Load simulation device for high voltage and large power consumption

Abstract

The utility model relates to the field of load testing, and discloses a load simulation device for high voltage and high power consumption, which is portable and easy to erect on the basis of providing required load current in a high-voltage and high-power load scene. A load simulation device for high voltage and high power comprises a circuit board which comprises a first surface; the metal sheet is fixed on the first surface and is used for being welded with a to-be-tested plate; a plurality of adjustable resistor modules fixed on the first surface; the plurality of adjustable resistor modules are arranged in parallel and are electrically connected with the metal sheet; each adjustable resistor module comprises a switching device and a resistor which are connected in series; the general control switch is fixed on the circuit board, is electrically connected with each switching device in the plurality of adjustable resistor modules and is used for respectively controlling the on-off of each switching device; wherein the first surface comprises a resistor area, and orthographic projection arrays of all the resistors on the first surface are distributed in the resistor area.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of load testing, in particular to a load simulation device for high-voltage and high-power consumption. BACKGROUND

[0002] With the popularity of artificial intelligence (AI) applications, the demand for AI servers in the server market has increased dramatically. AI servers are characterized by their ability to complete high-computational applications such as reasoning, deduction, and training, which often require a large amount of computing resources. Graphics Processing Unit (GPU) is the core component of AI servers, used to accelerate deep learning and data processing tasks. To meet this demand, multiple high-performance GPU cards are usually configured in AI servers, and the parallel computing capability of multiple GPU cards significantly improves the overall performance of the server, but also brings huge power consumption. With the advancement of technology, the performance of processors is constantly improving, the number of cores is increasing, and the clock speed is increasing, resulting in an increase in power consumption. Although high-speed memory modules provide higher bandwidth and lower latency, power consumption also increases. Large-capacity, high-speed solid-state drives provide faster data read and write speeds, but also increase power consumption. The traditional 12V power supply system is gradually difficult to meet the high-power demand, and the 48V power supply system is being adopted more and more due to its higher efficiency and lower current loss.

[0003] Due to the significant increase in power consumption at the component end, protection schemes at the server board card end are also increasing to ensure the stability and safety of the system. With the increase in protection schemes, targeted verification tests are required for each protection chip scheme.

[0004] Currently, for the power stability and performance testing of servers, electronic load meters are usually used to simulate the back-end load. This method can effectively evaluate the power stability and performance of each component of the server during actual operation. Electronic load is a device used to simulate real load conditions and can dynamically adjust the size of the load current. In this way, the electronic load can simulate the load current required by each component (such as processors, graphics processors, memories, etc.) of the server during actual operation, thereby performing comprehensive power stability and performance testing. However, electronic load meters have the disadvantages of complicated setup and large space occupation. Practical new type content

[0005] The application discloses a load simulation device for high-voltage and high-power consumption, which is used to provide the required load current on the basis of high-voltage and high-power load scenarios.

[0006] To achieve the above object, the application provides the following technical solutions:

[0007] A load simulation device for high-voltage and high-power, comprising:

[0008] A circuit board, comprising a first surface;

[0009] A metal sheet fixed to the first surface, used for welding with a to-be-tested board;

[0010] A plurality of adjustable resistance modules fixed to the first surface; the plurality of adjustable resistance modules are arranged in parallel and electrically connected with the metal sheet; each adjustable resistance module comprises a switch device and a resistor arranged in series;

[0011] A general control switch fixed to the circuit board, electrically connected with each switch device in the plurality of adjustable resistance modules, used for controlling the on-off of each switch device;

[0012] The first surface comprises a resistance area, and the array of the projections of all the resistors on the first surface is distributed in the resistance area.

[0013] The load simulation device is applied to a high-voltage and high-power scenario, and is used for realizing power supply testing of a to-be-tested board such as a server board card. The load simulation device comprises a circuit board and a metal sheet, adjustable resistance modules and a general control switch fixed to the circuit board. The circuit board serves as a carrier of circuit layout, carries and connects other structures, and the first surface of the circuit board is the main working surface of the circuit board. The metal sheet, the adjustable resistance modules and the general control switch are all fixed to the first surface of the circuit board and electrically connected through the circuit inside the circuit board. The metal sheet serves as a power supply input end of the whole load simulation device, used for welding with the to-be-tested board to ensure good electrical connection. The metal sheet of the sheet material as the welding end ensures the connection reliability with the to-be-tested board, improving the long-time use stability of the device. All the adjustable resistance modules form a parallel circuit and are electrically connected with the metal sheet through the circuit board; each adjustable resistance module comprises a resistor and a switch device, the switch device is connected in series with the resistor, used for controlling the on-off of the parallel branch. The plurality of adjustable resistance modules are connected in parallel to reduce the power density on a single resistance module and reduce the loss on the module. The first surface of the circuit board comprises a resistance area used for laying the resistors, and in specific layout, all the resistors are arrayed in the resistance area, and regular layout can reduce the occupied space of the resistors, thereby reducing the size of the circuit board and the volume of the whole device. By adjusting the resistance values of the adjustable resistance modules, different load conditions can be simulated. The switch devices of each module are uniformly controlled by the general control switch, which can be selectively turned on or off as needed.

