Spraying device for semiconductor wafer

Abstract

The utility model discloses a spraying device for a semiconductor wafer, which comprises a fixed seat provided with a plurality of groups of mounting holes; the nozzle assembly comprises a connecting part which is movably inserted into the mounting hole, the two ends of the connecting part extend to the outer part of the mounting hole, and a mounting ring is integrally formed on the surface of the connecting part and is positioned below the fixed seat. The nozzle assembly can be conveniently connected with other parts, the mounting ring is located below the fixing base, the connecting piece on the mounting ring is clamped with the bottom of the fixing base, the nozzle assembly is conveniently and rapidly fixed to the fixing base through the clamping connection mode, and meanwhile the nozzle assembly can be easily disassembled when needing to be replaced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor equipment especially relates to be used for semiconductor wafer's spraying device. BACKGROUND

[0002] In the semiconductor manufacturing process, the photoetch process is a very key link, and its core lies in uniformly covering the wafer surface with photoresist, and then projecting the pattern accurately on the photoresist by means of ultraviolet light or laser through the mask, and finally forming the pattern required by integrated circuit (IC) on the wafer surface. As a key component of photoresist, photoresist plays an indispensable role in manufacturing complex micro-patterns due to its high resolution and excellent chemical stability.

[0003] At present, most of the photoresist spraying equipment on the market adopts an integrated nozzle structure. This structure has obvious drawbacks. Because the photoresist has large single spraying discharge capacity and high viscosity, the nozzle is easily contaminated. Once the nozzle is contaminated, it is difficult to clean and replace, which undoubtedly slows down the spraying efficiency of wafer photoresist. Therefore, a spraying device for semiconductor wafer is proposed to solve this problem. SUMMARY

[0004] The utility model provides the following technical scheme in view of the deficiency of prior art.

[0005] The spraying device for semiconductor wafer comprises:

[0006] A fixing seat is provided with a plurality of mounting holes;

[0007] A nozzle assembly comprises a connecting part movably inserted into the mounting hole, both ends of the connecting part extend to the outside of the mounting hole, and an installation ring is integrally formed on the surface of the connecting part and below the fixing seat, a connecting piece is fixedly connected to the top of the installation ring on both sides of the connecting part, and the connecting piece is snap-connected with the bottom of the fixing seat.

[0008] A photoresist hose is screwed onto the top of the connecting part.

[0009] As an improvement of the above technical scheme, the connecting part comprises a connecting pipe matched with the mounting hole, an enlarged pipe communicated with the bottom of the connecting pipe, and a spray head communicated with the bottom of the enlarged pipe, and the installation ring is arranged on the enlarged pipe.

[0010] As an improvement of the above technical scheme, an enlarged hole is communicated with the bottom of the mounting hole in the fixing seat, and the enlarged hole is matched with the enlarged pipe.

[0011] As the improvement of the above technical scheme, the connecting piece comprises a plug rod integrally formed with the mounting ring, a mounting groove is formed in the plug rod, a limiting column is movably inserted on both sides of the mounting groove, a spring is arranged between the two limiting columns, and the limiting column is in a hemispherical structure at the end far from the mounting groove.

[0012] As the improvement of the above technical scheme, the fixing seat is provided with plug holes on both sides of the mounting hole at the bottom, and the plug holes are adapted to the plug rod.

[0013] As the improvement of the above technical scheme, the fixing seat is provided with a fixing sleeve at the top and around the mounting hole, and the diameter of the fixing sleeve is greater than that of the photoresist soft tube.

[0014] The present application has the following beneficial effects:

[0015] The two ends of the connecting part extend out of the mounting hole, facilitating the connection with other components, the mounting ring is located below the fixing seat, the connecting piece on the mounting ring is clamped with the bottom of the fixing seat, the clamping connection mode can conveniently and quickly fix the nozzle assembly on the fixing seat, and the nozzle assembly can also be easily disassembled when it needs to be replaced. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a main view of the overall structure of the present application.

[0017] Figure 2 It is a structure schematic view of the nozzle assembly of the present application.

[0018] Figure 3 It is a partial structure sectional view of the fixing seat of the present application.

[0019] Figure 4 It is a structure schematic view of the present application Figure 1 It is an enlarged structure schematic view of position A.

