Quartz wafer cutting equipment
By combining the limit plate and proximity switch, the advancing distance of the propulsion cylinder is precisely controlled, which solves the problem of difficulty in controlling the cutting thickness of quartz wafers in existing equipment, realizes continuous cutting of quartz wafers with constant thickness, and improves the stability and consistency of the cutting process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2026-04-10
AI Technical Summary
Existing quartz cutting equipment has difficulty controlling the advance distance of the crystal ball, making it difficult to control the cutting thickness of quartz wafers.
By employing a combination of a limit plate and a proximity switch, the advancing distance of the hydraulic cylinder is precisely controlled through the position adjustment of the limit plate and the sensing of the proximity switch. Combined with the movable clamping mechanism and the fixed clamping mechanism, the crystal weight is clamped and fixed to ensure the consistency and continuity of the cutting thickness.
It enables precise control of the cutting thickness of quartz wafers and continuous cutting, improving the stability and consistency of the cutting process.
Smart Images
Figure CN224103227U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to quartz wafer processing technical field, concretely is a kind of quartz wafer cutting equipment. BACKGROUND
[0002] When quartz crystal resonator is manufactured, quartz crystal weight is cut into quartz wafer, and copper-plated steel wire cutting is currently commonly used quartz wafer cutting method.In the slicing process of crystal weight, the crystal weight is moved by a set distance by the driving of the driving mechanism, and the continuity of the crystal weight is realized by the rotation of the copper-plated steel wire.The existing quartz cutting equipment is not easy to control the driving distance of the crystal weight, so that the cutting thickness of the quartz wafer is not easy to control. UTILITY MODEL CONTENTS
[0003] In view of the above situation, in order to overcome the defects of the prior art, the utility model provides a quartz wafer cutting equipment to at least partially solve the problems in the background art.
[0004] The utility model provides the following technical scheme: the utility model provides a kind of quartz wafer cutting equipment, comprising:
[0005] Bottom plate, one end is fixed with driving cylinder;
[0006] Crystal weight clamping mechanism, including movable clamping mechanism and fixed clamping mechanism, the fixed clamping mechanism is fixed at the end of the bottom plate away from driving cylinder, the free end of the driving cylinder is fixedly connected with movable fixed mechanism, and the movable fixed mechanism is driven to move relative to the fixed clamping mechanism by the driving of the driving cylinder;
[0007] Supporting guide roller, rotationally arranged on the bottom plate, the supporting guide roller is located between movable clamping mechanism and fixed clamping mechanism, and the supporting guide roller is used to support and convey the crystal weight;
[0008] Cutting mechanism, the cutting mechanism is arranged above supporting guide roller and fixed clamping mechanism;
[0009] Wherein, the fixed clamping mechanism is movably provided with limit plate, the limit plate is configured to be adjustable relative to the position of cutting mechanism, the limit plate is provided with proximity switch, and the proximity switch is electrically connected with driving cylinder.
[0010] It should be noted that the cutting mechanism used in the embodiment is the existing copper-plated steel wire cutting mechanism, and the height of the cutting mechanism can be raised and lowered by the driving of the lifting cylinder, and the crystal weight is cut from top to bottom when the cutting mechanism is lowered.The above structure and function are mature technologies in the art, so the specific structure and working principle are not described in detail in this embodiment.
[0011] Further, the crystal weight clamping mechanism comprises:
[0012] The clamping seat is internally provided with a clamping driving cavity, and a guide groove is formed in the side wall of the clamping driving cavity;
[0013] The clamping motor is fixedly arranged on the side wall of the clamping seat;
[0014] The clamping screw is rotatably arranged between the opposite two inner walls of the clamping driving cavity, one end of the clamping screw is connected with the output end of the clamping motor, and the clamping screw is a bidirectional screw;
[0015] The clamping plates are provided in two groups, the two groups of clamping plates are connected with the two ends of the clamping screw through threads respectively, and the clamping plates are slidably arranged in the guide groove.
[0016] It should be noted that a guide slide rod can also be fixedly arranged in the clamping driving cavity, and the movement of the clamping plate is guided in cooperation with the guide groove, and the support stability of the movement of the clamping plate can be improved.
[0017] Further, the end baffle of the fixed clamping mechanism is provided on the clamping seat.
[0018] Further, the position adjusting screw is threadedly connected to the end baffle of the fixed clamping mechanism, the anti-rotation slide rod is slidably arranged on the end baffle of the fixed clamping mechanism, the limiting plate is fixedly connected with the anti-rotation slide rod, and the position adjusting screw is rotatably connected with the limiting plate.