[0014] It should be noted that the selection of the switching device and the resistor needs to consider the derating requirement of high-power application.

[0015] Therefore, the load simulation device provided by the embodiments of the present application has small volume, simple welding, and is convenient to erect, and can simultaneously perform tensile load testing on multiple positions.

[0016] In some embodiments, the switching device includes one or more of an insulated gate bipolar transistor device, a metal oxide semiconductor device, a metal oxide semiconductor device based on silicon carbide material, and a high electron mobility transistor based on gallium nitride material. These devices not only have high voltage resistance characteristics, but also can handle large currents, and can be controlled by external signals.

[0017] In some embodiments, the first surface further includes a switching region, and the array of the positive projections of all the metal oxide semiconductor devices on the first surface is distributed in the switching region.

[0018] The first surface of the circuit board includes a switching region for arranging the metal oxide semiconductor devices, and in specific arrangement, all the metal oxide semiconductor devices are arrayed in the switching region. Regular arrangement can reduce the occupied space of the metal oxide semiconductor devices, and thus reduce the size of the circuit board, thereby reducing the volume of the entire device.

[0019] In some embodiments, the circuit board is provided with a plurality of fixing holes, and the plurality of fixing holes are arranged outside the resistance region for fixing the heat sink.

[0020] Since the device is used in a high-voltage and high-power environment, a large amount of heat is generated, and therefore the heat sink is installed through the fixing holes to ensure stable operation of the device under high-temperature conditions. Arranging the fixing holes around the resistance region can reduce the occupied space of the heat sink on the basis of heat dissipation of the resistor, thereby further reducing the volume of the entire device.

[0021] In some embodiments, the plurality of fixing holes are arranged outside the switching region and the resistance region.

[0022] Arranging the fixing holes around the switching region and the resistance region can reduce the occupied space of the heat sink on the basis of heat dissipation of the switching device and the resistor, thereby further reducing the volume of the entire device.

[0023] In some embodiments, the surfaces of all the switching devices away from the first surface are located in the same plane, which is convenient for contact with the surface of the heat sink to achieve effective heat dissipation.

[0024] And / or, the surfaces of all the resistors away from the first surface are located in the same plane, which is convenient for contact with the surface of the heat sink to achieve effective heat dissipation.

[0025] In some embodiments, the load simulation device further comprises:

[0026] a heat sink; the heat sink comprises a heat dissipation substrate, a heat dissipation fin and a fixing member;

[0027] The heat dissipation substrate comprises opposite first and second surfaces, and the heat dissipation fin is fixed to the second surface of the heat dissipation substrate; the heat dissipation substrate is fixed to the circuit board through the fixing hole and the fixing member, and the first surface of the heat dissipation substrate is in thermal contact with all the resistors.

[0028] The heat sink is fixed to the circuit board through the fixing member and the fixing hole, and is in thermal contact with all the resistors, so that the resistors can be cooled, and the stability of the entire device can be ensured. The heat dissipation substrate is in thermal contact with the resistors and conducts heat to the heat dissipation fin, and the heat dissipation fin exchanges heat with air to release the heat of the resistors.

[0029] In some embodiments, the first surface of the heat dissipation substrate is in thermal contact with all the resistors and the switching device.

[0030] Using the same heat sink to cool the switching device and the resistors can facilitate the installation and fixation of the heat sink, avoid too many fixing holes on the circuit board affecting the internal circuit wiring, and further reduce the size of the circuit board.

[0031] In some embodiments, the master switch comprises a control chip or a mechanical switch. The control chip as the master switch has excellent performance in reliability, integration, flexibility and the like, and the advantages of the control chip are particularly obvious for high-frequency, long-time working and high-reliability application scenarios. The mechanical switch is an electrical element that realizes the on-off of a circuit through a physical mechanism, and has the characteristics of simple structure, high reliability and wide application.

