Composite gradient electronic packaging structure of aluminum alloy and iron-based material
By combining an iron-based encapsulation ring and cover with an aluminum alloy encapsulation shell and using a high-temperature, high-pressure DC pulse coupling fixation method, the problem of non-removable aluminum alloy encapsulation is solved, achieving removability and maintainability, and ensuring the integrity and airtightness of the encapsulation structure.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-14
- Publication Date
- 2026-04-07
AI Technical Summary
Existing aluminum alloy electronic packaging structures are difficult to disassemble after sealing and welding, resulting in non-repairability. The strength and hardness of aluminum alloys are insufficient to withstand mechanical stress and impact.
Using iron-based materials as the encapsulation ring and cover, it is fixed to the aluminum alloy encapsulation shell by high temperature, high pressure and DC pulse coupling, and formed by connection methods such as discharge plasma sintering or brazing to form a detachable encapsulation structure.
It achieves the detachability of the electronic packaging structure, protects internal components from external damage, ensures the integrity and maintainability of the packaging structure, and maintains the airtightness and strength of the packaging shell.
Smart Images
Figure CN224098164U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic packaging technology, and in particular to a composite gradient electronic packaging structure of aluminum alloy and iron-based materials. Background Technology
[0002] In modern aerospace, electronic packaging materials made from different materials are often combined to meet complex performance requirements. Silicon-aluminum alloys are widely used in aerospace and electronic equipment due to their low density, good casting properties, high specific strength and stiffness, and excellent thermal conductivity. Aluminum alloys, with their low density and good thermal conductivity, are widely used in high-power applications. However, a common drawback of these materials is that once sealed and welded, if internal components malfunction, the packaging shell must be opened destructively, thus lacking repairability. Utility Model Content
[0003] This utility model provides a composite gradient electronic packaging structure of aluminum alloy and iron-based materials, which can provide a packaging structure that can be disassembled for internal component maintenance.
[0004] This utility model provides a composite gradient electronic packaging structure of aluminum alloy and iron-based materials, including a packaging shell, a packaging ring and a cover;
[0005] The packaging shell is made of aluminum alloy and is a cylindrical body with one end closed and the other end open. Electronic components are installed inside the packaging shell. The open end of the packaging shell is the end to be closed. The end to be closed is sealed with a packaging ring of a matching size. The packaging ring is sealed to one end of the packaging shell and a cover is connected thereto. Both the packaging ring and the cover are made of iron-based materials.
[0006] In one possible design, the package housing and the package ring are brazed together.
[0007] In one possible design, the encapsulation housing and the encapsulation ring are sealed together by spark plasma sintering technology.
[0008] In one possible design, the encapsulation ring and the cover are sealed together by arc welding or resistance welding.
[0009] In one possible design, the aluminum alloy includes a silicon-aluminum alloy, a magnesium-aluminum alloy, or a copper-aluminum alloy.
[0010] In one possible design, the iron-based material includes steel or Kovar.
[0011] In one possible design, the tensile strength between the encapsulation housing and the encapsulation ring is 100–110 MPa.
[0012] In one possible design, the leakage rate between the package housing and the package ring is 1.2 × 10⁻⁶. -10 ~1.5×10 -10 Pa·m 3 / s.
[0013] Compared with the prior art, the present invention has at least the following advantages:
[0014] In this embodiment, a packaging structure made entirely of lightweight, highly thermally conductive aluminum alloy is difficult to achieve a detachable design due to the poor strength and hardness of aluminum alloy. To address this issue, an iron-based material is fixedly connected as a packaging ring at the location to be packaged within the packaging shell. After the electronic components are installed inside the packaging shell, a cover, also made of iron-based material, is sealed and connected to the packaging ring. The iron-based cover possesses high strength and hardness, capable of withstanding certain mechanical stress and impacts. During application in complex environments, it effectively protects the internal electronic components from external damage, ensuring the integrity of the packaging structure. When internal components require repair due to quality issues, only external force needs to be applied between the packaging ring and the cover to open the cover. Because of the high strength of the iron-based material, the external force will not affect the packaging shell, allowing it to continue to be used. After repair, the cover simply needs to be re-welded. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of a composite gradient electronic packaging structure of aluminum alloy and iron-based materials provided in an embodiment of this utility model.
[0017] In the picture:
[0018] 1-Encapsulation housing;
[0019] 2-Encapsulation ring;
[0020] 3-Lid body. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0022] In the description of the embodiments of this utility model, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0023] In this specification, it should be understood that the directional terms such as "upper" and "lower" used in the description of the embodiments of this utility model are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this utility model. Furthermore, in the context, it should also be understood that when it is mentioned that one element is connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected to the other element "upper" or "lower" through an intermediate element.
[0024] like Figure 1 As shown, this utility model embodiment provides a composite gradient electronic packaging structure of aluminum alloy and iron-based materials, including a packaging shell 1, a packaging ring 2 and a cover 3;
[0025] The packaging shell 1 is made of aluminum alloy and is a cylindrical body with one end closed and the other end open. Electronic components are installed inside the packaging shell 1. The open end of the packaging shell 1 is the end to be sealed. The end to be sealed is sealed with a packaging ring 2 of the same size. The packaging ring 2 is sealed with a cover 3 at one end of the packaging shell 1. Both the packaging ring 2 and the cover 3 are made of iron-based materials.
