Optical fiber scanning equipment master control box heat dissipation structure and optical fiber scanning equipment light source host

Abstract

The utility model discloses an optical fiber scanning equipment master control box heat dissipation structure, which comprises a shell with two open ends, a first heat dissipation device, a circuit board group and a second heat dissipation device are sequentially arranged in the shell with the two open ends of the shell as the front end and the rear end, and a plurality of electronic elements capable of generating heat in the working process are distributed on the upper surface of the circuit board group. A heat conducting piece is arranged between the upper surface of the electronic element and the lower surface of the first radiator; a plurality of electronic elements which can generate heat in the working process are distributed on the lower surface of the circuit board set, heat conduction pieces are arranged between the lower surfaces of the electronic elements and the upper surface of the second radiator, and a cooling fan is arranged at an opening in the front end of the shell. According to the utility model, heat dissipation of a plurality of circuit boards is completed by using a group of heat dissipation fans. On the premise that the heat dissipation effect is guaranteed, the multiple circuit boards are installed in the same box body, the structure is compact, the occupied size and circuit line consumption are reduced, circuits are clear, follow-up maintenance and management are very convenient, and protectiveness is high.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of optical fiber scanning display equipment, in particular to a light source main machine of an optical fiber scanning equipment master control box heat dissipation structure and an optical fiber scanning equipment. BACKGROUND

[0002] The imaging principle of the scanning projection technology is that the light corresponding to each pixel point of the to-be-displayed image is modulated by a light source, and then the scanning output of each pixel point corresponding light is realized through the movement of a scanner driving a scanning optical fiber or a micro-electro-mechanical system scanning mirror, so that each pixel point corresponding light of the to-be-displayed image is projected onto a projection screen one by one to form a projection image plane.

[0003] It should be noted that as one of the new scanning projection technologies, the optical fiber scanning technology is usually an optical fiber scanning system composed of an optical fiber scanner and a light source, wherein the light source input to the optical fiber scanner is usually after the beam combination of multiple color light emitting units (such as red, green and blue light emitting units).

[0004] The master control box is a box body for accommodating control elements, and the control elements mainly include a circuit board, a processor, an image storage unit, a light source control module, a scanning driving module, a readable storage medium and a first-in-first-out memory (FIFO) integrated on the circuit board, which are used to send an electrical control signal (i.e. a driving signal) to the scanning driving module to drive the optical fiber scanner, control the optical fiber cantilever in the optical fiber scanner to perform scanning movement in a predetermined two-dimensional scanning track (such as: spiral scanning, grid format scanning, Lissajous scanning); and send an electrical control signal to the light source control module to control the light source unit to output light corresponding to each pixel point in the current display image in sequence according to the image data in the FIFO, so that the light output by the light source completely matches the optical fiber scanning track to form an image on the projection plane.

[0005] The light source unit includes a second housing, a plurality of semiconductor lasers are arranged in the second housing, and the light beams emitted by the semiconductor lasers are coupled into a first optical fiber through a coupling lens. The light emitting end of the first optical fiber is connected to the light input end of a second optical fiber of the optical fiber scanner.

[0006] The light source control module outputs a light source modulation signal according to the received control signal to modulate each semiconductor laser in the light source unit, and the light generated by each semiconductor laser in the light source unit generates light corresponding to each pixel point in the image one by one after beam combination through the coupling lens.

[0007] Good heat dissipation performance of the master control box is the basis for ensuring stable operation of the optical fiber scanner and the light source. CONTENT OF THE UTILITY MODEL

[0008] The embodiment of the present application provides a light fiber scanning equipment master control box heat dissipation structure to at least ensure the heat dissipation effect.

[0009] In order to achieve the above-mentioned application purposes, the application provides a heat dissipation structure of a fiber scanning device master control box, which comprises a shell with two open ends, the two open ends of the shell are front and rear ends, a first heat sink, a circuit board group and a second heat sink are sequentially arranged in the shell from top to bottom,

[0010] A plurality of electronic components generating heat during operation are arranged on the upper surface of the circuit board group, and a heat conduction member for conducting the heat generated by the electronic components to the first heat sink is arranged between the upper surface of the electronic components and the lower surface of the first heat sink.

[0011] A plurality of electronic components generating heat during operation are arranged on the lower surface of the circuit board group, and a heat conduction member for conducting the heat generated by the electronic components to the second heat sink is arranged between the lower surface of the electronic components and the upper surface of the second heat sink.

[0012] A heat dissipation fan is arranged at the front end opening of the shell.