[0032] In some embodiments, the load simulation device further comprises:

[0033] A fan connector fixed to the first surface is used to install a cooling fan. The load simulation device provided by the embodiments of the present application can determine whether to use an external fan for cooling according to the power consumption, so that the present application can be applied to more use scenarios. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 A topological structure diagram of a load simulation device for high-voltage and high-power consumption provided by the embodiments of the present application;

[0035] Figure 2 A structural schematic diagram of a load simulation device for high-voltage and high-power consumption provided by the embodiments of the present application;

[0036] Figure 3Another structure schematic diagram of a load simulation device for high-voltage and high-power consumption provided by an embodiment of the present application is provided.

[0037] Figure 4 Another application scenario schematic diagram of a load simulation device for high-voltage and high-power consumption provided by an embodiment of the present application is provided.

[0038] Icon: 1-circuit board; 2-metal sheet; 3-adjustable resistance module; 4-master control switch; 5-radiator; 6-fan connector; 11-first surface; 12-fixing hole; 31-switching device; 32-resistor; 51-radiating substrate; 52-radiating fin; 53-fixing piece; 11a-resistance area; 11b-switching area. DETAILED DESCRIPTION

[0039] First, the application scenario of the present application is introduced: in the traditional scheme, an electronic load instrument is used to test the stability and performance of the power supply, but there are also several disadvantages in using the electronic load instrument: first, the electronic load instrument is used in the scene of large power load, and the erection is complicated and occupies a large space. This is because the electronic load instrument is large in size, and the power provided by a single load is limited. When facing the demand of large power load, multiple machines need to be erected in parallel to meet the test requirements. Such a use method needs to occupy a large space, and the erection environment is not convenient. Second, the use of the electronic load instrument needs to weld a load line from the server related board to connect the load instrument. The welding method of the load line has three disadvantages: 1, because the load line is thick, the server board may not have enough space to weld, and the welding difficulty is large; 2, the load line needs a larger solder pad for welding, fixing and current flow, and in the case that the server board does not have enough space, the board is easily damaged; 3, the load line itself will generate a large loss when performing large power load test, which affects the test accuracy.

[0040] Based on the above application scenario, an embodiment of the present application provides a load simulation device for high-voltage and high-power, which is small in size, convenient to erect, can be welded to the corresponding position of the to-be-tested board by a metal sheet, does not need to be welded with a wire, and can provide the required load current in the scene of high-voltage and high-power load.

[0041] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the scope of protection of the present application. In the description of the embodiments of the present application, unless otherwise specified, " / " represents the meaning of or, for example, A / B can represent A or B; in the text, "and / or" only describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone. In addition, in the description of the embodiments of the present application, "multiple" means two or more than two.

[0042] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features, and in the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" is two or more than two.

[0043] Based on Ohm's law, the resistance value of the resistor in the circuit is selected to flexibly adjust the rear-end required impedance, so as to set the load current required by the front-end power supply voltage. According to I=U / R, in the case of determining the front-end power supply voltage, adjusting the rear-end resistance value can set the corresponding current according to the requirement. However, if only a resistor is simply connected in the rear end, the opening and closing of the load cannot be controlled. Therefore, a high-power switching device is added in the front section, and a total control switch is added. Thus, the load simulation device provided by the embodiments of the present application can open the corresponding number of switching devices according to the requirement, that is, the application case of variable resistance can be achieved. The topology of the present application is shown in Figure 1 , and the load current direction is realized as shown by the arrow in Figure 1 . In this way, the load current switching is controllable, and the size of the load current can be adjusted in real time. After the setting of the load current is realized, the structure is fixed to the circuit board for the purpose of portability and easy erection. The corresponding modules and control circuits are set on the circuit board.

[0044] Since the primary purpose of this application is to reduce the erection difficulty of the test environment and improve the simplicity, a whole piece of through-flow medium is used to perform high-power through-flow in a manner similar to the gold finger connector at one end of the circuit board. The selection of the through-flow medium selects a material with small direct-current impedance, which can effectively improve the through-flow capacity, meet the power supply requirement of large current, reduce the heating condition during use, and improve the long-time use stability of the device.

