Heat dissipation device

Abstract

The utility model discloses a heat dissipation device which comprises a first heat dissipation unit, a heat pipe unit, a heat dissipation base and a second heat dissipation unit. The first heat dissipation unit comprises an upper heat dissipation fin set, a middle heat dissipation fin set and a lower heat dissipation fin set which are arranged in a laminated mode. One end of the heat pipe unit is provided with a heat absorption part, the other end of the heat pipe unit is provided with a first heat dissipation part and a second heat dissipation part which are arranged in a laminated mode, the heat absorption part is used for being attached to a heat source, and the first heat dissipation part extends into the first heat dissipation unit and is located between the upper heat dissipation fin set and the middle heat dissipation fin set. The second heat dissipation part extends into the first heat dissipation unit and is positioned between the middle heat dissipation fin group and the lower heat dissipation fin group; the heat dissipation base is arranged on the heat absorption part; the second heat dissipation unit is arranged on the heat dissipation base; after the heat absorption part absorbs heat of a heat source, the heat is dissipated through the second heat dissipation unit and the first heat dissipation unit in sequence.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation technical field, especially a passive heat dissipation device for high power processor. BACKGROUND

[0002] The information age and artificial intelligence age cannot be separated from the support of various electronic products. In order to meet the performance, various electronic products will continuously develop and improve chip technology. While chip technology is becoming more and more developed, the power density of product chips will gradually increase. As we all know, electronic products operating continuously at high temperature for a long time will cause chip damage, product failure, and reduced service life. Therefore, each excellent and qualified product must be designed for temperature control to extend the service life of the product. Especially for the heat dissipation problem of high power processor, it has become a hot spot in the industry.

[0003] In the prior art, a heat pipe is used to indirectly contact the heat source through a copper base. However, when this method is applied to high power processors, its heat dissipation performance does not match the high power processor at all, which can easily cause overheating problems. Therefore, developing a heat dissipation device for high power processors has become a primary technical problem. SUMMARY

[0004] The utility model provides a heat dissipation device to improve the effective application of heat dissipation space and improve the heat dissipation performance.

[0005] One embodiment of the utility model discloses a heat dissipation device, which comprises:

[0006] The first heat dissipation unit comprises an upper heat dissipation fin group, a middle heat dissipation fin group, and a lower heat dissipation fin group arranged in layers.

[0007] The heat pipe unit has a heat absorbing portion at one end and a first heat dissipation portion and a second heat dissipation portion arranged in layers at the other end. The heat absorbing portion is used to fit the heat source. The first heat dissipation portion extends into the first heat dissipation unit and is located between the upper heat dissipation fin group and the middle heat dissipation fin group. The second heat dissipation portion extends into the first heat dissipation unit and is located between the middle heat dissipation fin group and the lower heat dissipation fin group.

[0008] The heat dissipation base is installed on the heat absorbing portion.

[0009] The second heat dissipation unit is installed on the heat dissipation base.

[0010] After the heat absorbing portion absorbs the heat of the heat source, the heat is dissipated through the second heat dissipation unit and the first heat dissipation unit in sequence.

[0011] The heat dissipation device, wherein the first heat dissipation part and the second heat dissipation part extend into the first heat dissipation unit from one side of the long side of the first heat dissipation unit and extend to two short sides of the first heat dissipation unit.

[0012] The heat dissipation device, wherein the heat pipe unit comprises a first heat pipe group and a second heat pipe group, the first heat pipe group comprises at least one first heat pipe, the second heat pipe group comprises at least one second heat pipe, at least one first heat pipe and at least one second heat pipe are arranged alternately, one end of at least one first heat pipe and at least one second heat pipe constitutes the heat absorption part, the other end of at least one first heat pipe constitutes the first heat dissipation part, and the other end of at least one second heat pipe constitutes the second heat dissipation part.

