Camera

Abstract

The utility model discloses a camera. The camera includes: a housing; the camera is arranged on the machine shell, and the camera is provided with an optical lens; the circuit board assembly is arranged in the machine shell, the circuit board assembly comprises a metal installation frame, a main board and a circuit board, the main board is arranged on the metal installation frame, and the circuit board is arranged on the metal installation frame. The camera provided by the utility model has the advantages of few parts, high assembly efficiency, small size and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic equipment technical field, specifically, relate to camera. BACKGROUND

[0002] The camera in the prior art comprises a plurality of circuit boards, in order to dissipate heat of the plurality of circuit boards, a plurality of large-area punched heat dissipation aluminum sheets are arranged in the camera. The plurality of large-area punched heat dissipation aluminum sheets need to occupy a large space, resulting in that the size of the camera is large. SUMMARY

[0003] The utility model aims at solving one of the technical problems in the prior art at least to some extent. For this purpose, the utility model provides a camera.

[0004] The camera of the utility model comprises: a casing; a camera head, the camera head is arranged in the casing, and the camera head has an optical lens; and a circuit board assembly, the circuit board assembly is arranged in the casing, and the circuit board assembly comprises a metal mounting frame, a mainboard and a circuit board, the mainboard is arranged in the metal mounting frame, and the circuit board is arranged in the metal mounting frame.

[0005] The camera of the utility model has the advantages of few parts, high assembly efficiency and small size.

[0006] Optionally, the circuit board assembly further comprises a first metal heat conduction piece, the first metal heat conduction piece is arranged between the chip of the mainboard and the metal mounting frame, and the first metal heat conduction piece is in contact with the chip and the metal mounting frame.

[0007] Optionally, the circuit board assembly further comprises a shielding cover, the shielding cover is arranged on the chip, the first metal heat conduction piece is arranged between the shielding cover and the metal mounting frame, and the first metal heat conduction piece is in contact with the shielding cover and the metal mounting frame.

[0008] Optionally, a heat conduction adhesive layer is arranged between the first metal heat conduction piece and the metal mounting frame, a heat conduction adhesive layer is arranged between the first metal heat conduction piece and the shielding cover, and a heat conduction adhesive layer is arranged between the chip and the shielding cover.

[0009] Optionally, the metal mounting frame is a die casting.

[0010] Optionally, the circuit board comprises a Bluetooth circuit board and a sensor circuit board, and the Bluetooth circuit board and the sensor circuit board are arranged on two sides in the thickness direction of the metal mounting frame respectively.

[0011] Optionally, the Bluetooth circuit board and the sensor circuit board are in direct contact with the metal mounting frame.

[0012] Optionally, the circuit board assembly further comprises a first BTB connector connected with the main board and a second BTB connector connected with the Bluetooth circuit board, the first BTB connector and the second BTB connector being connected by a first FPC flat cable; a third BTB connector connected with the main board and a fourth BTB connector connected with the sensor circuit board, the third BTB connector and the fourth BTB connector being connected by a second FPC flat cable.

[0013] Optionally, the circuit board assembly further comprises an infrared lamp circuit board arranged on the main board so as to be arranged on the metal mounting bracket through the main board, the main board being located between the metal mounting bracket and the infrared lamp circuit board in the thickness direction of the metal mounting bracket.

[0014] Optionally, the circuit board assembly further comprises a second metal heat-conducting member arranged between the infrared lamp circuit board and the main board, the second metal heat-conducting member being in contact with the infrared lamp circuit board and the main board.

[0015] Optionally, one of the main board and the second metal heat-conducting member comprises a mounting portion in contact with the other of the main board and the second metal heat-conducting member, the mounting portion being connected with the other of the main board and the second metal heat-conducting member by a first fastener, the infrared lamp circuit board and the second metal heat-conducting member being connected by a second fastener.

