Rapid leveling mechanism for wafer table of photoetching machine

Abstract

The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a quick leveling mechanism for a wafer table of a photoetching machine, which comprises a placing table, the supporting assembly comprises a mounting seat; the leveling assembly comprises a driving rod and a telescopic rod mounted at the top of the driving rod; wherein the telescopic rod can stretch out and draw back in the radial direction of the driving rod, the supporting assembly further comprises a base with the size slightly larger than that of the mounting base, the base is fixedly connected to the bottom of the mounting base, the outer wall of the base is connected with external equipment through mounting bolts, and the leveling assembly further comprises a plurality of mounting blocks fixedly connected to the top wall of the mounting base; the posture of the placement table can be dynamically adjusted in real time through the leveling assembly in multi-axis cooperative movement, so that high-precision synchronous leveling of wafers on the placement table is ensured, meanwhile, through synchronous work of the supporting assembly, counter-acting force generated by movement is effectively absorbed, vibration is restrained, and the stability of the wafer placement table is improved. And firm and reliable stability guarantee is provided for the whole leveling process and device operation.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a photoetching machine wafer table fast leveling mechanism. BACKGROUND

[0002] As a key equipment in the semiconductor manufacturing process, the precision and stability of the photoetching machine play a decisive role in chip manufacturing quality. In the photoetching process, the leveling of the wafer table is crucial, because even a small height error can cause inaccurate transfer of the photoetching pattern on the wafer, thereby affecting the performance and yield of the chip. Therefore, designing a photoetching machine wafer table leveling mechanism that can quickly and accurately level has important practical significance for improving the overall performance of the photoetching machine and promoting the progress of semiconductor manufacturing technology.

[0003] Chinese patent authorization announcement number: CN219715533U provides a wafer detection platform leveling device, the scheme "includes: detection table, the top of the detection table is provided with a placing disc; positioning mechanism, the positioning mechanism is set on the surface of the placing disc to quickly position the wafer on the placing disc; wherein, the positioning mechanism includes a positioning component set on the surface of the placing disc, the surface of the positioning component is provided with a driving assembly; in the device, the output shaft of the servo motor drives the sliding block to move through the first bevel gear, the second bevel gear and the lead screw, the spring increases the resistance of the sliding block movement, the four clamping blocks drive the elastic blocks to slowly approach and clamp the wafer at the same time, can clamp wafers of different sizes, the positioning mechanism reduces the damage to the wafer surface, ensures the flatness of the wafer on the placing disc, then performs leveling work, ensures the accuracy of the wafer detection of the detection platform".

[0004] Although the above device can clamp wafers of different sizes, it does not design a structure for leveling the wafer, so that the device has certain use limitations. UTILITY MODEL CONTENT

[0005] In view of the above or existing problems in the prior art, the utility model is proposed.

[0006] Therefore, the purpose of the utility model is to provide a photoetching machine wafer table fast leveling mechanism.

[0007] To solve the above technical problems, the utility model provides the following technical scheme: a photoetching machine wafer table fast leveling mechanism, including a placing table; and a support assembly, including a mounting seat; and a leveling assembly, including a driving rod and a telescopic rod mounted on the top of the driving rod;

[0008] Among them, the telescopic rod can be telescopic along the radial direction of the driving rod.

[0009] As a preferred embodiment of the rapid leveling mechanism for a lithography machine wafer stage according to this utility model, the support assembly further includes a base slightly larger than the mounting base, the base being fixedly connected to the bottom of the mounting base, and the outer wall of the base being connected to external equipment by mounting bolts.

[0010] As a preferred embodiment of the rapid leveling mechanism for a lithography machine wafer stage of this utility model, the leveling component further includes a plurality of mounting blocks fixedly connected to the top wall of the mounting base. A first connecting ball is mounted on the outer wall of the mounting block, and a first connecting block is provided on the outer wall of the first connecting ball. The first connecting block is fixedly connected to the bottom wall of the drive rod.

[0011] As a preferred embodiment of the rapid leveling mechanism for a lithography machine wafer stage of this utility model, the output end of the telescopic rod is fixedly connected to a second connecting block, the inner wall of the second connecting block is equipped with a second connecting ball, the outer wall of the second connecting ball is fixedly connected to a fixing block, and a support platform is provided on the inner side of the fixing block.

