Hollowed-out circuit board convenient for heat dissipation

Abstract

The utility model discloses a hollowed-out circuit board convenient for heat dissipation, and relates to the technical field of circuit boards. The hollow groove is formed in the outer wall of one side of the plate body; the cooling assembly is used for cooling the interior of the hollow groove; the positioning assembly ensures stable connection between the cooling assembly and the plate body; according to the utility model, through the hollowed-out design, the third layer and the fourth layer in the board body can be hollowed out, the wiring and punching design of the first layer and the second layer can be reserved at the same time to maintain connectivity and functionality, and the hollowed-out grooves can be used for placing electronic components, so that the overall strength of the cooling assembly and the board body is improved, and the service life of the board body is prolonged. The device placing area for product design is saved, and the device is especially suitable for micro-miniature electronic products.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field especially relates to a hollow formula circuit board convenient for heat dissipation. BACKGROUND

[0002] With the rapid development of electronic technology, electronic products are constantly moving towards high performance, high integration and miniaturization. As the core component of electronic products, circuit board bears the important responsibility of electrical connection and electronic component support, and its performance plays a decisive role in the overall performance of electronic products.

[0003] In the existing circuit board technology, the application of multilayer printed circuit board (PCB) is extremely wide. Multilayer PCB can realize more circuit connection and functional integration in limited space, however, this also leads to a series of problems. Since electronic components will generate heat during work, and the structure of multilayer PCB is compact, heat is difficult to dissipate effectively, which leads to the continuous rise of the temperature of the circuit board. High temperature will seriously affect the performance and life of electronic components, such as reducing the stability of components, accelerating the aging of components, and even may cause component failure, thereby affecting the normal operation of the entire electronic product.

[0004] In addition, the existing circuit board also has deficiencies in space utilization. With the continuous increase of electronic product functions, the number of electronic components that need to be installed on the circuit board also increases, which makes the wiring of the circuit board more complex, and the spacing between components becomes smaller, further exacerbating the heat dissipation difficulty. Therefore, a hollow circuit board convenient for heat dissipation is needed to solve the above problems. UTILITY MODEL CONTENTS

[0005] The utility model aims at solving the shortcomings in the prior art, and provides a hollow circuit board convenient for heat dissipation. The advantages are as follows: through the hollow design in the circuit board, the third and fourth layers in the board body can be hollowed out, while the wiring and punching design of the first and second layers are retained to maintain connectivity and functionality. The hollow groove can place electronic components, saving the component placement area of product design, especially suitable for small-sized electronic products.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0007] A hollow circuit board convenient for heat dissipation, comprising:

[0008] A board body;

[0009] A hollow groove is opened on one side of the outer wall of the board body;

[0010] A cooling assembly for heat dissipation inside the hollow groove;

[0011] a positioning assembly for ensuring stable connection of the cooling assembly and the plate body; and

[0012] a reinforcing assembly for improving the overall strength of the cooling assembly and the plate body, the reinforcing assembly being arranged on both sides of the cooling assembly.

[0013] Through the above technical scheme: the third and fourth layers of the circuit board are hollowed out, while the first and second layers are retained for wiring and punching design to maintain connectivity and functionality, and the hollowed-out groove can accommodate electronic components, thereby saving the component placement area of the product design, especially for miniaturized electronic products.

[0014] The utility model further sets up, cooling assembly includes the second heat conduction board of setting in the hollowed-out groove bottom inner wall, the top outer wall of second heat conduction board is fixedly connected with the second radiating fin of equidistance distribution, the top outer wall of second radiating fin is fixedly connected with the first heat conduction board, both sides of first heat conduction board and second heat conduction board are all abutted on both sides inner wall of hollowed-out groove.

[0015] Through the above technical scheme: when the electronic components in the hollowed-out groove generate heat during work, the first heat conduction plate absorbs heat and transfers it to the second radiating fin, increasing the area of heat exchange with air, thereby improving the heat dissipation effect of the electronic components.