[0016] Optionally, the camera further comprises an antenna and a coaxial cable, one end of the coaxial cable being connected with the antenna, the other end of the coaxial cable being connected with the Bluetooth circuit board, wherein a diameter of the coaxial cable is less than or equal to a preset value, and the coaxial cable comprises at least one bending portion. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a structural schematic view of a circuit board assembly of a camera according to an embodiment of the present application;

[0018] Figure 2 is a structural schematic view of a circuit board assembly of a camera according to an embodiment of the present application;

[0019] Figure 3 is a partial structural schematic view of a circuit board assembly of a camera according to an embodiment of the present application;

[0020] Figure 4 is a partial structural schematic view of a circuit board assembly of a camera according to an embodiment of the present application;

[0021] Figure 5 is a local structure schematic view of a circuit board assembly of a camera according to an embodiment of the present application;

[0022] Figure 6 is an exploded view of a circuit board assembly of a camera according to an embodiment of the present application;

[0023] Figure 7 is a structure schematic view of a second metal heat-conducting member of a circuit board assembly of a camera according to an embodiment of the present application. DETAILED DESCRIPTION

[0024] Embodiments of the present application are described in detail below with reference to the accompanying drawings. The embodiments described below by way of example with reference to the accompanying drawings are illustrative and are intended to explain the present application, and are not to be understood as limiting the present application.

[0025] A camera according to an embodiment of the present application is described below with reference to the accompanying drawings. As shown in Figures 1-7 the camera according to an embodiment of the present application includes a casing, a camera head, and a circuit board assembly 100. The camera head is provided in the casing, and the camera head has an optical lens. The circuit board assembly 100 is provided in the casing. The circuit board assembly 100 includes a metal mounting bracket 1, a main board 2, and a circuit board. The main board 2 is provided in the metal mounting bracket 1, and the circuit board is provided in the metal mounting bracket 1.

[0026] The circuit board assembly of the camera in the related art includes a plastic bracket, and the main board and the circuit board are both provided on the plastic bracket. In order to dissipate heat from the main board and the circuit board, a plurality of large-area punched heat-dissipating aluminum sheets need to be provided, which results in a large size of the circuit board assembly, and further results in a large size of the camera.

[0027] The camera according to an embodiment of the present application is provided with the metal mounting bracket 1, and the main board 2 and the circuit board are provided in the metal mounting bracket 1, so that the metal mounting bracket 1 can not only be used for mounting the main board 2 and the circuit board, but also be used for dissipating heat from the main board 2 and the circuit board.

[0028] Therefore, it is not necessary to provide a plurality of large-area punched heat-dissipating aluminum sheets, so that not only the number of parts of the circuit board assembly 100 can be reduced and the assembly efficiency can be improved, but also the size of the circuit board assembly 100 and the occupied space can be effectively reduced, and further the size of the camera can be effectively reduced, so as to facilitate the miniaturization of the circuit board assembly 100 and the camera.

[0029] Therefore, the camera according to an embodiment of the present application has the advantages of fewer parts, high assembly efficiency, and small size.

[0030] As Figures 1-7As shown in

[0031] The metal mounting frame 1 can be a die-cast part. In this way, the metal mounting frame 1 can have a special-shaped structure, so that the metal mounting frame 1 can effectively utilize the internal space of the camera, so as to further reduce the size of the circuit board assembly 100 and the camera, and better realize the miniaturization of the circuit board assembly 100 and the camera. Moreover, by making the metal mounting frame 1 a die-cast part, the manufacturing difficulty and cost of the metal mounting frame 1 can be reduced, and the manufacturing efficiency of the metal mounting frame 1 can be improved.

[0032] Optionally, the metal mounting frame 1 is a die-cast aluminum part, i.e., the metal mounting frame 1 can be a die-cast aluminum mounting frame. In this way, the manufacturing cost and die-casting difficulty of the metal mounting frame 1 can be reduced while ensuring that the metal mounting frame 1 has excellent heat dissipation effect and structural strength.

[0033] As shown in Figure 5 and Figure 6 The circuit board assembly 100 further includes a first metal heat-conducting part 31. The first metal heat-conducting part 31 is arranged between the chip 21 of the main board 2 and the metal mounting frame 1, and the first metal heat-conducting part 31 is in contact with both the chip 21 and the metal mounting frame 1, so as to transmit the heat of the chip 21 of the main board 2 to the metal mounting frame 1 by the first metal heat-conducting part 31, and then dissipate the heat of the chip 21 of the main board 2 through the metal mounting frame 1. By arranging the first metal heat-conducting part 31, the chip 21 of the main board 2 can be more effectively dissipated.