[0013] The heat dissipation device, wherein the heat pipe unit further comprises a first heat conduction part and a second heat conduction part, one end of the first heat conduction part and the second heat conduction part is connected to the heat absorption part, the other end of the first heat conduction part is connected to the first heat dissipation part, and the other end of the second heat conduction part is connected to the second heat dissipation part.

[0014] The heat dissipation device, wherein each first heat pipe comprises a first heat absorption section, a first heat conduction section and a first heat dissipation section, each second heat pipe comprises a second heat absorption section, a second heat conduction section and a second heat dissipation section, the first heat absorption section and the second heat absorption section are mutually adhered to form the heat absorption part, the first heat dissipation section and the second heat dissipation section extend into the first heat dissipation unit from one side of the long side of the first heat dissipation unit and extend to one side of the short side of the first heat dissipation unit to form the first heat dissipation part and the second heat dissipation part, two ends of the first heat conduction section are connected to the first heat absorption section and the first heat dissipation section respectively to form the first heat conduction part, and two ends of the second heat conduction section are connected to the second heat absorption section and the second heat dissipation section respectively to form the second heat conduction part.

[0015] The heat dissipation device, wherein the first heat conduction section and / or the second heat conduction section comprises a tubular part and a flat part which are connected to each other.

[0016] The heat dissipation device, wherein the upper heat dissipation fin group has a first opening, the first heat dissipation part extends into the first heat dissipation unit from the first opening, the middle heat dissipation fin group has a second opening, and the second heat dissipation part extends into the first heat dissipation unit from the second opening.

[0017] The heat dissipation device, wherein a substrate is further included, and the first heat dissipation unit is arranged on the substrate.

[0018] In the aforementioned heat dissipation device, the second heat dissipation unit includes a first heat dissipation fin group in the shape of a cross and a second heat dissipation fin group in the shape of a concave U, with one end of the first heat dissipation fin group inserted into the groove of the second heat dissipation fin group.

[0019] In the aforementioned heat dissipation device, the first heat pipe and / or the second heat pipe are superconducting heat pipes.

[0020] In the aforementioned heat dissipation device, the heat dissipation base is provided with a plurality of heat pipe grooves, the first heat absorption section and the second heat absorption section are correspondingly arranged in the heat pipe grooves, and there is a preset height between the top of the heat pipe groove and the top surface of the heat dissipation base, the preset height being greater than or equal to 2mm.

[0021] In the aforementioned heat dissipation device, the first heat-absorbing section and the second heat-absorbing section are disposed after the heat pipe groove, and the heat-absorbing surface of the heat-absorbing part is formed by rolling and sizing the first heat-absorbing section and the second heat-absorbing section.

[0022] According to the heat dissipation device of the above embodiments, the present invention has the following advantages over the prior art:

[0023] 1. This heat dissipation device takes into account the different capillary requirements of heat pipes in different areas, and specially adopts superconducting heat pipe technology to optimize the heat transfer effect of heat pipes. Then, the heat pipes are combined with the heat dissipation base through rolling tube technology to reduce thermal resistance.

[0024] 2. The overall performance of the heat dissipation module can be improved by increasing the contact area between the heat pipe and the heat sink fins. The contact area generated by different fin gaps can improve the heat transfer efficiency of the heat pipe, thereby improving the heat distribution.

[0025] 3. By directly contacting the heat source through the heat pipe, the loss during the heat transfer process is reduced, thereby improving the overall heat dissipation performance.

[0026] The above description of the present utility model and the following description of the embodiments are used to demonstrate and explain the principle of the present utility model, and to provide a further explanation of the scope of the patent application of the present utility model. Attached Figure Description

[0027] Figure 1 This is a perspective view of the heat dissipation device according to an embodiment of the present invention.

[0028] Figure 2 This is a perspective view of the heat dissipation device according to another embodiment of the present invention.

[0029] Figure 3 yes Figure 1 A partial cross-sectional view of the first heat pipe assembly.