[0045] Since the scheme is mainly applied to the scene of high-voltage and high-power load, the power density on a single module can be reduced by increasing the number of parallel connections, and the loss on the module can also be reduced. Reducing the loss of the module also reduces the heat generated by the related module. At the same time, the selection is aimed at the demand of high-voltage application in the server end, and high-power and high-voltage resistant switching devices and resistors are selected.

[0046] In summary, the embodiment of the present application provides a load simulation device for high-voltage and high-power, as shown in Figures 2 to 3 The device comprises:

[0047] A circuit board 1, the circuit board 1 comprises a first surface 11;

[0048] A metal sheet 2 fixed to the first surface 11, used for welding with the board to be tested;

[0049] A plurality of adjustable resistance modules 3 fixed to the first surface 11; the plurality of adjustable resistance modules 3 are arranged in parallel and electrically connected with the metal sheet 2; each adjustable resistance module 3 comprises a switching device 31 and a resistor 32 arranged in series;

[0050] A master control switch 4 fixed to the circuit board 1, the master control switch 4 is electrically connected with each switching device 31 in the plurality of adjustable resistance modules 3, used for controlling the on-off of each switching device 31 respectively;

[0051] The first surface 11 comprises a resistance area 11a, and the array of the normal projection of all the resistors 32 on the first surface 11 is distributed in the resistance area 11a.

[0052] The load simulation device is applied to a high-voltage and high-power scene, and is used for realizing power supply testing of a to-be-tested board such as a server board card. The load simulation device comprises a circuit board 1, a metal sheet 2, an adjustable resistance module 3 and a general control switch 4 fixed to the circuit board 1. The circuit board 1 serves as a carrier of circuit layout, carries and connects other structures, and a first surface 11 of the circuit board 1 is a main working surface of the circuit board 1. The metal sheet 2, the adjustable resistance module 3 and the general control switch 4 are all fixed to the first surface 11 of the circuit board 1 and are electrically connected through internal circuits of the circuit board 1. The metal sheet 2 serves as a power supply input end of the entire load simulation device and is used for being welded with the to-be-tested board to ensure good electrical connection. The metal sheet 2 of the sheet material as the welding end ensures the connection reliability with the to-be-tested board, and improves the long-time use stability of the device. All the adjustable resistance modules 3 form a parallel circuit and are electrically connected with the metal sheet 2 through the circuit board 1; each adjustable resistance module 3 comprises a resistor 32 and a switching device 31, the switching device 31 is connected in series with the resistor 32 and is used for controlling the on-off of the parallel branch. The plurality of adjustable resistance modules 3 are connected in parallel to reduce the power density on a single resistance module and reduce the loss on the module. While reducing the loss of the module, the heat quantity of the related module is also reduced. The first surface 11 of the circuit board 1 comprises a resistance region 11a for laying the resistors 32, and in specific laying, all the resistors 32 are arranged in an array in the resistance region 11a. Regular arrangement of the resistors 32 can reduce the occupied space of the resistors 32, and then reduce the size of the circuit board 1, thereby reducing the volume of the entire device. By adjusting the resistance values of the adjustable resistance modules 3, different load conditions can be simulated. The switching devices 31 of each module are uniformly controlled by the general control switch 4, and can be selectively turned on or turned off according to needs.

[0053] It should be noted that the selection of the switching device 31 and the resistor 32 needs to consider the derating requirement of high-power application. At the same time, the selection is for the requirement of high-voltage application on the server end, and the switching device 31 and the resistor 32 with high power and high voltage resistance are selected. For example, the load simulation device provided in the embodiments of the present application can be used in two power supply systems of 48V or 54V.

[0054] Therefore, the load simulation device provided in the embodiments of the present application has small volume, simple welding and is convenient to erect, and can simultaneously perform pull load testing on multiple positions.

[0055] In one embodiment, as shown in Figure 2 the load simulation device has three adjustable resistance modules 3, each adjustable resistance module 3 has a switching device 31 and a resistor 32 connected in series, and the three resistors 32 are arranged in a row in the resistance region 11a. The regular arrangement of the resistors 32 can reduce the occupied space of the resistors 32.

[0056] In some embodiments, the switching device 31 includes one or more of an insulated gate bipolar transistor device, a metal-oxide-semiconductor device, a silicon carbide material-based metal-oxide-semiconductor device, a gallium nitride material-based high electron mobility transistor. These devices not only have high voltage withstand characteristics, but also can handle large currents, and can be controlled by an external signal.

