Positioning device for chip packaging
By using a multi-axis linkage structure consisting of a support base, worktable, positioning components, and drive motor, the problem of limited adjustment range in traditional chip packaging devices is solved, thereby improving flexibility and packaging quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-18
- Publication Date
- 2026-04-07
AI Technical Summary
Traditional chip packaging positioning devices have limited adjustment range and insufficient flexibility, making it impossible to guarantee packaging quality.
It adopts a structure consisting of a support base, worktable, positioning components, drive motor, and rotating shaft. Through multi-axis linkage, the rotation and pitch angle adjustment of the worktable are realized, avoiding collisions and improving the adjustment range and flexibility.
This improves the positional accuracy during chip packaging, avoids offset and tilt, and ensures the reliability and stability of the packaging.
Smart Images

Figure CN224098119U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip packaging positioning technology, specifically a positioning device for chip packaging. Background Technology
[0002] A chip is a set of electronic circuits integrated on a small, flat wafer. It utilizes the physical properties of semiconductor materials, adding and removing materials to form a multi-layered interconnected grid structure, thereby creating countless tiny switches. These switches can turn current on or off, thus performing specific functions such as data processing, signal amplification, and information storage. Chip packaging refers to sealing the chip in a package made of materials such as plastic, metal, or ceramic to protect it from external environmental influences and provide an interface for the chip to connect with other electronic components to achieve information input and output. During chip packaging, the chip needs to be precisely placed on the packaging substrate and connected to electrodes on the substrate through wire bonding or flip-chip bonding. Positioning devices ensure the chip's positional accuracy during packaging, preventing chip misalignment or tilting, thus guaranteeing the reliability and stability of the package.
[0003] Traditional chip packaging positioning devices typically lack adjustment mechanisms, requiring adjustments based on the chip packaging details. This reduces applicability and compromises packaging quality. To address these issues, some chip packaging positioning devices incorporate a rotating shaft on the base. The positioning stage is positioned directly above the base and connected to the shaft, allowing for pitch adjustment based on the chip packaging details. This improves applicability and ensures packaging quality. However, this approach, relying on only a single rotating shaft, limits the device's adjustment range and reduces flexibility. Therefore, a new chip packaging positioning device is proposed. Utility Model Content
[0004] (a) Technical problems to be solved
[0005] To address the shortcomings of existing technologies, this utility model provides a positioning device for chip packaging, which solves the aforementioned technical problems of not only increasing the limited adjustment range of the device but also reducing its flexibility.
[0006] (II) Technical Solution
[0007] To achieve the above objectives, this utility model provides the following technical solution: a positioning device for chip packaging, comprising:
[0008] A support base and a worktable located directly above the support base, with a shelf mounted on the upper surface of the worktable and positioning components installed around the shelf.
[0009] A first drive motor is disposed on the upper surface of the support base, and an annular concave plate is rotatably connected to the inner cavity of the support base. The first drive motor and the annular concave plate are coaxially connected.
[0010] A side connector is located on the upper surface of the annular concave plate. A second drive motor is mounted on the outer side of the side connector, and a rotating shaft is connected to the inner side of the side connector. The rotating shaft is connected to the worktable, and the second drive motor is coaxially connected to the rotating shaft. After the chip is placed on the mounting base, the positioning component performs the positioning operation during chip packaging. The first drive motor drives the annular concave plate to rotate on the support base and adjusts the direction of rotation of the annular concave plate. The side connector can drive the worktable to rotate in the same direction as the annular concave plate and adjust the orientation of the worktable. The second drive motor on the side connector can drive the rotating shaft to rotate and adjust the direction of rotation of the rotating shaft, thereby adjusting the pitch angle of the worktable. On the one hand, this not only reduces the adjustment limitation range of the device but also improves the flexibility of the device. On the other hand, since the side connector is located below and on the outer side of the worktable, collisions between the worktable and the side connector are avoided when adjusting the pitch angle.
[0011] Preferably, a rotating shaft is connected between the rotating end of the first drive motor and the center position of the upper surface of the annular concave plate. The first drive motor drives the annular concave plate to rotate within the cavity of the support base via the rotating shaft.
[0012] Preferably, the positioning component includes positioning plates, which are evenly distributed around the upper surface of the holder. The positioning plates can clamp and position the chip around its perimeter on the holder.
