniently and accurately positioned.
[0029] The working principle of the above embodiment is as follows:
[0030] The chip is placed in the chip placing groove 15, the telescopic spring rod 14 pushes the clamping plate 17 to be clamped at the side of the chip for positioning, the first driving motor 2 drives the moving frame 3 to move, the driving of the first driving motor 2 is disconnected when the infrared sensor 7 is kept vertical, the second driving motor 4 is turned on to horizontally move the position of the detection block 11 to keep alignment with the center of the chip, and at the same time, the third driving motor 8 drives the internal thread sleeve 12 through the second threaded rod 13 to drive the movable plate 16 to move upward from the inside of the fixed frame plate 6, so as to adjust the distance between the chip and the detection block 11, facilitate better observation of the test result of packaging, and improve the accuracy.
[0031] The mounting mode, connection mode or setting mode disclosed in the embodiment are all common mechanical connection modes, as long as the beneficial effects can be achieved, and moreover, the electrical elements appearing in the embodiment are all electrically connected with a master control and a power supply, the master control can be a conventional known device such as a computer which plays a control role, the control of the electrical elements can be realized by simple programming by the person skilled in the art, and the existing disclosed power connection technology also belongs to the common knowledge in the field, so the specific structure composition and working principle will not be described in detail.
[0032] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other inventors can develop based on the same general inventive concepts embodied by the described embodiments. That is, although the present application is described in terms of particular embodiments and implementations, it is to be understood that the terminology used is for the purpose of descriptive clarity and that it is intended to be limited only by the words recited in the appended claims. The scope of the present application shall be limited only by the claims.
[0033] While the embodiments of the present application have been shown and described with respect to particular embodiments thereof, it will be understood by those skilled in the art that various changes in form and details can be made therein without departing from the spirit and scope of the application. Therefore, the scope of the application should not be limited by the embodiments, but should be defined only in accordance with the following claims and their equivalents.
Claims
1. A packaging and testing apparatus for chip production, comprising a fixed frame plate (6), characterized in that: A first fixed frame (1) is fixedly connected to one side of the fixed frame plate (6), a first drive motor (2) is fixedly installed on the right side of the first fixed frame (1), a third threaded rod (18) is fixedly connected to the output end of the first drive motor (2), a movable frame (3) is threadedly connected to the outer side of the third threaded rod (18), a packaging test device is provided inside the movable frame (3), and a chip positioning device is provided inside the fixed frame plate (6). The packaging test device includes a second drive motor (4) fixedly installed on one side of the movable frame (3), a connecting plate (5) fixedly connected to the inner wall of the movable frame (3), a first threaded rod (9) fixedly connected to the output end of the second drive motor (4), three detection blocks (11) threadedly connected to the outside of the first threaded rod (9), and a first slide rod (10) slidably sleeved on the upper side of the detection block (11). The chip positioning device includes multiple movable plates (16) slidably connected inside the fixed frame plate (6), three sets of telescopic spring rods (14) fixedly connected inside the movable plates (16), a clamping plate (17) fixedly connected to one side of the telescopic spring rods (14), and three chip placement slots (15) opened inside the movable plates (16).
2. The packaging and testing apparatus for chip production according to claim 1, characterized in that: A second fixing frame (19) is fixedly connected to the other side of the fixing frame plate (6), and a second sliding rod (20) is fixedly connected to the inner wall of the second fixing frame (19).
3. The packaging and testing apparatus for chip production according to claim 2, characterized in that: The movable frame (3) is slidably sleeved on the outside of the second slide rod (20) on the side away from the third threaded rod (18).
4. The packaging and testing apparatus for chip production according to claim 1, characterized in that: Multiple third drive motors (8) are fixedly installed on the lower side of the fixed frame plate (6), and the output end of the third drive motor (8) is fixedly connected to a second threaded rod (13).
5. The packaging and testing apparatus for chip production according to claim 4, characterized in that: The outer thread of the second threaded rod (13) is connected to an inner threaded sleeve (12), and the top of the inner threaded sleeve (12) is fixedly connected to the lower side of the movable plate (16).
6. The packaging and testing apparatus for chip production according to claim 1, characterized in that: The connecting plate (5) has a through hole inside, and the detection block (11) passes through the through hole and extends to the outside.
7. The packaging and testing apparatus for chip production according to claim 1, characterized in that: Each set of the telescopic spring rods (14) is in pairs, with the two telescopic spring rods (14) arranged vertically.
8. The packaging and testing apparatus for chip production according to claim 1, characterized in that: Multiple infrared sensors (7) are embedded and installed on the upper side of the fixed frame plate (6), and the multiple infrared sensors (7) are arranged horizontally at equal intervals.