Micro-fluidic chip clamp and micro-fluidic chip system

Abstract

The utility model provides a micro-fluidic chip clamp and a micro-fluidic chip system, and the micro-fluidic chip clamp comprises a chip installation assembly which is used for accommodating and installing a micro-fluidic chip; the chip pressing assembly is arranged on one side of the chip mounting assembly in the vertical direction and is used for pre-pressing the micro-fluidic chip; and at least one chip fixing assembly, wherein each chip fixing assembly accommodates the corresponding part of the chip mounting assembly and compresses the corresponding part of the chip compressing assembly. The pre-tightening force is provided for the micro-fluidic chip through the chip pressing assembly, and the micro-fluidic chip can be kept stable in the fixing process of the chip fixing assembly, so that the problems of electric connection failure or chip damage and the like caused by shaking of the micro-fluidic chip in the mounting process are avoided. Moreover, the chip mounting assembly, the chip pressing assembly and the chip fixing assembly are simple in mounting and dismounting modes, so that the micro-fluidic chip is not damaged in the mounting, dismounting or using process of the clamp, and the use convenience of a user is also improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to micro -fluidic chip technical field especially, relates to a kind of micro -fluidic chip clamp and micro -fluidic chip system. BACKGROUND

[0002] Micro -fluidic chip technology is to integrate the sample sampling, separation, detection etc. Basic operation unit of chemical, medical, biological analysis process to a micron scale chip, through the flow channel on micro -fluidic chip and external device common operation, realize certain biological function. Specifically, micro -fluidic chip can carry out single biological granularity level operation to less sample capacity, including movement, physical separation, apparent function analysis (such as surface protein analysis, secreted protein analysis) and target sample specified position export etc. This process uses full automation program control, with effectively reduce sample consumption, shorten time, operation standardization etc. Characteristics.

[0003] In actual use micro -fluidic chip, chip clamp is usually used to fix chip. However, since the structure of existing chip clamp is relatively simple, it is easy to damage chip during installation, disassembly or use. UTILITY MODEL CONTENTS

[0004] The utility model discloses micro -fluidic chip clamp and micro -fluidic chip system to solve the above problem.

[0005] In the first aspect, the utility model provides a kind of micro -fluidic chip clamp, it is used to fix micro -fluidic chip and include: chip installation component, for accommodating and installing micro -fluidic chip;Chip compression component is arranged in the chip installation component one side along up-down direction, for pre-compression micro -fluidic chip in the chip installation component;And at least one chip fixed component, each chip fixed component accommodates the corresponding part of the chip installation component and compresses the corresponding part of the chip compression component.

[0006] Further, each chip fixed component includes fixed plate, at least one pressing block and at least one connecting component. At least one support rod is provided on the fixed plate, each pressing block is rotatably connected with corresponding support rod by corresponding connecting component, and the pressing block is arranged to rotate to abut with the fixed plate when part of the pressing block is under external force and simultaneously compress the chip compression component.

[0007] Further, the pressing block includes driving portion, compression portion and limiting portion connected in sequence, the compression portion protrudes from the driving portion, the limiting portion protrudes from the compression portion, and the limiting portion and the compression portion protrude in the same direction. The compression portion is arranged to rotate under the driving portion when external force acts on the driving portion and compress the chip compression component when the limiting portion abuts with the fixed plate.

[0008] Further, the limiting parts are arranged in pairs, and the two limiting parts of each pair are arranged on both sides of the supporting rod, and the outer surface of each limiting part is an arc surface.

[0009] Further, the chip pressing assembly comprises a pressing plate, an elastic sealing plug and a first magnet. The pressing plate is provided with a first positioning groove for mounting the elastic sealing plug and a second positioning groove for mounting the first magnet; the elastic sealing plug is used for sealing the microfluidic chip, and the first magnet is magnetically attracted to the chip mounting assembly to pre-press the microfluidic chip in the chip mounting assembly.

[0010] Further, the pressing plate is provided with a limiting protrusion protruding in the up-down direction, which is used to limit the microfluidic chip in the up-down direction and make it horizontal.

[0011] Further, the chip mounting assembly comprises a first mounting plate, a circuit board, a second mounting plate and an insertion plate. The circuit board is provided with a probe, the second mounting plate is arranged between the circuit board and the microfluidic chip and is used to fix the probe, the insertion plate is arranged on the second mounting plate and is connected with the first mounting plate, and the insertion plate is connected with the fixing plate.

