Printed circuit board blind hole tin immersion filling device

Abstract

The utility model discloses a printed circuit board blind hole tin immersion filling device, which relates to the technical field of printed circuit board production and processing equipment and comprises a tin immersion tank filled with tin immersion liquid medicine, a conveying mechanism used for conveying a circuit board into the tin immersion tank is arranged at a tank opening of the tin immersion tank, and a spraying mechanism is arranged in the tin immersion tank. The spraying mechanism comprises a spraying head, a plurality of nozzles, a spraying pump and a liquid guide pipe, the spraying head is arranged on the inner wall of the tin immersion tank, the nozzles are arranged on the spraying head in a matrix manner and are all communicated with the spraying head, the spraying pump is arranged at the bottom of the tin immersion tank, one end of the liquid guide pipe is communicated with the output end of the spraying pump, and the other end of the liquid guide pipe is communicated with the spraying head. By means of the pressure of the injection mechanism, the problem that liquid medicine is difficult to reach the bottom of the blind hole fully in a traditional natural convection mode is effectively solved, and the quality and effect of blind hole tin immersion filling are improved. The tin immersion liquid medicine can be used for filling the blind hole quickly and uniformly, the tin immersion time is shortened, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of printed circuit board production and processing equipment, and particularly relates to a printed circuit board blind hole tin filling device. BACKGROUND

[0002] Printed circuit board, also known as printed wiring board, is the provider of electrical connection for electronic components. The main advantage of using circuit board is to greatly reduce wiring and assembly errors, and to improve automation level and production efficiency. After completing the basic circuit board line production and early processing, it is usually necessary to carry out tin immersion treatment. Tin immersion treatment can uniformly deposit a layer of tin metal on the surface of the circuit board, especially in the line and pad area, through chemical displacement reaction.

[0003] Specifically, in the process of manufacturing printed circuit boards, blind holes refer to holes that are only open on one side of the circuit board and covered with insulating material on the other side. Tin filling is to deposit tin in the blind hole to achieve electrical connection and enhance mechanical properties.

[0004] In the tin immersion process of printed circuit boards, the traditional tin immersion tank relies on natural convection to make the tin immersion medicine flow in the tank. Natural convection refers to the existence of temperature difference in the tin immersion medicine in the tin immersion tank. The heating source is usually located at the bottom of the tin immersion tank, so that the medicine at the bottom has a higher temperature and a smaller density. The upper medicine has a relatively low temperature and a larger density. According to the principle of thermal expansion and cold contraction, hot low-density medicine will float upward, and cold high-density medicine will sink downward, thus forming natural convection.

[0005] Due to the limited driving force of natural convection, the flow speed of the medicine is slow. For the blind holes on the circuit board, especially the small blind holes, it is difficult for the medicine to fully enter the bottom of the blind hole under the action of natural convection, which may lead to insufficient tin filling at the bottom of the blind hole and affect the electrical performance and quality of the printed circuit board. Utility model content

[0006] The utility model provides a kind of printed circuit board blind hole tin filling device, can solve the problem that in the tin immersion process of printed circuit board in prior art, tin immersion tank promotes tin immersion medicine to flow in tank by means of natural convection, and medicine is difficult to reach the bottom of blind hole sufficiently.

[0007] The utility model provides a kind of printed circuit board blind hole tin filling device, including internally filled with tin filling tank, the slot of the tin filling tank is provided with conveying mechanism for sending circuit board into tin filling tank, the inside of the tin filling tank is provided with injection mechanism, the injection mechanism includes spray head, nozzle, injection pump and liquid guide pipe, the spray head is arranged on the inner wall of tin filling tank, the nozzle is provided with several, and it is arranged in matrix on spray head, the nozzle is all communicated with spray head, the injection pump is fixedly arranged at the bottom of tin filling tank, one end of the liquid guide pipe is communicated with the output end of injection pump, the other end of the liquid guide pipe is communicated with spray head.

[0008] As a further scheme of the utility model: the injection mechanism further includes rotating shaft, the rotating shaft is horizontally connected with the tin filling tank, the rotating shaft is provided with through hole in the middle, one end of the rotating shaft is coaxially connected with the spray head, the other end of the rotating shaft is rotatably connected with the liquid guide pipe.