[0016] The utility model further sets up, two second radiating fins and the cross section of first heat conduction board and second heat conduction board are isosceles trapezoidal.

[0017] Through the above technical scheme: compared with the ordinary shape, the isosceles trapezoidal structure composed of two radiating fins and the first and second heat conduction plates not only has good supporting effect, but also can increase the contact area of the radiating fins and air in the same space, thereby improving the heat dissipation efficiency of the entire cooling assembly.

[0018] The utility model further sets up, the top of first heat conduction plate is provided with heat conduction sheet, and the heat conduction sheet is equidistantly distributed on the top of the first heat conduction plate.

[0019] Through the above technical scheme: the heat conduction capacity can be further enhanced, and the heat generated by the electronic components can be better transferred to the first heat conduction plate.

[0020] The utility model further sets up, the bottom inner wall of hollowed-out groove is equipped with assembly groove, the bottom outer wall of second heat conduction plate is fixedly connected with assembly rod, and the assembly rod and assembly groove are mutually clamped.

[0021] Through the above technical scheme: by inserting the assembling rod into the assembling groove, the second heat-conducting plate can be ensured to be in close contact with the bottom of the hollowed-out groove, the thermal resistance is reduced, and thus the speed of heat transfer from the hollowed-out groove to the second heat-conducting plate is accelerated.

[0022] The utility model further sets up, the reinforcing component includes the first radiating fin and reinforcing rod of fixed connection between the first heat-conducting plate and the second heat-conducting plate, the both ends of the first radiating fin, the reinforcing rod are fixedly connected with the first heat-conducting plate, the second heat-conducting plate respectively, the first radiating fin and the reinforcing rod are staggered distribution between the first heat-conducting plate and the second heat-conducting plate.

[0023] Through the above technical scheme: the overall strength of the cooling assembly is enhanced by the reinforcing component, the risk of bending damage under external force is reduced, and the stable operation of the circuit board is ensured.

[0024] The utility model further sets up, the cross section of first radiating fin is wavy, the cross section of reinforcing rod is cross-shaped.

[0025] Through the above technical scheme: the first radiating fin of wavy shape and the reinforcing rod of cross shape, while enhancing the strength, expand the area of heat exchange with air, play good auxiliary radiating effect.

[0026] The utility model further sets up, the positioning assembly includes the positioning hole of setting up in the assembling groove and the inside of assembling rod, and the inside of positioning hole is provided with fixed screw rod, and the assembling rod is fastened and is connected in the inside of assembling groove through fixed screw rod.

[0027] Through the above technical scheme: the assembling rod is fastened and connected in the inside of assembling groove through fixed screw rod, and this positioning mode ensures the stability of the connection of the assembling rod and the assembling groove.

[0028] The utility model has the advantages of:

[0029] In the utility model, through the hollow design in the circuit board, the third and fourth layers in the plate body can be hollowed out, while the wiring and punching design of the first and second layers are retained to maintain connectivity and functionality, and the hollow groove can place electronic components, saving the device placement area of product design, especially suitable for small-sized electronic products.

[0030] In the utility model, the cooling assembly can effectively cool the electronic components in the hollow groove, the first heat-conducting plate absorbs heat and transfers it to the second radiating fin, increases the area of heat exchange with air, improves the heat dissipation effect of electronic components, and the heat-conducting sheet on the top of the first heat-conducting plate can make the heat-conducting silica gel flow in fully, ensuring the stability after solidification and further enhancing the heat-conducting capacity.

[0031] The utility model discloses, through the first radiating fin and reinforcing rod in the reinforcing component, it is staggered distribution between the first, second heat conduction plate to enhance the overall strength of the cooling assembly, reduce the risk of bending damage under the action of external force, guarantee the stability of circuit board, and the first radiating fin of wave shape and cross -shaped reinforcing rod, while enhancing the strength, still expand the area of air heat exchange, play good auxiliary radiating effect. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 The utility model discloses a whole structure schematic diagram of hollow formula circuit board convenient to radiate heat is provided.