[0026] In this embodiment, the packaging structure made entirely of lightweight, highly thermally conductive aluminum alloy is difficult to achieve a detachable function because aluminum alloy has poor strength and hardness. To solve this problem, an iron-based material is fixedly connected as a packaging ring 2 at the packaging housing 1 where it is to be packaged. After the electronic components are installed inside the packaging housing 1, the cover 3, also made of iron-based material, is sealed and connected to the packaging ring 2. The iron-based cover 3 has high strength and hardness, and can withstand certain mechanical stress and impact. During the application of the material in complex environments, it can effectively protect the internal electronic components from external damage, ensuring the integrity of the packaging structure. When the internal components have quality problems and need repair, only external force needs to be applied between the packaging ring 2 and the cover 3 to open the cover. Because the iron-based material has high strength, the external force will not affect the packaging housing 1, and it can continue to be used. After the repair is completed, the cover 3 only needs to be welded back on.
[0027] In some embodiments of this utility model, the encapsulation housing 1 and the encapsulation ring 2 are brazed together.
[0028] In some embodiments of this utility model, the encapsulation shell 1 and the encapsulation ring 2 are sealed together by spark plasma sintering technology.
[0029] When fixing the iron-based material to the packaging shell 1, this application employs a high-temperature, high-pressure, and DC pulse coupling fixing method to integrally form the iron-based material and the packaging shell 1. While brazing can also be used, although iron-based materials and aluminum alloys can be bonded together by brazing, the reliability of the bond is poor, and the airtightness and strength at the joint are also weak. Therefore, this application uses a high-temperature, high-pressure, and DC pulse coupling fixing method to achieve a higher bonding strength between the iron-based material and the packaging shell 1.
[0030] In this embodiment, a DC pulse current is applied directly to the composite material to generate high temperature through the Joule heating effect, resulting in a discharge phenomenon at the contact point of the composite interface. The pulse current promotes atomic diffusion at the interface, which reduces the sintering temperature and shortens the sintering time. At the same time, under the applied pressure, a high-performance composite interface can be obtained at the composite interface.
[0031] In some embodiments of this utility model, the encapsulation ring 2 and the cover 3 are sealed together by arc welding or resistance welding.
[0032] Understandably, iron-based materials can quickly generate sufficient heat to form solder joints or welds during welding, facilitating the welding process. Furthermore, the solder joints are located in the weld area between the encapsulation ring 2 and the cover 3, and have no impact on the components inside the encapsulation housing 1. When it is necessary to open the housing, the cover can be opened by applying a certain external force along the weld.
[0033] In some embodiments of this utility model, the aluminum alloy includes silicon-aluminum alloy, magnesium-aluminum alloy, or copper-aluminum alloy.
[0034] In some embodiments of this invention, the iron-based material includes steel or Kovar.
[0035] Steel possesses high strength and hardness, enabling it to withstand certain mechanical stresses and impacts. In complex environments, it effectively protects internal electronic components from external damage, ensuring the integrity of the packaging structure. Kovar materials (also known as iron-nickel-cobalt alloys) have a low coefficient of thermal expansion. In electronic packaging, they can achieve good sealing with these insulating materials, avoiding stress at the seal due to excessive differences in thermal expansion coefficients, which could lead to seal failure or component damage.
[0036] In some embodiments of this utility model, the tensile strength between the encapsulation housing 1 and the encapsulation ring 2 is 100-110 MPa.
[0037] In some embodiments of this invention, the leakage rate between the encapsulation housing 1 and the encapsulation ring 2 is 1.2 × 10⁻⁶. -10 ~1.5×10 -10 Pa·m 3 / s.
[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A composite gradient electronic packaging structure of aluminum alloy and iron-based materials, characterized in that, It includes a housing (1), a packaging ring (2), and a cover (3); The packaging shell (1) is made of aluminum alloy and is a cylindrical body with one end closed and the other end open. Electronic components are installed inside the packaging shell (1). The open end of the packaging shell (1) is the end to be closed. The end to be closed is sealed with a packaging ring (2) of matching size. The packaging ring (2) is sealed with a cover (3) at one end of the packaging shell (1). The packaging ring (2) and the cover (3) are both made of iron-based materials.
2. The composite gradient electronic packaging structure of aluminum alloy and iron-based materials according to claim 1, characterized in that, The encapsulation housing (1) and the encapsulation ring (2) are brazed together.
3. The composite gradient electronic packaging structure of aluminum alloy and iron-based materials according to claim 1, characterized in that, The encapsulation housing (1) and the encapsulation ring (2) are sealed together by spark plasma sintering technology.
4. The composite gradient electronic packaging structure of aluminum alloy and iron-based materials according to claim 1, characterized in that, The encapsulation ring (2) and the cover (3) are sealed together by arc welding or resistance welding.
5. The composite gradient electronic packaging structure of aluminum alloy and iron-based materials according to claim 1, characterized in that, The aluminum alloy includes silicon-aluminum alloy, magnesium-aluminum alloy, or copper-aluminum alloy.
6. The composite gradient electronic packaging structure of aluminum alloy and iron-based materials according to claim 1, characterized in that, The iron-based material includes steel or Kovar.
7. The composite gradient electronic packaging structure of aluminum alloy and iron-based materials according to claim 3, characterized in that, The tensile strength between the encapsulation housing (1) and the encapsulation ring (2) is 100~110MPa.
8. The composite gradient electronic packaging structure of aluminum alloy and iron-based materials according to claim 3, characterized in that, The leakage rate between the encapsulation housing (1) and the encapsulation ring (2) is 1.2 × 10⁻⁶. -10 ~1.5×10 -10 Pa·m 3 / s.