[0057] An insulated gate bipolar transistor (IGBT) has high voltage withstand capability and large current carrying capability. It has high input impedance, is easy to drive, and has fast switching speed, low loss, good thermal stability and reliability.

[0058] A metal-oxide-semiconductor (MOS) device is a class of electronic components based on metal-insulator-semiconductor structure, which has low on-resistance and high switching speed, can effectively reduce power consumption, and has relatively simple structure without mechanical contact parts, so it has high reliability and long service life. The most common one is metal-oxide-semiconductor field effect transistor (MOSFET). Metal-oxide-semiconductor field effect transistors are divided into N-channel and P-channel, which have very high input impedance and fast switching speed.

[0059] A silicon carbide material-based metal-oxide-semiconductor device such as a silicon carbide material-based metal-oxide-semiconductor field effect transistor has higher voltage withstand, lower on-resistance and better high temperature performance. It is suitable for higher voltage and larger power applications.

[0060] A gallium nitride material-based high electron mobility transistor (HEMT) has high switching speed and low on-resistance, and is suitable for high frequency and high performance applications.

[0061] In some embodiments, as shown in Figure 2 The first surface 11 further includes a switching region 11b, and all the metal-oxide-semiconductor devices are arrayed in the switching region 11b.

[0062] The first surface 11 of the circuit board 1 includes a switching region 11b for arranging the metal-oxide-semiconductor devices, and in a specific arrangement, all the metal-oxide-semiconductor devices are arrayed in the switching region 11b. Regular arrangement can reduce the occupied space of the metal-oxide-semiconductor devices, and thus reduce the size of the circuit board 1, thereby reducing the volume of the entire device.

[0063] In one embodiment, as shown in Figure 2As shown, the load simulation device has three adjustable resistance modules 3, each with a switch device 31 and a resistor 32 in series. The three switch devices 31 are arranged in a row with equal spacing between adjacent switch devices 31. This regular arrangement reduces the space occupied by the switch devices 31.

[0064] In some embodiments, all switch devices 31 and all resistors 32 in the multiple adjustable resistance modules 3 are arranged in a rectangular array.

[0065] The rectangular array arrangement of all switch devices 31 and all resistors 32 on the circuit board 1 not only simplifies the design and production process, but also significantly improves the performance, reliability, and maintainability of the circuit board 1.

[0066] The rectangular array design simplifies the layout design of the circuit board. The regularity of the rectangular array makes the wiring and component placement more orderly, reducing the complexity of the layout design. The regular arrangement facilitates layout optimization using automated circuit board design tools, improving design efficiency.

[0067] The rectangular array design also improves production efficiency. The rectangular array distribution facilitates assembly using automated production equipment such as chip mounters, improving production accuracy and speed. The regular layout reduces the error rate in manual operations, ensuring a higher yield.

[0068] The rectangular array design also improves heat management. The rectangular array distribution ensures relatively uniform spacing between devices, facilitating uniform heat dissipation and avoiding local overheating. More effective heat dissipation structures such as heat sink or fan placement can be designed based on the characteristics of the rectangular array.

[0069] The rectangular array design also optimizes signal integrity. The regular arrangement helps reduce electromagnetic interference (EMI) between adjacent devices, improving signal integrity and system stability. Reasonable spacing and layout can reduce crosstalk between signal lines, which is particularly important in high-speed signal transmission.

[0070] The rectangular array design makes the location of each device more explicit, facilitating quick identification of target devices during debugging and maintenance.

[0071] The rectangular array distribution also ensures uniform distribution of mechanical stress on the circuit board, reducing the risk of damage caused by stress concentration.

[0072] In one embodiment, as shown in Figure 2 the three switch devices 31 and the three resistors 32 form a three-by-three grid arrangement. The rectangular array distribution makes the circuit board 1 look more neat and professional, improving the overall quality of the product.

[0073] In some embodiments, a plurality of fixing holes 12 are arranged on the circuit board 1, and the plurality of fixing holes 12 are arranged outside the resistor area 11a, for fixing the heat sink 5.

[0074] Since the device is used in a high-voltage and high-power environment, a large amount of heat is generated, and therefore the heat sink 5 is installed through the fixing holes 12 to ensure stable operation of the device under high-temperature conditions. Arranging the fixing holes 12 around the resistor area 11a can reduce the occupied space of the heat sink 5 on the basis of achieving heat dissipation of the resistor 32, thereby further reducing the volume of the entire device.

