Semiconductor wafer polishing device

Abstract

The utility model relates to the technical field of semiconductor wafer processing, and discloses a semiconductor wafer polishing device which comprises a polishing table and a vacuum porous wafer bearing table, a fixing frame is fixedly installed on the rear side of the surface of the polishing table, a hydraulic cylinder is fixedly installed on the top of the fixing frame, a polishing assembly is fixedly installed at the output end of the hydraulic cylinder, and the vacuum porous wafer bearing table is fixedly installed on the polishing assembly. A turnover collecting device is fixedly installed on the surface of the polishing table, an intermittent rotating device is arranged above the turnover collecting device and comprises an installation frame, multiple sets of wafers are placed on a vacuum porous wafer bearing table, a hydraulic cylinder drives a polishing assembly to move up and down accurately, efficient polishing is achieved, meanwhile, a motor in the installation frame drives a drive plate to rotate, and the drive plate is driven by a motor to rotate. Through cooperation of the cylindrical pin and the radial groove and cooperation of the convex arc and the locking arc, the grooved wheel is driven to intermittently rotate, the vacuum porous wafer bearing table is driven to be periodically positioned, wafers are sequentially rotated to the position below the polishing assembly, cyclic polishing of the multiple wafers is completed, and the machining efficiency is remarkably improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor wafer processing, in particular to a semiconductor wafer polishing device. BACKGROUND

[0002] The semiconductor wafer is a kind of micro electronic assembly made of semiconductor material, usually used in integrated circuit, it is one of the core basic components in electronic equipment, semiconductor wafer is usually made of silicon material, production steps include polishing, and polishing device is needed to polish the outer edge of wafer.

[0003] Applicant finds that Chinese patent discloses "a kind of semiconductor wafer edge grinding device", and its publication (announcement) number is "CN220699105U", the patent mainly includes machine table, the upper surface of machine table is fixedly connected with support, the middle part of support is provided with polishing mechanism, the utility model can be driven by first motor Elliptical plate rotates ninety degrees, elliptical plate rotates simultaneously drives slide rod to slide in the inside of sliding groove, to further will pull down piston rod, the pressure in trachea reduces, semiconductor wafer is adsorbed on suction disc, reaches the effect of adsorbing semiconductor wafer, simultaneously will not cause damage to the outer surface of semiconductor wafer, but the above-mentioned technology can only polish single semiconductor wafer each time, after polishing, semiconductor wafer is taken out, and another wafer is placed to polish, greatly reduce work efficiency, for this, we propose a kind of semiconductor wafer polishing device. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of semiconductor wafer polishing device, to solve the problem that only single semiconductor wafer can be polished each time, after polishing, semiconductor wafer is taken out, and another wafer is placed to polish, greatly reduce work efficiency.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a kind of semiconductor wafer polishing device, including polishing table and vacuum porous wafer support table, the surface rear side of the polishing table is fixedly installed with fixed frame, and the top of fixed frame is fixedly installed with hydraulic cylinder, the output end of hydraulic cylinder is fixedly installed with polishing assembly, the surface of the polishing table is fixedly installed with turnover collection device, and the upper portion of turnover collection device is equipped with intermittent rotating device, the intermittent rotating device includes mounting bracket, the inside left end of mounting bracket is fixedly installed with dial through motor and motor shaft, and the inside right end of mounting bracket is rotatably connected with rotating column, the surface center of dial is fixedly installed with convex arc, and the surface one side of dial is fixedly installed with cylindrical pin, the top of rotating column is fixedly installed with grooved wheel, the surface of grooved wheel is fixedly installed with a plurality of support columns distributed in circumferential array, the vacuum porous wafer support table is fixedly installed on the top of a plurality of support columns.

[0006] As a preferred scheme, a plurality of locking arcs in circumferential array are arranged on the circumferential surface of the groove wheel, and a plurality of radial grooves in circumferential array are arranged on the surface of the groove wheel.

[0007] As a preferred scheme, the locking arcs are matched with convex arcs, and the radial grooves are matched with cylindrical pins.

[0008] As a preferred scheme, the turnover collecting device comprises two groups of mounting plates and fixing plates fixedly installed on the surface of the polishing table, the fixing plate is arranged on the right surface of the polishing table, a rotating motor is fixedly installed on the right outer surface of the fixing plate, a collecting groove is arranged on the surface of the polishing table and below the vacuum porous wafer supporting table, and slide rails are fixedly installed on the bottom surface of the polishing table and on both sides of the collecting groove.

[0009] As a preferred scheme, the turnover collecting device further comprises a turnover plate, an arc-shaped protrusion is fixedly installed at the bottom axial center of the turnover plate, a rotating shaft is fixedly installed at the output end of the rotating motor, the rotating shaft is fixedly installed in the arc-shaped protrusion, one end of the rotating shaft away from the rotating motor is rotationally connected to the surface of the left mounting plate, and a plurality of reinforcing members are fixedly installed between the two sides of the arc-shaped protrusion and the bottom surface of the turnover plate.

