Semiconductor laser patch correction tool

Abstract

The utility model relates to a semiconductor laser patch correction tool, comprising a processing table which is provided with a conveying mechanism and a displacement module. A mounting plate is longitudinally arranged at the lower end of one side of the displacement seat, sliding rails are longitudinally arranged on the two sides of the surface of the mounting plate, a movable plate is slidably arranged on the sliding rails, and the upper end of the movable plate is driven to ascend and descend through a driving electric cylinder arranged on the displacement seat; one end of the rotating shaft is fixedly connected with the center of the overturning frame, the other end of the rotating shaft is driven by a driving motor arranged on the other side of the movable plate to rotate, a dispensing machine and a hot air gun are installed at the two ends of the overturning frame respectively, and the driving motor drives the overturning frame to overturn and enables the dispensing machine and the hot air gun to conduct solder paste dispensing and hot air solder paste melting on a chip respectively. And the chip is aligned under the action of the surface tension and wetting force of the solder paste solder, so that the correction efficiency and precision are effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of laser patch technology, and in particular to a semiconductor laser patch correction fixture. Background Technology

[0002] In the laser packaging process, the bottom surface of the recessed cavity on the upper surface of the heat sink base needs to be silver-plated. Then, solder paste is applied to the silver-plated surface, the chip is placed, and it undergoes reflow soldering. During the placement process, uneven force applied to the components by the pick-up nozzle or insufficient solder can prevent effective wetting, leading to insufficient pull force on one side. This can cause chip misalignment or skew, ultimately increasing the defect rate. Traditional correction methods involve operators observing and marking the misaligned chip position using a magnifying glass or microscope, then using a hot air gun to locally heat the solder, melting it, and readjusting the chip position. Tweezers or a vacuum pen are then used to fine-tune the chip to the center of the pad. This correction method suffers from low efficiency, unstable accuracy, susceptibility to secondary damage, and high cost. Utility Model Content

[0003] To address the aforementioned problems, this utility model discloses a semiconductor laser patch correction fixture that enables automatic identification and correction, solving the problems of low efficiency and high cost associated with traditional manual correction of chip misalignment.

[0004] The specific technical solution is as follows:

[0005] A semiconductor laser chip mounting and alignment fixture includes a processing table, on which a conveying mechanism and a displacement module are provided. The conveying mechanism is used to transport the laser housing after reflow soldering. A displacement seat is movably mounted on the displacement module. A mounting plate is longitudinally mounted on the lower end of one side of the displacement seat. Slide rails are longitudinally provided on both sides of the surface of the mounting plate. A movable plate is slidably mounted on the slide rails via a slider. The upper end of the movable plate is driven to lift and lower by a drive cylinder mounted on the displacement seat. A flipping frame is rotatably mounted on one side of the movable plate via a rotating seat and a rotating shaft. One end of the rotating shaft is fixedly connected to the center of the flipping frame, and the other end of the rotating shaft is driven to rotate by a drive motor mounted on the other side of the movable plate. A dispensing machine and a hot air gun are respectively mounted on both ends of the flipping frame. The drive motor drives the flipping frame to flip, so that the dispensing machine and the hot air gun respectively apply solder paste to the chip and melt the solder paste with hot air, so that the chip returns to the correct position under the action of the surface tension and wetting force of the solder paste.

[0006] Furthermore, an industrial camera is mounted on the bottom of the movable plate via a bracket. The lens of the industrial camera is aimed at the location of the components inside the laser housing and takes pictures for identification.

[0007] Furthermore, the nozzle direction of the dispensing machine is on the same straight line as the air outlet direction of the hot air gun.

[0008] Furthermore, the mounting plate has a recess at its lower end for accommodating the drive motor.

[0009] Furthermore, the displacement module includes two X-axis linear modules and one Y-axis linear module. The two X-axis linear modules are horizontally arranged on the worktable via a support frame, and one Y-axis linear module is movably arranged on the two X-axis linear modules. The displacement seat is slidably arranged on the Y-axis linear module.

[0010] Furthermore, the conveying mechanism includes a conveyor wheel, a conveyor belt mounted on the conveyor wheel, and a conveyor motor that drives the conveyor wheel to rotate. A shelf for placing the laser housing is mounted on the conveyor belt.

