Quartz boat

Abstract

A first bearing mechanism and a second bearing mechanism which are partially overlapped along a second direction are arranged in a bearing cavity of a boat body, the first bearing mechanism comprises a plurality of first bearing stations which are arranged along a first direction at intervals, and the second bearing mechanism comprises a plurality of second bearing stations which are arranged along a second direction at intervals. The second bearing mechanism comprises a plurality of second bearing stations arranged at intervals in the first direction, the first bearing stations and the second bearing stations are arranged in a staggered mode in the first direction, the first bearing stations are configured to bear a part of silicon wafers, the second bearing stations are configured to bear the other part of silicon wafers, the inner space of the quartz boat can be reasonably utilized, and the service life of the quartz boat is prolonged. Therefore, the number of silicon wafers which can be contained in the quartz boat at a time is increased, and the production efficiency of solar cells can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of solar cell process equipment, in particular to a quartz boat. BACKGROUND

[0002] The quartz boat is an essential tool for the diffusion process in the preparation process of solar cells. The diffusion process in the passivation contact cell technology is specifically boron diffusion process. The temperature of the boron diffusion process is relatively high, which requires a temperature of more than 1000℃. High temperature can make the quartz boat more easily damaged, thereby shortening the service life of the quartz boat, and making it necessary to frequently replace new quartz boats in the production process of solar cells. When the quartz boat is damaged, the equipment usually needs to be stopped, and the production continues after replacing a new quartz boat, which seriously affects the production efficiency of solar cells. CONTENT OF THE UTILITY MODEL

[0003] The content of the utility model discloses a quartz boat, which helps to increase the number of silicon wafers placed in the quartz boat, thereby helping to improve the production efficiency of solar cells.

[0004] In order to achieve the above purpose, the content of the utility model discloses a quartz boat, which comprises:

[0005] A boat body, the boat body has a bearing cavity, the bearing cavity has an upward opening, and the opening is used for allowing silicon wafers to enter the bearing cavity;

[0006] A first bearing mechanism, the first bearing mechanism is arranged in the bearing cavity and connected to the cavity wall of the bearing cavity, the first bearing mechanism comprises a plurality of first bearing stations, the plurality of first bearing stations are arranged at intervals along a first direction, and each first bearing station is configured to bear a part of the silicon wafers; and

[0007] A second bearing mechanism, the second bearing mechanism is arranged in the bearing cavity and connected to the cavity wall of the bearing cavity, and along a second direction, the second bearing mechanism and the first bearing mechanism partially overlap, the second bearing mechanism comprises a plurality of second bearing stations, the plurality of second bearing stations are arranged at intervals along the first direction, and along the first direction, the second bearing stations and the first bearing stations are arranged alternately, and each second bearing station is configured to bear another part of the silicon wafers;

[0008] Wherein, the first direction is the length direction of the boat body, and the second direction is the height direction of the boat body.

[0009] As an optional implementation, the first bearing mechanism comprises a first support assembly and a second support assembly, the first support assembly is located at the bottom of the bearing cavity, the second support assembly is arranged above the first support assembly along the second direction, and the second support assembly is arranged adjacent to the top of the bearing cavity, and the first support assembly and the second support assembly both extend along the first direction.

[0010] The second bearing mechanism comprises a third support assembly and a fourth support assembly, the third support assembly is arranged between the first support assembly and the second support assembly along the second direction, the fourth support assembly is arranged above the second support assembly along the second direction, and the fourth support assembly is arranged adjacent to the top of the bearing cavity, and the third support assembly and the fourth support assembly both extend along the first direction.

[0011] As an optional implementation, a plurality of first groove portions are arranged on the first support assembly along the first direction to form the first bearing station, and the first groove portion is configured to bear a part of the silicon wafer; and / or,

[0012] A plurality of second groove portions are arranged on the second support assembly along the first direction to form the first bearing station, and the second groove portion is configured to bear a part of the silicon wafer.

[0013] As an optional implementation, when a plurality of first groove portions are arranged on the first support assembly and a plurality of second groove portions are arranged on the second support assembly, each second groove portion is arranged corresponding to each first groove portion along the second direction to form each first bearing station.

[0014] As an optional implementation, the first groove portion has an upward first opening configured to bear a bottom edge of a part of the silicon wafer; and / or,

[0015] The second groove portion has a second opening along a third direction and towards the inside of the boat body, and the second opening is configured to bear a side edge of a part of the silicon wafer, wherein the third direction is the width direction of the boat body.