[0010] As a preferred scheme, slide strips are slidingly connected in the interiors of the two groups of slide rails, and a collecting box is fixedly installed between the two groups of slide strips and on the front outer surface of the collecting box.

[0011] The technical effects and advantages of the utility model are as follows:

[0012] 1. By setting the intermittent rotating device, a plurality of wafers are arranged on the vacuum porous wafer supporting table, the polishing assembly is driven by the hydraulic cylinder to move up and down accurately, efficient polishing is realized, meanwhile, the motor in the mounting frame drives the dial to rotate, the cooperation of the cylindrical pin and the radial groove, the convex arc and the locking arc drives the intermittent rotation of the groove wheel, and the vacuum porous wafer supporting table is periodically positioned, so that the wafers are sequentially rotated below the polishing assembly, the multi-wafer cycle polishing is completed, and the processing efficiency is significantly improved.

[0013] 2. By setting the turnover collecting device, the two groups of mounting plates and the fixing plate form a stable support structure, the rotating motor on the fixing plate drives the arc-shaped protrusion at the bottom of the turnover plate through the rotating shaft, the turnover action is realized, after the wafer polishing is completed, the turnover plate automatically collects the wafers in the collecting groove below the vacuum porous wafer supporting table, in addition, the collecting box is slidingly matched with the slide strips and the slide rails, the operator can conveniently pull out the collecting box through the pull block, the polished wafers are cleaned, and the operation efficiency and the maintenance convenience are improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a three-dimensional structure schematic view of the utility model;

[0015] Figure 2 Part structure schematic view of the present application;

[0016] Figure 3 Right view sectional structure schematic view of the present application;

[0017] Figure 4 Turnover collecting device structure schematic view of the present application;

[0018] Figure 5 Intermittent rotating device structure schematic view of the present application;

[0019] Figure 6 Intermittent rotating device structure schematic view of the present application.

[0020] In the figure: 1, polishing table; 2, fixed frame; 3, hydraulic cylinder; 4, polishing assembly; 5, vacuum porous piece supporting table; 6, intermittent rotating device; 7, turnover collecting device; 8, supporting column; 9, collecting groove; 601, mounting frame; 602, rotating column; 603, dial; 604, convex arc; 605, cylindrical pin; 606, grooved wheel; 607, locking arc; 608, radial groove; 701, fixed plate; 702, mounting plate; 703, rotating motor; 704, turnover plate; 705, arc-shaped protrusion; 706, reinforcing member; 707, rotating shaft; 708, sliding rail; 709, sliding bar; 710, collecting box. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0022] Please refer to the drawings in the embodiments of the present application, Figure 1 the drawings in the embodiments of the present application, Figure 3 the drawings in the embodiments of the present application, Figure 5 the drawings in the embodiments of the present application, Figure 6The utility model provides a kind of semiconductor wafer polishing device, including polishing table 1 and vacuum porous wafer support table 5, the surface rear side of polishing table 1 is fixedly installed with fixed frame 2, and the top of fixed frame 2 is fixedly installed with hydraulic cylinder 3, the output end of hydraulic cylinder 3 is fixedly installed with polishing assembly 4, the surface of polishing table 1 is fixedly installed with turnover collection device 7, and the upper side of turnover collection device 7 is equipped with intermittent rotation device 6, intermittent rotation device 6 includes mounting bracket 601, the inside left end of mounting bracket 601 is fixedly installed with dial 603 by motor and motor shaft, and the inside right end of mounting bracket 601 is rotatably connected with rotating column 602, the surface center of dial 603 is fixedly installed with convex arc 604, and the surface side of dial 603 is fixedly installed with cylindrical pin 605, the top of rotating column 602 is fixedly installed with grooved wheel 606, the surface of grooved wheel 606 is fixedly installed with a plurality of support columns 8 in circumferential array distribution, vacuum porous wafer support table 5 is fixedly installed on the top of a plurality of support columns 8, polishing table 1 is as the basis bearing component of whole device, provides stable mounting platform for fixed frame 2, turnover collection device 7 etc.;Fixed frame 2 is installed in the rear side of polishing table 1, for firm support hydraulic cylinder 3, hydraulic cylinder 3 can accurately control the up-and-down movement of polishing assembly 4, to accurately adjust polishing intensity and position, realize the efficient and accurate polishing operation to semiconductor wafer, polishing assembly 4 is usually composed of motor and transmission shaft and polishing head, it is prior art, this paper does not make too much repetition, vacuum porous wafer support table 5 is equipped with multiple placement areas, can place multiple semiconductor wafers simultaneously.

