Heterojunction cell PECVD automatic PEEK improvement mechanism
By setting screw holes on the solar cell to fix PEEK, and installing bevels and baffles on it, the problem of silicon wafer scratches and displacement in the automated structure of heterojunction solar cells is solved, achieving the effect of reducing the breakage rate and improving equipment stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2026-04-07
AI Technical Summary
Existing heterojunction solar cells have complex automated structures, resulting in a high breakage rate, especially since the right-angled edges on both sides of the PEEK layer are prone to causing scratches and misalignment of the silicon wafer.
Screw holes are made on the solar cell to fix the PEEK. An inclined edge and a stop bar are installed on top of the PEEK and fixed by welding to prevent the silicon wafer from contacting the fixing surface and to prevent displacement.
This reduces scratches and overlaps on silicon wafers during movement, decreases the breakage rate, and improves the operational stability of the equipment.
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Figure CN224098063U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of heterojunction battery, specifically to a heterojunction battery PECVD automation PEEK improvement mechanism. BACKGROUND
[0002] Heterojunction battery is the current popular battery technology, has high efficiency, low temperature manufacturing process, no PID phenomenon, can develop to the sheet and has broad development prospect, but compared with other types of battery automation structure is complex, cause more fragments, so reducing the equipment fragment rate also became the primary task, at present, the PEEK of heterojunction CVD each section automation belt fast runway is more, all be used to contact silicon wafer, lift silicon wafer, the original PEEK both sides is right angle edge, the warping is not big, in the fast motion of the belt, right angle edge is easy to cause scratch and position deviation, to the rear station due to design defects easy to cause the edge and fragment, the scheme changes the design of PEEK for this problem, achieves the purpose of reducing scratch and fragment rate. SUMMARY
[0003] The utility model discloses a kind of heterojunction battery PECVD automation PEEK improvement mechanism, to solve the problem that the above background technology proposes that the existing battery automation structure is complex, cause more fragments.
[0004] To achieve the above object, the utility model provides the following technical scheme:
[0005] A kind of heterojunction battery PECVD automation PEEK improvement mechanism, including battery piece, the screw hole is set on the upper surface of the battery piece, the screw hole is set on the upper surface of the battery piece with multiple groups, the upper side of the screw hole is fixedly installed and is provided with PEEK, the screw hole is used to fix PEEK, PEEK is fixed to the belt of fast runway, it is convenient to install.
[0006] Preferably, the upper side of the PEEK is installed and is provided with bevel, the bevel is fixed with PEEK by welding, the bevel of the upper side of the PEEK is installed, used to lift silicon wafer, prevent silicon wafer from being contacted with fixed surface, cause scratch.
[0007] Preferably, the other end of the bevel away from the screw hole is installed and is provided with baffle, the baffle is fixed with PEEK by welding, by the baffle of installation, to effectively prevent silicon wafer from being deviated on runway.
[0008] Compared with prior art, the utility model has the advantages that:
[0009] 1. The heterojunction battery PECVD automation PEEK improvement mechanism, by replacing the new pad on the CVD each section automation fast runway, thereby reducing the silicon wafer edge, so as to reduce the purpose of the broken piece rate.
[0010] 2. The heterojunction battery PECVD automation PEEK improvement mechanism, by PEEK using the edge setting, the two sides of PEEK are changed into bevel, prevent causing scratch in the movement process, so as to facilitate the broken piece and the edge caused by the gantry taking and placing wafer in the subsequent work station. BRIEF DESCRIPTION OF DRAWINGS
[0011] Figure 1 It is the whole cross section structure schematic diagram of the utility model;
[0012] In the drawing: 1, battery piece; 2, screw hole; 3, PEEK; 4, bevel; 5, baffle. DETAILED DESCRIPTION
[0013] The technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the present application.
[0014] Please refer to Figure 1 The utility model provides a technical scheme:
[0015] A heterojunction battery PECVD automation PEEK 3 improvement mechanism, including battery piece 1, the upper surface of battery piece 1 is provided with screw hole 2, a plurality of groups of screw holes 2 are provided on the upper surface of battery piece 1, PEEK 3 is fixedly installed above screw hole 2, PEEK 3 is fixed to the belt of fast runway by screw hole 2, and convenient installation.
[0016] In the embodiment, the upper side of PEEK 3 is provided with bevel 4, and the bevel 4 is fixed with PEEK 3 by welding. The bevel 4 installed on the upper side of PEEK 3 is used to lift the silicon wafer, prevent the silicon wafer from contacting the fixed surface and causing scratches.
[0017] In the embodiment, the other end of bevel 4 away from screw hole 2 is provided with baffle 5, and baffle 5 is fixed with PEEK 3 by welding. The baffle 5 is installed, thereby effectively preventing the silicon wafer from deviating on the runway.
[0018] In this embodiment, an improved PEEK3 automated PECVD mechanism for heterojunction solar cells reduces wafer overlap by replacing the new pads on each section of the automated high-speed track of the Maiwei CVD process, thereby reducing the breakage rate. The PEEK3 is designed with raised edges, and the two sides of the PEEK3 are changed to bevels to prevent scratches during movement, thus facilitating wafer handling and removal in subsequent workstations.
[0019] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. An improved mechanism for automated PEEK (3) of heterojunction solar cell PECVD, comprising solar cell (1), characterized in that: The upper surface of the battery cell (1) is provided with screw holes (2), and multiple sets of screw holes (2) are provided on the upper surface of the battery cell (1). A PEEK (3) is fixedly installed above the screw holes (2).
2. The improved PEEK (3) automated PECVD mechanism for heterojunction solar cells according to claim 1, characterized in that: An inclined side (4) is installed on the top of the PEEK (3), and the inclined side (4) is fixed to the PEEK (3) by welding.
3. The improved PEEK (3) automated PECVD mechanism for heterojunction solar cells according to claim 2, characterized in that: A stop bar (5) is installed at the other end of the inclined side (4) away from the screw hole (2), and the stop bar (5) is fixed to the PEEK (3) by welding.