[0012] As a preferred embodiment of the rapid leveling mechanism for a lithography machine wafer stage according to this utility model, a tilt sensor is installed on the outer wall of the placement stage.

[0013] As a preferred embodiment of the rapid leveling mechanism for a lithography machine wafer stage according to this utility model, a control switch is installed on the top wall of the mounting base, and the control switch is electrically connected to the drive rod and the tilt sensor respectively.

[0014] The beneficial effects of this utility model are as follows: This utility model uses a multi-axis coordinated motion leveling component to adjust the posture of the placement stage in real time and dynamically, thereby ensuring that the wafers on it achieve high-precision synchronous leveling. At the same time, by working synchronously with the support component, the reaction force generated by the motion is effectively absorbed and vibration is suppressed, providing a solid and reliable stability guarantee for the entire leveling process and the operation of the device. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure and a partial enlarged view of a rapid leveling mechanism for a lithography machine wafer stage.

[0017] Figure 2 This is a schematic diagram and a partial enlarged view of the leveling component structure of a rapid leveling mechanism for a lithography machine wafer stage.

[0018] Figure 3 This is a front view schematic diagram of a rapid leveling mechanism for a lithography machine wafer stage.

[0019] In the diagram, 1. Placement platform; 2. Support assembly; 21. Base; 22. Mounting bolt; 23. Mounting seat; 3. Leveling assembly; 31. Mounting block; 32. First connecting ball; 33. First connecting block; 34. Drive rod; 35. Telescopic rod; 36. Second connecting block; 37. Second connecting ball; 38. Fixing block; 39. Support platform; 4. Tilt sensor; 5. Control switch. Detailed Implementation

[0020] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0021] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0022] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0023] Reference Figure 1 , Figure 2 and Figure 3 A rapid leveling mechanism for a lithography machine wafer stage includes a placement stage 1; wherein the placement stage 1 is fixedly connected to a support stage 39 via a support rod and is used for placing the wafer.

[0024] And, the support component 2 includes a mounting base 23; wherein the mounting base 23 has a triangular design, thereby ensuring that the mounting base 23 has a certain degree of stability.

[0025] And, the leveling assembly 3 includes a drive rod 34 and a telescopic rod 35 mounted on top of the drive rod 34; wherein, the telescopic rod 35 can extend and retract along the radial direction of the drive rod 34; the drive rod 34 and the telescopic rod 35 are the internal guide structure of the leveling assembly 3, which drives the support platform 39 to move, and the drive rod 34 is designed in multiple groups, which can ensure that the leveling assembly 3 has sufficient degrees of freedom, so that the device has a certain degree of flexibility and meets the leveling requirements under different conditions.

[0026] Specifically, the leveling assembly 3 also includes multiple mounting blocks 31 fixedly connected to the top wall of the mounting base 23. The outer wall of the mounting block 31 is equipped with a first connecting ball 32, and the outer wall of the first connecting ball 32 is provided with a first connecting block 33. The first connecting block 33 is fixedly connected to the bottom wall of the drive rod 34. The first connecting ball 32 and the first connecting block 33 are fixedly designed. The drive rod 34 can move at multiple angles through the movable connection of the first connecting ball 32 on the outer surface of the mounting block 31.

[0027] Furthermore, a second connecting block 36 is fixedly connected to the output end of the telescopic rod 35. A second connecting ball 37 is installed on the inner wall of the second connecting block 36, and a fixing block 38 is fixedly connected to the outer wall of the second connecting ball 37. A support platform 39 is provided on the inner side of the fixing block 38. The second connecting ball 37 and the second connecting block 36 are also fixedly connected and move synchronously, cooperating with the movement trajectory of the drive rod 34 and the telescopic rod 35 to ensure the stable operation of the leveling component 3.

