Falling-resistant composite film and packaging bag

Abstract

The utility model provides a drop-resistant composite film and a packaging bag, the composite film is composed of a barrier layer, a composite layer and a heat sealing layer which are connected through a glue layer, the barrier layer can be made of materials such as a PET-AlOx film, the composite layer is made of NY or PET, and the heat sealing layer is a polyethylene cooking film. According to the composite film, a multi-stage embossing structure is designed, the multi-stage embossing structure comprises first embossing forming damping strips, second embossing forming an angle with the first embossing and third embossing embedded in a downward concave area of buffering patterns, a three-stage buffering gradient structure is jointly formed, stress is effectively dispersed, and the impact resistance is improved. In addition, the composite film can be made into a packaging bag and has good low-temperature impact resistance.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of composite film, specifically relates to food packaging composite film, more specifically relates to a kind of drop-resistant composite film and the packaging bag comprising the composite film. BACKGROUND

[0002] Food packaging composite film requires it to have the characteristics of high-temperature cooking resistance, so as to kill harmful microorganisms by cooking method and protect food safety.

[0003] In the low-temperature environment of cold season, the flexibility and toughness of the composite film material will decrease significantly, resulting in weakened impact resistance. Currently, the composite film suitable for cooking mostly uses CPP (cast polypropylene) as the inner layer, but in cold temperatures such as northern winters, the packaging bag is easily broken when impacted by external forces, such as accidentally falling during handling. Specifically, the heavier the content of the packaging bag prepared using the composite film, the worse the drop resistance, so it is necessary to develop a new type of composite film material that can still maintain good drop resistance in low-temperature environments.

[0004] The utility model patent application with publication number CN113334883A provides a PE film resistant to 121℃ high-temperature cooking and a preparation method thereof. SUMMARY

[0005] The utility model aims to overcome the deficiencies of the prior art and provide a drop-resistant composite film and packaging bag that have good drop resistance in low-temperature environments.

[0006] To achieve the above-mentioned purpose, the utility model provides the technical scheme as follows:

[0007] A drop-resistant composite film includes, in sequence:

[0008] Barrier layer: including PET-AlO x Film, PET-SiO2 film, BOPP-AlO x Film, at least one of Al film;

[0009] Composite layer: including NY or PET;

[0010] Heat-sealing layer: including polyethylene cooking film;

[0011] The barrier layer, composite layer and heat-sealing layer are connected by a glue layer, and the glue layer includes semi-high-temperature cooking glue or high-temperature cooking glue.

[0012] Further,

[0013] The thickness of the barrier layer is ≥12 μm;

[0014] The thickness of the composite layer is greater than or equal to 15 μm;

[0015] The thickness of the heat-sealing layer is greater than or equal to 100 μm.

[0016] Further, the composite layer is provided with a plurality of first embossing in parallel, and the first embossing forms a damping strip.

[0017] Further, the composite layer is provided with a plurality of second embossing in parallel, and the second embossing is at an angle with the first embossing, and the first embossing and the second embossing form a honeycomb-shaped buffer pattern.

[0018] Further, the depth of the first embossing is 5-10 μm, and the width of the first embossing is 1-2 mm.

[0019] Further, the depth of the second embossing is 5-10 μm, and the width of the second embossing is 1-2 mm, the spacing between adjacent first embossing and the spacing between adjacent second embossing are both 2-5 mm, and the included angle between the first embossing and the second embossing is 30°-90°.

[0020] Further, the cross section of the first embossing and / or the second embossing is trapezoidal, the lower base length of the trapezoid is the width of the first embossing and / or the second embossing, and the height of the trapezoid is the height of the first embossing and / or the second embossing.

[0021] Further, the lower concave area of the honeycomb-shaped buffer pattern is further provided with third embossing, the depth of the third embossing is 3-5 μm, the width of the third embossing is 0.5-0.8 mm, and the first embossing, the second embossing and the third embossing form a three-level buffer gradient structure.

[0022] The composite film shown in the utility model is also prepared into a packaging bag, and the packaging bag has any of the technical features described above, and is prepared by enclosing and heat-sealing the end edges of the composite film.

[0023] Further, the heat-sealing layer of the packaging bag is integrally connected and inwardly embedded with a barbed sealing strip.

[0024] The utility model has the advantages and beneficial effects that:

[0025] 1. The composite film connected by three layers can realize excellent drop resistance in a low-temperature environment, and the reasonable collocation and structural design of the barrier layer, the composite layer and the heat-sealing layer make the composite film not only be able to effectively block the invasion of external gas and moisture and maintain the stability of the internal environment of the package while being cooked, but also be able to withstand a large impact force without being broken or deformed under low-temperature conditions.