[0012] Further, the microfluidic chip clamp further comprises at least one sliding guide assembly and at least one adapter plate, and each sliding guide assembly is provided with an adapter plate on one side in the first direction. Each chip fixing assembly is slidably connected with a corresponding sliding guide assembly, and each fixing plate is arranged to be able to slide in the first direction relative to the corresponding sliding guide assembly, so that the probe can be electrically connected to the oppositely arranged adapter plate.

[0013] Further, each chip fixing assembly further comprises at least one second magnet, and each second magnet is arranged on the side of the fixing plate away from the pressing block in the up-down direction. Each sliding guide assembly comprises a sliding plate and at least one permanent magnet, the sliding plate is slidably connected with the fixing plate in the first direction, and each permanent magnet can cooperate with a corresponding second magnet to provide guidance for the sliding of the sliding plate and the fixing plate in the first direction.

[0014] Further, the microfluidic chip clamp further comprises a heat conduction assembly, the heat conduction assembly comprising a heat conduction block, a semiconductor refrigeration sheet, a heat insulation block and a mounting base plate. At least part of the heat conduction block is accommodated in the chip mounting assembly and is arranged to face the microfluidic chip, the semiconductor refrigeration sheet is arranged between the heat conduction block and the mounting base plate in the up-down direction, the heat insulation block is arranged on both sides of the semiconductor refrigeration sheet in the second direction, and the heat conduction block is connected with the heat insulation block and the mounting base plate to compress the semiconductor refrigeration sheet.

[0015] In a second aspect, the utility model provides a microfluidic chip system, it includes microfluidic chip and above-mentioned microfluidic chip clamp, the microfluidic chip clamp fixes the microfluidic chip.

[0016] The utility model has the advantages that:

[0017] In the application, the chip mounting assembly provides a receiving and mounting space and a bottom support for the microfluidic chip to realize the limiting installation of the microfluidic chip, and the chip compression assembly provides a pre-tightening force for the microfluidic chip, which can keep the microfluidic chip stable during the fixing process of the chip fixing assembly, thereby avoiding problems such as electrical connection failure or chip damage caused by shaking of the microfluidic chip during the clamp installation process. Therefore, based on the cooperation of the chip mounting assembly, the chip compression assembly and the chip fixing assembly, the application can not only quickly realize the installation and fixing of the microfluidic chip. Moreover, the installation and disassembly mode between the chip mounting assembly, the chip compression assembly and the chip fixing assembly is simple, so that the microfluidic chip will not be damaged during the clamp installation, disassembly or use process, and the user's use convenience is improved.

[0018] The utility model content part is provided to introduce the concept selection in the form of simplification, which will be further described in the specific embodiment below. The utility model content part is not intended to identify the important features or essential features of the present disclosure, nor is it intended to limit the scope of the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above and other objects, features and advantages of the present disclosure will become more apparent from the following detailed description thereof taken in conjunction with the accompanying drawings in which like reference characters designate the same components throughout the drawings, best mode for carrying out the present disclosure.

[0020] Figure 1 The structure schematic diagram of the microfluidic system of the utility model is shown;

[0021] Figure 2 The three-dimensional assembly view of the microfluidic chip clamp of the utility model is shown;

[0022] Figure 3Another micro-fluidic chip clamp of the utility model is shown in the perspective assembly view;

[0023] Figure 4 The structure schematic view of the chip fixing assembly of the utility model is shown;

[0024] Figure 5 The structure schematic view of the chip mounting assembly of the utility model is shown;

[0025] Figure 6 The structure schematic view of the chip mounting assembly before being inserted into the chip fixing assembly is shown;

[0026] Figure 7 The structure schematic view of the chip pressing assembly of the utility model is shown;

[0027] Figure 8 The structure schematic view of the sliding guide assembly and the adapter plate of the utility model is shown;

[0028] Figure 9 The structure schematic view of the chip fixing assembly before being inserted into the sliding guide assembly is shown;

[0029] Figure 10 The structure schematic view of the heat conduction assembly of the utility model is shown.

