Drive mechanism

Abstract

A driving mechanism is used for driving an optical element to move and mainly comprises a fixed part, a movable part and a driving assembly. The movable part is movably connected with the fixed part, the optical element is arranged on the movable part, and the driving assembly is used for driving the movable part to move relative to the fixed part.

Description

TECHNICAL FIELD

[0001] The present application relates to a driving mechanism. More particularly, the present application relates to a driving mechanism for moving an optical element. BACKGROUND

[0002] With the development of technology, many electronic devices (e.g. smart phones or digital cameras) nowadays have the function of taking pictures or recording videos. These electronic devices are increasingly popular and are developing towards the direction of convenience and thinness, providing users with more choices.

[0003] Some electronic devices with the function of taking pictures or recording videos are provided with a lens driving module to drive an optical element to move, thereby achieving the functions of auto focusing (AF) and optical image stabilization (OIS), in which light can pass through the optical element to form an image on a photosensitive element.

[0004] However, how to further achieve the miniaturization of the lens driving module and improve its stability and reliability has become an important challenge for researchers in this technical field. SUMMARY

[0005] The present application aims to provide a driving mechanism to solve at least one of the above problems.

[0006] In view of the above known problems, an embodiment of the present application provides a driving mechanism for moving an optical element, which mainly comprises a fixed part, a movable part and a driving assembly. The movable part is movably connected to the fixed part, wherein the optical element is arranged on the movable part, and the driving assembly is used to drive the movable part to move relative to the fixed part.

[0007] In an embodiment, the driving mechanism further comprises an upper spring plate and a side spring plate, and the fixed part comprises a base and a housing connected to each other, wherein the upper spring plate and the side spring plate are connected to the movable part and the base.

[0008] In an embodiment, the upper spring plate and the side spring plate are not coplanar.

[0009] In an embodiment, the upper spring plate and the side spring plate are perpendicular to each other or parallel to each other.

[0010] In an embodiment, an external light enters the optical element along a vertical direction, and the side spring plate is parallel to the vertical direction.

[0011] In an embodiment, the driving mechanism further comprises a metal sheet, a support member, and a buffer element, the metal sheet is embedded in the movable part, the support member has a metal material and is fixed on the metal sheet, and the buffer element covers the support member.

[0012] In an embodiment, the metal sheet has a magnetic permeability greater than that of the support member.

[0013] In an embodiment, the metal sheet and the support member are welded to each other.

[0014] In an embodiment, the metal sheet has a C-shaped structure.

[0015] In an embodiment, the driving mechanism further comprises a gasket and a ball joint, the ball joint is pivoted to the movable part and the fixed part, and the movable part forms a receiving groove, wherein the gasket is disposed in the receiving groove and forms an opening, and a portion of the ball joint is located in the opening.

[0016] In an embodiment, the gasket has a metal material, and the opening has a polygonal structure, wherein the ball joint contacts at least two sides of the opening.

[0017] In an embodiment, the opening has a triangular structure.

[0018] In an embodiment, the driving mechanism further comprises a metal sheet, embedded in the movable part and exposed at the bottom side of the receiving groove.

[0019] In an embodiment, the hardness of the gasket is greater than that of the metal sheet.

[0020] In an embodiment, the metal sheet has a magnetic permeability greater than that of the gasket.

[0021] In an embodiment, the driving mechanism further comprises a buffer rubber, disposed in the receiving groove and connected to the metal sheet and the gasket.

[0022] In an embodiment, the ball joint contacts the buffer rubber.

[0023] In an embodiment, the driving mechanism further comprises a plurality of ball elements and a ball joint, the ball joint is pivoted to the movable part and the fixed part, and the movable part forms a receiving groove, wherein a plurality of the ball elements are disposed in the receiving groove, and the ball joint contacts a plurality of the ball elements.

[0024] In an embodiment, the diameter of the ball joint is greater than that of a plurality of the ball elements.

[0025] In an embodiment, the driving mechanism further comprises a buffer rubber, disposed in the receiving groove and contacting a plurality of the ball elements. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 FIG. 1 shows a perspective view of an optical system according to an embodiment of the present application.