[0016] As an optional implementation, a plurality of third groove portions are arranged on the third support assembly along the first direction, and the third groove portion is configured to bear another part of the silicon wafer.

[0017] The fourth support assembly is provided with a plurality of fourth grooves arranged at intervals along the first direction, and the fourth grooves are configured to carry another part of the silicon wafers. Along the second direction, each of the third grooves is arranged in one-to-one correspondence with each of the fourth grooves, so that each of the third grooves and each of the fourth grooves jointly form the second carrying station.

[0018] As an optional implementation, the third groove has an upward third opening and a fourth opening along a third direction and towards the inside of the boat body, the third opening and the fourth opening are in communication, and the third opening and the fourth opening are jointly used to carry the corners of the silicon wafers; and / or,

[0019] The fourth groove has a fifth opening along the third direction and towards the inside of the boat body, and the fifth opening is configured to carry the side edges of the silicon wafers, wherein the third direction is the width direction of the boat body.

[0020] As an optional implementation, the second support assembly is provided with a plurality of first avoiding grooves arranged at intervals along the first direction, and the third support assembly is provided with a plurality of third grooves, and the fourth support assembly is provided with a plurality of fourth grooves, along the second direction, each of the first avoiding grooves is arranged in one-to-one correspondence with each of the third grooves and each of the fourth grooves, and the first avoiding grooves are configured to avoid a part of the silicon wafers carried by the first carrying mechanism; and / or,

[0021] The third support assembly is provided with a plurality of second avoiding grooves arranged at intervals along the first direction, and when the first support assembly is provided with a plurality of first grooves and the second support assembly is provided with a plurality of second grooves, along the second direction, each of the second avoiding grooves is arranged in one-to-one correspondence with each of the first grooves and each of the second grooves, and the second avoiding grooves are configured to avoid another part of the silicon wafers carried by the second carrying mechanism.

[0022] As an optional implementation, the first support assembly, the second support assembly, the third support assembly and the fourth support assembly each include two support rods arranged at intervals along the third direction.

[0023] As an optional implementation, the boat body is provided with a plurality of air holes on the two side walls along the first direction, and the air holes are in communication with the carrying cavity.

[0024] Compared with the prior art, the application has the following beneficial effects:

[0025] The quartz boat provided by the utility model is provided with a first bearing mechanism and a second bearing mechanism which are partially overlapped along a second direction in the bearing cavity of the boat body, wherein the first bearing mechanism comprises a plurality of first bearing stations which are arranged at intervals along a first direction, the second bearing mechanism comprises a plurality of second bearing stations which are arranged at intervals along the first direction, the first bearing stations and the second bearing stations are arranged staggeredly along the first direction, and the first bearing stations and the second bearing stations are both configured to bear silicon wafers. This arrangement mode does not affect the gas flow in the quartz boat, and helps to increase the number of silicon wafers placed in the quartz boat at a time, thereby helping to improve the production efficiency of solar cells. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0027] Figure 1 is a structural schematic view of the quartz boat disclosed by the embodiments of the present application;

[0028] Figure 2 is a structural schematic view of the connection between the silicon wafer and the bearing mechanism disclosed by the embodiments of the present application;

[0029] Figure 3 is a side view of the connection between the silicon wafer and the bearing mechanism disclosed by the embodiments of the present application;

[0030] Figure 4 is another structural schematic view of the connection between the silicon wafer and the bearing mechanism disclosed by the embodiments of the present application;

[0031] Figure 5 is a structural schematic view of the first support assembly disclosed by the embodiments of the present application;

[0032] Figure 6 is a structural schematic view of the second support assembly disclosed by the embodiments of the present application;

[0033] Figure 7 is a structural schematic view of the third support assembly disclosed by the embodiments of the present application;

[0034] Figure 8 is a structural schematic view of the fourth support assembly disclosed by the embodiments of the present application;

[0035] Figure 9 is another structural schematic view of the quartz boat disclosed by the embodiments of the present application.

[0036] Explanation of reference signs:

[0037] 100 - quartz boat; 1 - boat body; 11 - bearing cavity; 12 - side wall; 121 - air hole; 2 - first bearing mechanism; 21 - first support assembly; 211 - first groove portion; 2111 - first opening; 212 - support rod; 22 - second support assembly; 221 - second groove portion; 2211 - second opening; 222 - first avoiding groove; 2221 - sixth opening; 3 - second bearing mechanism; 31 - third support assembly; 311 - third groove portion; 3111 - third opening; 3112 - fourth opening; 312 - second avoiding groove; 3121 - seventh opening; 32 - fourth support assembly; 321 - fourth groove portion; 3211 - fifth opening; 4 - first silicon wafer; 5 - second silicon wafer; X - first direction; Y - second direction; Z - third direction. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0039] In the present application, the positions or location relations indicated by the terms "upper", "lower", and the like are based on the positions or location relations shown in the drawings. These terms are mainly used for better describing the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific position, or to be constructed and operated in a specific position.