[0023] A plurality of locking arcs 607 are arranged in circumferential array distribution on the circumferential surface of the grooved wheel 606, a plurality of radial grooves 608 are arranged in circumferential array distribution on the surface of the grooved wheel 606, the locking arcs 607 are matched with the convex arcs 604, the radial grooves 608 are matched with the cylindrical pins 605, the radial grooves 608 on the surface of the grooved wheel 606 are matched with the cylindrical pins 605 on the dial 603, when the dial 603 rotates, the cylindrical pins 605 are embedded in the radial grooves 608, to drive the grooved wheel 606 to rotate, and the intermittent rotation function of the grooved wheel 606 is realized by the cooperation of the two.

[0024] Specifically, a plurality of wafers are placed on a plurality of placement positions of the vacuum porous wafer support table 5, the hydraulic cylinder 3 drives the polishing assembly 4 to move up and down, to accurately control the polishing intensity and position, to efficiently polish the semiconductor wafers, the motor in the mounting bracket 601 drives the dial 603 to rotate, the cylindrical pins 605 on the dial 603 are matched with the radial grooves 608 of the grooved wheel 606, the convex arcs 604 are matched with the locking arcs 607, to realize the intermittent rotation of the grooved wheel 606, to drive the vacuum porous wafer support table 5 fixed on the support columns 8 to intermittently rotate, to lock the rotation after a certain angle of rotation, to rotate the wafers placed on the vacuum porous wafer support table 5 to be directly below the polishing assembly 4, to rotate the wafers on the vacuum porous wafer support table 5 in turn, to improve the work efficiency.

[0025] Please refer to the attached drawings Figure 1 - attached Figure 4 The turnover collection device 7 includes two sets of mounting plates 702 fixedly installed on the surface of the polishing table 1 and a fixed plate 701, the fixed plate 701 is arranged on the right surface of the polishing table 1, a rotating motor 703 is fixedly installed on the right outer surface of the fixed plate 701, a collection groove 9 is arranged on the surface of the polishing table 1 directly below the vacuum porous wafer support table 5, and slide rails 708 are fixedly installed on the bottom surface of the polishing table 1 and located on both sides of the collection groove 9. The surface of the polishing table 1 is provided with the collection groove 9 directly below the vacuum porous wafer support table 5, which facilitates the falling of the polished wafer. The bottom surface of the polishing table 1 is provided with the slide rails 708 on both sides of the collection groove 9, which provides guidance for the sliding of the collection box 710.

[0026] The turnover collection device 7 further includes a turnover plate 704, an arc-shaped protrusion 705 is fixedly installed at the bottom axial center of the turnover plate 704, a rotating shaft 707 is fixedly installed at the output end of the rotating motor 703, and the rotating shaft 707 is fixedly installed in the arc-shaped protrusion 705. One end of the rotating shaft 707 away from the rotating motor 703 is rotatably connected to the surface of the left mounting plate 702, a plurality of reinforcing members 706 are fixedly installed between the two sides of the arc-shaped protrusion 705 and the bottom surface of the turnover plate 704, the arc-shaped protrusion 705 at the bottom axial center of the turnover plate 704 is fixedly connected with the rotating shaft 707 at the output end of the rotating motor 703, and the other end of the rotating shaft 707 is rotatably connected with the left mounting plate 702, so that the turnover plate 704 can be turned over under the driving of the rotating motor 703. The plurality of reinforcing members 706 between the two sides of the arc-shaped protrusion 705 and the bottom surface of the turnover plate 704 enhance the structural strength of the turnover plate 704.

[0027] The inner portions of the two sets of slide rails 708 are slidably connected with slide bars 709, and the collection box 710 is fixedly installed between the two slide bars 709, and a pull block is fixedly installed on the front outer surface of the collection box 710. The slide bars 709 can smoothly slide in the slide rails 708, the two slide bars 709 are connected with the collection box 710, so that the collection box 710 can be smoothly pulled out or pushed in along the slide rails 708. After the vacuum pump is turned off, the wafers on the turnover plate will fall into the collection groove 9 under the action of gravity, and finally fall into the collection box 710 connected with the slide bars 709.

[0028] Specific, two sets of mounting plate 702 and fixed plate 701 provide stable support for the overall structure, the rotating motor 703 on the fixed plate 701 through the rotating shaft 707 driven flip plate 704 bottom arc-shaped lug 705 rotation, realize the flip plate 704 flip action, after the semiconductor wafer polishing is completed, can be collected from the flip wafer under the vacuum porous wafer table 5 collection tank 9, high degree of automation, improve the efficiency of wafer collection, collection box 710 through the slide bar 709 and slide rail 708 sliding connection, convenient to pull out and push in, when the collection box 710 collection a certain number of polished wafer, can be easily pulled out by pulling block collection.