[0028] Reference Figure 1 and Figure 2 The support assembly 2 also includes a base 21 that is slightly larger than the mounting base 23. The base 21 is fixedly connected to the bottom of the mounting base 23, and the outer wall of the base 21 is connected to the external equipment by mounting bolts 22. The base 21 is fixed to the bottom of the mounting base 23, and the base 21 is installed on the outer equipment platform by mounting bolts 22 to ensure the overall stability of the device.

[0029] Reference Figure 1 and Figure 3 An angle sensor 4 is installed on the outer wall of the placement stage 1. The angle sensor 4 determines the horizontal state by measuring the tilt angle of the object relative to the horizontal plane. The angle sensor 4 is stably installed on the surface of the placement stage 1 to realize the detection of the horizontal state of the wafer.

[0030] Specifically, a control switch 5 is installed on the top wall of the mounting base 23. The control switch 5 is electrically connected to the drive rod 34 and the tilt sensor 4 respectively. The multiple drive rods 34 are controlled by the control switch 5 to work in conjunction with the relevant system and improve the stable operation of the device.

[0031] Working principle: First, the base 21 and the mounting base 23 are fixedly connected. Multiple mounting bolts 22 are installed on the outer wall of the base 21, fixing the base 21 to the outer platform. This provides a stable support platform for the leveling assembly 3, allowing the wafer to be placed on the surface of the placement stage 1. The leveling assembly 3 has a multi-axis design, with the outer surface of the mounting block 31 having inclined sides. The first connecting ball 32 and the second connecting ball 37 are respectively installed on the surfaces of the mounting block 31 and the fixed block 38. The first connecting ball 32 and the second connecting ball 37 allow the drive rod 34 and the telescopic rod 35 to move forward. The wafer leveling system allows for multi-angle adjustment. When wafer leveling is required, the control switch 5 centrally controls multiple drive rods 34. The first connecting ball 32 and the first connecting block 33 drive the drive rods 34 to move in different directions. Simultaneously, the telescopic rod 35 can be controlled to extend and retract along the outer surface of the drive rod 34, thereby driving the support platform 39 to move in multiple angles and directions. Based on the wafer's position, the coordinated action of multiple drive rods 34 and telescopic rods 35 enables the support platform 39 to be adjusted at multiple angles, thereby bringing the placement stage 1 and the wafer into a horizontal state and achieving the wafer leveling effect.

[0032] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A rapid leveling mechanism for a lithography machine wafer stage, characterized in that: Including the placement platform (1); and, Support component (2), including mounting base (23); and, The leveling assembly (3) includes a drive rod (34) and a telescopic rod (35) mounted on top of the drive rod (34). The telescopic rod (35) can extend and retract radially along the drive rod (34).

2. The rapid leveling mechanism for a lithography machine wafer stage as described in claim 1, characterized in that: The support assembly (2) also includes a base (21) slightly larger than the mounting base (23), the base (21) being fixedly connected to the bottom of the mounting base (23), and the outer wall of the base (21) being connected to an external device by mounting bolts (22).

3. The rapid leveling mechanism for a lithography machine wafer stage as described in claim 2, characterized in that: The leveling assembly (3) also includes a plurality of mounting blocks (31) fixedly connected to the top wall of the mounting base (23). The outer wall of the mounting block (31) is equipped with a first connecting ball (32), and the outer wall of the first connecting ball (32) is provided with a first connecting block (33). The first connecting block (33) is fixedly connected to the bottom wall of the drive rod (34).

4. The rapid leveling mechanism for a lithography machine wafer stage as described in claim 3, characterized in that: The output end of the telescopic rod (35) is fixedly connected to a second connecting block (36), the inner wall of the second connecting block (36) is equipped with a second connecting ball (37), the outer wall of the second connecting ball (37) is fixedly connected to a fixing block (38), and the inner side of the fixing block (38) is provided with a support platform (39).

5. The rapid leveling mechanism for a lithography machine wafer stage as described in claim 4, characterized in that: An angle sensor (4) is installed on the outer wall of the placement platform (1).

6. The rapid leveling mechanism for a lithography machine wafer stage as described in claim 5, characterized in that: A control switch (5) is installed on the top wall of the mounting base (23), and the control switch (5) is electrically connected to the drive rod (34) and the tilt sensor (4) respectively.

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