[0040] In addition, the above-mentioned partial terms may, in addition to being used to indicate the position or location relation, also be used to indicate other meanings, for example, the term "upper" may also be used to indicate a certain dependent relationship or connection relationship in some cases. Those skilled in the art can understand the specific meanings of these terms in the present application according to the specific circumstances.

[0041] In addition, the terms "set", "connected", "linked" should be understood broadly. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication between two devices, elements or components. Those skilled in the art can understand the specific meanings of the above terms in the present application according to the specific circumstances.

[0042] In addition, the terms "first", "second", and the like are used to distinguish different devices, elements or components (the specific type and configuration of which can be the same or different), and are not used to indicate or imply relative importance or quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "a plurality" is two or more.

[0043] Solar cells can be divided into P-type cells (silicon wafers doped with boron) and N-type cells (silicon wafers doped with phosphorus) according to the different doping elements of the substrate silicon material. From the current technical development, the P-type cell has approached the efficiency ceiling, and the speed of reducing cost has also slowed down. The N-type cell has a higher efficiency ceiling, and the cell process and efficiency improvement is significantly accelerated, and the future conversion efficiency improvement space is larger. In the N-type cell technology route, it mainly includes TOPCon (Tunnel Oxide Passivated Contact, passivated contact cell), HJT (Heterojunction with Intrinsic Thin-film, heterojunction cell), and BC (Back Contact, back contact cell). Among them, the passivated contact cell retains and utilizes the existing traditional P-type cell equipment process to the greatest extent, only needs to increase the boron expansion and thin film deposition equipment, does not need to open holes on the back and align, greatly simplifies the cell production process, and has low mass production difficulty, so it becomes the mainstream choice.

[0044] The most important process in the preparation process of the passivated contact cell is the preparation of the PN junction, mainly using the boron diffusion process. The N-type silicon wafer doped with boron is diffused by a liquid source of boron tribromide at high temperature, so that the liquid boron oxide is deposited on the surface of the silicon wafer by nitrogen gas carrying in the diffusion furnace tube, and a reduction reaction occurs with silicon to generate boron monomer. The boron monomer diffuses into the silicon wafer as a diffusion source at high temperature to form a PN junction. The formation of the boron doped layer on the surface of the silicon wafer can realize the regulation of the electrical properties of the silicon wafer. This process requires a high temperature of more than 1000℃, which directly leads to a very short service life of the quartz boat used to carry the silicon wafer, and frequent damage.

[0045] In the related art, when the quartz boat is damaged, the equipment usually needs to be stopped, and a new quartz boat needs to be replaced before production continues, which results in the need to frequently replace the quartz boat on the production line, and seriously affects the production efficiency of the solar cell.

[0046] Therefore, the quartz boat disclosed in the embodiments of the present application is provided, which comprises a boat body, a first bearing mechanism and a second bearing mechanism arranged in the bearing cavity of the boat body and partially overlapped in a second direction. The first bearing mechanism comprises a plurality of first bearing stations arranged at intervals in a first direction, and the second bearing mechanism comprises a plurality of second bearing stations arranged at intervals in the first direction. The first bearing stations and the second bearing stations are staggered in the first direction. The first bearing stations are configured to bear a part of the silicon wafers, and the second bearing stations are configured to bear another part of the silicon wafers. The quartz boat can reasonably utilize the internal space of the quartz boat, so that the number of the silicon wafers that can be contained in the quartz boat at one time is increased, thereby helping to improve the production efficiency of the solar cells. In addition, a plurality of air holes are formed in the two side walls of the quartz boat in the length direction and are communicated to the bearing cavity, which helps to enhance the flowability of the gas in the bearing cavity, thereby helping to ensure the effect of boron diffusion on the silicon wafers.

[0047] The technical solutions of the present application will be further described below with reference to the embodiments and the accompanying drawings.