[0030] Among them, the reference signs are as follows:

[0031] 1000, micro-fluidic chip system;

[0032] 100, micro-fluidic chip clamp;

[0033] 10, chip mounting assembly; 11, first mounting plate; 12, circuit board; 13, second mounting plate; 14, insertion plate; 15, probe;

[0034] 20, chip pressing assembly; 21, pressing plate; 211, first positioning groove; 212, second positioning groove; 213, limiting protrusion; 214, observation port; 22, elastic sealing plug; 23, first magnet;

[0035] 30, chip fixing assembly; 31, fixing plate; 32, pressing block; 321, driving part; 322, pressing part; 323, limiting part; 33, connecting assembly; 331, fixing shaft; 332, locking piece; 34, supporting rod; 35, second magnet; 36, probe fixing plate;

[0036] 40, sliding guide assembly; 41, sliding plate; 411, bottom plate part; 412, first limiting part; 413, second limiting part; 42, permanent magnet;

[0037] 50, adapter plate;

[0038] 60, heat conducting component; 61, heat conducting block; 62, semiconductor refrigeration sheet; 63, heat insulation block; 64, mounting base plate;

[0039] A, plug-in sliding groove; B, plug-in protrusion; C, accommodating groove; D, open groove;

[0040] 200, microfluidic chip;

[0041] H, up-down direction; L1, first direction; L2, second direction. DETAILED DESCRIPTION

[0042] Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure is more thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art.

[0043] The term "comprising" and variations thereof as used herein are intended to mean "including but not limited to". The term "or" as used herein is intended to mean "and / or". The term "based on" is intended to mean "based, at least in part, on". The term "one example embodiment" and "an embodiment" are intended to mean "at least one example embodiment". The term "another embodiment" is intended to mean "at least one additional embodiment". The terms "first", "second", and the like as used herein can refer to different or same objects. Other explicit or implicit definitions can also be included below.

[0044] The microfluidic chip clamp and the microfluidic chip system of the embodiments of the present application will be described below with reference to Figures 1-10

[0045] Figure 1 A structural schematic diagram of the microfluidic system of the present utility model is shown.

[0046] With reference to Figure 1 , the microfluidic chip system 1000 in the embodiments of the present application includes a microfluidic chip 200 and a microfluidic chip clamp 100.

[0047] The microfluidic chip clamp 100 can provide clamping force for the microfluidic chip 200 to fix the microfluidic chip 200, and the microfluidic chip clamp 100 can be adapted to different specifications of the microfluidic chip 200.

[0048] Figure 2 A perspective assembly view of a microfluidic chip clamp of the present utility model is shown, Figure 3 A perspective assembly view of another microfluidic chip clamp of the present utility model is shown.

[0049] With reference to Figure 2 and​Figure 3 The microfluidic chip clamp 100 comprises a chip mounting assembly 10, a chip pressing assembly 20, and at least one chip fixing assembly 30.

[0050] The chip mounting assembly 10 is used to accommodate and mount the microfluidic chip 200. Specifically, the chip mounting assembly 10 is formed with a chip accommodation cavity for accommodating the microfluidic chip 200, and some electrical connection components are included in the chip mounting assembly 10 to realize electrical connection of the microfluidic chip 200 with external devices.

[0051] The chip pressing assembly 20 is arranged on one side of the chip mounting assembly 10 in the up-down direction H, and is used to pre-press the microfluidic chip 200 in the chip mounting assembly 10 in the up-down direction H.

[0052] Based on different specifications of the microfluidic chip 200, the number of chip fixing assemblies 30 can be one or more.

[0053] Specifically, for a microfluidic chip 200 of a smaller specification, the chip fixing assembly 30 is one, which accommodates the whole of the chip mounting assembly 10 and presses the chip pressing assembly 20 to further press the microfluidic chip 200 in the chip mounting assembly 10, as shown in FIG. 2B. Figure 2

[0054] For a microfluidic chip 200 of a larger specification, the chip fixing assembly 30 is multiple, and the multiple chip fixing assemblies 30 respectively accommodate corresponding parts of the chip mounting assembly 10 and press different parts of the chip pressing assembly 20 to further press the microfluidic chip 200 in the chip mounting assembly 10 by jointly pressing the chip pressing assembly 20. Exemplarily, the chip fixing assembly 30 is two, and the two chip fixing assemblies 30 press both ends of the chip pressing assembly 20, as shown in FIG. 2C. Figure 3

[0055] In this embodiment, the chip mounting assembly 10 provides an accommodation and mounting space and a bottom support for the microfluidic chip 200 to realize limited installation of the microfluidic chip 200, and the chip pressing assembly 20 provides a pre-tightening force for the microfluidic chip 200, which can keep the microfluidic chip 200 stable during the fixing process of the chip fixing assembly 30, thereby avoiding problems such as electrical connection failure or chip damage caused by shaking of the microfluidic chip 200 during clamp installation.