[0009] As a further scheme of the utility model: the injection mechanism further includes driven wheel, driving wheel and transmission belt, the driven wheel is coaxially connected with the rotating shaft, the driving wheel is rotatably connected with the tin filling tank, the transmission belt is arranged between the driven wheel and the driving wheel.

[0010] As a further scheme of the utility model: the injection mechanism is provided with two groups, and is first injection assembly and second injection assembly respectively, the first injection assembly and the second injection assembly are symmetrically arranged on the two sides of the tin filling tank.

[0011] As a further scheme of the utility model: the conveying mechanism includes support frame, movable slide and clamping jaw, the support frame is fixedly arranged at the slot of the tin filling tank, the side of the support frame is provided with vertical chute, the movable slide is slidably arranged in the chute, the clamping jaw is fixedly arranged at the bottom of the movable slide for clamping printed circuit board.

[0012] As a further scheme of the utility model: the conveying mechanism further includes telescopic rod, the telescopic rod is fixedly connected with the tin filling tank, and the telescopic end of the telescopic rod is fixedly connected with the movable slide.

[0013] As a further scheme of the utility model: the bottom of the tin filling tank is fixedly provided with a plurality of matrix arrangement universal wheels.

[0014] The utility model has the beneficial effects that compared with prior art:

[0015] 1、By means of the pressure of the spraying mechanism, the problem that traditional natural convection makes it difficult for the plating solution to reach the bottom of the blind hole is solved, so that the plating solution can quickly and uniformly fill the blind hole, the plating time is shortened, and the production efficiency is improved. Through the rotating cooperation of the rotating shaft and the plating tank, and through the through hole to convey the plating solution and drive the nozzle to rotate, the spraying range of the spraying mechanism is expanded, the coverage area is increased, and the filling uniformity is improved.

[0016] 2、The main wheel is driven by the rotating motor, the driven wheel is driven by the transmission belt, the rotating shaft drives the nozzle to rotate, the controllable rotation of the nozzle is realized, the plating solution spraying effect is optimized, and the filling quality is improved; the two groups of spraying assemblies are symmetrically arranged on the two sides of the plating tank, can spray the plating solution to the circuit board from different directions at the same time, enhance the impact force and coverage range, improve the filling effect and efficiency, and ensure the plating uniformity.

[0017] The additional aspects and advantages of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, with reference to the following drawings, in which:

[0019] Fig. 1 It is a three-dimensional structure schematic diagram of a printed circuit board blind hole plating filling device.

[0020] Fig. 2 It is a three-dimensional structure schematic diagram of a spraying mechanism in the present application.

[0021] Fig. 3 It is a three-dimensional structure sectional view of a conveying mechanism in the present application.

[0022] Fig. 4 It is a three-dimensional structure sectional view of a spraying mechanism in the present application.

[0023] The reference signs include:

[0024] 1, plating tank; 2, conveying mechanism; 3, spraying mechanism; 4, nozzle; 5, nozzle; 6, spraying pump; 7, liquid guide pipe; 8, rotating shaft; 9, through hole; 10, driven wheel; 11, main wheel; 12, transmission belt; 13, rotating motor; 14, first spraying assembly; 15, second spraying assembly; 16, support frame; 17, movable sliding plate; 18, clamping jaw; 19, telescopic rod; 20, universal wheel. DETAILED DESCRIPTION

[0025] The specific embodiments of the present application will be described in detail below, but it should be understood that the protection scope of the present application is not limited by the specific embodiments.

[0026] As Figs. 1 to 4 The utility model provides a printed circuit board blind hole tin filling device, including the tin sink tank 1 that fills with tin medicine water in the inside, the slot mouth of tin sink tank 1 is provided with the conveying mechanism 2 for sending the circuit board into tin sink tank 1, the inside of tin sink tank 1 is provided with the injection mechanism 3, the injection mechanism 3 includes the spray head 4, nozzle 5, injection pump 6 and liquid guide pipe 7, the spray head 4 sets up on the inner wall of tin sink tank 1, nozzle 5 is provided with several, and matrix arrangement is on the spray head 4, nozzle 5 all are communicated with the spray head 4, injection pump 6 is fixedly set up at the bottom of tin sink tank 1, one end of liquid guide pipe 7 is communicated with the output end of injection pump 6, the other end of liquid guide pipe 7 is communicated with the spray head 4.