[0048] Please refer to Figure 1 , Figure 1 is a structural schematic view of the quartz boat disclosed in the embodiments of the present application. The quartz boat 100 comprises a boat body 1, a first bearing mechanism 2 and a second bearing mechanism 3. The boat body 1 has a bearing cavity 11 with an upward opening for the silicon wafers to enter the bearing cavity 11. The first bearing mechanism 2 is arranged on the cavity wall of the bearing cavity 11 and comprises a plurality of first bearing stations arranged at intervals in a first direction X. Each of the first bearing stations is configured to bear a part of the silicon wafers. By arranging the first bearing mechanism 2 to comprise a plurality of first bearing stations arranged at intervals, the bearing cavity 11 of the boat body 1 can simultaneously accommodate a plurality of silicon wafers.

[0049] The second bearing mechanism 3 is arranged on the cavity wall of the bearing cavity 11 and comprises a plurality of second bearing stations arranged at intervals in the first direction X. Each of the second bearing stations is configured to bear another part of the silicon wafers. By arranging the bearing cavity 11 to further comprise the second bearing mechanism 3, and the second bearing mechanism 3 comprises a plurality of second bearing stations arranged at intervals, the number of the silicon wafers that can be simultaneously accommodated in the bearing cavity 11 of the boat body 1 is further increased, thereby helping to improve the production efficiency of the solar cells.

[0050] It can be understood that the first bearing mechanism 2 and the second bearing mechanism 3 can be used to bear different silicon wafers at the same time. Therefore, a part of the silicon wafers borne by the first bearing mechanism 2 is referred to as the first silicon wafers 4, and another part of the silicon wafers borne by the second bearing mechanism 3 is referred to as the second silicon wafers 5 in the subsequent description.

[0051] For example, the first bearing mechanism 2 can be used to bear 20 first silicon wafers 4, and the second bearing mechanism 3 can also be used to bear 20 second silicon wafers 5. Compared with the quartz boat 100 provided with only the first bearing mechanism 2, the number of silicon wafers borne by the quartz boat 100 of the present application is greatly increased in a single time, thereby facilitating the improvement of the production efficiency of the solar cell in a single time.

[0052] In the second direction Y, the second bearing mechanism 3 and the first bearing mechanism 2 partially overlap, and in the first direction X, the second bearing station and the first bearing station are staggered. The first direction X is the length direction of the boat body 1, and the second direction Y is the height direction of the boat body 1. Through this arrangement, the space of the bearing cavity 11 of the boat body 1 can be reasonably utilized, so that on the basis of the first bearing mechanism 2 arranged in the bearing cavity 11 for bearing the first silicon wafers 4, the second bearing mechanism 3 can also be arranged for bearing the second silicon wafers 5, which facilitates the increase of the number of silicon wafers borne in the bearing cavity 11 of the boat body 1 in a single time, thereby facilitating the increase of the number of silicon wafers processed in a single time. In this way, even if the quartz boat 100 is damaged at high temperature (for example, between 1020-1050℃) and stops, the number of silicon wafers processed in a single time is larger, thereby reducing the impact on the production efficiency of the solar cell, and further facilitating the improvement of the production efficiency of the solar cell. In addition, the first bearing mechanism 2 and the second bearing mechanism 3 are staggered in the first direction X and the second direction Y, which can reduce the influence on the flow of gas, thereby facilitating the guarantee of the effect of boron diffusion.

[0053] It can be understood that the material of the boat body 1 can be quartz or silicon carbide. Quartz has the characteristics of high temperature resistance and corrosion resistance, which facilitates the improvement of the high temperature resistance and corrosion resistance of the boat body 1. Silicon carbide has good thermal stability and high strength, which facilitates the improvement of the thermal stability and service life of the boat body 1. The present embodiment does not make specific limitation on this.

[0054] It can be understood that the silicon wafer is usually circular or square, and in the field of solar cell manufacturing, the silicon wafer is usually square, so the present embodiment will be described in the following with the silicon wafer being square.

[0055] In some embodiments, please refer to Figures 1 to 4 , Figure 2 is a structure diagram of the connection between the silicon wafer and the bearing mechanism disclosed by the present embodiment, Figure 3 is a side view of the connection between the silicon wafer and the bearing mechanism disclosed by the present embodiment, Figure 4is another structure schematic diagram of the silicon wafer and the bearing mechanism connection disclosed by the embodiment of the present application. The first bearing mechanism 2 comprises a first support assembly 21 and a second support assembly 22. The first support assembly 21 is located at the bottom of the bearing cavity 11, and the second support assembly 22 is arranged above the first support assembly 21 along the second direction Y and is arranged adjacent to the top of the bearing cavity 11. Both the first support assembly 21 and the second support assembly 22 extend along the first direction X. By arranging the first support assembly 21 and the second support assembly 22 along the second direction Y, the first silicon wafer 4 is fixed, and the first silicon wafer 4 is placed in the form of extending along the second direction Y. In addition, arranging two support assemblies instead of one support assembly helps to improve the fixing effect of the silicon wafer, thereby helping to improve the stability of the silicon wafer in the reaction process.