[0029] The utility model works: the utility model is a kind of semiconductor wafer polishing device, when the semiconductor wafer polishing device works, first, multiple wafers are placed in multiple placing positions of vacuum porous wafer table 5 respectively, vacuum pump in vacuum porous wafer table 5 is opened, wafer is adsorbed, starting device, hydraulic cylinder 3 drives polishing assembly 4 to move up and down, accurately control polishing strength and position, polish wafer, after polishing a group of wafers, motor in mounting bracket 601 drives dial 603 rotation, cylindrical pin 605 on dial 603 and radial slot 608 of slot wheel 606 are adapted, convex arc 604 and locking arc 607 are adapted, make slot wheel 606 intermittent rotation, in turn drive vacuum porous wafer table 5 intermittent rotation, the wafer in different positions is rotated to the polishing assembly 4 directly below, realize rotation polishing, after polishing, rotating motor 703 on fixed plate 701 drives arc-shaped lug 705 at the bottom of flip plate 704 rotation, flip plate 704 flips, polished wafer is collected from the collection tank 9 below vacuum porous wafer table 5, falls into collection box 710, when collection box 710 collects a certain number of polished wafers, can be pulled out slide bar 709 along slide rail 708, collection box 710 is pulled out uniform collection, thus, the whole process ends.

[0030] Finally, it should be noted that: the above only for preferred embodiment of the utility model and does not limit the utility model, although the utility model is described in detail with reference to the foregoing embodiments, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or equivalent replacement to part of technical features, any modification, equivalent replacement, improvement etc. made within the spirit and principles of the utility model, should be included in the protection scope of the utility model.

Claims

1. A semiconductor wafer polishing apparatus comprising a polishing table (1) and a vacuum porous wafer support table (5), characterized in that: The surface rear side of the polishing table (1) is fixedly installed with a fixing frame (2), and the top of the fixing frame (2) is fixedly installed with a hydraulic cylinder (3), and the output end of the hydraulic cylinder (3) is fixedly installed with a polishing assembly (4), and the surface of the polishing table (1) is fixedly installed with a turnover collecting device (7), and the upper side of the turnover collecting device (7) is provided with an intermittent rotating device (6), and the intermittent rotating device (6) comprises a mounting frame (601), and the inside left end of the mounting frame (601) is fixedly installed with a dial (603) through a motor and a motor shaft, and the inside right end of the mounting frame (601) is rotatably connected with a rotating column (602), and the surface center of the dial (603) is fixedly installed with a convex arc (604), and the surface side of the dial (603) is fixedly installed with a cylindrical pin (605), and the top of the rotating column (602) is fixedly installed with a grooved wheel (606), and the surface of the grooved wheel (606) is fixedly installed with a plurality of support columns (8) distributed in a circumferential array, and the vacuum porous sheet supporting table (5) is fixedly installed on the top of the plurality of support columns (8).

2. A semiconductor wafer polishing apparatus according to claim 1, wherein: A plurality of locking arcs (607) are arranged on the circumferential surface of the grooved wheel (606) in a circumferential array, and a plurality of radial grooves (608) are arranged on the surface of the grooved wheel (606) in a circumferential array.

3. A semiconductor wafer polishing apparatus as set forth in claim 2, wherein: The locking arcs (607) are matched with the convex arcs (604), and the radial grooves (608) are matched with the cylindrical pins (605).

4. The semiconductor wafer polishing apparatus of claim 1, wherein: The turnover collecting device (7) comprises two groups of mounting plates (702) and a fixed plate (701) fixedly installed on the surface of the polishing table (1), the fixed plate (701) is arranged on the right surface of the polishing table (1), the right outer surface of the fixed plate (701) is fixedly installed with a rotating motor (703), the surface of the polishing table (1) and below the vacuum porous sheet supporting table (5) is provided with a collecting groove (9), and the bottom surface of the polishing table (1) and on both sides of the collecting groove (9) are fixedly installed with sliding rails (708).

5. The apparatus of claim 4 wherein: The turnover collecting device (7) further comprises a turnover plate (704), the bottom shaft center of the turnover plate (704) is fixedly installed with an arc-shaped protrusion (705), the output end of the rotating motor (703) is fixedly installed with a rotating shaft (707), and the rotating shaft (707) is fixedly installed in the arc-shaped protrusion (705), one end of the rotating shaft (707) away from the rotating motor (703) is rotatably connected to the surface of the left mounting plate (702), and a plurality of reinforcing members (706) are fixedly installed between the two sides of the arc-shaped protrusion (705) and the bottom surface of the turnover plate (704).

6. The apparatus of claim 4 wherein: The inside of the two groups of sliding rails (708) is slidably connected with sliding bars (709), the two groups of sliding bars (709) are fixedly installed with a collecting box (710), and the front outer surface of the collecting box (710) is fixedly installed with a pull block.

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