Chip pressure sintering furnace

Abstract

The utility model relates to the technical field of chip processing equipment, and provides a chip pressure sintering furnace which comprises a supporting frame, a hydraulic assembly, a lower pressure head assembly, an upper pressure head assembly and a drag chain. The hydraulic assembly is arranged above the supporting frame, the lower pressing head assembly is arranged on a bottom plate of the hydraulic assembly, the upper pressing head assembly is arranged on a middle plate of the hydraulic assembly, one end of the drag chain is arranged on the supporting frame, and the other end of the drag chain is arranged on the side of the middle plate of the hydraulic assembly. And a middle plate of the hydraulic assembly moves up and down. And the chip pressure sintering furnace is good in operation stability and reliability.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip processing equipment technical field especially relates to a chip pressure sintering furnace. BACKGROUND

[0002] At present, the mode of nano silver or nano copper hot-press sintering used in chip hot-press sintering is mostly integral compression or split compression (distributed on the same plane), the workpiece to be processed is placed on the lower compression platform, the workpiece to be processed located between the two compression heads is completed chip compression through the mutual approaching and moving away of the two compression heads. The stability and reliability of the existing compression equipment are poor. SUMMARY

[0003] The utility model provides a chip pressure sintering furnace to solve the problem of poor stability and reliability of the prior art compression equipment.

[0004] A chip pressure sintering furnace, comprising a support frame, a hydraulic assembly, a lower compression head assembly, an upper compression head assembly and a drag chain; the hydraulic assembly is arranged above the support frame, the lower compression head assembly is arranged on the bottom plate of the hydraulic assembly, the upper compression head assembly is arranged on the middle plate of the hydraulic assembly, one end of the drag chain is arranged on the support frame, the other end of the drag chain is arranged on the side of the middle plate of the hydraulic assembly, and the middle plate of the hydraulic assembly moves up and down.

[0005] According to the chip pressure sintering furnace of the utility model, the upper compression head assembly comprises an upper cavity frame, a roller shaft, a connecting plate and an upper compression head; the connecting plate is arranged below the middle plate, the connecting plate is arranged above the upper cavity frame, the upper compression head is arranged inside the upper cavity frame, and the roller shaft is arranged on the side of the upper cavity frame.

[0006] According to the chip pressure sintering furnace of the utility model, the upper cavity frame further comprises a limiting mechanism, and the limiting mechanism is arranged on the side of the upper cavity frame.

[0007] According to the chip pressure sintering furnace of the utility model, the upper cavity frame further comprises a limiting mechanism, and the limiting mechanism is arranged on the side of the upper cavity frame.

[0008] According to the chip pressure sintering furnace of the utility model, the hydraulic assembly further comprises a hydraulic cylinder, an upper plate, a guide column and a bottom plate; the upper plate is arranged above the middle plate, the bottom plate is arranged below the middle plate, the upper part of the guide column is arranged on the upper plate, the lower part of the guide column is arranged on the bottom plate, the middle part of the guide column is arranged on the middle plate, the middle plate moves up and down along the guide column, and the hydraulic cylinder is arranged above the upper plate.

[0009] The chip pressure sintering furnace further comprises a displacement sensor, and the displacement sensor is arranged above the hydraulic cylinder.

[0010] The chip pressure sintering furnace further comprises a pressure sensor, and the pressure sensor is arranged above the middle plate.

[0011] The chip pressure sintering furnace further comprises an upper heating pipe and a lower heating pipe; the upper heating pipe is arranged in the upper pressure head assembly, and the lower heating pipe is arranged in the lower pressure head assembly.

[0012] The chip pressure sintering furnace further comprises an upper heating pipe and a lower heating pipe; the upper heating pipe is arranged in the upper pressure head assembly, and the lower heating pipe is arranged in the lower pressure head assembly.

[0013] The drag chain of the utility model adapts to reciprocating motion, provides reliable support and traction for lines and pipelines, ensures that the lines and pipelines will not appear winding, twisting or loosening in the motion process, improves the motion reliability of the equipment, reduces the equipment failure and downtime caused by the problems of the lines and pipelines, and thus improves the stability and reliability of the equipment operation. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0015] Figure 1 It is a structure schematic view of the partial A enlarged view;

[0016] Figure 2 It is a structure schematic view of the partial A enlarged view;

[0017] Figure 3 It is a structure schematic view of the hydraulic assembly;

[0018] Figure 4 It is a structure schematic view of the upper pressure head assembly;

[0019] Figure 5 It is a structure schematic view of the lower pressure head assembly;

[0020] Label: 1, support frame; 2, hydraulic assembly; 3, lower pressing head assembly; 4, upper pressing head assembly; 5, drag chain; 6, film covering mechanism; 21, hydraulic cylinder; 22, upper plate; 23, pressure sensor; 24, middle plate; 25, guide column; 26, bottom plate; 27, displacement sensor; 31, lower cavity frame; 32, lower pressing head; 33, vacuum pumping mechanism; 41, upper cavity frame; 42, roller; 43, limiting mechanism; 44, connecting plate. DETAILED DESCRIPTION

[0021] The embodiments of the present application will be further described below in conjunction with the drawings and examples. The following examples are used to illustrate the present application, but cannot be used to limit the scope of the present application.

[0022] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0023] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0024] In the embodiments of the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0025] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or at least one embodiment or example in a suitable manner. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples without contradiction.

