Three-dimensional uniform temperature plate

Abstract

A three-dimensional uniform temperature plate comprises a uniform temperature plate module and a vertical flat heat dissipation module. The vapor chamber module comprises an upper shell structure, and the upper shell structure comprises an upper shell and an upper shell capillary structure formed in the upper shell. The vertical flat heat dissipation module is fixed to the vapor chamber module and communicated with the vapor chamber module. In addition, the vertical flat heat dissipation module comprises a vertical flat heat dissipation shell fixed on the upper shell and a vertical flat capillary structure formed in the vertical flat heat dissipation shell and connected to the capillary structure of the upper shell, so that the heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to a three-dimensional vapor chamber, and more particularly to a three-dimensional vapor chamber with a vertical flat heat dissipation module. BACKGROUND

[0002] With the increasing progress of technology, the computing power of electronic devices is increasing, and the temperature control of electronic components such as processors of electronic devices is becoming more and more important. In particular, as the operating speed of the working chip in the electronic device such as a mobile phone, a tablet computer and a notebook computer is continuously improved, the environmental temperature in the system of the electronic device is also increased, thereby reducing the system stability.

[0003] In order to solve the problem, various heat dissipation devices such as heat pipes and vapor chambers are used in the industry to dissipate heat from the working chip, so that the heat energy of the working chip can be quickly discharged outside the system, thereby controlling the temperature in the system of the electronic device such as a mobile phone, a tablet computer, a notebook computer or a higher heat source, such as a server, a network device, a wireless transmission device and the like, thereby maintaining the stability of the system.

[0004] The three-dimensional vapor chamber combines the vapor chamber and the heat pipe to be connected to the heat source that needs to be cooled and connected to the heat dissipation fin or other heat dissipation device, thereby transmitting heat to the heat dissipation fin or other heat dissipation device through the three-dimensional vapor chamber to take out the heat from the electronic device such as a mobile phone, a tablet computer and a notebook computer. However, as the heat dissipation demand of electronic devices is becoming higher and higher, various heat dissipation devices are gradually designed and developed.

[0005] Therefore, how to further improve the heat dissipation efficiency of the three-dimensional vapor chamber will help to improve the working efficiency of the processor and the electronic device. SUMMARY

[0006] The present application relates to a three-dimensional vapor chamber, and more particularly to a three-dimensional vapor chamber with a vertical flat heat dissipation module.

[0007] According to an embodiment of the present application, a three-dimensional vapor chamber is provided. The three-dimensional vapor chamber includes a vapor chamber module and a vertical flat heat dissipation module. The vapor chamber module includes an upper shell structure, and the upper shell structure includes an upper shell body and an upper shell capillary structure formed in the upper shell body. The vertical flat heat dissipation module is fixed to the vapor chamber module and is in communication with the vapor chamber module, wherein the vertical flat heat dissipation module includes a vertical flat heat dissipation shell fixed to the upper shell body, and a vertical flat capillary structure formed in the vertical flat heat dissipation shell and connected to the upper shell capillary structure.

[0008] In some embodiments, the upright flat heat sink module has a thickness greater than 0.5 millimeter (mm) and a width greater than 8 millimeters (mm).

[0009] In some embodiments, the upright flat heat sink module has a width to thickness ratio greater than 10:1.

[0010] In some embodiments, the upper housing includes an upper housing body and a raised interface formed in the upper housing body, and the upright flat heat sink housing is disposed in the raised interface.

[0011] In some embodiments, the upright flat heat sink housing includes an upright flat heat sink body and an expanded tube interface connected to the upright flat heat sink body and interfacing with the raised interface of the upper housing.

[0012] In some embodiments, the upper housing wicking structure includes an upper housing body wicking structure formed on an inner surface of the upper housing body and an upper housing raised wicking structure connected to the upper housing body wicking structure and formed on an inner side of the raised interface.

[0013] In some embodiments, the upright flat wicking structure includes an upright flat body wicking structure formed on an inner surface of the upright flat heat sink body and an upright flat expanded tube wicking structure connected to the upright flat body wicking structure and formed on an inner side of the expanded tube interface.

[0014] In some embodiments, an end surface of the upper housing raised wicking structure is connected to an end surface of the upright flat expanded tube wicking structure and the expanded tube interface.

[0015] In some embodiments, the upright flat expanded tube wicking structure is embedded in the upper housing raised wicking structure.

[0016] In some embodiments, the upright flat expanded tube wicking structure is interfaced between the upper housing raised wicking structure and the expanded tube interface.

[0017] In some embodiments, the upper housing raised wicking structure is interfaced between the upright flat expanded tube wicking structure and the raised interface.

[0018] In some embodiments, the upper housing further includes an interface flange connected to the raised interface to interface with the expanded tube interface of the upright flat heat sink housing.