[0056] ​​Therefore, based on the cooperation of the chip mounting assembly 10, the chip pressing assembly 20 and the chip fixing assembly 30, the microfluidic chip 200 can be quickly mounted and fixed, and the mounting and dismounting between the chip mounting assembly 10, the chip pressing assembly 20 and the chip fixing assembly 30 is simple, so that the microfluidic chip 200 will not be damaged during the mounting, dismounting or use of the clamp, and the user's convenience is improved.

[0057] Figure 4 The structure diagram of the chip fixing assembly of the utility model is shown.

[0058] Referring to Figure 4 The chip fixing assembly 30 comprises a fixing plate 31, at least one pressing block 32 and at least one connecting assembly 33. The number of the connecting assembly 33 is consistent with the number of the pressing block 32, so as to mount a corresponding pressing block 32 on the fixing plate 31.

[0059] At least one supporting rod 34 is protrudedly arranged on the fixing plate 31 along the up-down direction H, and each pressing block 32 is rotationally connected with a corresponding supporting rod 34 through a corresponding connecting assembly 33. The supporting rod 34 can be integrally arranged with the fixing plate 31 or separately arranged and connected together.

[0060] The pressing block 32 is arranged to be rotated to press the chip pressing assembly 20 when part of the pressing block 32 abuts against the fixing plate 31 under the action of an external force.

[0061] In this embodiment, the supporting rod 34 is arranged on the fixing plate 31, and the rotational connection between the pressing block 32 and the supporting rod 34 is realized by the connecting assembly 33, so that when the pressing block 32 is acted on by an external force, the pressing block 32 can be rotated to the position where part of the pressing block 32 abuts against the fixing plate 31 and cannot continue to rotate, at this time, it indicates that it is turned to the right position, and the pressing block 32 can provide a pressing force for the chip pressing assembly 20; and the pressing block 32 is reversely rotated, and when the pressing block 32 is completely separated from the fixing plate 31, the pressing force of the pressing block 32 on the chip pressing assembly 20 can be released.

[0062] Therefore, compared with the existing clamp adopting the rotary pressing structure, based on the cooperation mode of the pressing block 32 and the fixing plate 31, the rotational position of the pressing block 32 can be well controlled to quickly realize pressing and release, which is simple in operation and improves the user's convenience.

[0063] This is because the existing clamp adopting the rotary pressing structure usually presses the chip by rotating a nut or other fastener, or drives a pressing member to press the chip after rotating the fastener, and since everyone has different standards for judging the pressing, it is not clear to what extent the rotation is considered as pressing, which causes inconvenience for users, and may also cause damage to the chip due to excessive rotation.

[0064] Specifically, the connecting assembly 33 can include a fixed shaft 331 and a locking piece 332, one end of the fixed shaft 331 is arranged through the pressing block 32 and the supporting rod 34, and the locking piece 332 is locked and connected with the fixed shaft 331 arranged through the pressing block 32 and one end of the supporting rod 34, so as to fix the pressing block 32 on the supporting rod 34 and enable the pressing block 32 to rotate relative to the fixed shaft 331.

[0065] With reference to the drawings Figure 4 continuously, the pressing block 32 includes a driving part 321, a pressing part 322 and a limiting part 323 connected in sequence.

[0066] The driving part 321 and the limiting part 323 are located at two ends of the pressing part 322, the pressing part 322 protrudes in the thickness direction of the driving part 321, the limiting part 323 protrudes in the thickness direction of the pressing part 322, and the protruding directions of the limiting part 323 and the pressing part 322 are the same. In addition, the pressing part 322 is arranged to rotate under the action of an external force on the driving part 321 and press the chip when the limiting part 323 abuts against the fixed plate 31.

[0067] In this embodiment, by arranging different parts of the pressing block 32 to have different thicknesses, the rotation position of the pressing block 32 can be limited during rotation, so that no additional limiting parts are needed, thereby helping to simplify the overall structure of the chip fixing assembly 30 and reduce the manufacturing cost of the clamp.

[0068] Further, the limiting parts 323 are arranged in pairs, and the two limiting parts 323 in each pair are arranged on both sides of the supporting rod 34 to ensure the stability of the pressing block 32 during rotation. In addition, the outer surface of each limiting part 323 is an arc surface. Therefore, during the rotation of the pressing block 32, the arc surface of the limiting part 323 can ensure the stability of the rotation, and when the top position of the arc surface abuts against the fixed plate 31, it indicates that the pressing is in place.