[0027] Figure 2 FIG. 2 shows a cross-sectional view of the optical system in FIG. 1. Figure 1

[0028] Figure 3 FIG. 3 shows a perspective view of a driving mechanism in FIG. 1. Figure 1

[0029] Figure 4 FIG. 4 shows a perspective view of another driving mechanism in FIG. 1. Figure 1

[0030] Figure 5 FIG. 5 shows an exploded view of the driving mechanism in FIG. 1 when the housing is separated from the base. Figure 3

[0031] Figure 6 FIG. 6 shows another perspective exploded view of the driving mechanism in FIG. 1. Figure 3

[0032] Figure 7 FIG. 7 shows an exploded view of the base, the ball joint, the upper spring, the side spring, the first coil, the substrate, the carrier plate, and the sensor HS in FIG. 1. Figure 6

[0033] Figure 8 FIG. 8 shows another perspective exploded view of the base, the ball joint, the upper spring, the side spring, the first coil, the substrate, the carrier plate, and the sensor in FIG. 1. Figure 6

[0034] Figure 9 FIG. 9 shows a perspective view of the substrate, the carrier plate, and the sensor combined in FIG. 1. Figures 5-8

[0035] Figure 10 FIG. 10 shows a partial cross-sectional view of the base, the carrier, the substrate, and the carrier plate after assembly.

[0036] Figure 11 FIG. 11 shows a perspective view of the base, the carrier, the substrate, and the carrier plate after assembly.

[0037] Figure 12 FIG. 12 shows an exploded view of the base, the carrier, the ball joint, and a spacer before combination.

[0038] Figure 13 FIG. 13 shows another perspective exploded view of the base and the carrier before combination.

[0039] Figure 14 ​​​​​​​​An exploded view showing the cushioning element, the cushioning pad, the metal sheet, and the support before being combined with the carrier.

[0040] Figure 15 An exploded view showing the cushioning element before being combined with the support.

[0041] Figure 16 An exploded view showing the carrier, the ball joint, the gasket, and the cushioning rubber before being combined.

[0042] Figure 17 An exploded view showing Figure 16 the carrier, the ball joint, the gasket, and the cushioning rubber after being combined.

[0043] Figure 18 An exploded view showing the ball joint, the cushioning rubber, the plurality of ball elements, and the carrier combination of another embodiment of the present application before being combined.

[0044] Figure 19 An exploded view showing Figure 18 the ball joint, the cushioning rubber, the plurality of ball elements, and the carrier combination after being combined.

[0045] Reference signs are as follows:

[0046] 100: optical system

[0047] 10: driving mechanism

[0048] 11: circuit board

[0049] 12: base

[0050] 121: clamping block

[0051] 122: opening

[0052] 123: groove

[0053] 1231: limiting surface

[0054] 1232: limiting surface

[0055] 1233: surface

[0056] 124: ball seat

[0057] 13: carrier

[0058] 131: accommodating groove

[0059] 13A: cushioning element

[0060] 13B: cushioning pad

[0061] 13T: metal sheet

[0062] 13U: support

[0063] 14: substrate

[0064] 141: winding post

[0065] 142: card block

[0066] 143: recess

[0067] 144: through hole

[0068] 145: protrusion

[0069] 146: protrusion

[0070] 14P: circuit element

[0071] 15: carrier plate

[0072] 151: conductive line

[0073] 16: housing

[0074] 161: card slot

[0075] 162: card slot

[0076] 17: ball joint

[0077] 18: gasket

[0078] 181: opening

[0079] 19: ball element

[0080] 20: driving mechanism

[0081] 21: circuit board

[0082] A: center axis

[0083] C1: first coil

[0084] C2: second coil

[0085] D1: vertical direction

[0086] D2: horizontal direction

[0087] FS: upper spring piece

[0088] G: buffer rubber

[0089] HS: sensor

[0090] L1: optical element

[0091] L2: optical element

[0092] M1: first magnetic element

[0093] M2: second magnetic element

[0094] R: optical element

[0095] RS: side spring

[0096] V: connection position DETAILED DESCRIPTION

[0097] The driving mechanisms of the embodiments of the present application are described below. However, it can be easily understood that the embodiments of the present application provide many suitable inventive concepts and can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are merely for illustration in a specific manner using the present application and are not intended to limit the scope of the present application.