[0019] Further, the mounting column is slidably arranged on the limiting plate, the protective plate is arranged on the mounting column, one end of the mounting column is provided with the mounting plate, the reset spring is sleeved on the mounting column, and the two ends of the reset spring are connected with the limiting plate and the mounting plate respectively.
[0020] Further, the waste falling groove is arranged on the bottom plate, the waste falling groove is located directly below the cutting mechanism, and the collecting box is arranged below the bottom plate.
[0021] Further, the guide groove is arranged on the side wall of the clamping driving cavity, which is away from the waste falling groove.
[0022] The beneficial effects achieved by the above structure are as follows:
[0023] (1) The position of the limiting plate is adjusted, and the proximity switch is arranged, so that the pushing distance of the pushing oil cylinder is limited, the consistency of the thickness of the wafer cutting each time is ensured, and the wafer is continuously cut to a fixed thickness through the cooperation of the pushing oil cylinder, the limiting plate and the proximity switch.
[0024] (2) The two ends of the crystal weight are clamped and fixed through the movable clamping mechanism and the fixed clamping mechanism, the stability of the crystal weight during cutting is ensured, and the stability of the crystal weight during continuous cutting, pushing and conveying is ensured through the arrangement of the supporting guide roller. BRIEF DESCRIPTION OF DRAWINGS
[0025] The accompanying drawings are used to provide a further understanding of the present application, and constitute a part of the specification, and are used to explain the present application together with embodiments of the present application, and do not constitute a limitation to the present application. In the drawings:
[0026] Figure 1 It is a schematic view of the overall structure of the embodiment of the present application;
[0027] Figure 2 It is a schematic view of the overall structure of the embodiment of the present application;
[0028] Figure 3 It is a schematic view of the overall structure of the embodiment of the present application; Figure 2
[0029] Figure 4 It is a schematic view of the structure above the bottom plate of the embodiment of the present application.
[0030] Among them, 1, the bottom plate, 2, the push oil cylinder, 3, the movable clamping mechanism, 4, the fixed clamping mechanism, 5, the supporting guide roller, 6, the cutting mechanism, 7, the limiting plate, 8, the proximity switch, 9, the clamping seat, 10, the clamping drive cavity, 11, the guide groove, 12, the clamping motor, 13, the clamping screw, 14, the clamping plate, 15, the end baffle, 16, the position adjusting screw, 17, the anti-rotation slide rod, 18, the mounting column, 19, the protective plate, 20, the mounting plate, 21, the return spring, 22, the waste chute, 23, the collection box. DETAILED DESCRIPTION
[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application; based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0032] It should be noted that the words "front", "back", "left", "right", "up" and "down" used in the following description refer to the directions in the drawings, and the words "in" and "out" refer to the directions towards or away from the geometric center of a particular component.
[0033] Referring to Figure 1 , Figure 2 and Figure 4 , the quartz wafer cutting device provided by the embodiment comprises:
[0034] The bottom plate 1 is fixedly provided with a push oil cylinder 2 at one end;
[0035] The crystal bar clamping mechanism comprises a movable clamping mechanism 3 and a fixed clamping mechanism 4, the fixed clamping mechanism 4 is fixedly arranged at one end of the bottom plate 1 away from the advancing oil cylinder 2, the movable clamping mechanism is fixedly connected with the free end of the advancing oil cylinder 2, the movable clamping mechanism is driven by the advancing oil cylinder 2 to move relative to the fixed clamping mechanism 4, the movable clamping mechanism 3 is driven to move by the advancing oil cylinder 2, the position of the crystal bar is adjusted, and the continuous cutting of the wafer is realized.
[0036] A supporting guide roller 5 is rotatably arranged on the bottom plate 1, the supporting guide roller 5 is located between the movable clamping mechanism 3 and the fixed clamping mechanism 4, and the supporting guide roller 5 is used for supporting and conveying the crystal bar.
[0037] A cutting mechanism 6 is arranged above the supporting guide roller 5 and the fixed clamping mechanism 4.
[0038] The fixed clamping mechanism 4 movably arranges a limiting plate 7, the limiting plate 7 is configured to be adjustable relative to the position of the cutting mechanism 6, the limiting plate 7 is provided with a proximity switch 8, the proximity switch 8 is electrically connected with the advancing oil cylinder 2, and the cutting thickness of the wafer is controlled by the cooperation of the advancing oil cylinder 2 and the limiting plate 7.
