RCD load box

Abstract

The utility model discloses an RCD load box, and relates to the technical field of load boxes. The device comprises a box body, a plurality of mounting plates are arranged on the inner wall of the box body in an array mode, a plurality of ventilation openings are formed in one side of the box body in a penetrating mode, and the ventilation openings correspond to the mounting plates in a one-to-one mode; the heat dissipation mechanism comprises an air inlet pipe arranged at the bottom of the box body, a fan is arranged in the air inlet pipe, one end of the air inlet pipe communicates with an air outlet pipe frame, and the air outlet pipe frame is located on the side, away from the ventilation opening, of the box body; according to the utility model, electronic components are mounted in a layered manner through the mounting plate, the ventilation opening is formed in one side of the box body, the air outlet pipe frame is arranged on one side, far away from the ventilation opening, of the box body, the fan sucks in external air, and refrigerated water cools and refrigerates the air through the cold exchange pipe; and the refrigerated air passes through the electronic component mounting area transversely through the air outlet pipe frame and is discharged through the ventilation opening, so that the electronic component is uniformly blown and cooled, and the heat can be quickly guided out.

Description

TECHNICAL FIELD

[0001] The utility model relates to a load box technical field, concretely relates to a RCD load box. BACKGROUND

[0002] RCD load box is a kind of power detection equipment, mainly to generator, uninterruptible power supply, power transmission equipment is loaded detection and maintenance, is generator set and UPS uninterruptible power supply periodic test, maintenance tool equipment, load box when running, its inside will emit a large amount of heat, therefore, load box usually cooperates with heat dissipation system to dissipate heat, to ensure the normal operation of load box.

[0003] The existing load box is usually to open the heat dissipation hole on the box body and be equipped with fan to dissipate heat, but in actual use, since numerous electronic components are arranged in the box body, electronic components will block each other, cause airflow circulation not enough smooth, cannot quickly export heat, to make its poor heat dissipation effect, therefore, the utility model provides a kind of RCD load box. UTILITY MODEL CONTENT

[0004] The utility model aims at: to solve the problems in the above background art, the utility model provides a kind of RCD load box.

[0005] The utility model discloses a kind of RCD load boxes to achieve the above purposes, and specifically adopt the following technical solutions:

[0006] A kind of RCD load box, comprising:

[0007] Box, the inner wall of which is provided with a plurality of mounting plates, a plurality of ventilation openings are provided through one side of the box, and the plurality of ventilation openings are one-to-one corresponding to the plurality of mounting plates, respectively.

[0008] Heat dissipation mechanism, including the air inlet pipe arranged at the bottom of the box, the fan is arranged in the air inlet pipe, the air outlet pipe frame is communicated with one end of the air inlet pipe, and the air outlet pipe frame is located on the side of the box away from the ventilation opening, the water tank is arranged in the box, the bottom of the water tank is communicated with the cold exchange pipe located in the air inlet pipe, and the semiconductor refrigeration fin is arranged in the water tank.

[0009] Further, the air outlet pipe frame includes the air guide pipe communicated with the air inlet pipe, a plurality of shunt pipes are communicated with the air guide pipe, the plurality of shunt pipes are one-to-one corresponding to the plurality of ventilation openings, respectively, and a plurality of spray pipes are arrayed communicated on the shunt pipe.

[0010] Further, the number of air inlet pipes is a plurality of, one end of the plurality of air inlet pipes is communicated with the air guide pipe through the confluence pipe, and the number of cold exchange pipes is a plurality of and is located in the plurality of air inlet pipes, respectively.

[0011] Further, the cold exchange pipe is configured as a spiral shape.

[0012] Further, the converging pipe is provided with a through slot on one side, and an arc-shaped cover plate for blocking the through slot is detachably installed on the converging pipe, and a mesh bag for placing a drying agent is arranged on the inner wall of the arc-shaped cover plate.

[0013] Further, the converging pipe is provided with a first magnetic block, and the arc-shaped cover plate is provided with a second magnetic block magnetically connected with the first magnetic block.

[0014] Further, a plurality of through slots are arranged on the mounting plate.

[0015] Further, the air inlet pipe and the air vent are both provided with a dustproof net.