[0034] Optionally, the first metal heat-conducting part 31 is arranged between the chip 21 of the main board 2 and the metal mounting frame 1 in the thickness direction of the metal mounting frame 1. In this way, the structure of the circuit board assembly 100 can be more compact, so as to further reduce the size and space occupied by the circuit board assembly 100 and the camera. The thickness direction of the metal mounting frame 1 is indicated by an arrow A in Figure 3 .

[0035] As shown in Figure 5 and Figure 6 The circuit board assembly 100 further includes a shielding cover 4, and the shielding cover 4 covers the chip 21. The first metal heat-conducting part 31 is arranged between the shielding cover 4 and the metal mounting frame 1, and the first metal heat-conducting part 31 is in contact with both the shielding cover 4 and the metal mounting frame 1. In this way, the heat of the chip 21 of the main board 2 is transmitted to the first metal heat-conducting part 31 through the shielding cover 4, and then transmitted to the metal mounting frame 1. By using the shielding cover 4 as a heat dissipation part, not only the heat dissipation area can be increased, but also the manufacturing cost of the circuit board assembly 100 can be reduced.

[0036] Optionally, a heat-conducting adhesive layer 52 is arranged between the chip 21 and the shielding cover 4, i.e. the heat-conducting adhesive layer 52 is in contact with both the chip 21 and the shielding cover 4. In this way, the heat of the chip 21 of the mainboard 2 can be more fully and rapidly transferred to the shielding cover 4 through the heat-conducting adhesive layer 52, and then to the metal mounting rack 1.

[0037] As shown in Figure 5 and Figure 6 , a heat-conducting adhesive layer 51 is arranged between the first metal heat-conducting member 31 and the metal mounting rack 1, i.e. the heat-conducting adhesive layer 51 is in contact with both the first metal heat-conducting member 31 and the metal mounting rack 1.

[0038] In this way, the heat of the first metal heat-conducting member 31 can be more fully and rapidly transferred to the metal mounting rack 1 through the heat-conducting adhesive layer 51, so that the heat of the chip 21 of the mainboard 2 can be more fully and rapidly transferred to the metal mounting rack 1. Moreover, since the heat-conducting adhesive layer 51 is elastic, it can exert pressure on the shielding cover 4, the first metal heat-conducting member 31, the heat-conducting adhesive layer 51 and the metal mounting rack 1, so as to press them tightly, thereby more fully and rapidly transferring the heat of the chip 21 to the metal mounting rack 1.

[0039] As shown in Figure 5 , a heat-conducting adhesive layer 53 is arranged between the first metal heat-conducting member 31 and the shielding cover 4, i.e. the heat-conducting adhesive layer 53 is in contact with both the first metal heat-conducting member 31 and the shielding cover 4.

[0040] In this way, the heat of the shielding cover 4 can be more fully and rapidly transferred to the first metal heat-conducting member 31 through the heat-conducting adhesive layer 53, so that the heat of the chip 21 of the mainboard 2 can be more fully and rapidly transferred to the metal mounting rack 1. Moreover, since the heat-conducting adhesive layer 53 is elastic, it can exert pressure on the shielding cover 4, the heat-conducting adhesive layer 53, the first metal heat-conducting member 31, the heat-conducting adhesive layer 51 and the metal mounting rack 1, so as to press them tightly, thereby more fully and rapidly transferring the heat of the chip 21 to the metal mounting rack 1.

[0041] As shown in Figure 5 and Figure 6 , the first metal heat-conducting member 31 has a first surface and a second surface 312 opposite in the thickness direction thereof. The first surface of the first metal heat-conducting member 31 is in contact with the shielding cover 4, and the second surface 312 of the first metal heat-conducting member 31 is in contact with the metal mounting rack 1. In this way, the heat of the shielding cover 4 can be more fully and rapidly transferred to the metal mounting rack 1 through the first metal heat-conducting member 31, so that the heat of the chip 21 of the mainboard 2 can be more fully and rapidly transferred to the metal mounting rack 1.

[0042] Optionally, the first surface of the first metal heat-conducting member 31 is in contact with the heat-conductive adhesive layer 53, and the second surface 312 of the first metal heat-conducting member 31 is in contact with the heat-conductive adhesive layer 51. In this way, the heat of the shielding cover 4 can be more fully and rapidly transferred to the metal mounting frame 1 through the heat-conductive adhesive layer 53, the first metal heat-conducting member 31 and the heat-conductive adhesive layer 51, so that the heat of the chip 21 of the main board 2 can be more fully and rapidly transferred to the metal mounting frame 1.