[0039] It should be known that the cutting mechanism 6 adopted in the embodiment is a conventional copper-plated steel wire cutting mechanism 6, and the height of the cutting mechanism 6 can be lifted by the driving of the lifting oil cylinder, and the crystal bar is cut from top to bottom when the cutting mechanism 6 is lowered. Since the above structure and function are the existing mature technology in the art, the specific structure and working principle will not be described in detail in the embodiment.
[0040] In work, first, the position of the limiting plate 7 on the fixed clamping mechanism 4 is adjusted according to the cutting thickness of the wafer, so that the transverse spacing between the limiting plate 7 and the cutting position of the cutting mechanism 6 is adapted to the cutting thickness of the wafer; then one end of the crystal bar is placed on the movable clamping mechanism 3, and the crystal bar is clamped and fixed under the action of the movable clamping mechanism 3, and the other end of the crystal bar is placed on the supporting guide roller 5.
[0041] The crystal bar is driven to move towards the fixed clamping mechanism 4 under the action of the advancing oil cylinder 2, and the stability of the movement of the crystal bar is ensured under the cooperation of the supporting guide roller 5; one end of the crystal bar passes below the cutting mechanism 6, and when the crystal bar approaches the limiting plate 7, the proximity switch 8 on the limiting plate 7 senses the in-place signal of the crystal bar, controls the advancing oil cylinder 2 to stop advancing, and the fixed clamping mechanism 4 clamps and fixes the other end of the crystal bar; finally, the wafer cutting action is completed under the cutting mechanism 6.
[0042] After one wafer is cut and taken out, the above advancing action of the advancing oil cylinder 2 is repeated to complete the continuous thickness cutting of the wafer.
[0043] Specifically, referring to Figure 1And Figure 2 In the embodiment, the crystal bar clamping mechanism comprises:
[0044] A clamping seat 9 is internally provided with a clamping driving cavity 10, and a guide groove 11 is formed in the side wall of the clamping driving cavity 10;
[0045] A clamping motor 12 is fixedly arranged on the side wall of the clamping seat 9;
[0046] A clamping screw 13 is rotatably arranged between the opposite two inner walls of the clamping driving cavity 10, one end of the clamping screw 13 is connected with the output end of the clamping motor 12, and the clamping screw 13 is a bidirectional screw;
[0047] Two groups of clamping plates 14 are arranged, the two groups of clamping plates 14 are respectively connected with the two ends of the clamping screw 13 through threads, and the clamping plates 14 are slidably arranged in the guide groove 11.
[0048] In operation, the clamping motor 12 drives the clamping screw 13 to rotate, and the clamping screw 13 drives the two groups of clamping plates 14 to move from both sides to the crystal bar under the guidance of the guide groove 11, so that the crystal bar is clamped and fixed from both sides.
[0049] It should be noted that a guide sliding rod can also be fixedly arranged in the clamping driving cavity 10, and the movement of the clamping plates 14 is guided in cooperation with the guide groove 11, and the support stability of the movement of the clamping plates 14 can be improved.
[0050] Specifically, referring to Figure 2 And Figure 4 In the embodiment, the end head baffle 15 is arranged on the clamping seat 9, the end head of the crystal bar is positioned through the arrangement of the end head baffle 15, and the multi-directional positioning of the crystal bar is realized under the cooperation of the end head baffle 15 and the clamping plates 14.
[0051] Specifically, referring to Figure 3 And Figure 4 In the embodiment, the position adjusting screw 16 is threadedly connected to the end head baffle 15 of the fixed clamping mechanism 4, the anti-rotation sliding rod 17 is slidably arranged on the end head baffle 15 of the fixed clamping mechanism 4, the limiting plate 7 is fixedly connected with the anti-rotation sliding rod 17, and the position adjusting screw 16 is rotatably connected with the limiting plate 7.
[0052] In operation, the position adjusting screw 16 is rotated, the position adjusting screw 16 moves along the end head baffle 15, and the limiting plate 7 can be driven to move under the driving of the position adjusting screw 16 and the guidance of the anti-rotation sliding rod 17, so that the transverse distance between the limiting plate 7 and the cutting mechanism 6 is adjusted, the cutting thickness of the wafer is controlled, and the smaller the transverse distance between the limiting plate 7 and the cutting mechanism 6 is, the thinner the cutting thickness of the wafer is.
[0053] Specifically, referring to Figure 3 AndFigure 4 In the embodiment, the limiting plate 7 is slidably provided with a mounting column 18, the mounting column 18 is provided with a protective plate 19, one end of the mounting column 18 is provided with a mounting plate 20, the mounting column 18 is sleeved with a reset spring 21, and two ends of the reset spring 21 are connected with the limiting plate 7 and the mounting plate 20 respectively.