[0027] The printed circuit board blind hole tin filling device works, conveying mechanism 2 first sends printed circuit board to tin sink tank 1 inside.Just injection mechanism 3 starts, and injection pump 6 sends the tin medicine water in tin sink tank 1 to the spray head 4 through liquid guide pipe 7, then sprays out by the nozzle 5 of matrix arrangement on the spray head 4.The medicine water impacts printed circuit board with certain pressure, makes it fully enter the blind hole bottom, realizes the tin filling of blind hole.

[0028] With the pressure of injection mechanism 3, effectively solve the problem that medicine water is difficult to fully reach the bottom of blind hole under the traditional natural convection mode, improve the quality and effect of blind hole tin filling.Can make the tin medicine water fill the blind hole quickly and evenly, shorten the tin time, improve the production efficiency.

[0029] As a further scheme of the utility model: the injection mechanism 3 still includes rotating shaft 8, the rotating shaft 8 is horizontally connected with the rotation of tin sink tank 1, the middle part of rotating shaft 8 is provided with through hole 9 that is communicated with both ends, one end of rotating shaft 8 is coaxially fixedly connected with spray head 4, the other end of rotating shaft 8 is rotationally connected with liquid guide pipe 7.

[0030] Rotating shaft 8 is horizontally connected with the rotation of tin sink tank 1, and the middle part through hole 9 is communicated with both ends, one end is connected with spray head 4, and the other end is rotationally connected with liquid guide pipe 7.When injection pump 6 sends medicine water, medicine water enters spray head 4 and nozzle 5 through liquid guide pipe 7 and rotating shaft 8 through hole 9.At the same time, rotating shaft 8 can drive spray head 4 to rotate, so that the medicine water injection range is expanded.The coverage area of medicine water injection is increased, so that each part of printed circuit board can fully contact medicine water, and the uniformity and effect of blind hole tin filling are improved.

[0031] As a further scheme of the utility model: the injection mechanism 3 still includes driven wheel 10, driving wheel 11 and transmission belt 12, driven wheel 10 is coaxially fixedly connected with rotating shaft 8, driving wheel 11 is rotatably connected with tin sink 1, transmission belt 12 is cooperatively arranged between driven wheel 10 and driving wheel 11. The injection mechanism 3 still includes rotary motor 13, rotary motor 13 is fixedly connected with tin sink 1, the output end of rotary motor 13 is coaxially fixedly connected with driving wheel 11. Rotary motor 13 drives driving wheel 11 to rotate, drives driven wheel 10 to rotate through transmission belt 12, driven wheel 10 is coaxially fixed with rotating shaft 8, thereby making rotating shaft 8 drive nozzle 4 to rotate. The controllable rotation of nozzle 4 is realized, the rotation speed and angle of nozzle 4 can be adjusted according to actual demand, further optimize the effect of injection of medicine, improve the quality of blind hole tin filling.

[0032] As a further scheme of the utility model: the injection mechanism 3 is provided with two groups, and is first injection assembly 14 and second injection assembly 15 respectively, first injection assembly 14 and second injection assembly 15 are symmetrically arranged at the both sides of tin sink 1. Two groups of injection assemblies are symmetrically arranged at the both sides of tin sink 1, and the printed circuit board is injected with medicine at the same time, so that the printed circuit board is impacted from different directions, so that the medicine is more easily entered into the blind hole. The impact force and coverage range of the medicine on the printed circuit board are enhanced, the effect and efficiency of blind hole tin filling are further improved, and the uniformity of tin sinking is ensured.

[0033] As a further scheme of the utility model: the conveying mechanism 2 includes support frame 16, movable sliding plate 17 and clamping jaw 18, the support frame 16 is fixedly arranged at the slot opening of tin sink 1, the side portion of support frame 16 is provided with vertical chute, movable sliding plate 17 is slidably arranged in the chute, clamping jaw 18 is fixedly arranged at the bottom of movable sliding plate 17 for clamping the printed circuit board. The clamping jaw 18 is parallel gripper. The conveying mechanism 2 further includes telescopic rod 19, the telescopic rod 19 is fixedly connected with tin sink 1, and the telescopic end of telescopic rod 19 is fixedly connected with movable sliding plate 17. The telescopic rod 19 is electric telescopic cylinder. The movable sliding plate 17 is driven to move up and down by telescopic rod 19, so that the circuit board is sent into or out of tin sink 1. The printed circuit board is sent into tin sink 1 for tin sinking treatment by conveying mechanism 2, and the position stability of the circuit board in the tin sinking process is ensured, and the convenience and stability of operation are improved.