[0016] The beneficial effects of the present application are as follows:

[0017] In the present application, the electronic components are installed in layers by the mounting plate, a plurality of air vents are arranged on one side of the box, and an air outlet pipe frame is arranged on the side of the box far from the air vents; air outside is sucked in by the fan, the water after refrigeration is used to cool and refrigerate the air through the cold exchange pipe, and the air after refrigeration is horizontally passed through the electronic component installation area through the air outlet pipe frame and is discharged through the air vent, which not only effectively and uniformly blows and dissipates heat of the electronic components, but also quickly leads out the heat, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a perspective view of the present application;

[0019] Figure 2 is a perspective view of the present application;

[0020] Figure 3 is another perspective view of the present application;

[0021] Figure 4 is an exploded view of part of the present application;

[0022] Figure 5 is an enlarged view of A in the present application; Figure 2

[0023] Figure 6 is an enlarged view of B in the present application; Figure 3

[0024] Figure 7 is an enlarged view of C in the present application; Figure 4

[0025] ​​​Mark: 1, box; 2, mounting plate; 3, ventilation opening; 4, heat dissipation mechanism; 5, through slot; 6, arc cover plate; 7, net bag; 8, first magnetic block; 9, second magnetic block; 10, through slot; 11, dust screen; 401, air inlet pipe; 402, fan; 403, air outlet pipe support; 404, water tank; 405, cold exchange pipe; 406, semiconductor refrigeration piece; 407, confluence pipe; 4031, air guide pipe; 4032, shunt pipe; 4033, nozzle. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the utility model embodiment more clear, the technical scheme in the utility model embodiment will be clearly and completely described below in combination with the drawings in the utility model embodiment.

[0027] As Figures 1-7 shown, an RCD load box according to one embodiment of the utility model comprises:

[0028] The box 1 has a plurality of mounting plates 2 arranged on the inner wall, and the electronic components inside the load box are arranged on the mounting plates 2. The plurality of mounting plates 2 are used for installing the electronic components in layers, so that the electronic components have a certain installation spacing. A plurality of ventilation openings 3 are provided through one side of the box 1, and the plurality of ventilation openings 3 correspond to the plurality of mounting plates 2 one by one. Since the mounting plates 2 install the electronic components in layers, and the plurality of ventilation openings 3 correspond to the plurality of mounting plates 2 one by one, the plurality of ventilation openings 3 correspond to the installation spacing of the electronic components, so that the airflow can circulate and dissipate heat.

[0029] The heat dissipation mechanism 4 comprises an air inlet pipe 401 arranged at the bottom of the box 1. The air inlet pipe 401 is provided with a fan 402. One end of the air inlet pipe 401 is communicated with an air outlet pipe support 403, and the air outlet pipe support 403 is located on the side of the box 1 away from the ventilation opening 3. As Figure 2 shown, the air outlet pipe support 403 is arranged on the side of the box 1 away from the ventilation opening 3. When dissipating heat, the fan 402 works to suck the airflow from outside into the air inlet pipe 401. The airflow then flows into the air outlet pipe support 403 and is sprayed out through the air outlet pipe support 403. Since the air outlet pipe support 403 and the ventilation opening 3 are arranged opposite to each other, the electronic components on different installation layers can be effectively blown, and the heat can be quickly discharged, thereby improving the heat dissipation efficiency. The box 1 is provided with a water tank 404. The bottom of the water tank 404 is communicated with a cold exchange pipe 405 located in the air inlet pipe 401. The water tank 404 is provided with a semiconductor refrigeration piece 406. Preferably, as Figure 6As shown, one side of the water tank 404 is provided with a sleeve extending to the outside of the box body 1, the refrigeration end of the semiconductor refrigeration sheet 406 is located in the water tank 404, and the heat exchange end is located outside the water tank 404 and is arranged in the sleeve, so that the heat of the heat exchange end of the semiconductor refrigeration sheet 406 cannot be directly conducted into the box body 1, and meanwhile, the capacity of the water tank 404 does not need to be too large; when clean water is added into the water tank 404, the clean water will flow downward in a limited manner, so as to fill the refrigeration pipe 405; after the water fills the refrigeration pipe 405, the semiconductor refrigeration sheet 406 only needs to be submerged; the semiconductor refrigeration sheet 406 is powered on to refrigerate the water in the water tank 404; since the water tank 404 is communicated with the refrigeration pipe 405, the refrigerated water can conduct the cold energy to the refrigeration pipe 405 (an iron pipe or a copper pipe); since the refrigeration pipe 405 is located in the air inlet pipe 401, when the air flows along the air inlet pipe 401, the air can pass through the refrigeration pipe 405, and the refrigeration pipe 405 can conduct the cold energy to the air, so as to refrigerate the air; the refrigerated air enters the box body 1 to blow and cool the electronic elements, so as to further improve the heat dissipation efficiency.