[0075] In some embodiments, as shown in FIG. 1, the plurality of fixing holes 12 are arranged outside the switch area 11b and the resistor area 11a. The switch device 31 and the resistor 32 are cooled by the same heat sink 5. Figure 2

[0076] Arranging the fixing holes 12 around the switch area 11b and the resistor area 11a can reduce the occupied space of the heat sink 5 on the basis of achieving simultaneous heat dissipation of the switch device 31 and the resistor 32, thereby further reducing the volume of the entire device.

[0077] In some embodiments, all the switch devices 31 have surfaces facing away from the first surface 11 located in the same plane, facilitating surface contact with the heat sink 5 to achieve effective heat dissipation.

[0078] In some embodiments, all the switch devices 31 have surfaces facing away from the first surface 11 located in the same plane, facilitating surface contact with the heat sink 5 to achieve effective heat dissipation.

[0079] In one embodiment, the heat sink 5 simultaneously cools all the switch devices 31. In order to improve the heat conduction efficiency, all the switch devices 31 have surfaces facing away from the first surface 11 located in the same plane, facilitating the heat sink 5 to be designed to achieve surface contact between the heat sink 5 and all the switch devices 31 for heat conduction, and at the same time, the heat conduction path is consistent, which can avoid local high temperature.

[0080] In one embodiment, the heat sink 5 simultaneously cools all the resistors 32. In order to improve the heat conduction efficiency, all the resistors 32 have surfaces facing away from the first surface 11 located in the same plane, facilitating the heat sink 5 to be designed to achieve surface contact between the heat sink 5 and all the resistors 32 for heat conduction, and at the same time, the heat conduction path is consistent, which can avoid local high temperature.

[0081] ​In an embodiment, the heat sink 5 simultaneously dissipates heat from all the switching devices 31 and all the resistors 32. In order to improve the heat conduction efficiency, the surfaces of all the switching devices 31 and all the resistors 32 away from the first surface 11 are located in the same plane, so that the heat sink 5 is designed to be in surface contact with all the switching devices 31 and all the resistors 32 for heat conduction, ensuring that the heat conduction path is consistent, and local high temperature can be avoided.

[0082] In order to cope with the heat generation of all modules in the high-power use scenario, the circuit board 1 is provided with a fixing hole 12 for a heat sink 52 of a related module. In the case of subsequent high-power applications, a self-cooling scheme can be provided, so that more use scenarios can be applied.

[0083] In some embodiments, the master switch 4 includes a control chip or a mechanical switch.

[0084] The control chip as the master switch 4 has excellent performance in reliability, integration, flexibility, etc. In particular, for high-frequency, long-time working, and high-reliability application scenarios, the advantages of the control chip are particularly obvious.

[0085] The mechanical switch is an electrical element that realizes circuit on-off through a physical mechanism, and has the characteristics of simple structure, high reliability, and wide application.

[0086] In some embodiments, as shown in Figure 2 the load simulation device further includes:

[0087] The fan connector 6 fixed to the first surface 11 is used to install a cooling fan.

[0088] The load simulation device provided in the embodiments can determine whether to use an external fan for cooling according to the power consumption, so that the application can be applied to more use scenarios. The circuit board 1 is provided with a fan power supply interface and a fan support position for a related module. In the case of subsequent high-power applications, a self-cooling scheme can be provided.

[0089] The switching device 31 and the resistor 32 in series in the embodiments can simply and effectively simulate the load current. At the same time, based on the small size of the device, the device can be stacked for use. In a small effective space, the device can be stacked multiple times to simulate the large power consumption load required when a large power component works. The device can be fixed on a to-be-tested board to provide a test environment in a simple way, fully embodying the portability.

[0090] In some embodiments, as shown in Figure 3 the load simulation device further includes:

[0091] Radiator 5; Radiator 5 includes a heat dissipation base plate 51, heat dissipation fins 52 and a fixing member 53;

[0092] The heat dissipation substrate 51 includes a first side and a second side facing each other, and the heat sink 52 is fixed to the second side of the heat dissipation substrate 51. The heat dissipation substrate 51 is fixed to the circuit board 1 through the fixing hole 12 and the fixing member 53, and the first side of the heat dissipation substrate 51 is in thermal contact with all the resistors 32.