[0098] and unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0099] and the foregoing and other technical contents, features and effects of the present application will become apparent from the following detailed description of a preferred embodiment, given by way of example only, which is made with reference to the accompanying drawings. Directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only with reference to the direction of the accompanying drawings. Therefore, the directional terms used in the embodiments are used for illustration and not for limiting the present application.

[0100] and first refer to Figures 1-4 wherein Figure 1 represents a perspective view of an optical system 100 according to an embodiment of the present application, Figure 2 represents Figure 1 a cross-sectional view of the optical system 100 in Figure 3 represents Figure 1 a perspective view of a driving mechanism 10 in Figure 4 represents Figure 1 a perspective view of another driving mechanism 20 in

[0101] and as shown in Figures 1-4 , the optical system 100 of the present embodiment can be installed inside a mobile phone or other portable electronic device, which mainly includes two driving mechanisms 10, 20 connected to each other and a plurality of optical elements R, L1, L2. Specifically, the aforementioned optical element R (e.g. a prism) is arranged inside the driving mechanism 10, and the aforementioned optical elements L1, L2 (e.g. optical lenses) are arranged inside the driving mechanism 20.

[0102] In this embodiment, the driving mechanisms 10, 20 are voice coil motors (VCMs), for example. The driving mechanism 10 can drive the optical element R to rotate, and the driving mechanism 20 can drive the optical element L2 to move along the X-axis direction, thereby achieving functions such as auto focusing (AF) or optical image stabilization (OIS).

[0103] With the above mechanism configuration, external light can enter the optical element R of the driving mechanism 10 along a vertical direction D1 (-Z-axis direction), and then be reflected by the optical element R and sequentially pass through the optical elements L1, L2 along a horizontal direction D2 (X-axis direction), and then exit the optical system 100 to reach an image sensing element (not shown), thereby generating a digital image.

[0104] It can also be seen from Figures 1-4 that the bottom sides of the driving mechanisms 10, 20 are respectively provided with circuit boards 11, 21. External circuits can apply current signals to the coils inside the driving mechanisms 10, 20 through the circuit boards 11, 21, thereby generating electromagnetic driving forces to drive the optical elements R, L1, L2 inside the driving mechanisms 10, 20 to move, thereby achieving functions such as auto focusing (AF) or optical image stabilization (OIS).

[0105] Then, please refer to Figures 5-7 , wherein Figure 5 represents an exploded view of the housing 16 of the driving mechanism 10 in Figure 3 separated from the base 12, Figure 6 represents another perspective exploded view of the driving mechanism 10 in Figure 3 , Figure 7 represents an exploded view of the base 12, the ball joint 17, the upper spring FS, the side spring RS, the first coil C1, the substrate 14, the carrier plate 15, and the sensor HS in Figure 6 , Figure 8 represents another perspective exploded view of the base 12, the ball joint 17, the upper spring FS, the side spring RS, the first coil C1, the substrate 14, the carrier plate 15, and the sensor HS in Figure 6 , Figure 9 represents a perspective view of the substrate 14, the carrier plate 15, and the sensor HS combined in Figures 5-8 .

[0106] As shown in Figures 5-9As shown, the driving mechanism 10 of the embodiment of the present application mainly comprises a circuit board 11, a base 12, a bearing 13, two substrates 14, two carriers 15, a housing 16, a ball joint 17, at least one upper spring FS and at least one side spring RS. The base 12 and the housing 16 are fixed to each other and form a fixed part of the driving mechanism 10.

[0107] In particular, the circuit board 11 is fixed to the bottom of the base 12, and the upper spring FS and the side spring RS are connected between the base 12 and the bearing 13. The bearing 13 is movably connected to the ball joint 17 inside the base 12, so that the bearing 13 and the optical element R arranged on the bearing 13 can rotate relative to the base 12 and serve as a movable part of the driving mechanism 10.