[0019] In some embodiments, the upright flat expanded tube wicking structure portion of the upright flat wicking structure is connected to the upper housing raised wicking structure of the upper housing wicking structure.

[0020] In some embodiments, the heat spreader module further comprises a lower shell structure tightly connected to the upper shell structure, and the lower shell structure comprises a lower shell body and a lower shell body capillary structure formed on an inner surface of the lower shell body, and the periphery of the upper shell body capillary structure is connected to the lower shell body capillary structure.

[0021] Therefore, according to the various embodiments of the three-dimensional heat spreader of the present application, the three-dimensional heat spreader can use the upright flat expansion capillary structure part of the upright flat capillary structure or the upper shell body protruding capillary structure connected to the ring-shaped upper shell body capillary structure to increase the flow efficiency of the heat dissipation fluid, thereby increasing the heat dissipation efficiency of the three-dimensional heat spreader. In addition, the three-dimensional heat spreader of the present application uses the upright flat heat dissipation module to increase the surface area of the upright flat heat dissipation module under the same heat spreader module area, thereby increasing the contact area of the upright flat heat dissipation module and the heat spreader module to improve the overall heat dissipation area of the three-dimensional heat spreader, effectively improving the heat dissipation efficiency of the three-dimensional heat spreader of the present application, while improving the connection strength of the upright flat heat dissipation module and the heat spreader module. In addition, the parallel arrangement of the upright flat heat dissipation module can guide the heat dissipation gas through the outer surface of the three-dimensional heat spreader of the present application to further improve the heat dissipation efficiency of the three-dimensional heat spreader.

[0022] The above only serves to explain the problems to be solved by the present application, the technical means for solving the problems, and the technical effects thereof, and the specific details of the present application will be described in detail in the embodiments and related drawings below. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to make the above and other purposes, features, advantages and embodiments of the present application more obvious and easy to understand, the drawings of the specification are described as follows:

[0024] Figure 1 is a three-dimensional schematic view of a three-dimensional heat spreader according to an embodiment of the present application.

[0025] Figure 2 is a partial enlarged sectional view of a three-dimensional heat spreader according to an embodiment of the present application.

[0026] Figure 3 is a partial enlarged sectional view of a three-dimensional heat spreader according to another embodiment of the present application.

[0027] Figure 4 is a partial enlarged sectional view of a three-dimensional heat spreader according to yet another embodiment of the present application.

[0028] Figure 5 is a partial enlarged sectional view of a three-dimensional heat spreader according to still another embodiment of the present application.

[0029] Figure 6 is an exploded view of a three-dimensional heat spreader according to an embodiment of the present application.

[0030] Figure 7 is a top view schematic diagram of a three-dimensional uniform temperature plate according to an embodiment of the present new type.

[0031] In which, the reference signs are explained as follows:

[0032] 100: three-dimensional uniform temperature plate

[0033] 102: uniform temperature plate module

[0034] 103: lower shell structure

[0035] 104: upper shell structure

[0036] 106: upright flat heat dissipation module

[0037] 110: lower shell

[0038] 120: upper shell

[0039] 122: upper shell body

[0040] 124: raised joint

[0041] 126: joint flange

[0042] 130: upright flat heat dissipation shell

[0043] 132: upright flat heat dissipation body

[0044] 134: expanded tube joint

[0045] 140: lower shell capillary structure

[0046] 150: upper shell capillary structure

[0047] 152: upper shell main capillary structure

[0048] 154: upper shell raised capillary structure

[0049] 156: periphery

[0050] 160: upright flat capillary structure

[0051] 162: upright flat main capillary structure

[0052] 164: upright flat expanded tube capillary structure

[0053] 201: joint

[0054] 202: angle

[0055] 301: joint

[0056] 302: angle

[0057] 401: junction

[0058] 402: angle

[0059] 501: junction

[0060] 502: angle

[0061] 701: width

[0062] 702: thickness

[0063] 703: width

[0064] 704: thickness

[0065] 705: annular fixing portion DETAILED DESCRIPTION

[0066] In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be recognized by one skilled in the art that embodiments of the present application can be practiced without resorting to the details specific. In other instances, well-known structures and devices are shown in block diagram form.

[0067] Figure 1 Figure 6 Figure 7 is a perspective view, an exploded view and a top view of a three-dimensional heat spreader. And Figures 2 to 5 are partial enlarged sectional view of the embodiments.

[0068] Referring to Figure 1 Figure 6 Figure 7 The three-dimensional heat spreader 100 includes a heat spreader module 102 and a vertical flat heat dissipation module 106. The heat spreader module 102 includes an upper shell structure 104 and a lower shell structure 103. The upper shell structure 104 includes an upper shell body 120 and an upper shell body capillary structure 150 formed in the upper shell body 120. The upper shell body 120 and the upper shell body capillary structure 150 can be integrally formed or separately manufactured and then combined, or the upper shell body 120 can be formed first, and then the upper shell body capillary structure 150 is formed on the upper shell body 120, such as sintering or bonding, without departing from the concept and protection method of the present application.