[0033] Figure 2 The utility model discloses a hollow formula circuit board convenient to radiate heat Figure 1 The utility model discloses a whole structure schematic diagram of hollow formula circuit board convenient to radiate heat is provided.

[0034] Figure 3 The utility model discloses a whole structure schematic diagram of hollow formula circuit board convenient to radiate heat is provided.

[0035] Figure 4 The utility model discloses a whole structure schematic diagram of hollow formula circuit board convenient to radiate heat is provided. Figure 3 The utility model discloses a whole structure schematic diagram of hollow formula circuit board convenient to radiate heat is provided.

[0036] In the drawing: 1, board body;2, hollow groove;3, first heat conduction plate;4, heat conduction sheet;5, first radiating fin;6, second radiating fin;7, second heat conduction plate;8, assembly groove;9, fixed screw;10, assembly rod;11, reinforcing rod. DETAILED DESCRIPTION

[0037] The technical scheme of the patent will be explained in further detail in combination with specific implementation manners.

[0038] Referring to Figures 1-4 A hollow formula circuit board convenient to radiate heat, comprising:

[0039] Board body 1;

[0040] Hollow groove 2, hollow groove 2 is set up on the one side outer wall of board body 1, need to explain, this board body 1 is four layer PCB board, wherein hollow groove 2 is hollow to the third layer and fourth layer in board body 1, like this can make the first layer and second layer reserve the connectivity and function of wiring and punch design connector device, and hollow groove 2 can also put some devices, like this can save the device placement area of entire product design, has greater advantage to some microelectronic products;

[0041] Cooling assembly for radiating heat inside hollow groove 2;

[0042] The positioning assembly is used for ensuring stable connection of the cooling assembly and the plate body 1.

[0043] The reinforcing assembly is used for improving the overall strength of the cooling assembly and the plate body 1.

[0044] In order to improve the heat dissipation effect on the electronic components, referring to Figure 3 , the cooling assembly comprises a second heat-conducting plate 7 arranged on the inner wall of the bottom of the hollowed-out groove 2, the top outer wall of the second heat-conducting plate 7 is fixedly connected with second heat dissipation fins 6 distributed at equal distances, the top outer wall of the second heat dissipation fins 6 is fixedly connected with a first heat-conducting plate 3, and the two sides of the first heat-conducting plate 3 and the second heat-conducting plate 7 are tightly abutted against the two side inner walls of the hollowed-out groove 2. When the electronic components in the hollowed-out groove 2 generate heat during work, the first heat-conducting plate 3 absorbs the heat and transmits it to the second heat dissipation fins 6, thereby increasing the heat exchange area with air and improving the heat dissipation effect on the electronic components.

[0045] In order to ensure the structural strength of the entire cooling assembly, referring to Figures 1-3 , the two second heat dissipation fins 6 and the first heat-conducting plate 3 and the second heat-conducting plate 7 have an isosceles trapezoidal cross section. Compared with the ordinary shape, the isosceles trapezoidal structure formed by the two second heat dissipation fins 6 and the first heat-conducting plate 3 and the second heat-conducting plate 7 not only has a good supporting effect, but also can increase the contact area of the heat dissipation fins with air in the same space, thereby improving the heat dissipation efficiency of the entire cooling assembly.

[0046] In order to ensure the fixing effect on the electronic components, referring to Figures 2-3 , the top of the first heat-conducting plate 3 is provided with heat-conducting sheets 4, the heat-conducting sheets 4 are distributed at equal distances on the top of the first heat-conducting plate 3, and the electronic components are fixed by using heat-conducting silica gel when being installed on the top of the first heat-conducting plate 3. The heat-conducting sheets 4 can make the heat-conducting silica gel fully flow in, ensure the stability after solidification, further enhance the heat-conducting capacity, and better transmit the heat generated by the electronic components to the first heat-conducting plate 3.