[0108] In this embodiment, the upper spring FS is parallel to the XY plane, and the side spring RS is parallel to the YZ plane, that is, the upper spring FS and the side spring RS are perpendicular to each other. However, the upper spring FS and the side spring RS can also be parallel to each other but not coplanar, and the present application is not limited to the disclosed embodiment.

[0109] On the other hand, the first magnetic element M1 is arranged on both sides of the bearing 13, and the second magnetic element M2 is arranged on the bottom of the bearing 13. In addition, the substrate 14 is fixed in the groove 123 on both sides of the base 12, and the first coil C1 is arranged on the substrate 14, and the second coil C2 is arranged on the circuit board 11.

[0110] It should be understood that the positions of the first and second coils C1, C2 are adjacent to the first and second magnets M1, M2 (e.g. magnets), respectively, and the first and second coils C1, C2 and the first and second magnets M1, M2 form a driving assembly of the driving mechanism 10 to drive the bearing 13 to rotate relative to the base 12.

[0111] When a current signal is applied to the first and second coils C1, C2 through the circuit board 11, the bearing 13 and the optical element R arranged thereon can be driven to rotate relative to the base 12 by the magnetic force generated between the first and second coils C1, C2 and the first and second magnets M1, M2, thereby achieving the functions of automatic focusing (AF) or optical image stabilization (OIS).

[0112] In addition, the driving mechanism 10 can be used in a camera module, and the camera module can be used in a mobile phone, a tablet computer, a digital camera, a wearable device or the like. Figures 5-6As can be seen, the housing 16 is formed with clamping slots 161, 162, and during assembly of the driving mechanism 10, the clamping blocks 121 protruding from the surface of the base 12 can be inserted into the clamping slots 161, and the clamping blocks 142 protruding from the surface of the substrate 14 can be inserted into the clamping slots 162, so that the housing 16 and the base 12 can be firmly combined with each other.

[0113] Furthermore, as can be seen, Figure 5 As can be seen, the base 12 is further formed with a long slot 122 between the two clamping blocks 121 and penetrating a side wall of the base 12, and the slot 122 is opposite to the gap between the carrier 13 and the circuit board 11, so that the internal components of the base 12 can be observed from the outside of the base 12 during assembly, and the yield of the product can be greatly improved.

[0114] In the present embodiment, the substrate 14 is formed with two winding posts 141 on the bottom side, and during assembly, the first coil C1 and the winding posts 141 can be connected by wires (not shown), and then the wires on the winding posts 141 can be soldered or welded to conductive members on the base 12, and the conductive members can be electrically connected to external circuits through the circuit board 21.

[0115] Furthermore, a plurality of circuit elements 14P made of metal are combined inside the substrate 14 by insert molding, and the ends of each circuit element 14P protrude from the substrate 14, and during assembly, the circuit elements 14P can be soldered to the conductive members on the base 12, and electrically connected to the circuit board 21 below the base 12 through the conductive members.

[0116] In particular, the substrate 14 is, for example, a plastic substrate with a thickness greater than or equal to 0.2 mm (for example, 0.5 mm), and the carrier 15 is, for example, a flexible circuit board with a thickness less than the substrate 14 (for example, a thickness of 0.1 mm), and a sensor HS (for example, a Hall effect sensor or other magnetic field sensing element) is arranged inside the carrier 15 to sense the position change of the first magnet M1. In an embodiment, the sensor HS can also be other electronic elements (for example, integrated circuit elements or passive elements), and is not limited to the disclosed embodiments of the utility model.

[0117] It should be particularly noted that a recess 143 is formed on the outside of the substrate 14, and a through hole 144 is formed at the bottom of the recess 143, and during assembly, the carrier 15 can be arranged in the recess 143, and the sensor HS is located in the through hole 144. In an embodiment, glue can be applied in the recess 143 to simultaneously bond the substrate 14, the carrier 15, and the housing 16.

[0118] In another aspect, a protrusion 145 is formed on the inner side of the substrate 14, the protrusion 145 passes through the first coil C1, and the through hole 144 penetrates the protrusion 145, wherein the sensor HS is exposed on one side of the protrusion 145 through the through hole 144 (as shown in Figures 7-9 In this embodiment, a central axis A parallel to the Y-axis direction passes through the carrier plate 15, the sensor HS, the substrate 14, the first coil C1, and the groove 123.