[0093] The heat sink 5 is fixed to the circuit board 1 by the fastener 53 and the fixing hole 12, and makes thermal contact with all the resistors 32, which can dissipate heat from the resistors 32 and ensure the stability of the entire device. The heat sink 5 conducts heat to the resistors 32 through the heat dissipation substrate 51 and transfers the heat to the heat sink 52. The heat sink 52 exchanges heat with the air to release the heat from the resistors.

[0094] In some embodiments, the first surface of the heat dissipation substrate 51 is in thermal contact with all resistors 32 and switching devices 31.

[0095] Using the same heat sink 5 to dissipate heat for the switching device 31 and the resistor 32 can facilitate the installation and fixation of the heat sink 5, avoid excessive mounting holes 12 on the circuit board 1 affecting the internal circuit routing, and further reduce the size of the circuit board 1.

[0096] like Figure 4 As shown, the load simulation device provided in this embodiment can be soldered onto the server motherboard or system board at the location requiring load testing. Due to its small size and dedicated current-carrying metal sheet 2, soldering is simple. Furthermore, its small size allows for simultaneous load testing at multiple locations.

[0097] For example, Scenario 1: It is necessary to verify the current sharing of multiple protection chips connected in parallel on a server system board. Multiple devices can be used to simulate load points and actual current conditions at various actual component locations, thereby measuring the current sharing at the protection chip terminals. Scenario 2: It is necessary to simulate the temperature rise of a server motherboard under long-term full-load operation. Similarly, multiple devices can be soldered to the required locations for simulation. Simultaneously, the device itself can also provide heat dissipation to prevent overheating.

[0098] In both scenarios described above, the need for extensive use of electronic load testers for load testing is avoided. This significantly reduces the time and space required for test environment setup, allowing for more efficient and stable verification. This greatly assists in server-related verification work, enabling more comprehensive power supply verification within a limited timeframe, facilitating more tests, and ensuring reliability.

[0099] It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application cover the modifications and variations of this application provided they come within the scope of the appended claims and their equivalents.

Claims

1. A load simulation device for high voltage and high power consumption, characterized by, The load simulation device comprises: a circuit board comprising a first surface; a metal sheet fixed to the first surface for welding with a board to be tested; a plurality of adjustable resistance modules fixed to the first surface; the plurality of adjustable resistance modules are arranged in parallel and electrically connected with the metal sheet; each of the adjustable resistance modules comprises a switch device and a resistor arranged in series; a master control switch fixed to the circuit board, the master control switch is electrically connected with each switch device in the plurality of adjustable resistance modules, for controlling the on-off of each switch device; wherein the first surface comprises a resistance area, and the array of the orthographic projections of all the resistors on the first surface is distributed in the resistance area.

2. The load simulation apparatus according to claim 1, characterized by, The switch device comprises one or more of an insulated gate bipolar transistor device, a metal oxide semiconductor device, a metal oxide semiconductor device based on silicon carbide material, and a high electron mobility transistor based on gallium nitride material.

3. The load simulation apparatus according to claim 2, characterized by, The first surface further comprises a switch area, and the array of the orthographic projections of all the switch devices on the first surface is distributed in the switch area.

4. The load simulation device according to claim 3, characterized by The circuit board is provided with a plurality of fixing holes, the plurality of fixing holes are arranged outside the resistance area, and the plurality of fixing holes are used for fixing a heat sink.

5. The load simulation device of claim 4, wherein The plurality of fixing holes are arranged outside the switch area and the resistance area.

6. The load simulation apparatus according to claim 4, wherein The side surfaces of all the switch devices away from the first surface are located in the same plane. And / or, the side surfaces of all the resistors away from the first surface are located in the same plane.

7. The load simulation device of claim 5, wherein The load simulation device further comprises: a heat sink; the heat sink comprises a heat dissipation base plate, a heat dissipation fin, and a fixing member; wherein the heat dissipation base plate comprises opposite first and second surfaces, the heat dissipation fin is fixed to the second surface of the heat dissipation base plate; the heat dissipation base plate is fixed to the circuit board through the fixing hole and the fixing member, and the first surface of the heat dissipation base plate is in thermal contact with all the resistors.

8. The load simulation device of claim 7, wherein, The first surface of the heat dissipation base plate is in thermal contact with all the resistors and the switch devices.

9. The load simulation device according to claim 1 or 4, characterized by The master control switch comprises a control chip or a mechanical switch.

10. The load simulation device according to any one of claims 1 to 8, characterized by, The load simulation device further comprises: a fan connector fixed to the first surface, for mounting a heat dissipation fan.

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