[0047] In order to ensure that the cooling assembly is tightly matched with the bottom of the hollowed-out groove 2, referring to Figures 3-4 , the bottom inner wall of the hollowed-out groove 2 is provided with an assembly groove 8, the bottom outer wall of the second heat-conducting plate 7 is fixedly connected with an assembly rod 10, and the assembly rod 10 and the assembly groove 8 are mutually clamped. When the cooling assembly is installed, the assembly rod 10 is inserted into the assembly groove 8, so that the second heat-conducting plate 7 can be tightly contacted with the bottom of the hollowed-out groove 2, the thermal resistance is reduced, and the speed of heat transmission from the hollowed-out groove 2 to the second heat-conducting plate 7 is accelerated.

[0048] In order to improve the structural strength of the entire cooling assembly, referring to Figure 3The reinforcing assembly comprises the first heat dissipation fins 5 and the reinforcing rods 11 fixedly connected between the first heat conduction plate 3 and the second heat conduction plate 7, the two ends of the first heat dissipation fins 5 and the reinforcing rods 11 are fixedly connected with the first heat conduction plate 3 and the second heat conduction plate 7 respectively, the first heat dissipation fins 5 and the reinforcing rods 11 are staggered and distributed at equal distances between the first heat conduction plate 3 and the second heat conduction plate 7, the first heat dissipation fins 5 and the reinforcing rods 11 are fixedly connected between the first heat conduction plate 3 and the second heat conduction plate 7, and the two ends thereof are fixedly connected with the first heat conduction plate 3 and the second heat conduction plate 7 respectively, and they are staggered and distributed at equal distances between the first heat conduction plate 3 and the second heat conduction plate 7, the structure enhances the overall strength of the cooling assembly, reduces the risk of bending damage under external force, and guarantees the stable operation of the circuit board.

[0049] In order to further improve the heat dissipation performance of the entire circuit board, referring to Figure 3 , the cross section of the first heat dissipation fin 5 is in a wave shape, and the cross section of the reinforcing rod 11 is in a cross shape, the wave-shaped first heat dissipation fin 5 and the cross-shaped reinforcing rod 11 not only enhance the strength, but also expand the area of heat exchange with air, and have good auxiliary heat dissipation effect.

[0050] In order to ensure that the cooling assembly and the plate body 1 are stably connected, so that the cooling assembly can normally play a heat dissipation role, referring to Figures 3-4 , the positioning assembly comprises a positioning hole opened in the inside of the assembly groove 8 and the assembly rod 10, the inside of the positioning hole is provided with a fixed screw rod 9, and the assembly rod 10 is tightly connected in the inside of the assembly groove 8 through the fixed screw rod 9, and the positioning mode guarantees the stability of the connection between the assembly rod 10 and the assembly groove 8.

[0051] Working principle: since the total number of layers of the plate body 1 is four layers of PCB boards, the hollowed-out grooves 2 correspond to the third layer and the fourth layer in the plate body 1, so that the first layer and the second layer can retain the connectivity and function of the wiring and the punched connector devices, and some devices can also be placed in the hollowed-out grooves 2, so that the device placement area of the entire product design can be saved;

[0052] Meanwhile, through the cooling assembly arranged in the hollowed-out groove 2, the electronic components installed in the hollowed-out groove 2 can be effectively cooled, wherein the heat generated by the electronic components during operation can be absorbed by the first heat conduction plate 3, and the absorbed heat is transmitted to the second heat dissipation fins 6, the second heat dissipation fins 6 can increase the area of heat exchange with air, and further improve the cooling effect of the electronic components, and the heat conduction fins 4 arranged on the top of the first heat conduction plate 3 can make the heat-conducting silica gel (which can fix the electronic components on the top of the first heat conduction plate 3) fully flow between the two heat conduction fins 4, and guarantee the stability of the cured heat-conducting silica gel and the heat conduction fins 4;