[0119] Please also refer to Figure 10 and Figure 11 , wherein Figure 10 represents a partial cross-sectional view of the base 12, the carrier 13, the substrate 14, and the carrier plate 15 after assembly, Figure 11 represents a perspective view of the base 12, the carrier 13, the substrate 14, and the carrier plate 15 after assembly.

[0120] As shown in Figure 10 , the sensor HS arranged on the carrier plate 15 is located in the through hole 144 of the substrate 14 after assembly, and is used to sense the position change of the first magnet M1, wherein the carrier plate 15 is completely located inside the recess 143 of the substrate 14 after assembly, and does not protrude out of the recess 143.

[0121] In addition, a metal sheet 13T with high magnetic permeability is embedded in the carrier 13 in this embodiment Figure 10 , and the first magnetic element M1 is located between the metal sheet 13T and the first coil C1, thereby increasing the magnetic field strength between the first magnetic element M1 and the first coil C1, and greatly improving the driving force and overall performance of the driving mechanism 10.

[0122] As can be seen from Figure 10 and Figure 11 , the bottom side of the substrate 14 is formed with a protrusion 146 adjacent to the winding post 141 and abutting against a limiting surface 1231 located below the groove 123 of the base 12; or the substrate 14 can also abut against a limiting surface 1232 located above the groove 123 of the base 12, so that the substrate 14 can be positioned at a predetermined position inside the groove 123, wherein the limiting surfaces 1231, 1232 are perpendicular to the Z-axis direction.

[0123] It should be understood that the winding post 141 located below the substrate 14 can have a T-shaped or L-shaped structure, and the wires (not shown) wound around the winding post 141 and the circuit element 14P protruding from the substrate 14 can be respectively welded to the conductive member 12P exposed on the side of the base 12 during assembly Figure 11), the conductive member 12P is combined with the inside of the base 12 by insert molding, so that the aforementioned first coil C1 can be electrically connected to the external circuit through the wire, the conductive member 12P and the circuit board 21 below the base 12 in sequence.

[0124] and on the other hand, from Figure 11 it can be seen that one side of the carrier plate 15 is provided with a plurality of conductive lines 151 (for example, metal wires), one end of the aforementioned conductive lines 151 is electrically connected to the sensor HS, the other end of the conductive lines 151 is welded to the circuit element 14P (as shown by the connection position V in Figure 11 ), and the circuit element 14P protruding from both sides of the substrate 14 can be welded to the conductive member 12P exposed on the surface of the base 12. In this way, the sensor HS can be electrically connected to the circuit board 21 below the base 12 through the conductive lines 151, the circuit element 14P and the conductive member 12P in sequence, and the aforementioned sensor HS and the aforementioned connection position V are respectively located on the inside and the outside (opposite side) of the carrier plate 15.

[0125] and in an embodiment, the aforementioned sensor HS and the connection position V can also be located on the outside surface of the carrier plate 15 and face the shell 16, and are not limited to the embodiments disclosed by the utility model.

[0126] and specifically, the aforementioned conductive member 12P is exposed on the surface 1233 of the groove 123 of the base 12, the aforementioned surface 1233 is parallel to the Z-axis direction, and the connection position V of the circuit element 14P and the conductive lines 151 is closer to the first coil C1 than the aforementioned surface 1233 in the Y-axis direction.

[0127] and then please refer to Figure 12 and Figure 13 , wherein Figure 12 represents an exploded view of the base 12, the carrier 13, the spherical joint 17 and a gasket 18 before combination, Figure 13 represents another perspective exploded view of the base 12 and the carrier 13 before combination.