[0043] For example, the first metal heat-conducting member 31 can be a copper foil, and the heat-conductive adhesive layers 51, 52 and 53 can all be heat-conductive silicone layers. Both the heat-conductive silicone and the copper foil are die-cut auxiliary materials, which have the advantages of convenient production and assembly, and the copper foil and the heat-conductive silicone layers also have the advantage of small thickness, so as to further reduce the size and space occupied by the circuit board assembly 100 and the camera.

[0044] The thickness direction of the first metal heat-conducting member 31 is consistent with the thickness direction of the metal mounting frame 1, and the thickness directions of the heat-conductive adhesive layers 51 and 53 are consistent with the thickness direction of the metal mounting frame 1. In this way, the structure of the circuit board assembly 100 can be more compact, so as to further reduce the size and space occupied by the circuit board assembly 100 and the camera.

[0045] As shown in Figures 1-3 and Figure 6 The circuit board can include a Bluetooth circuit board 61 and a sensor circuit board 62. The Bluetooth circuit board 61 and the sensor circuit board 62 are respectively arranged on both sides of the main board 2 in the thickness direction of the metal mounting frame 1. That is, the metal mounting frame 1 is located between the main board 2 and the Bluetooth circuit board 61 (the sensor circuit board 62) in the thickness direction of the metal mounting frame 1. In this way, not only the space of the metal mounting frame 1 can be more fully utilized, but also the main board 2 can be prevented from interfering with the Bluetooth circuit board 61 and the sensor circuit board 62.

[0046] The Bluetooth circuit board 61 and the sensor circuit board 62 can both be in direct contact with the metal mounting frame 1, so that the heat of the Bluetooth circuit board 61 and the sensor circuit board 62 can be directly transferred to the metal mounting frame 1. That is, the heat of the Bluetooth circuit board 61 and the sensor circuit board 62 does not need to be transferred to the metal mounting frame 1 through a heat-conducting member. In this way, not only the heat dissipation of the Bluetooth circuit board 61 and the sensor circuit board 62 can be more effective, but also the heat-conducting member for transferring the heat of the Bluetooth circuit board 61 and the sensor circuit board 62 to the metal mounting frame 1 is not needed, so as to reduce the number of components of the circuit board assembly 100, improve the assembly efficiency, and further reduce the size and space occupied by the circuit board assembly 100 and the camera.

[0047] As shown in Figures 1-3As shown, the circuit board assembly 100 also includes a first BTB connector 71, a second BTB connector 72, and a first FPC cable 73. The first BTB connector 71 is connected to the motherboard 2, and the second BTB connector 72 is connected to the Bluetooth circuit board 61. The first BTB connector 71 and the second BTB connector 72 are connected via the first FPC cable 73.

[0048] In related technologies, the motherboard and circuit board of the circuit board assembly are connected by a large number of wire harnesses, which not only makes the connection process complicated, but also occupies a large amount of wiring space.

[0049] By using the first FPC cable 73 to connect the motherboard 2 and the Bluetooth circuit board 61, not only can the motherboard 2 and the Bluetooth circuit board 61 be connected conveniently and quickly, but a significant amount of wiring space can also be saved, effectively improving the space utilization of the circuit board assembly 100 and further reducing the size and space occupied by the circuit board assembly 100 and the camera. Moreover, by setting the first BTB connector 71 and the second BTB connector 72, the first FPC cable 73 can be connected to the motherboard 2 and the Bluetooth circuit board 61 conveniently and more reliably.

[0050] Specifically, the first BTB connector 71 includes a mating first portion 711 and a second portion 712, with the first portion 711 (e.g., a female connector) connected to the motherboard 2. The second BTB connector 72 includes a mating first portion 721 and a second portion 722, with the first portion 721 (e.g., a female connector) connected to the Bluetooth circuit board 61. One end of the first FPC cable 73 is connected to the second portion 712 (e.g., a male connector) of the first BTB connector 71, and the other end of the first FPC cable 73 is connected to the second portion 722 (e.g., a male connector) of the second BTB connector 72.