[0030] Figure 4 yes Figure 1 A partial cross-sectional view of the second heat pipe assembly.

[0031] Figure 5 This is a schematic diagram of a heat pipe.

[0032] In the attached figures, the following labels are used:

[0033] Heat dissipation device: 1;

[0034] First heat dissipation unit: 11;

[0035] Upper heat dissipation fin assembly: 111;

[0036] Central heat dissipation fin assembly: 112;

[0037] Lower heat dissipation fin assembly: 113;

[0038] First opening: K1;

[0039] Second opening: K2;

[0040] Long side: L;

[0041] Short side: S;

[0042] Heat pipe unit: 12;

[0043] Heat absorption section: E;

[0044] Heat absorption surface: E1;

[0045] First heat dissipation section: T1;

[0046] Second heat dissipation unit: T2;

[0047] First heat-conducting part: C1;

[0048] Second heat-conducting part: C2;

[0049] First heat pipe group: 121;

[0050] Second heat pipe assembly: 122;

[0051] First heat pipe: H1;

[0052] First heat absorption section: H11;

[0053] First heat conduction section: H12;

[0054] Tubular portion: G;

[0055] Flattened part: B;

[0056] First heat dissipation section: H13;

[0057] Second heat pipe: H2;

[0058] Second heat absorption section: H21;

[0059] Second heat conduction section: H22;

[0060] Tubular portion: G;

[0061] Flattened part: B;

[0062] Second heat dissipation section: H23;

[0063] Heat pipe groove: 131;

[0064] Preset height: H1;

[0065] Cooling pad: 13;

[0066] Second heat dissipation unit: 14;

[0067] First heat dissipation fin group: 141;

[0068] Second heat dissipation fin group: 142;

[0069] Groove: K3;

[0070] Substrate: 15;

[0071] Heat source: H;

[0072] First firmware lock: G1;

[0073] Second firmware: G2. Detailed Implementation

[0074] Please see Figures 1 to 5 . Figure 1 This is a perspective view of the heat dissipation device according to an embodiment of the present invention. Figure 2 This is a perspective view of the heat dissipation device according to another embodiment of the present invention. Figure 3 yes Figure 1 A partial cross-sectional view of the first heat pipe assembly. Figure 4 yes Figure 1 A partial cross-sectional view of the second heat pipe assembly. Figure 5 This is a schematic diagram of a heat pipe. (For example...) Figures 1 to 5As shown, a heat dissipation device 1 in this embodiment includes: a first heat dissipation unit 11, a heat pipe unit 12, a heat dissipation base 13, and a second heat dissipation unit 14. The first heat dissipation unit 11 includes an upper heat dissipation fin group 111, a middle heat dissipation fin group 112, and a lower heat dissipation fin group 113 stacked together. One end of the heat pipe unit 12 has a heat-absorbing portion E, and the other end has a first heat dissipation portion T1 and a second heat dissipation portion T2 stacked together. The heat-absorbing portion E is used to adhere to a heat source H. The first heat dissipation portion T1 extends into the first heat dissipation unit 11 and is located between the upper heat dissipation fin group 111 and the middle heat dissipation fin group 112. The second heat dissipation part T2 extends into the first heat dissipation unit 11 and is located between the middle heat dissipation fin group 112 and the lower heat dissipation fin group 113; the heat dissipation base 13 is mounted on the heat absorption part E; the second heat dissipation unit 14 is mounted on the heat dissipation base 13; wherein, after the heat absorption part E absorbs the heat from the heat source H, it dissipates heat through the second heat dissipation unit 14 and the first heat dissipation unit 11 in sequence; the first heat dissipation part T1 and the second heat dissipation part T2 extend into the first heat dissipation unit 11 from one side of the long side L of the first heat dissipation unit 11 and extend to the two short sides S of the first heat dissipation unit 11.