[0013] The first heat sink comprises a base plate and heat dissipation fins arranged on the top surface of the base plate, the heat dissipation fins are arranged in a vertical direction, and adjacent heat dissipation fins form an airflow channel extending in the front-rear direction. Preferably, the top opening of the airflow channel is covered by the top plate of the shell.

[0014] The second heat sink comprises a base plate and heat dissipation fins arranged on the bottom surface of the base plate, the heat dissipation fins are arranged in a vertical direction, and adjacent heat dissipation fins form an airflow channel extending in the front-rear direction. Preferably, the top opening of the airflow channel is covered by the bottom plate of the shell.

[0015] The circuit board group comprises at least two circuit boards stacked in a vertical direction.

[0016] Preferably, any two adjacent and heat-generating electronic components are arranged on the circuit board on the upper surface of the circuit board, the area of the circuit board on the upper layer is smaller than the area of the circuit board on the lower layer, the heat-generating electronic components on the circuit board on the lower layer are arranged at positions not covered by the circuit board on the upper layer, and the heat-generating electronic components on the circuit board on the upper layer are in contact with the first heat sink through the heat conduction member for heat conduction.

[0017] Preferably, any two adjacent and heat-generating electronic components are arranged on the circuit board on the lower surface of the circuit board, the area of the circuit board on the lower layer is smaller than the area of the circuit board on the upper layer, the heat-generating electronic components on the circuit board on the upper layer are arranged at positions not covered by the circuit board on the lower layer, and the heat-generating electronic components on the circuit board on the lower layer are in contact with the second heat sink through the heat conduction member for heat conduction.

[0018] Preferably, the front end of the shell is provided with a heat dissipation fan shell, the front side of the heat dissipation fan shell is provided with a mounting cavity for mounting a heat dissipation fan, the heat dissipation fan is mounted in the mounting cavity, and the heat dissipation fan shell is provided with an upper flow regulating member and a lower flow regulating member; the upper flow regulating member is provided with a flow channel communicated with the first radiator and a flow guide channel communicated with the mounting cavity; and the lower flow regulating member is provided with a flow channel communicated with the second radiator and a flow guide channel communicated with the mounting cavity.

[0019] Preferably, the rear end of the first radiator and the second radiator is provided with a sealing plate sealing the gap between the first radiator and the second radiator.

[0020] The utility model discloses a second aspect provides a kind of optical fiber scanning equipment light source host computer, including the optical fiber scanning equipment master control box heat dissipation structure and at least one light source body, light source body is fixedly installed in the upper portion of optical fiber scanning equipment master control box heat dissipation structure.

[0021] The top surface of the master control box heat dissipation structure is below the first radiator, and the flowing airflow cools the first radiator. Therefore, installing the light source body on the upper portion of the optical fiber scanning equipment master control box heat dissipation structure has little effect on the heat dissipation performance of the circuit board group in the optical fiber scanning equipment master control box heat dissipation structure. At the same time, the light source of the optical fiber scanning equipment and the master control box become a single structural component, and the optical fiber scanner becomes the only unfixed separate component, which also conforms to the distribution logic of the optical fiber scanning equipment and improves the integration of the equipment.

[0022] The one or more technical solutions in the present application have at least the following technical effects or advantages:

[0023] The utility model discloses a set of heat dissipation fans to complete the heat dissipation of multiple circuit boards. Under the premise of ensuring the heat dissipation effect, multiple circuit boards are installed in the same box, which is compact in structure, reduces the occupied volume and circuit line consumption, and is clear in line, easy to maintain and manage, and strong in protection. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a structural schematic view of the utility model;

[0025] Figure 2 It is a structural schematic view of the shell inside the utility model;

[0026] Figure 3 It is a structural schematic view of the shell inside the utility model;

[0027] Figure 4 It is a structural schematic view of the circuit board group and the second radiator heat conduction structure. DETAILED DESCRIPTION

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0029] like Figure 1 , Figure 2 As shown, this application provides a heat dissipation structure for the main control box of a fiber optic scanning device, including a housing 100 with openings at both ends. The two ends of the openings in the housing 100 are the front and rear ends. Inside the housing 100, a first heat sink 200, a circuit board assembly 300, and a second heat sink 400 are sequentially arranged from top to bottom.

[0030] Combination Figure 3 As shown, the upper surface of the circuit board assembly 300 is provided with a plurality of electronic components that generate heat during operation. A heat-conducting component 501 is provided between the upper surface of the electronic components and the lower surface of the first heat sink 200 to conduct the heat generated by the electronic components to the first heat sink 200.