[0034] As a further scheme of the utility model: the bottom of tin sink 1 is fixedly provided with a plurality of matrix-arranged universal wheels 20. When it is needed to move tin sink 1, tin sink 1 can be easily pushed to change position, thereby improving the moving flexibility of the device, facilitating the position adjustment and carrying of the device, and adapting to different production sites and needs.

[0035] The above disclosed are only several specific embodiments of the present application, but the embodiments of the present application are not limited to this, and any changes that can be thought of by any person skilled in the art shall fall into the protection scope of the present application.

Claims

1. A printed circuit board blind hole tin filling device, comprising a tin filling tank (1) filled with tin filling liquid, a conveying mechanism (2) is arranged at the tank opening of the tin filling tank (1) for conveying the circuit board into the tin filling tank (1), characterized in that, The inside of the tin sink (1) is provided with a spraying mechanism (3), the spraying mechanism (3) comprises a spray head (4), a nozzle (5), a spray pump (6) and a liquid guide pipe (7), the spray head (4) is arranged on the inner wall of the tin sink (1), the nozzle (5) is arranged in a matrix on the spray head (4), the nozzle (5) is communicated with the spray head (4), the spray pump (6) is fixedly arranged at the bottom of the tin sink (1), one end of the liquid guide pipe (7) is communicated with the output end of the spray pump (6), the other end of the liquid guide pipe (7) is communicated with the spray head (4).

2. The apparatus according to claim 1, wherein The spraying mechanism (3) further comprises a rotating shaft (8), the rotating shaft (8) is horizontally connected with the tin sink (1) in a rotating manner, a through hole (9) is formed in the middle of the rotating shaft (8) and communicated with both ends, one end of the rotating shaft (8) is coaxially fixedly connected with the spray head (4), the other end of the rotating shaft (8) is rotatably connected with the liquid guide pipe (7).

3. The apparatus according to claim 2, wherein the apparatus further comprises a plurality of the first and second electrodes, and the controller is configured to control the first and second electrodes to apply the voltage to the blind via hole in the printed circuit board. The spraying mechanism (3) further comprises a driven wheel (10), a driving wheel (11) and a transmission belt (12), the driven wheel (10) is coaxially fixedly connected with the rotating shaft (8), the driving wheel (11) is rotatably connected with the tin sink (1), the transmission belt (12) is arranged between the driven wheel (10) and the driving wheel (11).

4. The apparatus according to claim 3, wherein the apparatus further comprises a plurality of the first and second electrodes. The spraying mechanism (3) further comprises a rotary motor (13), the rotary motor (13) is fixedly connected with the tin sink (1), the output end of the rotary motor (13) is coaxially fixedly connected with the driving wheel (11).

5. The apparatus according to claim 1, wherein The spraying mechanism (3) is provided with two groups, which are a first spraying assembly (14) and a second spraying assembly (15), the first spraying assembly (14) and the second spraying assembly (15) are symmetrically arranged on both sides of the tin sink (1).

6. The apparatus according to claim 1, wherein The conveying mechanism (2) comprises a support frame (16), a movable sliding plate (17) and a clamping jaw (18), the support frame (16) is fixedly arranged at the slot opening of the tin sink (1), a vertical sliding groove is formed in the side of the support frame (16), the movable sliding plate (17) is slidably arranged in the sliding groove, and the clamping jaw (18) is fixedly arranged at the bottom of the movable sliding plate (17) for clamping the printed circuit board.

7. The apparatus according to claim 6, wherein the apparatus is characterized by: The clamping jaw (18) is a parallel gripper.

8. The apparatus according to claim 6, wherein the apparatus is characterized by: The conveying mechanism (2) further comprises a telescopic rod (19), the telescopic rod (19) is fixedly connected with the tin sink (1), and the telescopic end of the telescopic rod (19) is fixedly connected with the movable sliding plate (17).

9. The apparatus according to claim 8, wherein the apparatus further comprises a plurality of the blind via tin filling devices. The telescopic rod (19) is an electric telescopic cylinder.

10. The apparatus according to claim 1, wherein A plurality of matrix arranged universal wheels (20) are fixedly arranged at the bottom of the tin sink (1).

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