[0026] 2. The damping strip structure formed by multiple first embossings, the honeycomb buffer pattern formed by the first and second embossings, and the third embossing embedded in the recessed area of ​​the honeycomb buffer pattern, in sequence constitute a three-level buffer gradient structure. This structure can disperse stress, absorb and mitigate impact force when subjected to impact, and improve the drop resistance of the packaging bag. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the composite membrane of this utility model;

[0028] Figure 2 This is a schematic diagram of the cross-sectional structure of the packaging bag of this utility model;

[0029] In the diagram: barrier layer 1, composite layer 2, heat seal layer 3, first embossing 4, second embossing 5, third embossing 6, barbed sealing strip 7. Detailed Implementation

[0030] To fully disclose and explain the relevant technical content in this patent application, the definitions of each term are as follows: PET-AlO x The membrane is a polyethylene terephthalate membrane with an aluminum-coated surface; the PET-SiO2 membrane is a polyethylene terephthalate membrane with a silicon-coated surface; and the BOPP-AlO2 membrane is... x The film is a biaxially oriented polypropylene film with an aluminum-coated surface, and the Al film is an aluminum foil.

[0031] Semi-high temperature retort adhesive or high temperature retort adhesive refers to food packaging adhesives used at temperatures of 101-120℃ and 121-145℃, respectively.

[0032] The polyethylene retort film of this utility model, that is, the heat-sealing layer, uses the PE film cited in the background art, manufactured by Huizhou Defang, with brand name RF-30-014-X1.

[0033] As a preferred embodiment, the depth of the first embossing is 5-10 μm and the width is 1-2 mm.

[0034] As a preferred embodiment, the depth of the second embossing is 5-10 μm, the width is 1-2 mm, the spacing between adjacent first embossings and adjacent second embossings is 2-5 mm, and the included angle between the first embossings and the second embossings is 30°-90°.

[0035] As a preferred embodiment, the recessed area of ​​the honeycomb buffer texture is further provided with a third embossing. The depth of the third embossing is 3-5 μm and the width is 0.5-0.8 mm. The first embossing, the second embossing, and the third embossing form a three-level buffer gradient structure.

[0036] As a preferred embodiment, the cross section of the first embossing and the second embossing is set as a trapezoid, especially an isosceles trapezoid, which is convenient for processing.

[0037] The specific embodiments of the present application will be further described in conjunction with the drawings and examples. The following examples are only used to more clearly illustrate the technical scheme of the present application, and cannot be used to limit the protection scope of the present application. The structures in each example are in turn barrier layer 1 / composite layer 2 / heat sealing layer 3, and the number after each layer is the thickness of the layer, the unit is microns. In the following examples, the prefix "R-" in RCPP and RPE indicates "retortable". CPP is a cast polypropylene film, and PE is a polyethylene film.

[0038] Example 1: PET12 / NY15 / RPE100.

[0039] Example 2: PET12 / PET15 / RPE100.

[0040] Example 3: The difference from example 1 is only that the composite layer is provided with a first embossing 4, the depth of the first embossing is 10 μm, the width is 2 mm, the cross section of the first embossing is a trapezoid, the upper base length of the trapezoid is 1.8 mm, and the spacing between adjacent first embossings is 5 mm.

[0041] Example 4: The difference from example 3 is only that the composite layer is further provided with a second embossing 5, the included angle between the second embossing and the first embossing is 60°, the depth of the second embossing is 10 μm, the width is 2 mm, the cross section of the second embossing is a trapezoid, the upper base length of the trapezoid is 1.8 mm, and the spacing between adjacent second embossings is 2 mm. The first embossing and the second embossing are staggered to form a concave area, which is called a honeycomb buffer pattern.

[0042] Example 5: The difference from example 4 is only that the composite layer is further provided with a third embossing 6, the third embossing is arranged in the concave area formed by the honeycomb buffer pattern, the depth of the third embossing is 3 μm, and the width is 0.5 mm.

[0043] Comparative example: PET12 / NY15 / RCPP100.

[0044] In each example, the barrier layer 1 can be selected from any one of PET-AlO x film, PET-SiO2 film, BOPP-AlO x film, Al film to meet the barrier requirement, and the experimental results are accurate and reliable. Each example and the comparative example does not have a plating structure, but uses conventional PET as a substitute. The production method of the second and third embossings can be realized by hot pressing, and preferably the first, second and third embossings are formed at the same time in one hot pressing.