[0031] Similarly, combined Figure 4 As shown, the lower surface of the circuit board assembly 300 is provided with multiple electronic components that generate heat during operation. A heat-conducting component 502 is provided between the lower surface of the electronic components and the upper surface of the second heat sink 400 to conduct the heat generated by the electronic components to the second heat sink 400.

[0032] A cooling fan 600 is provided at the front opening of the housing 100.

[0033] like Figure 2 As shown, the first heat sink 200 includes a substrate 201 and heat dissipation fins 202 disposed on the top surface of the substrate 201. The heat dissipation fins 202 are disposed in a generally vertical direction, and adjacent heat dissipation fins 202 form an airflow channel extending in a front-rear direction. Preferably, the top opening of the airflow channel is covered by the top plate of the housing 100.

[0034] The second heat sink 400 includes a substrate 401 and heat dissipation fins 402 disposed on the bottom surface of the substrate 401. The heat dissipation fins 402 are disposed in a generally vertical direction, and adjacent heat dissipation fins 402 form an airflow channel extending in a front-rear direction. Preferably, the bottom opening of the airflow channel is covered by the bottom plate of the housing 100.

[0035] The circuit board assembly 300 includes at least two circuit boards that are stacked sequentially in a vertical direction.

[0036] Preferred, combined Figure 3As shown, any two adjacent and heat-generating electronic components are arranged on the circuit board on the upper surface of the circuit board, the area of the circuit board on the upper layer is smaller than the area of the circuit board on the lower layer, the heat-generating electronic components on the circuit board on the lower layer are arranged at positions not covered by the circuit board on the upper layer, and the heat-generating electronic components on the circuit board on the upper layer are in contact with the first heat sink 200 through the heat-conducting member 501 for heat conduction.

[0037] Similarly, preferably, any two adjacent and heat-generating electronic components are arranged on the circuit board on the lower surface of the circuit board, the area of the circuit board on the lower layer is smaller than the area of the circuit board on the upper layer, the heat-generating electronic components on the circuit board on the upper layer are arranged at positions not covered by the circuit board on the lower layer, and the heat-generating electronic components on the circuit board on the lower layer are in contact with the second heat sink 400 through the heat-conducting member 502 for heat conduction.

[0038] Preferably, in combination Figure 3 , Figure 4 As shown, the front end of the shell 100 is provided with a heat dissipation fan shell 601, the front side of the heat dissipation fan shell 601 is provided with a mounting cavity for mounting a heat dissipation fan 600, the heat dissipation fan 600 is mounted in the mounting cavity, and the heat dissipation fan shell 601 is provided with an upper rectifier 602 and a lower rectifier 603, the upper rectifier 602 is provided with a flow channel communicating the first heat sink 200 and the mounting cavity, and the lower rectifier 603 is provided with a flow channel communicating the second heat sink 400 and the mounting cavity. The upper rectifier 602 and the lower rectifier 603 play a role of rectification, guide the airflow to pass through the airflow channel of the heat sink and the heat dissipation fan shell 601 in sequence, and prevent the airflow from forming vortex or turbulence in the heat dissipation fan shell 601.

[0039] Preferably, as shown in Figure 1 The rear end of the first heat sink 200 and the second heat sink 400 is provided with a sealing plate 503 sealing the gap between the first heat sink 200 and the second heat sink 400. Preferably, the sealing plate 503 seals the gap, thereby cooperating with the shell 601 and the heat dissipation fan shell 601 to seal the circuit board group 300 between the two heat sinks and form a waterproof sealing structure.

[0040] The utility model discloses a second aspect provides a kind of optical fiber scanning equipment light source host computer, as shown in Figure 1 Including the optical fiber scanning equipment main control box heat dissipation structure and at least one light source body 700, light source body 700 is fixedly installed on the upper portion of optical fiber scanning equipment main control box heat dissipation structure.

[0041] The first radiator 200 is below the top surface of the main control box heat dissipation structure, and the flowing air flow cools the first radiator 200, so that the installation of the light source body 700 on the upper part of the main control box heat dissipation structure of the optical fiber scanning device has little effect on the heat dissipation performance of the circuit board group 300 in the main control box heat dissipation structure of the optical fiber scanning device. At the same time, the light source of the optical fiber scanning device and the main control box become a single structural component, and the optical fiber scanner becomes the only separate component that is not fixed, which also conforms to the distribution logic of the optical fiber scanning device and improves the integration of the device.