[0020] Reference signs: 10, fixing seat; 11, mounting hole; 12, enlarged hole; 13, plug hole; 14, limiting hole; 15, fixing sleeve; 20, nozzle assembly; 21, connecting pipe; 22, enlarged pipe; 23, mounting ring; 24, connecting piece; 241, plug rod; 242, mounting groove; 243, limiting column; 244, spring; 25, nozzle; 30, photoresist soft tube. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below with reference to the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application, and are not used to limit the present application.

[0022] A spraying device for semiconductor wafers comprises:

[0023] A fixed seat 10 is provided with a plurality of mounting holes 11;

[0024] A nozzle assembly 20 comprises a connecting part movably inserted into the mounting holes 11, both ends of the connecting part extending to the outside of the mounting holes, the surface of the connecting part being integrally formed with a mounting ring 23 below the fixed seat 10, the top of the mounting ring 23 being fixedly connected with connecting pieces 24 on both sides of the connecting part, and the connecting pieces 24 being clampedly connected with the bottom of the fixed seat 10.

[0025] A photoresist hose 30 is threadedly sleeved on the top of the connecting part.

[0026] Both ends of the connecting part extending out of the mounting holes facilitate the connection with other components, the mounting ring 23 is below the fixed seat 10, the connecting pieces 24 on the mounting ring 23 are clampedly connected with the bottom of the fixed seat 10, this clamped connection mode facilitates the fixing of the nozzle assembly 20 on the fixed seat 10, and when the nozzle assembly needs to be replaced, the nozzle assembly can also be easily disassembled, after the connecting part is inserted into the mounting hole 11 from below the fixed seat 10, the photoresist hose 30 is threadedly sleeved on the top of the connecting part, the photoresist is transported to the connecting part through the photoresist hose 30, due to the tight threadedly connection mode, the photoresist leakage can be effectively prevented, the photoresist can be ensured to be transported along the predetermined path, when the device works, the photoresist flows from the photoresist hose 30 to the nozzle assembly 20, and finally sprays out from the bottom of the nozzle assembly 20 to spray the semiconductor wafer below, since the nozzle assembly 20 and the fixed seat 10 are relatively independent components, through the clamped connection, when the nozzle assembly 20 is contaminated, the photoresist hose 30 is disassembled from the connecting part, the connecting pieces 24 are separated from the fixed seat 10, the nozzle assembly can be conveniently cleaned or replaced, the problem that the nozzle of the traditional structure is easy to be contaminated and inconvenient to be cleaned or replaced is solved, and the photoresist spraying efficiency of the semiconductor wafer is improved.

[0027] In one embodiment, referring to Figure 2 and Figure 4 The connecting pieces 24 comprise an insertion rod 241 integrally formed with the mounting ring 23, the insertion rod 241 is provided with a mounting groove 242, the mounting groove 242 is movably inserted with limiting columns 243 on both sides, a spring 244 is arranged between the two limiting columns 243, the end of the limiting column 243 away from the mounting groove 242 is in a semispherical structure, the bottom of the fixed seat 10 is provided with insertion holes 13 on both sides of the mounting holes 11, the insertion holes 13 are adapted to the insertion rod 241, and the inside of the fixed seat 10 is provided with limiting holes 14 on both sides of the insertion holes 13, the limiting holes 14 are adapted to the limiting columns 243.

[0028] Specifically, after the connecting part is inserted into the mounting hole 11, the insertion rod 241 is aligned with the insertion hole 13 on both sides of the mounting hole 11 at the bottom of the fixing seat 10, the connecting part is pushed to move upward, and the insertion rod 241 is inserted into the insertion hole 13. During the insertion of the insertion rod 241, the inner wall of the insertion hole 13 will extrude the limiting column 243, and this extrusion will make the limiting column 243 extrude the spring 244 to shrink into the mounting groove 242. When the limiting column 243 is aligned with the limiting hole 14 in the fixing seat 10, at this time the spring 244 rebounds, the limiting column 243 is pushed into the limiting hole 14, thereby realizing the firm clamping connection of the nozzle assembly 20 and the fixing seat 10. Since the end of the limiting column 243 away from the mounting groove 242 is a hemispherical structure, during the disengagement of the limiting column 243 and the limiting hole 14, the limiting column 243 can move into the mounting groove 242 under the pushing action of the inner wall of the limiting hole 14.