[0056] Optionally, referring to Figures 1 to 4 , the second bearing mechanism 3 comprises a third support assembly 31 and a fourth support assembly 32. The third support assembly 31 is arranged between the first support assembly 21 and the second support assembly 22 along the second direction Y, and the fourth support assembly 32 is arranged above the second support assembly 22 along the second direction Y and is arranged adjacent to the top of the bearing cavity 11. Both the third support assembly 31 and the fourth support assembly 32 extend along the first direction X. By arranging the third support assembly 31 and the fourth support assembly 32 along the second direction Y, the second silicon wafer 5 is fixed, and the second silicon wafer 5 is also placed in the form of extending along the second direction Y. In addition, arranging two support assemblies instead of one support assembly helps to improve the fixing effect of the silicon wafer, thereby helping to improve the stability of the silicon wafer in the reaction process. In addition, by arranging the third support assembly 31 between the first support assembly 21 and the second support assembly 22 along the second direction Y and arranging the fourth support assembly 32 above the second support assembly 22 along the second direction Y, the second bearing mechanism 3 and the first bearing mechanism 2 are partially overlapped along the second direction Y, thereby helping to make the second silicon wafer 5 carried by the second bearing mechanism 3 and the first silicon wafer 4 carried by the first bearing mechanism 2 partially overlapped along the second direction Y, so as to help to reduce the occupation of the internal space of the boat 1.

[0057] In some embodiments, referring to Figures 1 to 4 , in combination with Figure 5 , Figure 5is a structural schematic view of a first support assembly disclosed by embodiments of the present application. In some embodiments, the first support assembly 21 is provided with a plurality of first groove portions 211 arranged at intervals along a first direction X, and the first groove portions 211 are configured to form first bearing stations for bearing the first silicon wafer 4. By using the groove portions to bear the first silicon wafer 4, compared with using connecting members or clamping members to support the first silicon wafer 4, the structure for bearing the first silicon wafer 4 is facilitated, and thus the structure of the boat body 1 as a whole is facilitated, and the economy of the boat body 1 as a whole is facilitated. Of course, as another example, the first bearing stations can also be formed by providing a plurality of protruding portions on the first support assembly 21, and recesses being formed between adjacent two protruding portions.

[0058] Referring to Figures 1 to 4 , in combination with Figure 6 , Figure 6 is a structural schematic view of a second support assembly disclosed by embodiments of the present application. In other embodiments, the second support assembly 22 is provided with a plurality of second groove portions 221 arranged at intervals along the first direction X, and the second groove portions 221 are configured to form first bearing stations for bearing the first silicon wafer 4. By using the groove portions to bear the first silicon wafer 4, compared with using connecting members or clamping members to support the first silicon wafer 4, the structure for bearing the first silicon wafer 4 is facilitated, and thus the structure of the boat body 1 as a whole is facilitated, and the economy of the boat body 1 as a whole is facilitated. Of course, as another example, the first bearing stations can also be formed by providing a plurality of protruding portions on the second support assembly 22, and recesses being formed between adjacent two protruding portions.

[0059] Referring to Figures 1 to 4 , in still other embodiments, the first support assembly 21 is provided with a plurality of first groove portions 211, and the second support assembly 22 is provided with a plurality of second groove portions 221, and along the second direction Y, each second groove portion 221 is arranged in one-to-one correspondence with each first groove portion 211, to jointly form the first bearing stations. By arranging the first groove portions 211 and the second groove portions 221 in correspondence along the second direction Y, the first bearing stations can be jointly formed by the first groove portions 211 and the second groove portions 221, so that different parts of the same first silicon wafer 4 can be borne, and thus the stability of the first silicon wafer 4 is facilitated.

[0060] Optionally, referring to Figures 1 to 4 , in combination with Figure 5The first groove portion 211 has an upward first opening 2111 and extends along a third direction Z, which is a width direction of the boat 1, through the first support assembly 21. The first opening 2111 is configured to carry a bottom edge of the first silicon wafer 4, which extends along the third direction Z. The first groove portion 211 extends through the first support assembly 21 at both ends along the extension direction of the bottom edge of the first silicon wafer 4, and the first groove portion 211 further has the upward opening, which helps the bottom edge of the first silicon wafer 4 to be clamped in the first groove portion 211, thereby helping the first groove portion 211 to fix the bottom edge of the first silicon wafer 4.