[0051] like Figures 1-3 As shown, the circuit board assembly 100 also includes a third BTB connector 74, a fourth BTB connector 75, and a second FPC cable 76. The third BTB connector 74 is connected to the motherboard 2, and the fourth BTB connector 75 is connected to the sensor circuit board 62. The third BTB connector 74 and the fourth BTB connector 75 are connected via the second FPC cable 76.

[0052] By using the second FPC cable 76 to connect the motherboard 2 and the sensor circuit board 62, not only can the motherboard 2 and the sensor circuit board 62 be connected conveniently and quickly, but a significant amount of wiring space can also be saved, effectively improving the space utilization of the circuit board assembly 100 and further reducing the size and space occupied by the circuit board assembly 100 and the camera. Moreover, by providing the third BTB connector 74 and the fourth BTB connector 75, the second FPC cable 76 can be connected to the motherboard 2 and the sensor circuit board 62 conveniently and more reliably.

[0053] Specifically, the third BTB connector 74 includes a mating first portion 741 and a second portion 742, with the first portion 741 (e.g., a female connector) connected to the motherboard 2. The fourth BTB connector 75 includes a mating first portion 751 and a second portion 752, with the first portion 751 (e.g., a female connector) connected to the sensor circuit board 62. One end of the second FPC cable 76 is connected to the second portion 742 (e.g., a male connector) of the third BTB connector 74, and the other end of the second FPC cable 76 is connected to the second portion 752 (e.g., a male connector) of the fourth BTB connector 75.

[0054] like Figure 2 , Figure 4 and Figure 6 As shown, the circuit board also includes an infrared lamp circuit board 63, which is disposed on the main board 2 so that it can be mounted on the metal mounting bracket 1 via the main board 2. The main board 2 is located between the metal mounting bracket 1 and the infrared lamp circuit board 63 in the thickness direction of the metal mounting bracket 1.

[0055] In other words, the motherboard 2 and the infrared lamp circuit board 63 are located on the same side of the metal mounting frame 1 in the thickness direction of the metal mounting frame 1, that is, the infrared lamp circuit board 63, the Bluetooth circuit board 61, and the sensor circuit board 62 are located on opposite sides of the metal mounting frame 1 in the thickness direction of the metal mounting frame 1. This makes the structure of the circuit board assembly 100 more reasonable.

[0056] Optionally, the infrared lamp circuit board 63 is connected to the motherboard 2 via the fifth BTB connector 77, so that the infrared lamp circuit board 63 and the motherboard 2 can be connected conveniently and more reliably.

[0057] The circuit board assembly 100 also includes a second metal heat-conducting component 32. The second metal heat-conducting component 32 is disposed between the infrared lamp circuit board 63 and the main board 2, and is in contact with both the infrared lamp circuit board 63 and the main board 2. This allows the second metal heat-conducting component 32 to transfer heat from the infrared lamp circuit board 63 to the main board 2, and then from the main board 2 to the metal mounting bracket 1. By providing the second metal heat-conducting component 32, heat dissipation from the infrared lamp circuit board 63 can be achieved more effectively.

[0058] Optionally, the infrared lamp circuit board 63 and the second metal heat-conducting member 32 are connected by a second fastener 82 (e.g. a screw, a bolt) so as to more conveniently and more stably mount the infrared lamp circuit board 63.

[0059] As shown in Figure 4 , Figure 6 and Figure 7 , one of the main plate 2 and the second metal heat-conducting member 32 comprises a mounting portion 321 which is in contact with the other of the main plate 2 and the second metal heat-conducting member 32. The mounting portion 321 and the other of the main plate 2 and the second metal heat-conducting member 32 are connected by a first fastener 81 (e.g. a screw, a bolt). By making the mounting portion 321 in contact with the other of the main plate 2 and the second metal heat-conducting member 32, the heat of the second metal heat-conducting member 32 can be more fully and more quickly transferred to the main plate 2, and then more fully and more quickly transferred to the metal mounting rack 1.

[0060] The second metal heat-conducting member 32 comprises a plate body 322 and a plurality of mounting portions 321. The infrared lamp circuit board 63 and the plate body 322 are connected by the second fastener 82. The plate body 322 has a plurality of corners, and the plurality of mounting portions 321 are provided one by one at the plurality of corners.