[0069] With reference to the drawings Figure 4 continuously, the fixed plate 31 is also provided with an open slot D, and the chip fixing assembly 30 further includes a probe fixing plate 36 arranged in the open slot D, and the probe fixing plate 36 is provided with a through hole for the probe 15 to pass through when the insertion plate 14 is inserted into the fixed plate 31.

[0070] Figure 5 A structural schematic view of a chip mounting assembly of the utility model is shown, Figure 6 A structural schematic view of the chip mounting assembly before being inserted into a chip fixing assembly is shown.

[0071] With reference to the drawings Figure 5 continuously, the chip mounting assembly 10 includes a first mounting plate 11, a circuit board 12, a second mounting plate 13 and an insertion plate 14.

[0072] The circuit board 12 is arranged above the second mounting plate 13 and is provided with the probe 15, the second mounting plate 13 is arranged between the circuit board 12 and the micro-fluidic chip 200 and is used for fixing the probe 15, that is, the micro-fluidic chip 200, the first mounting plate 11, the circuit board 12 and the second mounting plate 13 are arranged in layers, one end of the probe 15 is arranged through the second mounting plate 13 and is connected with the micro-fluidic chip 200, and the other end extends out of the circuit board 12.

[0073] The insertion plate 14 is arranged on the second mounting plate 13 and is connected with the second mounting plate 13, and the insertion plate 14 is connected with the fixed plate 31 in a plug-in mode.

[0074] In this embodiment, after the micro-fluidic chip 200 is arranged in the chip mounting assembly 10 and is pressed by the chip pressing assembly 20, the chip mounting assembly 10 can be directly inserted on the fixed plate 31 of the chip fixing assembly 30 in the first direction L1 through the insertion plate 14, so that the chip mounting assembly 10 and the chip fixing assembly 30 are quickly mounted, and the mounting efficiency is improved.

[0075] In order to further improve the mounting efficiency, the first mounting plate 11, the circuit board 12 and the second mounting plate 13 arranged in layers can be pre-assembled, and the insertion plate 14 is connected with the second mounting plate 13 in a detachable mode (such as fixed by screws). Specifically, positioning holes can be arranged on the first mounting plate 11, the circuit board 12 and the second mounting plate 13, and positioning pins are used to realize the positioning connection among the three. For example, the positioning pins are at least two, and preferably four.

[0076] Here, since the first mounting plate 11, the circuit board 12 and the second mounting plate 13 are pre-assembled, in the use process, the micro-fluidic chip 200 is placed according to the position of the pin hole on the first mounting plate 11, then the chip pressing assembly 20 is used for pre-pressing, and after completion, the chip mounting assembly 10 is inserted into the chip fixing assembly 30 through the insertion plate 14.

[0077] Referring to Figure 6 In order to realize the plug-in connection between the insertion plate 14 and the fixed plate 31, one of the insertion plate 14 and the fixed plate 31 is provided with a plug-in sliding groove A, and the other is provided with a plug-in protrusion B. Through the concave-convex cooperation between the plug-in sliding groove A and the plug-in protrusion B, positioning and quick plug-in can be realized, so that the mounting efficiency is further improved, and the assembly difficulty is simplified.

[0078] Figure 7 The structure schematic diagram of the chip pressing assembly of the utility model is shown.

[0079] Referring to Figure 7The chip pressing assembly 20 comprises a pressing plate 21, an elastic sealing plug 22 and a first magnet 23. The pressing plate 21 is provided with a first positioning groove 211 for mounting the elastic sealing plug 22 and a second positioning groove 212 for mounting the first magnet 23.

[0080] The elastic sealing plug 22 is used for sealing the microfluidic chip 200 to ensure the air tightness of the microfluidic chip 200. Specifically, the microfluidic chip 200 is usually provided with an inlet and an outlet, and the corresponding positions of the pressing plate 21 corresponding to the inlet and the outlet are provided with an elastic sealing plug 22 to seal the inlet and the outlet of the microfluidic chip 200.

[0081] The first magnet 23 is magnetically attracted to the chip mounting assembly 10 to pre-press the microfluidic chip 200 in the chip mounting assembly 10. Specifically, the first magnet 23 can be magnetically attracted to the positioning pin for pre-assembling the first mounting plate 11, the circuit board 12 and the second mounting plate 13.