[0069] ​​​​In addition, the upright flat heat dissipation module 106 is fixed to the vapor chamber module 102 and is in fluid communication with the vapor chamber module 102, so that the heat dissipation fluid can flow between the vapor chamber module 102 and the upright flat heat dissipation module 106. The upright flat heat dissipation module 106 includes an upright flat heat dissipation housing 130 fixed to the upper housing 120 and an upright flat capillary structure 160 formed in the upright flat heat dissipation housing 130 and connected to the upper housing capillary structure 150. The upright flat heat dissipation housing 130 and the upright flat capillary structure 160 can be integrally formed or separately manufactured and then combined by processing, or the upright flat heat dissipation housing 130 can be formed first, and then the upright flat capillary structure 160 is formed on the upright flat heat dissipation housing 130 by processing, such as sintering or bonding, without departing from the concept and protection method of the present application.

[0070] In some embodiments, the lower housing 110 and the upper housing 120 are joined to form a closed space in which the heat dissipation fluid is arranged to dissipate heat from the heat source. The upright flat heat dissipation housing 130 is fixed to the upper housing 120 and is in fluid communication with the closed space, so that the heat dissipation fluid can flow between the upright flat heat dissipation housing 130 and the closed space between the lower housing 110 and the upper housing 120.

[0071] In addition, the inner surface of the upper housing 120 is formed with the upper housing capillary structure 150, and the upright flat capillary structure 160 is formed in the upright flat heat dissipation housing 130 and connected to the upper housing capillary structure 150, so as to increase the flow speed and efficiency of the heat dissipation fluid in the three-dimensional vapor chamber 100, thereby increasing the heat dissipation efficiency of the three-dimensional vapor chamber 100.

[0072] In addition, the inner surface of the lower housing 110 is formed with the lower housing capillary structure 140, which can also effectively increase the flow speed and efficiency of the heat dissipation fluid. In some embodiments, the periphery 156 of the upper housing capillary structure 150 is preferably connected to the lower housing capillary structure 140 to increase the flow speed and efficiency of the heat dissipation fluid.

[0073] In some embodiments, the lower housing 110 and the upper housing 120 can be joined by hard soldering, soft soldering, high-frequency welding, laser welding, resistance welding, or the like, or can be joined by using an adhesive, without departing from the concept and protection scope of the present application.

[0074] In some embodiments, the joining portion flange 126 of the upper housing 120 and the upright flat heat dissipation module 106 can be joined along the annular fixing portion 705 by hard soldering, soft soldering, high-frequency welding, laser welding, resistance welding, or the like, or can be joined by using an adhesive, without departing from the concept and protection scope of the present application.

[0075] With reference to the drawings Figure 7 As shown in the figures, in some embodiments, the ratio of the width 703 to the thickness 704 of the upright flat heat sink module 106 is greater than about 10:1, preferably greater than about 20:1. In some embodiments, the width 703 of the upright flat heat sink module 106 is greater than 8 millimeters (mm), and the thickness 704 is greater than 0.5 millimeters (mm).

[0076] In some embodiments, the width 703 of the upright flat heat sink module 106 is about 104 millimeters (mm), and the thickness 704 is about 4 millimeters.

[0077] In some embodiments, the ratio of the width 703 of the upright flat heat sink module 106 to the width 701 of the vapor chamber module 102 is greater than about 3:10, for example, 6:10, preferably greater than about 10:12. For example, the width 703 of the upright flat heat sink module 106 is about 104 millimeters (mm), and the width 701 of the vapor chamber module 102 is about 120 millimeters.

[0078] In some embodiments, the thickness 704 of the upright flat heat sink module 106 is about 4 millimeters, and the thickness 702 of the vapor chamber module 102 is about 80 millimeters.

[0079] Thus, in the case where the thickness 702 of the vapor chamber module 102 is 80 millimeters, and the width 701 of the vapor chamber module 102 is about 120 millimeters, the width 703 of the upright flat heat sink module 106 of the present application can be set to 104 millimeters, and the thickness 704 can be set to 4 millimeters. The vapor chamber module 102 can be provided with more than three upright flat heat sink modules 106, and the upright flat heat sink modules 106 can be used to direct the flow of heat dissipation air to more effectively reduce the temperature of the electronic device and the three-dimensional vapor chamber 100, and to improve the heat dissipation efficiency.