[0075] The heat pipe unit 12 further includes a first heat-conducting part C1 and a second heat-conducting part C2. One end of the first heat-conducting part C1 and the second heat-conducting part C2 are connected to the heat-absorbing part E, the other end of the first heat-conducting part C1 is connected to the first heat-dissipating part T1, and the other end of the second heat-conducting part C2 is connected to the second heat-dissipating part T.

[0076] Furthermore, the heat pipe unit 12 includes a first heat pipe group 121 and a second heat pipe group 122. The first heat pipe group 121 includes at least one first heat pipe H1, and the second heat pipe group 122 includes at least one second heat pipe H2. The at least one first heat pipe H1 and the at least one second heat pipe H2 are arranged alternately. One end of the at least one first heat pipe H1 and the at least one second heat pipe H2 constitutes the heat absorption part E, the other end of the at least one first heat pipe H1 constitutes the first heat dissipation part T1, and the other end of the at least one second heat pipe H2 constitutes the second heat dissipation part T2.

[0077] Each of the first heat pipes H1 includes a first heat absorption section H11, a first heat conduction section H12, and a first heat dissipation section H13; each of the second heat pipes H2 includes a second heat absorption section H21, a second heat conduction section H22, and a second heat dissipation section H23. The first heat absorption section H11 and the second heat absorption section H21 are attached to each other to form the heat absorption part E. The first heat dissipation section H13 and the second heat dissipation section H23 extend from one side of the long side L of the first heat dissipation unit 11 into the first heat dissipation unit 11 and extend to one side of the short side S of the first heat dissipation unit 11 to form the first heat dissipation part T1 and the second heat dissipation part T2. The two ends of the first heat conduction section H12 are respectively connected to the first heat absorption section H11 and the first heat dissipation section H13 to form the first heat conduction part C1. The two ends of the second heat conduction section H22 are respectively connected to the second heat absorption section H21 and the second heat dissipation section H23 to form the second heat conduction part C2.

[0078] In this embodiment, a portion of the first heat dissipation segment H13 extends toward the short side S on one side of the first heat dissipation unit 11, and another portion of the second heat dissipation segment H23 extends toward the short side S on the other side of the first heat dissipation unit 11; a portion of the second heat dissipation segment H23 extends toward the short side S on one side of the first heat dissipation unit 11, and another portion of the first heat dissipation segment H33 extends toward the short side S on the other side of the first heat dissipation unit 11; in another embodiment of this utility model, all the first heat dissipation segments H13 extend toward the short side S on one side of the first heat dissipation unit 11 and / or all the second heat dissipation segments H23 extend toward the short side S on one side of the first heat dissipation unit 11; in one embodiment of this utility model, all the first heat dissipation segments H13 extend toward the short side S on one side of the first heat dissipation unit 11 and all the second heat dissipation segments H23 extend toward the short side S on the other side of the first heat dissipation unit 11.

[0079] The first heat-conducting section H12 and / or the second heat-conducting section H22 each include a tubular portion G and a flat portion B connected to each other. The two ends of the tubular portion G are respectively connected to the flat portion B. The flat portion B of the first heat-conducting section H12 is used to connect the first heat-absorbing section H11 and the first heat-dissipating section H13. The flat portion B of the second heat-conducting section H22 is used to connect the second heat-absorbing section H21 and the second heat-dissipating section H23.

[0080] It should be noted that, in this embodiment, the upper heat dissipation fin group 111 has a first opening K1, and the first heat dissipation part T1 extends into the first heat dissipation unit 11 from the first opening K1. The middle heat dissipation fin group 112 has a second opening K2, and the second heat dissipation part T2 extends into the first heat dissipation unit 11 from the second opening K2. This utility model does not limit the position and number of the first opening K1 and the second opening K2.