[0029] In one embodiment, referring to Figure 2 , the connecting part comprises a connecting pipe 21 matched with the mounting hole 11, an enlarged pipe 22 communicated and arranged at the bottom of the connecting pipe 21, and a spray head 25 communicated and arranged at the bottom of the enlarged pipe 22. The mounting ring 23 is arranged on the enlarged pipe 22. The enlarged hole 12 is communicated and arranged in the fixing seat 10 and below the mounting hole 11, and the enlarged hole 12 is matched with the enlarged pipe 22.

[0030] Specifically, referring to Figure 1 , Figure 2 and Figure 3 The connecting pipe 21 is matched with the mounting hole 11 and movably inserted therein. The connecting pipe 21 ensures the installation and positioning of the nozzle assembly 20 on the fixing seat 10. The enlarged pipe 22 is communicated with the bottom of the connecting pipe 21, and the mounting ring 23 is arranged on the enlarged pipe 22. The cooperation of the enlarged pipe 22 and the enlarged hole 12 can further accurately position the nozzle assembly 20. The top of the connecting pipe 21 is threadedly connected with the photoresist hose 30, so that it can be limited in the vertical direction, providing additional support and stability to prevent the connecting part from loosening or falling off during use. The spray head 25 is the end component of the connecting part, responsible for spraying the photoresist. The diameter of the photoresist hose 30 is greater than the diameter of the mounting hole 11.

[0031] In one embodiment, referring to Figure 3 , the fixing sleeve 15 is arranged at the top of the fixing seat 10 and around the mounting hole 11, and the diameter of the fixing sleeve 15 is greater than the diameter of the photoresist hose 30.

[0032] Specifically, the fixing sleeve 15 can protect the connection position of the light blocking hose 30 and the connecting pipe 21 from external collision during use, and can guide the light blocking hose 30 to accurately connect with the connecting pipe 21 and assist in fixing the light blocking hose 30 to enhance the stability of the connection.

[0033] The above examples are only used to illustrate the technical solutions of the present application, and not to limit it.

Claims

1. A spray device for a semiconductor wafer, characterized by, Include: The fixed seat (10) is provided with a plurality of groups of mounting holes (11); The nozzle assembly (20) includes a connecting part movably inserted into the mounting hole (11), both ends of the connecting part extend to the outside of the mounting hole, the surface of the connecting part is integrally formed below the fixed seat (10) and provided with a mounting ring (23), the top of the mounting ring (23) is fixedly connected with a connecting piece (24) on both sides of the connecting part, and the connecting piece (24) is clamped and connected with the bottom of the fixed seat (10); The light blocking hose (30) is screwed onto the top of the connecting part.

2. The spray device for a semiconductor wafer according to claim 1, characterized by: The connecting part includes a connecting pipe (21) matched with the mounting hole (11), an expanded pipe (22) communicated and arranged at the bottom of the connecting pipe (21), and a spray head (25) communicated and arranged at the bottom of the expanded pipe (22), and the mounting ring (23) is arranged on the expanded pipe (22).

3. The spray device for a semiconductor wafer according to claim 2, characterized by: The expanded hole (12) is communicated and arranged inside the fixed seat (10) and below the mounting hole (11), and is matched with the expanded pipe (22).

4. The spray device for a semiconductor wafer according to claim 1, characterized by: The connecting piece (24) includes an insertion rod (241) integrally formed with the mounting ring (23), the insertion rod (241) is provided with a mounting groove (242) inside, the mounting groove (242) is movably inserted with a limiting column (243) on both sides, a spring (244) is arranged between the two limiting columns (243), and the limiting column (243) is semispherical at one end away from the mounting groove (242).

5. The spray device for a semiconductor wafer according to claim 4, characterized by: The bottom of the fixed seat (10) and located on both sides of the mounting hole (11) is provided with a plug hole (13) matched with the insertion rod (241), and the inside of the fixed seat (10) and located on both sides of the plug hole (13) is provided with a limiting hole (14) matched with the limiting column (243).

6. The spray device for a semiconductor wafer according to claim 1, characterized by: The top of the fixed seat (10) and located around the mounting hole (11) is provided with a fixed sleeve (15), and the diameter of the fixed sleeve (15) is greater than the diameter of the light blocking hose (30).

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