[0011] The beneficial effects of this utility model are reflected in:

[0012] This invention uses an industrial camera to photograph and identify the position of components, and a control system to determine whether there is a deviation. Then, a displacement module drives the correction fixture to move to the position of the deviated component. A hot air gun is used to melt the solder or to reapply solder paste to components with insufficient solder. This allows the component to return to the correct position under the action of the surface tension and wetting force of the solder paste, effectively improving the correction efficiency and accuracy. Attached Figure Description

[0013] Figure 1 This is a side sectional view of the present invention.

[0014] Figure 2 This is a front sectional view of the present invention.

[0015] Figure 3 This is a schematic diagram of the installation structure of the drive motor and the movable plate in this utility model.

[0016] Explanation of reference numerals in the attached drawings: 1. Processing table; 2. X-axis linear module; 3. Y-axis linear module; 4. Displacement seat; 41. Mounting plate; 42. Notch; 43. Slide rail; 5. Movable plate; 6. Drive cylinder; 7. Tilting frame; 71. Rotating shaft; 8. Drive motor; 9. Dispensing machine; 10. Hot air gun; 11. Industrial camera; 12. Conveying mechanism; 121. Conveying wheel; 122. Conveying motor; 123. Conveying belt. Detailed Implementation

[0017] To make the technical solution of this utility model clearer and more explicit, the utility model will be further described below with reference to the accompanying drawings. Any solution derived by equivalent substitution and conventional reasoning of the technical features of this utility model falls within the protection scope of this utility model. The fixed connections and fixed settings mentioned in this utility model are all common connection methods in the mechanical field, including welding, bolt and nut connections, and screw connections.

[0018] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0019] Please see the appendix Figure 1-3 This embodiment provides a semiconductor laser chip mounting and straightening fixture for straightening components inside a laser housing after chip mounting and curing. The straightening fixture includes a processing table 1, on which a conveying mechanism 12 and a displacement module are mounted. The conveying mechanism 12 is used to transport the laser housing after reflow soldering. A displacement seat 4 is movably mounted on the displacement module, allowing the displacement seat 4 to move in two dimensions. A mounting plate 41 is longitudinally mounted on the lower end of one side of the displacement seat 4. Slide rails 43 are longitudinally mounted on both sides of the surface of the mounting plate 41. A movable plate 5 is slidably mounted on the slide rails 43 via a slider. The upper end of the movable plate 5 is bent and driven to rise and fall by a drive cylinder 6 mounted on the displacement seat 4. A flipping frame 7 is rotatably mounted on one side of the movable plate 5 via a rotating seat and a rotating shaft 71. The rotating shaft 71 horizontally passes through the movable plate 5, and one end of the rotating shaft 71 is connected to the flipping frame. The rotating frame 7 is fixedly connected to the center. The other end of the rotating shaft 71 is driven by the drive motor 8 located on the other side of the movable plate 5 to rotate 180 degrees. The two ends of the rotating frame 7 are respectively equipped with a dispensing machine 9 and a hot air gun 10. The nozzle direction of the dispensing machine 9 and the air outlet direction of the hot air gun 10 are on the same straight line. The drive motor 8 drives the rotating frame 7 to rotate, so that the dispensing machine 9 and the hot air gun 10 respectively apply solder paste to the chip and melt the solder paste with hot air, so that the chip returns to the correct position under the action of the surface tension and wetting force of the solder paste.

[0020] An industrial camera 11 is mounted on the bottom of the movable plate 5 via a bracket. The industrial camera 11 is electrically connected to the control system via a data cable. The lens of the industrial camera 11 is aimed at the position of the components inside the laser housing and takes pictures for identification.

[0021] A recess 42 is provided at the lower end of the mounting plate 41. The recess 42 is used to accommodate the drive motor 8 on the movable plate 5 so that it can be raised and lowered.