[0030] In the scheme, the electronic elements are installed in layers through the mounting plate 2, a plurality of ventilation openings 3 are arranged on one side of the box body 1, and the air outlet pipe frame 403 is arranged on the side, away from the ventilation openings 3, of the box body 1; the air outside is sucked in through the fan 402; the refrigerated water is cooled through the refrigeration pipe 405; the refrigerated air passes through the air outlet pipe frame 403 to cross the electronic element installation area in a transverse direction and is discharged through the ventilation openings 3; the electronic elements are effectively and uniformly blown and cooled; the heat is quickly discharged; and the heat dissipation efficiency is improved.

[0031] As shown in the figure, Figure 4 The specific structure of the air outlet pipe frame 403 is disclosed to realize uniform air supply; the air outlet pipe frame 403 comprises the air guide pipe 4031 communicated with the air inlet pipe 401; a plurality of shunt pipes 4032 are communicated on the air guide pipe 4031; the plurality of shunt pipes 4032 are one-to-one corresponding to the plurality of ventilation openings 3; a plurality of spray pipes 4033 are arrayed and communicated on the shunt pipe 4032; the air flows in the air inlet pipe 401 to the air guide pipe 4031, is then shunted into the plurality of shunt pipes 4032, and is finally sprayed out through the plurality of spray pipes 4033; preferably, the plurality of spray pipes 4033 are arrayed and distributed along the length direction of the shunt pipe 4032, so that the air can uniformly blow and cool the electronic elements.

[0032] As shown in the figure, Figure 4As shown in the further technical scheme of the utility model for the air inlet pipe 401, the number of the air inlet pipe 401 is several, one end of the several air inlet pipes 401 is communicated with the air guide pipe 4031 through the confluence pipe 407, the number of the cold exchange pipe 405 is several and is located in the several air inlet pipes 401 respectively, because the air outlet pipe frame 403 has several nozzles 4033, the covering area when the airflow blows is increased, by setting the several air inlet pipes 401, and each air inlet pipe 401 is equipped with the fan 402 and the cold exchange pipe 405, for increasing the air inlet amount, at the same time, the several air inlet pipes 401 are communicated with the air guide pipe 4031 through the confluence pipe 407, while increasing the air inlet amount, the air pressure sprayed by the nozzle 4033 can also be improved, thereby improving the blowing heat dissipation efficiency of the electronic component.

[0033] As Figure 5 shown, the further technical scheme of the utility model for the cold exchange pipe 405 is disclosed, the cold exchange pipe 405 is structured as a spiral, as Figure 2 and Figure 5 shown, by structuring the cold exchange pipe 405 as a spiral pipe, the whole is conical, for increasing the contact area of the airflow and the cold exchange pipe 405, so that the airflow cooling and refrigeration effect is better, further improving the heat dissipation efficiency.

[0034] As Figure 7 shown, the further technical scheme of the utility model for the confluence pipe 407 is disclosed, one side of the confluence pipe 407 is provided with a through slot 5, the arc-shaped cover plate 6 for plugging the through slot 5 is detachably installed on the confluence pipe 407, the inner wall of the arc-shaped cover plate 6 is provided with the mesh bag 7 for placing the drying agent, when in summer, the outside air has a certain temperature, and the cold exchange pipe 405 has a certain cold capacity under the influence of cold water, when the airflow contacts the cold exchange pipe 405, under the action of cold and heat exchange, a small amount of water droplets will be generated on the outer surface of the cold exchange pipe 405, so that the airflow has a small amount of humidity, by setting the mesh bag 7 in the confluence pipe 407, the drying agent is placed in the mesh bag 7, can absorb the humidity in the air, to play the role of dehumidification, avoid affecting the electronic component, the arc-shaped cover plate 6 can be installed and detached, so that the drying agent in the mesh bag 7 is replaced conveniently, in actual use, the drying agent can be replaced regularly, to ensure that the gas is dehumidified stably, and the equipment is operated normally.