[0128] and as shown in Figure 12 and Figure 13 , a rectangular accommodating groove 131 is formed on the back side of the carrier 13 of the embodiment, the metal sheet 13T embedded in the carrier 13 is exposed on the bottom side of the accommodating groove 131, and a gasket 18 is arranged in the accommodating groove 131 Figure 12), the ball joint 17 (e.g. ceramic ball) is fixed in a ball seat 124 inside the base 12 and abuts the washer 18. When the driving mechanism 10 is assembled, a portion of the ball joint 17 is inside an opening 181 in the center of the washer 18, and the ball joint 17 abuts the metal sheet 13T exposed at the bottom of the accommodating groove 131.

[0129] It should be understood that the opening 181 in the embodiment has a triangular or other polygonal structure, so that the ball joint 17 can contact at least two sides of the opening 181 to disperse the pressure, thereby preventing the metal sheet 13T from being indented or structurally damaged by the ball joint 17.

[0130] In the embodiment, the washer 18 can be made of stainless steel or other metal material, which can be fixed to the metal sheet 13T by welding, and the magnetic permeability of the washer 18 and the metal sheet 13T is different. In addition, from Figure 12 and Figure 13 It can be seen that two buffer elements 13A are provided at the front end of the carrier 13, and since their hardness is less than that of the carrier 13, they can effectively prevent the front end of the carrier 13 from directly impacting other elements and causing structural damage.

[0131] In addition, please also refer to Figure 14 and Figure 15 , wherein Figure 14 represents an exploded view of the buffer element 13A, the buffer pad 13B, the metal sheet 13T, and the support element 13U before they are combined with the carrier 13, Figure 15 represents an exploded view of the buffer element 13A before it is combined with the support element 13U.

[0132] As shown in Figure 14 and Figure 15 , in addition to embedding the C-shaped metal sheet 13T inside the carrier 13, two metal support elements 13U are welded to the front side of the metal sheet 13T, wherein the two buffer elements 13A can cover the support elements 13U by embedding and forming, and the magnetic permeability of the support elements 13U and the metal sheet 13T is different. In an embodiment, the magnetic permeability of the metal sheet 13T is greater than that of the support elements 13U and the washer 18, and the hardness of the washer 18 is greater than that of the metal sheet 13T.

[0133] In addition, from Figure 14 and Figure 15 , it can be seen that two buffer pads 13B are provided at the bottom side of the carrier 13, wherein the second magnetic element M2 is located between the two buffer pads 13B, and the buffer element 13A and the buffer pad 13B can be made of plastic or rubber.

[0134] and please refer to Figure 16 and Figure 17 wherein Figure 16 represents the exploded view of the carrier 13, the ball joint 17, the gasket 18 and the buffer rubber G before combination, Figure 17 represents Figure 16 the carrier 13, the ball joint 17, the gasket 18 and the buffer rubber G in the combination of the carrier 13, the ball joint 17, the gasket 18 and the buffer rubber G.

[0135] and as shown in Figure 16 and Figure 17 In another embodiment of the present application, the buffer rubber G can also be arranged in the accommodating groove 131 to connect the gasket 18 and the metal sheet 13T, wherein the ball joint 17 can contact the buffer rubber G after assembly, thereby preventing the ball joint 17 from directly contacting the metal sheet 13T and causing structural damage.

[0136] and please refer to Figure 18 and Figure 19 wherein Figure 18 represents the exploded view of the ball joint 17, the buffer rubber G, the plurality of ball elements 19 and the carrier 13 before combination in another embodiment of the present application, Figure 19 represents Figure 18 the ball joint 17, the buffer rubber G, the plurality of ball elements 19 and the carrier 13 after combination in the combination of the ball joint 17, the buffer rubber G, the plurality of ball elements 19 and the carrier 13.

[0137] and as shown in Figure 18 and Figure 19 In another embodiment of the present application, the buffer rubber G can also be arranged in the accommodating groove 131 on the back side of the carrier 13, and then the plurality of ball elements 19 (such as ceramic balls) can be arranged in the accommodating groove 131 and contact the buffer rubber G; in this way, the ball joint 17 can abut the aforementioned three ball elements 19 (such as ceramic balls) in a multi-point contact manner, wherein the diameter of the aforementioned ball joint 17 is greater than the diameter of the aforementioned ball elements 19.