[0026] The following will be described in combination with Figures 1-5 The chip pressure sintering furnace described in the embodiments of the present application comprises a support frame 1, a hydraulic assembly 2, a lower pressing head assembly 3, an upper pressing head assembly 4 and a drag chain 5. The hydraulic assembly 2 is arranged above the support frame 1, the lower pressing head assembly 3 is arranged on the bottom plate 26 of the hydraulic assembly 2, the upper pressing head assembly 4 is arranged on the middle plate 24 of the hydraulic assembly 2, one end of the drag chain 5 is arranged on the support frame 1, the other end of the drag chain 5 is arranged on the side of the middle plate 24 of the hydraulic assembly 2, and the middle plate of the hydraulic assembly 2 moves up and down.

[0027] In some embodiments, the upper pressing head assembly 4 comprises an upper cavity frame 41, a roller shaft 42, a connecting plate 44 and an upper pressing head. The connecting plate 44 is arranged below the middle plate 24, the connecting plate 44 is arranged above the upper cavity frame 41, the upper pressing head is arranged inside the upper cavity frame 41, and the roller shaft 42 is arranged on the side of the upper cavity frame 41.

[0028] In some embodiments, a limiting mechanism 43 is further included, and the limiting mechanism 43 is arranged on the side of the upper cavity frame 41.

[0029] In some embodiments, a film coating mechanism 6 is further included, and the film coating mechanism 6 is arranged on the side of the middle plate 24.

[0030] In some embodiments, the hydraulic assembly 2 further comprises a hydraulic cylinder 21, an upper plate 22, a guide column 25 and a bottom plate 26. The upper plate 22 is arranged above the middle plate 24, the bottom plate 26 is arranged below the middle plate 24, the upper part of the guide column 25 is arranged on the upper plate 22, the lower part of the guide column 25 is arranged on the bottom plate 26, the middle part of the guide column 25 is arranged on the middle plate 24, the middle plate 24 moves up and down along the guide column 25, and the hydraulic cylinder 21 is arranged above the upper plate 22.

[0031] In some embodiments, a displacement sensor 27 is further included, and the displacement sensor 27 is arranged above the hydraulic cylinder 21.

[0032] In some embodiments, the pressure sensor 23 is further included, and the pressure sensor 23 is arranged above the middle plate 24.

[0033] In some embodiments, the lower pressing head assembly 3 comprises a lower cavity frame 31, a lower pressing head 32 and a vacuumizing mechanism 33; the lower pressing head 32 is arranged inside the lower cavity frame 31, and the vacuumizing mechanism 33 is arranged on both sides of the lower cavity frame 31.

[0034] In some embodiments, the upper heating pipe and the lower heating pipe are further included; the upper heating pipe is arranged inside the upper pressing head assembly 4, and the lower heating pipe is arranged inside the lower pressing head assembly 3.

[0035] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip pressure sintering furnace characterized by comprising: Including support frame, hydraulic assembly, lower head assembly, upper head assembly and drag chain; the hydraulic assembly is arranged above the support frame, the lower head assembly is arranged on the bottom plate of the hydraulic assembly, the upper head assembly is arranged on the middle plate of the hydraulic assembly, one end of the drag chain is arranged on the support frame, the other end of the drag chain is arranged on the side of the middle plate of the hydraulic assembly, and the middle plate of the hydraulic assembly moves up and down.

2. The chip pressure sintering furnace according to claim 1, wherein The upper head assembly comprises an upper cavity frame, a roller, a connecting plate and an upper head, the connecting plate is arranged below the middle plate, the connecting plate is arranged above the upper cavity frame, the upper head is arranged inside the upper cavity frame, and the roller is arranged on the side of the upper cavity frame.

3. The chip pressure sintering furnace according to claim 2, wherein Further comprising a limiting mechanism, the side of the upper cavity frame is provided with the limiting mechanism.

4. The chip pressure sintering furnace according to claim 1, wherein Further comprising a film covering mechanism, the side of the middle plate is provided with the film covering mechanism.

5. The chip pressure sintering furnace according to claim 1, wherein The hydraulic assembly further comprises a hydraulic cylinder, an upper plate, a guide column and a bottom plate, the upper plate is arranged above the middle plate, the bottom plate is arranged below the middle plate, the upper part of the guide column is arranged on the upper plate, the lower part of the guide column is arranged on the bottom plate, the middle part of the guide column is arranged on the middle plate, the middle plate moves up and down along the guide column, and the hydraulic cylinder is arranged above the upper plate.

6. The chip pressure sintering furnace according to claim 5, wherein Further comprising a displacement sensor, the displacement sensor is arranged above the hydraulic cylinder.

7. The chip pressure sintering furnace according to claim 5, wherein Further comprising a pressure sensor, the pressure sensor is arranged above the middle plate.

8. The chip pressure sintering furnace according to claim 1, wherein The lower head assembly comprises a lower cavity frame, a lower head and a vacuum pumping mechanism, the lower head is arranged inside the lower cavity frame, and the vacuum pumping mechanism is arranged on both sides of the lower cavity frame.

9. The chip pressure sintering furnace according to claim 1, wherein Further comprising an upper heating pipe and a lower heating pipe, the upper heating pipe is arranged inside the upper head assembly, and the lower heating pipe is arranged inside the lower head assembly.

Images