[0045] The packaging bags of each embodiment and the comparative example are made by three-edge surrounding heat sealing, and a barbed seal 7 is installed at the opening of the packaging bag. The packaging bag is released at a certain temperature and a certain height from the ground, and contains a certain mass of rice as the content, and the experimental results of each group are as follows.

[0046] Result 1: The experimental conditions are 23℃, 3kg of content, and each embodiment and the comparative example is dropped at 20, 30, 40, 50, and 60cm from the ground, and none of them has leakage and bag explosion problems.

[0047] Result 2: The experimental conditions are -20℃, 3kg of content, and each embodiment and the comparative example is dropped at 20, 30, 40, 50, 60, 70, 80, 90, and 100cm from the ground, and embodiment 1-2 can meet the 50cm drop resistance; embodiment 3, 4, and 5 can meet the 60, 80, and 100cm drop resistance respectively; the comparative example has leakage at 20cm.

[0048] Result 3: The experimental conditions are -20℃, 5kg of content, and each embodiment and the comparative example is dropped at 20, 30, 40, 50, 60, 70, and 80cm from the ground, and embodiment 1-2 can meet the 40cm drop resistance; embodiment 3, 4, and 5 can meet the 40, 50, and 80cm drop resistance respectively; the comparative example has leakage at 10cm.

[0049] Result 4: The experimental conditions are -20℃, 10kg of content, and each embodiment and the comparative example is dropped at 20, 30, 40, 50, and 60cm from the ground, and embodiment 1-2 can meet the 40cm drop resistance; embodiment 3, 4, and 5 can meet the 40, 50, and 60cm drop resistance respectively; the comparative example has leakage at 10cm.

[0050] Result 5: The experimental conditions are -20℃, 25kg of content, and each embodiment and the comparative example is dropped at 20, 30, 40, and 50cm from the ground, and embodiment 1-2 can meet the 40cm drop resistance; embodiment 3, 4, and 5 can meet the 30, 30, and 50cm drop resistance respectively; the comparative example has leakage at 10cm.

[0051] The above is only the preferred embodiment of the present application, and it should be pointed out that for ordinary skilled persons in the technical field, without departing from the technical principles of the present application, a number of improvements and refinements can be made, which should also be considered as the protection scope of the present application.

Claims

1. A drop-resistant composite film, characterized by, It comprises, in sequence: Barrier layer (1): comprising PET-AI2O x at least one of a film, PET-SiO2 film, BOPP-AI2O x at least one of a film, AI film a composite layer (2) comprising a NY film or a PET film; a heat-sealing layer (3) comprising a polyethylene retort film; The barrier layer, the composite layer and the heat-sealing layer are connected by a glue layer, and the glue layer comprises a semi-high-temperature retort glue or a high-temperature retort glue.

2. The composite film according to claim 1, wherein: The thickness of the barrier layer (1) is ≥12 μm; The thickness of the composite layer (2) is ≥15 μm; The thickness of the heat-sealing layer (3) is ≥100 μm.

3. The composite film according to claim 2, wherein: The composite layer is provided with a plurality of first embossing (4) in parallel, and the first embossing forms a damping strip.

4. The composite film according to claim 3, wherein: The composite layer is provided with a plurality of second embossing (5) in parallel, and the second embossing is at an angle with the first embossing, and the first embossing and the second embossing form a honeycomb-shaped buffer pattern.

5. The composite film according to claim 4, wherein: The depth of the first embossing is 5-10 μm, and the width of the first embossing is 1-2 mm.

6. The composite film according to claim 5, wherein: The depth of the second embossing is 5-10 μm, the width of the second embossing is 1-2 mm, the spacing between adjacent first embossing and the spacing between adjacent second embossing are both 2-5 mm, and the included angle between the first embossing and the second embossing is 30°-90°.

7. The composite film according to claim 6, wherein: The cross section of the first embossing and / or the second embossing is trapezoidal, the lower base length of the trapezoid is the width of the first embossing and / or the second embossing, and the height of the trapezoid is the height of the first embossing and / or the second embossing.

8. The composite film according to claim 7, wherein: The lower concave area of the honeycomb-shaped buffer pattern is further provided with a third embossing (6), the depth of the third embossing is 3-5 μm, the width of the third embossing is 0.5-0.8 mm, and the first embossing, the second embossing and the third embossing form a three-level buffer gradient structure.

9. A drop-resistant packaging bag, characterized by The composite film according to any one of claims 1-8 is enclosed and heat-sealed at the end edges.

10. The package of claim 9, wherein, The heat-sealing layer is inwardly embedded with a barbed sealing strip (7), and the barbed sealing strip is integrally connected with the heat-sealing layer.

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