[0061] It can be understood that, in addition to fixing the bottom edge of the first silicon wafer 4, the first groove portion 211 can also be configured as an L-shaped groove for fixing a lower corner of the first silicon wafer 4, which is not specifically limited in the embodiment.

[0062] In some embodiments, referring to Figures 1 to 4 , in combination with Figure 6 The second groove portion 221 has a second opening 2211 along the third direction Z and towards the inside of the boat 1, and extends along the second direction Y through the second support assembly 22. The second opening 2211 is configured to carry a side edge of the first silicon wafer 4, which extends along the second direction Y. The second groove portion 221 extends through the second support assembly 22 at both ends along the extension direction of the side edge of the first silicon wafer 4, and the second groove portion 221 further has the second opening 2211 along the third direction Z and towards the inside of the boat 1, which helps the side edge of the first silicon wafer 4 to be clamped in the second groove portion 221, thereby helping the second groove portion 221 to fix the side edge of the first silicon wafer 4.

[0063] The first opening 2111 and the second opening 2211 can fix the bottom edge and the side edge of the first silicon wafer 4. Compared with fixing only one edge of the first silicon wafer 4, the double-edge fixing method helps to improve the fixing effect of the first silicon wafer 4, thereby helping to improve the stability of the first silicon wafer 4 during the reaction process.

[0064] In some embodiments, referring to Figures 1 to 4 , in combination with Figure 7 , Figure 7is a structural schematic view of a third support assembly disclosed in embodiments of the present application. The third support assembly 31 is provided with a plurality of third groove portions 311 arranged at intervals along the first direction X, and the third groove portions 311 are configured to form second bearing stations for bearing the second silicon wafer 5. By bearing the second silicon wafer 5 in the form of the groove portions, compared with bearing the second silicon wafer 5 in the form of the connecting members or the clamping members, it is helpful to improve the structural simplicity of bearing the second silicon wafer 5, and thus it is helpful to improve the structural simplicity of the boat body 1 as a whole, and it is also helpful to improve the economy of the boat body 1 as a whole. Of course, as another example, the second bearing stations can also be formed by providing a plurality of protruding portions on the third support assembly 31, and forming grooves between adjacent two protruding portions.

[0065] Referring to Figures 1 to 4 , in combination with Figure 8 , Figure 8 is a structural schematic view of a fourth support assembly disclosed in embodiments of the present application. In some other embodiments, the fourth support assembly 32 is provided with a plurality of fourth groove portions 321 arranged at intervals along the first direction X, and the fourth groove portions 321 are configured to form second bearing stations for bearing the second silicon wafer 5. By bearing the second silicon wafer 5 in the form of the groove portions, compared with bearing the second silicon wafer 5 in the form of the connecting members or the clamping members, it is helpful to improve the structural simplicity of bearing the second silicon wafer 5, and thus it is helpful to improve the structural simplicity of the boat body 1 as a whole, and it is also helpful to improve the economy of the boat body 1 as a whole. Of course, as another example, the second bearing stations can also be formed by providing a plurality of protruding portions on the fourth support assembly 32, and forming grooves between adjacent two protruding portions.

[0066] Referring to Figures 1 to 4 In some other embodiments, the third support assembly 31 is provided with a plurality of third groove portions 311, and the fourth support assembly 32 is provided with a plurality of fourth groove portions 321, and along the second direction Y, each fourth groove portion 321 is arranged in one-to-one correspondence with each third groove portion 311, to jointly form the second bearing stations. By arranging the third groove portions 311 and the fourth groove portions 321 in correspondence along the second direction Y, it is helpful to jointly form the second bearing stations by the third groove portions 311 and the fourth groove portions 321, so as to be able to bear different parts of the same second silicon wafer 5, and thus it is helpful to improve the stability of the second silicon wafer 5.

[0067] In some embodiments, referring to Figures 1 to 4 , in combination with Figure 7The third groove portion 311 has a third opening 3111 facing upward, and has a fourth opening 3112 facing toward the inside of the boat 1 along the third direction Z, and the third opening 3111 and the fourth opening 3112 are communicated to form an L-shaped groove on the third support assembly 31, so that the third opening 3111 and the fourth opening 3112 are used to carry the corner of the second wafer 5 together. By the third groove portion 311 having the third opening 3111 and the fourth opening 3112 communicated to form an L-shaped groove, it is helpful to enable the lower corner of the second wafer 5 to be clamped in the L-shaped groove, so as to enable the L-shaped groove to fix the lower corner of the second wafer 5.