[0082] In this embodiment, before the chip fixing assembly 30 does not press the microfluidic chip 200, the first magnet 23 is magnetically attracted to the chip mounting assembly 10 to enable the pressing plate 2 to pre-press the microfluidic chip 200, at this time the elastic sealing plug 22 can be in contact with the inlet or outlet on the microfluidic chip 200, and after the chip fixing assembly 30 is pressed, based on the elasticity of the elastic sealing plug 22, the elastic sealing plug 22 can be deformed and always in a pressed state, thereby realizing liquid path sealing and ensuring the air tightness of the microfluidic chip 200. Moreover, based on the cooperation of the pressing plate 21, the elastic sealing plug 22 and the first magnet 23, it can be compatible with the microfluidic chip with a non-elastic cover plate and a smaller hole (such as a hole diameter less than 0.5mm) on the cover plate and the microfluidic chip with an elastic cover plate and a larger hole (such as a hole diameter greater than 0.5mm) on the cover plate.

[0083] Specifically, in order to ensure the elasticity of the elastic sealing plug 22, the material of the elastic sealing plug 22 can be a sealing material such as silicone, rubber or fluorine rubber.

[0084] Continuing to refer to Figure 7 The pressing plate 21 is provided with a limiting protrusion 213 protruding in the up-down direction H, which is used for limiting the microfluidic chip 200 in the up-down direction H to ensure that the microfluidic chip 1 is in a horizontal state without tilting.

[0085] It should be noted that the first direction L1 is the insertion direction between the chip mounting assembly 10 and the chip fixing assembly 30, and the second direction L2 is perpendicular to the first direction L1 and the up-down direction H.

[0086] Specifically, the limiting protrusions 213 can be arranged in pairs, and the two limiting protrusions 213 in each pair can limit the microfluidic chip 200 in the up-down direction H, so as to ensure that the chip is horizontal during use.

[0087] In addition, in order to facilitate observation with an optical detection system, the pressing plate 21 can further be provided with an observation port 214.

[0088] Figure 8 A structural schematic view of a sliding guide assembly and an adapter plate of the utility model is shown, Figure 9 A structural schematic view of a chip fixing assembly before being inserted into a sliding guide assembly is shown.

[0089] Referring to Figure 8 and Figure 9 , the microfluidic chip clamp 100 further comprises a sliding guide assembly 40 and an adapter plate 50, and the adapter plate 50 is arranged on one side of the sliding guide assembly 40 in the first direction L1. The fixed plate 31 is slidably connected with the sliding guide assembly 40, and the fixed plate 31 is arranged to be capable of sliding relative to the sliding guide assembly 40 in the first direction L1, so that the probe 15 can be electrically connected to the adapter plate 50.

[0090] In this embodiment, the sliding guide assembly 40 is used for guiding, so as to realize accurate alignment connection between the probe 15 and the adapter plate 50, and improve the connection accuracy between the probe 15 and the adapter plate 50.

[0091] The chip fixing assembly 30 further comprises at least one second magnet 35, and each second magnet 35 is arranged on the side of the fixed plate 31 away from the pressing block 32 in the up-down direction H. The sliding guide assembly 40 comprises a sliding plate 41 and at least one permanent magnet 42, the sliding plate 41 is slidably connected with the fixed plate 31 in the first direction L1, and each permanent magnet 42 can cooperate with a corresponding second magnet 35 to provide guidance for the sliding of the sliding plate 41 and the fixed plate 31 in the first direction L1.

[0092] Here, the second magnet 35 and the permanent magnet 42 are guided by magnetic attraction, and when the second magnet 35 is magnetically attracted to the permanent magnet 42, the probe 15 and the adapter plate 50 are connected in place, which saves the alignment time of the probe 15 and the adapter plate 50 and improves the clamp installation efficiency.

[0093] Continuing to refer to Figure 8 and Figure 9 , the sliding plate 41 comprises a bottom plate portion 411, a first limiting portion 412 and a second limiting portion 413.

[0094] The first limiting part 412 and the second limiting part 413 protrude from the bottom plate part 411 in the up-down direction H, the first limiting part 412 is arranged at both ends of the bottom plate part 411 in the second direction L2 to limit the fixing plate 31 in the second direction L2, and the second limiting part 413 is arranged at one end of the bottom plate part 411 in the first direction L1 to limit the fixing plate 31 in the first direction L1. That is, the bottom plate part 411 forms a limiting mounting space together with the first limiting part 412 and the second limiting part 413, and the fixing plate 31 can slide relative to the sliding plate 41 to be inserted into or removed from the limiting mounting space.