[0042] It should be noted that the above-mentioned embodiments illustrate the application rather than limit the application, and alternative embodiments can be designed by those skilled in the art without departing from the scope of the appended claims. In the claims, any reference signs located between parentheses shall not be construed as limiting the claims. The word "comprising" or "including" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The use of the word "about" followed by a value and / or the use of the expression "approximately" with respect to a value, denotes that the value can vary by + / - 10% around and still achieve the desired technical result.

[0043] All features disclosed in this specification, except for mutually exclusive features, can be combined in any way.

[0044] Any feature disclosed in this specification, unless otherwise indicated, can be replaced by an alternative feature serving the same, or a similar, purpose. That is, unless specifically stated otherwise, any feature is one of a number of equivalent or similar features.

[0045] The present application is not limited to the foregoing specific embodiments. The present application extends to any novel one, or any novel combination, of the features disclosed in this specification, as well as to any novel method or process disclosed in this specification, or any novel step or any novel combination of steps of any novel method or process disclosed in this specification.

Claims

1. A heat dissipation structure for the main control box of a fiber optic scanning device, characterized in that, The device includes a housing with openings at both ends, with the two ends of the openings considered as the front and rear ends. Inside the housing, from top to bottom, a first heat sink, a circuit board assembly, and a second heat sink are arranged sequentially. The upper surface of the circuit board assembly is provided with multiple electronic components that generate heat during operation, and a heat-conducting component is provided between the upper surface of the electronic components and the lower surface of the first heat sink. The lower surface of the circuit board assembly is equipped with multiple electronic components that generate heat during operation. A heat-conducting component is installed between the lower surface of the electronic components and the upper surface of the second heat sink. A cooling fan is installed at the front opening of the casing.

2. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 1, characterized in that, The first heat sink includes a base plate and heat dissipation fins disposed on the top surface of the base plate. The heat dissipation fins are disposed in a generally vertical direction, and adjacent heat dissipation fins form an airflow channel extending in a front-back direction. The top opening of the airflow channel is sealed by the top plate of the housing.

3. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 1, characterized in that, The second heat sink includes a base plate and heat dissipation fins disposed on the bottom surface of the base plate. The heat dissipation fins are disposed in a generally vertical direction, and adjacent heat dissipation fins form an airflow channel extending in a front-back direction. The top opening of the airflow channel is covered by the bottom plate of the housing.

4. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 1, characterized in that, The circuit board assembly includes at least two circuit boards stacked sequentially in a vertical direction.

5. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 4, characterized in that, Any two adjacent electronic components that generate heat are placed on the upper surface of the circuit board. The area of ​​the upper circuit board is smaller than that of the lower circuit board. The electronic components that generate heat on the lower circuit board are placed in positions not covered by the upper circuit board. The electronic components that generate heat on the upper circuit board are in contact with the first heat sink through heat-conducting components.

6. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 4, characterized in that, Any two adjacent electronic components that generate heat are placed on the lower surface of the circuit board. The area of ​​the lower circuit board is smaller than that of the upper circuit board. The electronic components that generate heat on the upper circuit board are placed in positions not covered by the lower circuit board. The electronic components that generate heat on the lower circuit board are in contact with the second heat sink through heat-conducting components.

7. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 2, characterized in that, The front end of the housing is provided with a cooling fan housing, and the front side of the cooling fan housing is provided with a mounting cavity for installing the cooling fan. The cooling fan is installed in the mounting cavity. An upper rectifier is provided inside the cooling fan housing, and the upper rectifier is provided with an airflow channel connecting the first heat sink and the mounting cavity.

8. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 3, characterized in that, The front end of the housing is provided with a cooling fan housing, and the front side of the cooling fan housing is provided with a mounting cavity for installing the cooling fan. The cooling fan is installed in the mounting cavity. The cooling fan housing is provided with a lower rectifier, and the lower rectifier is provided with an airflow channel connecting the second heat sink and the mounting cavity.

9. The heat dissipation structure of the main control box of a fiber optic scanning device as described in claim 1, characterized in that, The rear ends of the first and second radiators are provided with sealing plates to cover the gap between the first and second radiators.

10. A light source host for an optical fiber scanning device, characterized in that, It includes the heat dissipation structure of the main control box of the fiber optic scanning equipment as described in any one of claims 1-9 and at least one light source body, wherein the light source body is fixedly installed on the upper part of the heat dissipation structure of the main control box of the fiber optic scanning equipment.

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