[0061] As shown in Figure 1 and Figure 2 , the circuit board assembly 100 further comprises an antenna 91 and a coaxial cable 92. One end of the coaxial cable 92 is connected with the antenna 91, and the other end of the coaxial cable 92 is connected with the Bluetooth circuit board 61. The diameter of the coaxial cable 92 is less than or equal to a preset value, and the coaxial cable 92 comprises at least one bending portion 921.

[0062] By making the diameter of the coaxial cable 92 less than or equal to the preset value, the coaxial cable 92 can be more easily bent so as to more easily form the bending portion 921, and then the coaxial cable 92 can be more easily wired. Optionally, the antenna 91 can be an FPC antenna.

[0063] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0064] In addition, the terms "first", "second", or the like are used only to describe purposes and can not be understood as indicating or implying relative importance or implying the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the utility model, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0065] Unless otherwise expressly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanical connection, or electrical connection or communication with each other; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements, unless otherwise expressly limited. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0066] In the utility model, unless otherwise expressly specified and limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be indirectly contacted through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0067] In the utility model, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the description, the illustrative description of the above terms is not necessarily directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. Those skilled in the art can combine and combine the different embodiments or examples described in the description and the features of the different embodiments or examples without contradiction.

[0068] Although the embodiments of the utility model have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limiting the utility model. Those skilled in the art can change, modify, replace and modify the above embodiments within the scope of the utility model.

Claims

1. A video camera characterized by comprising: The application relates to a camera module. The camera module comprises: a housing; a camera disposed in the housing, the camera having an optical lens; and 2. The camera of claim 1, wherein, a circuit board assembly disposed in the housing, the circuit board assembly comprising a metal mount, a main board and a circuit board, the main board being disposed in the metal mount, and the circuit board being disposed in the metal mount.

3. The camera of claim 2, wherein, The circuit board assembly further comprises a first metal heat conductor disposed between a chip of the main board and the metal mount, the first metal heat conductor being in contact with both the chip and the metal mount.

4. The camera of claim 3, wherein, The circuit board assembly further comprises a shielding cover covering the chip, the first metal heat conductor being disposed between the shielding cover and the metal mount, the first metal heat conductor being in contact with both the shielding cover and the metal mount.

5. The camera of claim 1, wherein, A heat-conductive adhesive layer is disposed between the first metal heat conductor and the metal mount, between the first metal heat conductor and the shielding cover, and between the chip and the shielding cover.

6. The camera of claim 1, wherein, The metal mount is a die-cast part.

7. The camera of claim 6, wherein, The circuit board comprises a Bluetooth circuit board and a sensor circuit board, the Bluetooth circuit board and the sensor circuit board being disposed on two sides of the metal mount in a thickness direction of the metal mount.

8. The camera of claim 7, wherein, The Bluetooth circuit board and the sensor circuit board are both in direct contact with the metal mount. The circuit board assembly further comprises: a first BTB connector connected to the main board, and a second BTB connector connected to the Bluetooth circuit board, the first BTB connector and the second BTB connector being connected by a first FPC flat cable; 9. The camera of claim 1, wherein, a third BTB connector connected to the main board, and a fourth BTB connector connected to the sensor circuit board, the third BTB connector and the fourth BTB connector being connected by a second FPC flat cable.

10. The camera of claim 9, wherein, The circuit board further comprises an infrared lamp circuit board, the infrared lamp circuit board being disposed on the main board so as to be disposed on the metal mount through the main board, the main board being located between the metal mount and the infrared lamp circuit board in a thickness direction of the metal mount.

11. The camera of claim 10, wherein, The circuit board assembly further comprises a second metal heat conductor disposed between the infrared lamp circuit board and the main board, the second metal heat conductor being in contact with both the infrared lamp circuit board and the main board.

12. The camera of claim 6, wherein, One of the main board and the second metal heat conductor comprises a mounting portion in contact with the other of the main board and the second metal heat conductor, the mounting portion being connected to the other of the main board and the second metal heat conductor by a first fastener, the infrared lamp circuit board and the second metal heat conductor being connected by a second fastener. The application further comprises an antenna and a coaxial cable, one end of the coaxial cable being connected to the antenna, and the other end of the coaxial cable being connected to the Bluetooth circuit board, wherein a diameter of the coaxial cable is less than or equal to a preset value, and the coaxial cable comprises at least one bending portion.

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