[0095] The bottom plate part 411 is provided with at least one accommodation groove C on the side facing the fixing plate 31 in the up-down direction H, and the second limiting part 413 is also provided with at least one accommodation groove C on the side facing the fixing plate 31 in the first direction L1, each accommodation groove C is used to accommodate a corresponding permanent magnet 42.

[0096] Figure 10 The structure diagram of the heat conduction assembly of the utility model is shown.

[0097] Referring to Figure 10 The heat conduction assembly 60 includes a heat conduction block 61, a semiconductor refrigeration sheet 62, a heat insulation block 63 and a mounting bottom plate 64.

[0098] At least part of the heat conduction block 61 is accommodated in the chip mounting assembly 10 and arranged to face the microfluidic chip 200, the semiconductor refrigeration sheet 62 is arranged between the heat conduction block 61 and the mounting bottom plate 64 in the up-down direction H, the heat insulation block 63 is arranged on both sides of the semiconductor refrigeration sheet 62 in the second direction L2, and the heat conduction block 61 is connected with the heat insulation block 63 and the mounting bottom plate 64 to compress the semiconductor refrigeration sheet 62.

[0099] In this embodiment, the heating or refrigeration effect of the semiconductor refrigeration sheet 62 is conducted to the microfluidic chip 200 through the heat conduction block 61, so that the microfluidic chip 200 simultaneously meets the multiple functions of heating, refrigeration and power supply, which is simple and convenient.

[0100] In summary, based on the cooperation of the chip mounting assembly 10, the chip compression assembly 20 and the chip fixing assembly 30, the microfluidic chip 200 is quickly mounted and fixed, and the damage to the chip during installation, disassembly and use is avoided.

[0101] Further, based on the cooperation mode of the pressing block 32 and the fixing plate 31 in the chip fixing assembly 30, the rotating position of the pressing block 32 can be well controlled to quickly realize the pressing and unpressing, the operation is simple, and the user convenience is improved. Based on the elasticity of the elastic sealing plug 22 in the chip pressing assembly 20, the application can be compatible with the microfluidic chip with a non-elastic cover plate and a smaller hole (such as a hole diameter less than 0.5 mm) on the cover plate and the microfluidic chip with an elastic cover plate and a larger hole (such as a hole diameter greater than 0.5 mm) on the cover plate.

[0102] Moreover, based on the cooperation of the chip mounting assembly 10, the chip pressing assembly 20, the chip fixing assembly 30, the sliding guide assembly 40, the adapter plate 50 and the heat conduction assembly 60, the application realizes the integration of liquid, electricity and heat in one device to construct a microfluidic system platform that realizes the complete biological function of sample loading on the liquid path of the microfluidic chip 200, electrical driving and thermal incubation.

[0103] The above has described the embodiments of the present disclosure, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes are obvious to those skilled in the art without departing from the scope and spirit of the described embodiments. The selection of the terms used herein is intended to best explain the principles, practical application or technical improvement in the market of the embodiments, or to enable other ordinary skilled persons in the art to understand the embodiments disclosed herein.

Claims

1. A microfluidic chip clamp (100), characterized in that, A microfluidic chip (200) fixing device, the microfluidic chip clamp (100) comprises: a chip mounting assembly (10) for accommodating and mounting a microfluidic chip (200); a chip pressing assembly (20) arranged on one side of the chip mounting assembly (10) in the up-down direction (H) for pre-pressing the microfluidic chip (200) in the chip mounting assembly (10); and at least one chip fixing assembly (30), each of which accommodates a corresponding part of the chip mounting assembly (10) and presses a corresponding part of the chip pressing assembly (20).

2. The microfluidic chip clamp (100) according to claim 1, wherein each of the chip fixing assemblies (30) comprises a fixing plate (31), at least one pressing block (32), and at least one connecting assembly (33); the fixing plate (31) is provided with at least one supporting rod (34), and each of the pressing blocks (32) is rotationally connected to a corresponding one of the supporting rods (34) through a corresponding one of the connecting assemblies (33); the pressing block (32) is arranged to be rotated under the action of an external force to press the chip pressing assembly (20) when a part thereof abuts against the fixing plate (31).