[0138] and it should be understood that in the present embodiment, the plurality of ball elements 19 are arranged in the accommodating groove 131, and the aforementioned ball elements 19 contact the inner wall of the accommodating groove 131; in this way, the ball elements 19 can provide stable abutting support to the ball joint 17 in different directions, thereby dispersing the pressure and preventing structural damage of the carrier 13 and the metal sheet 13T.

[0139] and although the embodiments of the present application and its advantages have been disclosed, it should be understood that changes, substitutions and alterations can be made herein without departing from the spirit and scope of the present application. In addition, many modifications can be made to the application as would be understood by one of ordinary skill in the art, in light of the foregoing description, without departing from the scope of the following claims. Accordingly, the present application is not limited to only the described embodiments. Rather, the application is intended to embrace all without departing from the spirit and scope of the following claims.

[0140] Although the present application has been disclosed with reference to the preferred embodiments, it is to be understood that various other adaptations and changes can be made within the scope and spirit of the application. Therefore, it is intended that the present application not be limited to the disclosed embodiments, but that the application can include all adaptations and modifications without departing from the spirit and scope of the present application.

Claims

1. A drive mechanism for driving an optical element, characterized by The application relates to a driving mechanism of an optical element, comprising: a fixed part comprising a base and a housing connected to each other; a movable part movably connected to the fixed part, wherein the optical element is arranged on the movable part; an upper spring piece; a side spring piece, wherein the upper spring piece and the side spring piece are connected to the movable part and the base; and a driving assembly for driving the movable part to move relative to the fixed part.

2. The drive mechanism of claim 1, wherein, The upper spring piece and the side spring piece are not coplanar.

3. The drive mechanism of claim 2, wherein, The upper spring piece and the side spring piece are perpendicular to each other or parallel to each other.

4. The drive mechanism of claim 2, wherein, An external light enters the optical element along a vertical direction, and the side spring piece is parallel to the vertical direction.

5. The drive mechanism of claim 1, wherein, The driving mechanism further comprises a metal piece, a support and a buffer element, the metal piece is embedded in the movable part, the support is made of metal and is fixed on the metal piece, and the buffer element covers the support.

6. The drive mechanism of claim 5, wherein, The magnetic permeability of the metal piece is greater than that of the support.

7. The drive mechanism of claim 5, wherein, The metal piece and the support are welded to each other.

8. The drive mechanism of claim 5, wherein, The metal piece has a C-shaped structure.

9. The drive mechanism of claim 1, wherein, The driving mechanism further comprises a gasket and a ball joint, the ball joint is pivoted to the movable part and the fixed part, and the movable part forms a receiving groove, wherein the gasket is arranged in the receiving groove and forms an opening, and a part of the ball joint is located in the opening.

10. The drive mechanism of claim 9, wherein, The gasket is made of metal, and the opening has a polygonal structure, wherein the ball joint contacts at least two sides of the opening.

11. The drive mechanism of claim 10, wherein, The opening has a triangular structure.

12. The drive mechanism of claim 9, wherein, The driving mechanism further comprises a metal piece embedded in the movable part and exposed at the bottom side of the receiving groove.

13. The drive mechanism of claim 12, wherein, The hardness of the gasket is greater than that of the metal piece.

14. The drive mechanism of claim 12, wherein, The magnetic permeability of the metal piece is greater than that of the gasket.

15. The drive mechanism of claim 12, wherein, The driving mechanism further comprises a buffer rubber arranged in the receiving groove and connected to the metal piece and the gasket.

16. The drive mechanism of claim 15, wherein, The ball joint contacts the buffer rubber.

17. The drive mechanism of claim 1, wherein, The driving mechanism further comprises a plurality of ball elements and a ball joint, the ball joint is pivoted to the movable part and the fixed part, and the movable part forms a receiving groove, wherein a plurality of the ball elements are arranged in the receiving groove, and the ball joint contacts a plurality of the ball elements.

18. The drive mechanism of claim 17, wherein, The diameter of the ball joint is greater than that of a plurality of the ball elements.

19. The drive mechanism of claim 17, wherein, The driving mechanism further comprises a buffer rubber arranged in the receiving groove and contacting a plurality of the ball elements.

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