[0035] As Figure 7As shown in the further technical scheme of the utility model discloses to the confluence pipe 407, the first magnetic block 8 is arranged on the confluence pipe 407, the second magnetic block 9 magnetically connected with the first magnetic block 8 is arranged on the arc cover plate 6, the net bag 7 is placed into the confluence pipe 407 through the through slot 5, then the arc cover plate 6 covers the through slot 5, the magnetic cooperation of the first magnetic block 8 and the second magnetic block 9 is utilized, so that the arc cover plate 6 is fixed, in actual use, the inner wall of arc cover plate 6 can be provided with sealing pad, so that after arc cover plate 6 covers the through slot 5, the covering gap can be sealed.

[0036] As Figure 2 As shown in the further technical scheme of the utility model discloses to the mounting plate 2, a plurality of through slots 10 are arrayed and penetrated on the mounting plate 2, since electronic components are usually arranged on the top surface of the mounting plate 2, the through slots 10 are arrayed and penetrated on the mounting plate 2, so that after the electronic components are installed, the bottom part has exposed space, so that when the airflow flows, the bottom part can be blown, thereby further improving the heat dissipation efficiency.

[0037] As Figure 1 And Figure 2 As shown in the further technical scheme of the utility model discloses to the dustproof of the box 1, the dust screen 11 is arranged on the air inlet pipe 401 and the ventilation opening 3, by arranging the dust screen 11, under the premise that the air inlet pipe 401 air inlet and the ventilation opening 3 exhaust are not affected, dust and impurities in the air are effectively blocked, so that dust and impurities in the external air are prevented from entering the box 1, to play the role of protecting the internal electronic components of the box 1.

[0038] The above description of the disclosed embodiments enables a person skilled in the art to implement or use the utility model. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the utility model. Therefore, the utility model will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An RCD load box characterized by, Include: Box (1), the inner wall array is provided with several mounting plates (2), the side of the box (1) is provided with several ventilation openings (3), and the several ventilation openings (3) are one-to-one corresponding to the several mounting plates (2); The heat dissipation mechanism (4) comprises an air inlet pipe (401) arranged at the bottom of the box (1), the air inlet pipe (401) is provided with a fan (402), one end of the air inlet pipe (401) is communicated with an air outlet pipe frame (403), and the air outlet pipe frame (403) is located on the side of the box (1) away from the ventilation opening (3), the box (1) is provided with a water tank (404), the bottom of the water tank (404) is communicated with a cold exchange pipe (405) located in the air inlet pipe (401), and the water tank (404) is provided with a semiconductor refrigeration sheet (406).

2. The RCD load box of claim 1, wherein, The air outlet pipe frame (403) comprises a wind guide pipe (4031) communicated with the air inlet pipe (401), a plurality of shunt pipes (4032) are communicated on the wind guide pipe (4031), the plurality of shunt pipes (4032) are one-to-one corresponding to the plurality of ventilation openings (3), and a plurality of spray pipes (4033) are arrayed and communicated on the shunt pipe (4032).

3. The RCD load box of claim 2, wherein, The number of the air inlet pipe (401) is several, one end of the plurality of air inlet pipes (401) is communicated with the wind guide pipe (4031) through a confluence pipe (407), and the number of the cold exchange pipe (405) is several and is located in the plurality of air inlet pipes (401).

4. The RCD load box of claim 1, wherein, The cold exchange pipe (405) is configured as a spiral shape.

5. The RCD load box of claim 3, wherein, The confluence pipe (407) is provided with a through slot (5) on one side, the confluence pipe (407) is detachably provided with an arc-shaped cover plate (6) for blocking the through slot (5), and the inner wall of the arc-shaped cover plate (6) is provided with a mesh bag (7) for placing a drying agent.

6. The RCD load box of claim 5, wherein, The confluence pipe (407) is provided with a first magnetic block (8), and the arc-shaped cover plate (6) is provided with a second magnetic block (9) magnetically connected with the first magnetic block (8).

7. The RCD load box of claim 1, wherein, The mounting plate (2) is arrayed and provided with several through slots (10).

8. The RCD load box of claim 1, wherein, The air inlet pipe (401) and the ventilation opening (3) are provided with a dust screen (11).

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