3. The microfluidic chip clamp (100) according to claim 2, wherein the pressing block (32) comprises a driving portion (321), a pressing portion (322), and a limiting portion (323) connected in sequence, the pressing portion (322) protrudes from the driving portion (321), the limiting portion (323) protrudes from the pressing portion (322), and the limiting portion (323) and the pressing portion (322) protrude in the same direction; the pressing portion (322) is arranged to be rotated under the action of an external force on the driving portion (321) and to press the chip pressing assembly (20) when the limiting portion (323) abuts against the fixing plate (31).

4. The microfluidic chip clamp (100) according to claim 3, characterized in that the limiting portions (323) are arranged in pairs and sandwiched on both sides of the supporting rod (34), and the outer surface of each of the limiting portions (323) is an arc surface.

5. The microfluidic chip clamp (100) according to claim 2, wherein the chip pressing assembly (20) comprises a pressing plate (21), an elastic sealing plug (22), and a first magnet (23); the pressing plate (21) is provided with a first positioning groove (211) for mounting the elastic sealing plug (22) and a second positioning groove (212) for mounting the first magnet (23); the elastic sealing plug (22) is used to seal the microfluidic chip (200), and the first magnet (23) is magnetically attracted to the chip mounting assembly (10) to pre-press the microfluidic chip (200) in the chip mounting assembly (10).

6. The microfluidic chip cartridge (100) of claim 5, wherein, The pressing plate (21) is provided with a limiting protrusion (213) protruding in the up-down direction (H), which is used for limiting and horizontally arranging the micro-fluidic chip (200) in the up-down direction (H).

7. The micro-fluidic chip clamp (100) according to claim 2, characterized in that, The chip mounting assembly (10) comprises a first mounting plate (11), a circuit board (12), a second mounting plate (13) and an insertion plate (14); The circuit board (12) is provided with a probe (15), the second mounting plate (13) is arranged between the circuit board (12) and the micro-fluidic chip (200) and is used for fixing the probe (15), the insertion plate (14) is arranged on the second mounting plate (13) and is connected with the first mounting plate (11), and the insertion plate (14) is connected with the fixing plate (31) in a plug-in manner.

8. The micro-fluidic chip clamp (100) according to claim 7, characterized in that, The micro-fluidic chip clamp (100) further comprises at least one sliding guide assembly (40) and at least one adapter plate (50), and each sliding guide assembly (40) is provided with the adapter plate (50) on one side in a first direction (L1); Each chip fixing assembly (30) is connected with a corresponding sliding guide assembly (40) in a sliding manner, and each fixing plate (31) is arranged to be capable of sliding relative to the corresponding sliding guide assembly (40) in the first direction (L1), so that the probe (15) can be electrically connected to the adapter plate (50) arranged opposite thereto.

9. The micro-fluidic chip clamp (100) according to claim 8, characterized in that, Each chip fixing assembly (30) further comprises at least one second magnet (35), and each second magnet (35) is arranged on a side of the fixing plate (31) away from the pressing block (32) in the up-down direction (H); Each sliding guide assembly (40) comprises a sliding plate (41) and at least one permanent magnet (42), the sliding plate (41) is connected with the fixing plate (31) in the first direction (L1) in a sliding manner, and each permanent magnet (42) can cooperate with a corresponding second magnet (35) to provide guidance for the sliding of the sliding plate (41) and the fixing plate (31) in the first direction (L1).

10. The micro-fluidic chip clamp (100) according to any one of claims 1-9, characterized in that, The micro-fluidic chip clamp (100) further comprises a heat conduction assembly (60), and the heat conduction assembly (60) comprises a heat conduction block (61), a semiconductor refrigeration sheet (62), a heat insulation block (63) and a mounting bottom plate (64). At least part of the heat-conducting block (61) is accommodated in the chip mounting assembly (10) and arranged to face the microfluidic chip (200), the semiconductor refrigerating sheet (62) is arranged between the heat-conducting block (61) and the mounting bottom plate (64) in the up-down direction (H), the heat-insulating block (63) is arranged on both sides of the semiconductor refrigerating sheet (62) in the second direction (L2), and the heat-conducting block (61) is connected with the heat-insulating block (63) and the mounting bottom plate (64) to compress the semiconductor refrigerating sheet (62).

11. A microfluidic chip system, characterized by The microfluidic chip clamp (100) of any one of claims 1-10 is used for fixing the microfluidic chip (200).

Images