[0013] Preferably, hydraulic rods are installed on the outer surfaces of the positioning plate, and fixed outer plates are connected to the surfaces of the hydraulic rods. The hydraulic rods drive the positioning plate to move along the upper surface of the holder, so that the positioning plate fits tightly against the chip, thereby ensuring the stability of the chip during positioning.
[0014] Preferably, the upper surface of the worktable is rotatably connected to bidirectional lead screws on all four sides, and each end of the bidirectional lead screw is coaxially connected to a third drive motor. The third drive motor drives the bidirectional lead screws to rotate on the worktable and adjusts the direction of rotation of the bidirectional lead screws.
[0015] Preferably, sliding blocks are fitted on both sides of the surface of the bidirectional lead screw, and an outer connecting plate is rotatably connected between the sliding blocks and the fixed outer plate. The sliding blocks can drive the fixed outer plate to translate along the upper surface of the worktable through the outer connecting plate according to the direction of rotation of the bidirectional lead screw. This not only allows for adjustment of the position of the positioning component on the storage seat within a certain range according to chips of different sizes, but also improves the applicability of the device.
[0016] (III) Beneficial Effects
[0017] Compared with the prior art, the present invention provides a positioning device for chip packaging, which has the following advantages:
[0018] This chip packaging positioning device positions the chip after it is placed on the mounting base. The positioning component then performs the positioning operation during chip packaging. A first drive motor drives an annular concave plate to rotate on the support base and adjusts the direction of the annular concave plate. The side connector can drive the worktable to rotate in the same direction as the annular concave plate and adjust the orientation of the worktable. A second drive motor on the side connector can drive a rotating shaft to rotate and adjust the direction of the rotating shaft, thereby adjusting the pitch angle of the worktable. This not only reduces the adjustment limitation range of the device but also improves the flexibility of the device. At the same time, since the side connector is located on the lower outer side of the worktable, collisions between the worktable and the side connector are avoided when the pitch angle is adjusted. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0020] Figure 2 This is a cross-sectional view of the support base of this utility model;
[0021] Figure 3 This is a schematic diagram of the workbench and its connection structure of the present invention;
[0022] Figure 4 This is a schematic diagram of the positioning component and its connection structure of the present invention.
[0023] In the diagram: 1. Support base; 2. First drive motor; 3. Annular concave plate; 4. Side connecting seat; 5. Second drive motor; 6. Rotating shaft; 7. Storage seat; 8. Positioning assembly; 9. Positioning plate; 10. Hydraulic rod; 11. Fixed outer plate; 12. Bidirectional lead screw; 13. Third drive motor; 14. Sliding block; 15. Outer connecting plate; 16. Worktable. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0025] This utility model provides a technical solution: a positioning device for chip packaging, comprising: (see details) Figure 1 , Figure 3 The support base 1 and the worktable 16 located directly above the support base 1 are provided with a storage seat 7 on the upper surface of the worktable 16 and positioning components 8 are provided around the storage seat 7.
[0026] The first drive motor 2 is disposed on the upper surface of the support base 1, and the inner cavity of the support base 1 is rotatably connected to the annular concave plate 3. The first drive motor 2 and the annular concave plate 3 are coaxially connected.
[0027] Please see Figure 2 A side mounting base 4 is located on the upper surface of the annular concave plate 3. A second drive motor 5 is mounted on the outer side of the side mounting base 4, and a rotating shaft 6 is connected to the inner side of the side mounting base 4. The rotating shaft 6 is connected to the worktable 16, and the second drive motor 5 and the rotating shaft 6 are coaxially connected. After the chip is placed on the placement seat 7, the positioning component 8 performs the positioning operation for chip packaging. The first drive motor 2 drives the annular concave plate 3 to rotate on the support base 1 and adjusts the direction of the annular concave plate 3. The side mounting base 4 can drive the worktable 16 to rotate in the same direction as the annular concave plate 3 and adjust the orientation of the worktable 16. The second drive motor 5 drives the rotating shaft 6 to rotate on the side mounting base 4 and adjusts the direction of the rotating shaft 6, thereby adjusting the pitch angle of the worktable 16. On the one hand, this not only reduces the adjustment limitation range of the device but also improves the flexibility of the device. On the other hand, since the side mounting base 4 is located on the lower outer side of the worktable 16, the worktable 16 avoids collision with the side mounting base 4 when adjusting the pitch angle.
[0028] Please see Figure 2 A rotating shaft is connected between the rotating end of the first drive motor 2 and the center of the upper surface of the annular concave plate 3. The first drive motor 2 drives the annular concave plate 3 to rotate within the cavity of the support base 1 via the rotating shaft.