[0053] And in the whole cooling assembly installation process, through the stable cooperation between the assembling rod 10 and the assembling groove 8, the second heat-conducting plate 7 can be ensured to be in close contact with the bottom of the hollowed-out groove 2, thereby reducing the thermal resistance and accelerating the heat conduction. The first heat-dissipation fins 5 and the reinforcing rods 11 arranged on both sides of the first heat-conducting plate 3 and the second heat-conducting plate 7 can not only effectively improve the strength of the whole cooling assembly, avoid the bending damage and other conditions when the cooling assembly is subjected to external force, but also further expand the heat exchange area between the whole cooling assembly and the air, and further improve the heat dissipation effect of the cooling assembly on the whole plate body 1.

[0054] The above is only the preferred specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A hollowed-out circuit board for easy heat dissipation, characterized in that, include: Plate(1); A hollowed-out groove (2) is formed on one side of the outer wall of the plate (1); Cooling components for dissipating heat from the interior of the hollowed-out groove (2); A positioning component used to ensure a stable connection between the cooling component and the plate (1); as well as A reinforcing component for improving the overall strength of the cooling component and the plate (1), the reinforcing component being disposed on both sides of the cooling component.

2. The heat-dissipating hollow circuit board according to claim 1, characterized in that, The cooling component includes a second heat-conducting plate (7) disposed on the inner wall of the bottom of the hollowed-out groove (2). The top outer wall of the second heat-conducting plate (7) is fixedly connected with second heat dissipation fins (6) distributed at equal intervals. The top outer wall of the second heat dissipation fins (6) is fixedly connected with a first heat-conducting plate (3). Both sides of the first heat-conducting plate (3) and the second heat-conducting plate (7) are pressed against the inner walls of both sides of the hollowed-out groove (2).

3. A hollowed-out circuit board for easy heat dissipation according to claim 2, characterized in that, The two second heat dissipation fins (6) and the cross-sections of the first heat-conducting plate (3) and the second heat-conducting plate (7) are isosceles trapezoids.

4. A hollowed-out circuit board for easy heat dissipation according to claim 3, characterized in that, A heat-conducting plate (4) is provided on the top of the first heat-conducting plate (3), and the heat-conducting plate (4) is distributed at equal distances on the top of the first heat-conducting plate (3).

5. A heat-dissipating hollow circuit board according to claim 4, characterized in that, The bottom inner wall of the hollowed-out groove (2) is provided with an assembly groove (8), and the bottom outer wall of the second heat-conducting plate (7) is fixedly connected with an assembly rod (10), and the assembly rod (10) is engaged with the assembly groove (8).

6. A hollowed-out circuit board for easy heat dissipation according to claim 5, characterized in that, The reinforcing component includes a first heat dissipation fin (5) and a reinforcing rod (11) fixedly connected between the first heat-conducting plate (3) and the second heat-conducting plate (7). The two ends of the first heat dissipation fin (5) and the reinforcing rod (11) are fixedly connected to the first heat-conducting plate (3) and the second heat-conducting plate (7) respectively. The first heat dissipation fin (5) and the reinforcing rod (11) are distributed in an equidistant staggered manner between the first heat-conducting plate (3) and the second heat-conducting plate (7).

7. A heat-dissipating hollow circuit board according to claim 6, characterized in that, The first heat dissipation fin (5) has a wavy cross-section, and the reinforcing rod (11) has a cross-shaped cross-section.

8. A hollowed-out circuit board for easy heat dissipation according to claim 7, characterized in that, The positioning component includes positioning holes formed inside the assembly slot (8) and the assembly rod (10), and a fixing screw (9) is provided inside the positioning hole. The assembly rod (10) is fastened to the inside of the assembly slot (8) by the fixing screw (9).

Images