[0081] In this embodiment, the heat dissipation base 13 is provided with a plurality of heat pipe grooves 131. The first heat absorption section H11 and the second heat absorption section H21 are correspondingly disposed in the heat pipe grooves 131. There is a preset height H1 between the top of the heat pipe groove 131 and the top surface of the heat dissipation base 14. The preset height H1 is greater than or equal to 2mm. After the first heat absorption section H11 and the second heat absorption section H21 are disposed in the heat pipe grooves 141, the heat absorption surface E1 of the heat absorption part E is formed by rolling and sizing the first heat absorption section H11 and the second heat absorption section H21. Based on this, the present invention eliminates the copper base located in the heat absorption section in the prior art, allowing the heat source to directly contact the heat pipe; at the same time, it reduces solder paste filling, and the heat pipe directly contacts the heat sink base, reducing contact thermal resistance and improving performance; moreover, by increasing the thickness of the heat sink base in advance and then rolling the tube before surface treatment, the flatness of the heat absorption surface E1 can be kept within 0.1, reducing the gap between the heat pipe and the heat source, allowing the heat pipe to be completely in contact with the heat source, reducing the loss during heat pipe transmission, and improving the overall heat dissipation performance.

[0082] Furthermore, the heat dissipation device 1 also includes a substrate 15, on which the first heat dissipation unit 11 is disposed.

[0083] Furthermore, the second heat dissipation unit 14 includes a first heat dissipation fin group 141 in the shape of a cross and a second heat dissipation fin group 142 in the shape of a U. One end of the first heat dissipation fin group 141 is inserted into the groove K3 of the second heat dissipation fin group 142.

[0084] In one embodiment of this utility model, the first heat pipe and / or the second heat pipe are superconducting heat pipes. Depending on the different capillary requirements of the heat absorption section and the heat dissipation section, the interior of the superconducting heat pipe is filled with copper powder of different particle sizes to optimize the capillary utilization of each section of the heat pipe. That is, the capillary force decreases as the copper powder particles become larger, and the penetration force increases as the copper powder particles become larger.

[0085] In one embodiment of this utility model, the heat pipe and the heat dissipation base are made of any one of the following materials: copper, aluminum, stainless steel, titanium, titanium alloy, and aluminum alloy. The heat pipe and the heat dissipation base may be made of the same or different materials.

[0086] In this embodiment, the heat dissipation device further includes at least one first locking fastener G1 and at least one second locking fastener G2; wherein, the first locking fastener G1 is mounted on the substrate 15 to fix the substrate 15 in the housing of the electronic device, and the second locking fastener G2 is mounted on the heat dissipation base 13 to fix the heat dissipation base 13 in the housing of the electronic device.

[0087] According to the heat dissipation device of the above embodiment, by using a superconducting heat pipe and utilizing the influence of copper powder particle size on capillary force and permeability, different copper powders are used to optimize the heat transfer of the heat pipe, and the heat dissipation performance can be improved by about 1 degree. At the same time, unlike the traditional welding process, this utility model adopts rolling tube technology to reduce contact thermal resistance, so that the superconducting heat pipe can directly contact the heat source, which can effectively reduce the thermal resistance by about 10%, which helps to improve the performance of the heat dissipation module. In addition, by setting a height H1 to strengthen the structural strength of the heat dissipation base, it is ensured that the heat dissipation base will not deform in the rolling tube, thereby preventing product defects.

[0088] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the appended claims.

Claims

1. A heat dissipation device, characterized in that, Include: The first heat dissipation unit includes an upper heat dissipation fin group, a middle heat dissipation fin group and a lower heat dissipation fin group arranged in layers; A heat pipe unit has a heat-absorbing part at one end and a first heat-dissipating part and a second heat-dissipating part stacked on the other end. The heat-absorbing part is used to fit a heat source. The first heat-dissipating part extends into the first heat dissipation unit and is located between the upper heat dissipation fin group and the middle heat dissipation fin group. The second heat dissipating part extends into the first heat dissipation unit and is located between the middle heat dissipation fin group and the lower heat dissipation fin group. A heat dissipation base is mounted on the heat-absorbing part; The second heat dissipation unit is installed on the heat dissipation base; Wherein, after the heat-absorbing part absorbs the heat from the heat source, it dissipates heat through the second heat dissipation unit and the first heat dissipation unit in sequence.