[0029] Please see Figure 4 The positioning component 8 includes positioning plates 9, which are evenly distributed around the upper surface of the storage base 7. The positioning plates 9 can clamp and position the chip around its perimeter on the storage base 7. Hydraulic rods 10 are mounted on the outer surfaces of the positioning plates 9, and fixed outer plates 11 are connected to the surfaces of the hydraulic rods 10. The hydraulic rods 10 drive the positioning plates 9 to move along the upper surface of the storage base 7, ensuring a tight fit between the positioning plates 9 and the chip's perimeter, thus guaranteeing the stability of the chip during positioning. Bidirectional lead screws 12 are rotatably connected around the upper surface of the worktable 16, and a third drive motor 13 is coaxially connected to the ends of the bidirectional lead screws 12. The third drive motor 13 drives the bidirectional lead screws 12 to rotate on the worktable 16 and adjusts the direction of rotation of the bidirectional lead screws 12. Sliding blocks 14 are sleeved on both sides of the surface of the bidirectional lead screws 12, and an outer connecting plate 15 is rotatably connected between the sliding blocks 14 and the fixed outer plate 11. The sliding block 14 can drive the fixed outer plate 11 to move along the upper surface of the worktable 16 through the outer connecting plate 15 according to the rotation of the bidirectional lead screw 12. This not only allows the positioning component 8 to be adjusted on the storage seat 7 within a certain range according to chips of different sizes, but also improves the applicability of the device.
[0030] This solution: After the chip is placed on the storage seat 7, the hydraulic rod 10 drives the positioning plate 9 to move along the upper surface of the storage seat 7, so that the positioning plate 9 fits tightly with the chip. The third drive motor 13 drives the bidirectional lead screw 12 to rotate on the worktable 16 and adjusts the direction of the bidirectional lead screw 12. The sliding block 14 can drive the fixed outer plate 11 to perform translation operation along the upper surface of the worktable 16 through the outer connecting plate 15 according to the direction of the bidirectional lead screw 12. The first drive motor 2 drives the annular concave plate 3 to rotate on the support base 1 and adjusts the direction of the annular concave plate 3. The side connecting seat 4 can drive the worktable 16 to rotate in the same direction as the annular concave plate 3 and adjust the orientation of the worktable 16. The second drive motor 5 can drive the rotating shaft 6 to rotate on the side connecting seat 4 and adjust the direction of the rotating shaft 6, thereby adjusting the pitch angle of the worktable 16.
[0031] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A positioning device for chip packaging, characterized in that, include: Support base (1), and worktable (16) set directly above support base (1), with a storage seat (7) installed on the upper surface of worktable (16), and positioning components (8) added around the storage seat (7). The first drive motor (2) is disposed on the upper surface of the support base (1), and the inner cavity of the support base (1) is rotatably connected to the annular concave plate (3). The first drive motor (2) and the annular concave plate (3) are coaxially connected. A side connecting seat (4) is provided on the upper surface of the annular concave plate (3), and a second drive motor (5) is installed on the outer side of the side connecting seat (4), and a rotating shaft (6) is connected to the inner side of the side connecting seat (4), and the rotating shaft (6) is connected to the worktable (16). The second drive motor (5) and the rotating shaft (6) are coaxially connected.
2. The positioning device for chip packaging according to claim 1, characterized in that: A rotating shaft is connected between the rotating end of the first drive motor (2) and the center position of the upper surface of the annular concave plate (3).
3. The positioning device for chip packaging according to claim 1, characterized in that: The positioning component (8) includes a positioning plate (9), and the positioning plate (9) is evenly distributed around the upper surface of the seat (7).
4. The positioning device for chip packaging according to claim 3, characterized in that: Hydraulic rods (10) are installed on the outer side of the positioning plate (9), and the surface of the hydraulic rods (10) is connected to a fixed outer plate (11).
5. A positioning device for chip packaging according to claim 4, characterized in that: The upper surface of the worktable (16) is rotatably connected to a bidirectional lead screw (12) around its perimeter, and the ends of the bidirectional lead screw (12) are coaxially connected to a third drive motor (13).
6. A positioning device for chip packaging according to claim 5, characterized in that: The two-way lead screw (12) is fitted with sliding blocks (14) on both sides of its surface, and an outer connecting plate (15) is rotatably connected between the sliding blocks (14) and the fixed outer plate (11).