[0068] It can be understood that, since the third support assembly 31 is located between the first support assembly 21 and the second support assembly 22 along the second direction Y, and the third support assembly 31 is used to carry the lower end of the second wafer 5, in order to avoid the first wafer 4, the third groove portion 311 on the third support assembly 31 is different from the first groove portion 211, and cannot carry the bottom edge of the second wafer 5, which will cause the third support assembly 31 to be structurally limited by the first wafer 4, so the third support assembly 31 needs to be arranged in the form of carrying the lower corner of the second wafer 5.

[0069] Optionally, referring to Figures 1 to 4 in combination with Figure 8 The fourth groove portion 321 has a fifth opening 3211 facing toward the inside of the boat 1 along the third direction Z, and the fourth groove portion 321 penetrates the fourth support assembly 32 along the second direction Y, and the fourth opening 3112 is configured to carry the side edge of the second wafer 5 extending along the second direction Y. By the fourth groove portion 321 penetrating the fourth support assembly 32 along the two ends of the side edge of the second wafer 5, and the fourth groove portion 321 also having the fourth opening 3112 facing toward the inside of the boat 1 along the third direction Z, it is helpful to enable the side edge of the second wafer 5 to be clamped in the fourth groove portion 321, so as to enable the fourth groove portion 321 to fix the side edge of the second wafer 5.

[0070] By the third opening 3111 and the fourth opening 3112 and the fifth opening 3211, the lower corner and the side edge of the second wafer 5 can be fixed, which is helpful to improve the fixing effect of the second wafer 5 compared to fixing only one side of the second wafer 5, so as to improve the support stability of the second wafer 5 during the reaction process.

[0071] In some embodiments, referring to Figure 3 and Figure 6The second support assembly 22 is provided with a plurality of first avoiding grooves 222 along the first direction X, the first avoiding grooves 222 have sixth openings 2221 facing the inside of the boat 1 along the third direction Z, and the first avoiding grooves 222 penetrate the second support assembly 22 along the second direction Y. When the third support assembly 31 is provided with a plurality of third groove portions 311, and the fourth support assembly 32 is provided with a plurality of fourth groove portions 321, each first avoiding groove 222 along the second direction Y corresponds to each third groove portion 311 and each fourth groove portion 321. The first avoiding grooves 222 penetrating the second support assembly 22 along the second direction Y and having the sixth openings 2221 facing the inside of the boat 1 along the third direction Z can help the first avoiding grooves 222 to avoid the side edges of the second silicon wafer 5.

[0072] Optionally, referring to Figure 3 and Figure 7 The third support assembly 31 is provided with a plurality of second avoiding grooves 312 along the first direction X, the second avoiding grooves 312 have seventh openings 3121 facing the inside of the boat 1 along the third direction Z, and the second avoiding grooves 312 penetrate the third support assembly 31 along the second direction Y. When the first support assembly 21 is provided with a plurality of first groove portions 211, and the second support assembly 22 is provided with a plurality of second groove portions 221, each second avoiding groove 312 along the second direction Y corresponds to each first groove portion 211 and each second groove portion 221. The second avoiding grooves 312 penetrating the third support assembly 31 along the second direction Y and having the seventh openings 3121 facing the inside of the boat 1 along the third direction Z can help the second avoiding grooves 312 to avoid the side edges of the first silicon wafer 4.

[0073] In some embodiments, referring to Figure 2 and Figure 4 The first support assembly 21, the second support assembly 22, the third support assembly 31 and the fourth support assembly 32 each include two support rods 212 spaced along the third direction Z, and the two support rods 212 are arranged on the cavity wall of the carrying cavity 11. Compared with arranging the support rods 212 on only one side of the carrying cavity 11 along the third direction Z, arranging the support rods 212 on both sides can help the first support assembly 21 and the second support assembly 22 to provide more uniform support for the first silicon wafer 4, thereby helping to improve the stability of the first silicon wafer 4 during the reaction process. The third support assembly 31 and the fourth support assembly 32 can provide more uniform support for the second silicon wafer 5, thereby helping to improve the support stability of the second silicon wafer 5 during the reaction process.

[0074] Optionally, referring to Figure 9 , Figure 9is another structural schematic view of the quartz boat disclosed in the embodiments of the present application. The boat body 1 is provided with a plurality of air holes 121 on the two side walls 12 along the first direction X, which are communicated with the bearing cavity 11. It is helpful to make the gas enter into the bearing cavity 11 through the air holes 121 during the reaction, thereby helping to ensure the diffusion effect of boron on the silicon wafer.