2. The heat dissipation device as described in claim 1, characterized in that, The first heat dissipation part and the second heat dissipation part extend into the first heat dissipation unit from one side of the long side of the first heat dissipation unit and extend to the two short sides of the first heat dissipation unit.

3. The heat dissipation device as described in claim 2, characterized in that, The heat pipe unit includes a first heat pipe group and a second heat pipe group. The first heat pipe group includes at least one first heat pipe, and the second heat pipe group includes at least one second heat pipe. The at least one first heat pipe and the at least one second heat pipe are arranged alternately. One end of the at least one first heat pipe and the at least one second heat pipe constitutes the heat absorption part, the other end of the at least one first heat pipe constitutes the first heat dissipation part, and the other end of the at least one second heat pipe constitutes the second heat dissipation part.

4. The heat dissipation device as described in claim 3, characterized in that, The heat pipe unit further includes a first heat-conducting part and a second heat-conducting part, one end of the first heat-conducting part and the second heat-conducting part being connected to the heat-absorbing part, the other end of the first heat-conducting part being connected to the first heat-dissipating part, and the other end of the second heat-conducting part being connected to the second heat-dissipating part.

5. The heat dissipation device as described in claim 4, characterized in that, Each of the first heat pipes includes: a first heat-absorbing section, a first heat-conducting section, and a first heat-dissipating section; each of the second heat pipes includes: a second heat-absorbing section, a second heat-conducting section, and a second heat-dissipating section. The first heat-absorbing section and the second heat-absorbing section are attached to each other to form the heat-absorbing portion. The first heat-dissipating section and the second heat-dissipating section extend into the first heat-dissipating unit from one side of the long side and extend to one side of the short side of the first heat-dissipating unit to form the first heat-dissipating portion and the second heat-dissipating portion. The two ends of the first heat-conducting section are respectively connected to the first heat-absorbing section and the first heat-dissipating section to form the first heat-conducting portion. The two ends of the second heat-conducting section are respectively connected to the second heat-absorbing section and the second heat-dissipating section to form the second heat-conducting portion.

6. The heat dissipation device as described in claim 5, characterized in that, The first heat-conducting section and / or the second heat-conducting section each include interconnected tubular and flat portions.

7. The heat dissipation device as described in claim 1, characterized in that, The upper heat dissipation fin assembly has a first opening, and the first heat dissipation part extends into the first heat dissipation unit through the first opening. The middle heat dissipation fin assembly has a second opening, and the second heat dissipation part extends into the first heat dissipation unit through the second opening.

8. The heat dissipation device as described in claim 1, characterized in that, It also includes a substrate, on which the first heat dissipation unit is disposed.

9. The heat dissipation device as described in claim 1, characterized in that, The second heat dissipation unit includes a first heat dissipation fin group in the shape of a cross and a second heat dissipation fin group in the shape of a concave. One end of the first heat dissipation fin group is inserted into the groove of the second heat dissipation fin group.

10. The heat dissipation device as described in claim 3, characterized in that, The first heat pipe and / or the second heat pipe are superconducting heat pipes.

11. The heat dissipation device as described in claim 5, characterized in that, The heat dissipation base is provided with multiple heat pipe slots, and the first heat absorption section and the second heat absorption section are correspondingly arranged in the heat pipe slots. There is a preset height between the top of the heat pipe slot and the top surface of the heat dissipation base, and the preset height is greater than or equal to 2mm.

12. The heat dissipation device as described in claim 11, characterized in that, The first heat-absorbing section and the second heat-absorbing section are disposed after the heat pipe groove, and the heat-absorbing surface of the heat-absorbing part is formed by rolling and scalding the first heat-absorbing section and the second heat-absorbing section.

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