[0054] In work, the crystal is pushed to the clamping seat 9 of the fixed clamping mechanism 4 under the cooperation of the movable clamping mechanism 3 and the supporting guide roller 5, when the crystal contacts the protective plate 19, the protective plate 19 moves to the direction of the limiting plate 7, the proximity switch 8 senses the position of the protective plate 19, when the protective plate 19 contacts the limiting plate 7, the crystal is pushed to the position, and the proximity switch 8 transmits a signal to the pushing cylinder 2, and the pushing cylinder 2 stops the pushing work.
[0055] Specifically, referring to Figure 1 and Figure 2 In the embodiment, the bottom plate 1 is provided with a waste falling groove 22, the waste falling groove 22 is located directly below the cutting mechanism 6, the cutting debris and the cooling liquid generated by the cutting mechanism 6 fall through the waste falling groove 22, and the bottom plate 1 is provided with a collecting box 23, and the cutting debris and the cooling liquid are collected through the collecting box 23.
[0056] Specifically, referring to Figure 1 In the embodiment, the guide groove 11 is arranged on the side wall, away from the waste falling groove 22, of the clamping driving cavity 10, so that the cutting debris is prevented from entering the clamping driving cavity 10.
[0057] It is to be noted that, in the present document, the terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms “include”, “contain” or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, material or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, material or equipment.
[0058] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A quartz wafer cutting apparatus characterized by comprising: include: The base plate (1) has a propulsion cylinder (2) fixedly installed at one end. The crystal clamping mechanism includes a movable clamping mechanism (3) and a fixed clamping mechanism (4). The fixed clamping mechanism (4) is fixedly located at the end of the base plate (1) away from the push cylinder (2). The free end of the push cylinder (2) is fixedly connected to the movable fixed mechanism. The movable fixed mechanism is driven by the push cylinder (2) to move relative to the fixed clamping mechanism (4). The support guide roller (5) is rotatably mounted on the base plate (1). The support guide roller (5) is located between the movable clamping mechanism (3) and the fixed clamping mechanism (4). The support guide roller (5) is used to support and transport the crystal weight. The cutting mechanism (6) is located above the supporting guide roller (5) and the fixing clamping mechanism (4); The fixed clamping mechanism (4) is movably provided with a limiting plate (7), the limiting plate (7) is configured to be adjustable relative to the cutting mechanism (6), the limiting plate (7) is provided with a proximity switch (8), and the proximity switch (8) is electrically connected to the propulsion cylinder (2).
2. The quartz wafer cutting apparatus according to claim 1, wherein The crystal weight clamping mechanism includes: The clamping seat (9) has a clamping drive cavity (10) inside, and a guide groove (11) is provided on the side wall of the clamping drive cavity (10). The clamping motor (12) is fixedly mounted on the side wall of the clamping seat (9); The clamping screw (13) is rotatably disposed between the two opposing inner walls of the clamping drive cavity (10). One end of the clamping screw (13) is connected to the output end of the clamping motor (12). The clamping screw (13) is a bidirectional screw. The clamping plate (14) is provided in two sets. The two sets of clamping plates (14) are respectively connected to the two ends of the clamping screw (13) by threads. The clamping plate (14) is slidably disposed in the guide groove (11).
3. The quartz wafer cutting apparatus according to claim 2, wherein The clamping seat (9) is provided with an end baffle (15).
4. The quartz wafer cutting apparatus according to claim 3, wherein The end baffle (15) of the fixed clamping mechanism (4) is connected to a position adjusting screw (16) by a thread. An anti-rotation sliding rod (17) is slidably provided on the end baffle (15) of the fixed clamping mechanism (4). The limiting plate (7) is fixedly connected to the anti-rotation sliding rod (17), and the position adjusting screw (16) is rotatably connected to the limiting plate (7).
5. The quartz wafer cutting apparatus according to claim 1, wherein The limiting plate (7) is slidably provided with an installation post (18), the installation post (18) is provided with a protective plate (19), one end of the installation post (18) is provided with an installation plate (20), and a reset spring (21) is sleeved on the installation post (18). The two ends of the reset spring (21) are respectively connected to the limiting plate (7) and the installation plate (20).
6. The quartz wafer cutting apparatus according to claim 2, wherein A waste trough (22) is provided on the base plate (1), and the waste trough (22) is located directly below the cutting mechanism (6). A collection box (23) is provided under the base plate (1).
7. The quartz wafer cutting apparatus according to claim 6, wherein The guide groove (11) is located on the side wall of the clamping drive cavity (10) away from the waste discharge trough (22).