[0075] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A quartz boat, characterized in that, The quartz boat includes: The boat body has a support cavity with an upward opening for the silicon wafer to enter the support cavity; A first support mechanism is disposed in the support cavity to connect to the cavity wall. The first support mechanism includes a plurality of first support stations, which are spaced apart along a first direction. Each first support station is configured to support a portion of the silicon wafer. The second carrier mechanism is disposed in the carrier cavity to connect to the cavity wall of the carrier cavity, and the second carrier mechanism and the first carrier mechanism partially overlap along the second direction. The second carrier mechanism includes a plurality of second carrier stations, which are spaced apart along the first direction, and the second carrier stations and the first carrier stations are staggered along the first direction. Each second carrier station is configured to carry another part of the silicon wafer. Wherein, the first direction is the length direction of the boat body, and the second direction is the height direction of the boat body.

2. The quartz boat according to claim 1, characterized in that, The first support mechanism includes a first support component and a second support component. The first support component is located at the bottom of the support cavity, and the second support component is disposed at a distance above the first support component along the second direction. The second support component is disposed near the top of the support cavity, and both the first support component and the second support component extend along the first direction. The second bearing mechanism includes a third support component and a fourth support component. The third support component is disposed between the first support component and the second support component along the second direction. The fourth support component is disposed above the second support component along the second direction and is disposed near the top of the bearing cavity. Both the third support component and the fourth support component extend along the first direction.

3. The quartz boat according to claim 2, characterized in that, The first support component has a plurality of spaced first grooves along the first direction to form the first bearing station, the first grooves being configured to bear a portion of the silicon wafer; and / or, The second support component has a plurality of spaced second grooves along the first direction to form the first bearing station, and the second grooves are configured to bear a portion of the silicon wafer.

4. The quartz boat according to claim 3, characterized in that, When the first support component is provided with a plurality of first grooves and the second support component is provided with a plurality of second grooves, each second groove is respectively arranged in a one-to-one correspondence with each first groove along the second direction, so as to jointly form each first bearing station.

5. The quartz boat according to claim 4, characterized in that, The first groove has an upward-facing first opening, which is configured to support a portion of the bottom edge of the silicon wafer; And / or, The second groove has a second opening along a third direction and toward the interior of the boat body, the second opening being configured to carry a portion of the side of the silicon wafer, wherein the third direction is the width direction of the boat body.

6. The quartz boat according to claim 2, characterized in that, The third support component has a plurality of spaced third slots along the first direction, and the third slots are configured to support another part of the silicon wafer. The fourth support component has a plurality of spaced fourth slots along the first direction. The fourth slots are configured to carry another part of the silicon wafer. Along the second direction, each third slot is respectively arranged in a one-to-one correspondence with each fourth slot, so that each third slot and each fourth slot together form the second bearing station.

7. The quartz boat according to claim 6, characterized in that, The third groove has an upward-facing third opening, and the third groove also has a fourth opening along a third direction and toward the interior of the boat body. The third opening and the fourth opening communicate with each other so that the third opening and the fourth opening are used together to support the corner of the silicon wafer. And / or, The fourth groove has a fifth opening along the third direction toward the interior of the boat body, the fifth opening being configured to support the side of the silicon wafer, wherein the third direction is the width direction of the boat body.

8. The quartz boat according to claim 6, characterized in that, The second support component has a plurality of spaced-apart first clearance slots along the first direction. When the third support component has a plurality of third slots and the fourth support component has a plurality of fourth slots, along the second direction, each first clearance slot corresponds one-to-one with each third slot and each fourth slot. The first clearance slots are configured to avoid a portion of the silicon wafer carried by the first support mechanism; and / or, The third support component has a plurality of spaced second clearance slots along the first direction. When the first support component has a plurality of first slots and the second support component has a plurality of second slots, each second clearance slot is configured to correspond one-to-one with each first slot and each second slot along the second direction. The second clearance slot is configured to avoid another part of the silicon wafer carried by the second support mechanism.

9. The quartz boat according to any one of claims 2-8, characterized in that, The first support assembly, the second support assembly, the third support assembly, and the fourth support assembly each include two support rods spaced apart along a third direction.

10. The quartz boat according to any one of claims 1-8, characterized in that, The boat hull has multiple ventilation holes on its two side walls along the first direction, and the ventilation holes are connected to the bearing cavity.

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