[0022] In this embodiment, the displacement module includes two X-axis linear modules 2 and one Y-axis linear module 3. The two X-axis linear modules 2 are horizontally arranged on the worktable by a support frame. One Y-axis linear module 3 is movably arranged on the two X-axis linear modules 2. A displacement seat 4 is slidably arranged on the Y-axis linear module 3. The displacement module is electrically connected to the control system, so that the control system can control the displacement module to drive the displacement seat 4 to perform planar displacement.

[0023] In this embodiment, the conveying mechanism 12 includes a conveying wheel 121, a conveyor belt 123 disposed on the conveying wheel 121, and a conveying motor 122 for driving the conveying wheel 121 to rotate. A shelf for placing the laser housing is disposed on the conveyor belt 123.

[0024] The working principle of this embodiment is as follows: When the conveying mechanism 12 moves the laser housing to the designated detection station, the industrial camera 11 then aligns with the position of the components inside the laser housing and takes a picture for identification. The image signal is then uploaded to the control system to determine if there is any component misalignment. When the control system identifies the position of the misaligned component, the displacement module moves the hot air gun 10 above the misaligned component and heats it with the hot air gun 10. Under the action of the surface tension and wetting force of the solder paste, the component is straightened. Then the displacement module is reset, and the industrial camera 11 takes another picture for identification, completing the correction. If the misaligned chip is still misaligned, it indicates that the component has insufficient solder. The drive motor 8 drives the flipping frame 7 to rotate 180 degrees, and the dispensing machine 9 applies solder paste to the position of the misaligned component. Then the flipping frame 7 is reset again, and the hot air gun 10 heats it again to straighten it.

[0025] The above description is merely a preferred embodiment of this utility model, but the scope of protection of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A semiconductor laser patch straightening fixture, comprising a processing table (1), wherein a conveying mechanism (12) and a displacement module are provided on the processing table, the conveying mechanism (12) being used to convey the laser housing after reflow soldering; characterized in that, The displacement module is movably mounted with a displacement seat (4). A mounting plate (41) is longitudinally mounted on the lower end of one side of the displacement seat (4). Slide rails (43) are longitudinally mounted on both sides of the surface of the mounting plate (41). A movable plate (5) is slidably mounted on the slide rails (43) via a slider. The upper end of the movable plate (5) is driven to lift by a drive cylinder (6) mounted on the displacement seat (4). A flipping frame (7) is mounted on one side of the movable plate (5) via a rotating seat and a rotating shaft (71). One end of the rotating shaft (71) is fixedly connected to the center of the flipping frame (7). The other end of the rotating shaft (71) is driven to rotate by a drive motor (8) mounted on the other side of the movable plate (5). A dispensing machine (9) and a hot air gun (10) are respectively mounted on both ends of the flipping frame (7). The drive motor (8) drives the flipping frame (7) to flip, so that the dispensing machine and the hot air gun respectively apply solder paste to the chip and melt the solder paste with hot air, so that the chip returns to its original position under the action of the surface tension and wetting force of the solder paste.

2. The semiconductor laser patch correction fixture as described in claim 1, characterized in that, An industrial camera (11) is mounted on the bottom of the movable plate (5) via a bracket. The lens of the industrial camera (11) is aimed at the position of the components inside the laser housing and takes pictures for identification.

3. The semiconductor laser patch correction fixture as described in claim 1, characterized in that, The nozzle direction of the dispensing machine (9) and the air outlet direction of the hot air gun (10) are on the same straight line.

4. The semiconductor laser patch correction fixture as described in claim 1, characterized in that, The mounting plate (41) has a notch (42) at its lower end for accommodating the drive motor (8).

5. The semiconductor laser patch correction fixture as described in claim 1, characterized in that, The displacement module includes two X-axis linear modules (2) and one Y-axis linear module (3). The two X-axis linear modules (2) are horizontally mounted on the workbench via a support frame. One Y-axis linear module (3) is movably mounted on the two X-axis linear modules (2). The displacement seat (4) is slidably mounted on the Y-axis linear module (3).

6. The semiconductor laser patch correction fixture as described in claim 1, characterized in that, The conveying mechanism (12) includes a conveying wheel (121), a conveyor belt (123) disposed on the conveying wheel (121), and a conveying motor (122) for driving the conveying wheel (121) to rotate. A shelf for placing the laser housing is disposed on the conveyor belt (123).

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