[0080] In some embodiments, the upright flat heat sink module 106 can be formed by flattening a heat pipe, or any heat-conducting metal directly or by processing to form a flat heat sink hollow shell to fluidly connect the vapor chamber module 102. In some embodiments, the hollow shell of the upright flat heat sink module 106 preferably contains a capillary structure directly, processed or formed on the surface of the internal chamber of the hollow shell.

[0081] With reference to the drawings Figure 2In some embodiments, the upper housing 120 comprises an upper housing body 122 and a protrusion joint 124. The protrusion joint 124 is formed in the upper housing body 122, and the upright flat heat dissipation housing 130 is inserted into the protrusion joint 124 from the bottom to the top, that is, the upright flat heat dissipation housing 130 is inserted into the protrusion joint 124 from the inner side of the uniform temperature plate module 102 to the outer side, so that the upright flat heat dissipation housing 130 is in fluid communication with the sealed space between the lower housing 110 and the upper housing 120.

[0082] In some embodiments, the upright flat heat dissipation housing 130 comprises an upright flat heat dissipation body 132 and an expansion joint 134. The expansion joint 134 is connected to the upright flat heat dissipation body 132, and the expansion joint 134 is engaged with the protrusion joint 124 of the upper housing 120 to tightly connect the upright flat heat dissipation housing 130 and the upper housing 120.

[0083] In some embodiments, the upright flat heat dissipation housing 130 and the upper housing 120 can be engaged by hard soldering, soft soldering, high-frequency welding, laser welding, resistance welding, etc., or can be engaged by using an adhesive, all of which do not deviate from the concept and protection scope of the present application.

[0084] In some embodiments, the upper housing capillary structure 150 comprises an upper housing main capillary structure 152 and an upper housing protrusion capillary structure 154. The upper housing main capillary structure 152 is formed on the inner surface of the upper housing body 122, and the upper housing protrusion capillary structure 154 is connected to the upper housing main capillary structure 152 and formed on the inner side of the protrusion joint 124.

[0085] In addition, the upright flat capillary structure 160 comprises an upright flat main capillary structure 162 and an upright flat expansion capillary structure 164. The upright flat main capillary structure 162 is formed on the inner surface of the upright flat heat dissipation body 132, and the upright flat expansion capillary structure 164 is connected to the upright flat main capillary structure 162 and formed on the inner side of the expansion joint 134.

[0086] Further referring to Figure 2 As shown in the figure, in some embodiments, at the joint 201, the upright flat expansion capillary structure 164 and the expansion joint 134 are engaged with each other. In other words, the end surface of the upright flat expansion capillary structure 164 protrudes from the end surface of the expansion joint 134 and is engaged with the upper housing protrusion capillary structure 154, so as to effectively increase the connection strength and the transmission efficiency of the heat dissipation fluid.

[0087] Further referring to Figure 3In some embodiments, as shown in the figures, the end surface of the upright flat pipe-expanding capillary structure 164 is connected to the end surface of the upper housing protruding capillary structure 154 at the joint 301. In other words, the end surface of the upright flat pipe-expanding capillary structure 164 is flush with the end surface of the pipe-expanding joint 134, and the end surface of the upright flat pipe-expanding capillary structure 164 is connected to the end surface of the upper housing protruding capillary structure 154 at the joint 301, which forms a space for accommodating the heat dissipation fluid, or the space is sealed by the upper housing protruding capillary structure 154, so as to connect the upright flat pipe-expanding capillary structure 164 and the upper housing protruding capillary structure 154, thereby effectively increasing the transmission efficiency of the heat dissipation fluid.

[0088] Further referring to Figure 4 In some embodiments, as shown in the figures, the upper housing protruding capillary structure 154 is connected between the upright flat pipe-expanding capillary structure 164 and the pipe-expanding joint 134 at the joint 401. In other words, the upright flat pipe-expanding capillary structure 164 is clamped between the upper housing protruding capillary structure 154 and the pipe-expanding joint 134, and the pipe-expanding joint 134 is connected to the inner side of the protruding joint 124, thereby effectively increasing the connection area and strength of the capillary structure, and increasing the transmission efficiency of the heat dissipation fluid, so as to improve the heat dissipation efficiency of the three-dimensional vapor chamber 100.

[0089] Further referring to Figure 5 In some embodiments, as shown in the figures, the upper housing protruding capillary structure 154 is connected between the upright flat pipe-expanding capillary structure 164 and the pipe-expanding joint 134 at the joint 401. In other words, the upright flat pipe-expanding capillary structure 164 is clamped between the upper housing protruding capillary structure 154 and the pipe-expanding joint 134, and the pipe-expanding joint 134 is connected to the inner side of the protruding joint 124, thereby effectively increasing the connection area and strength of the capillary structure, and increasing the transmission efficiency of the heat dissipation fluid, so as to improve the heat dissipation efficiency of the three-dimensional vapor chamber 100.

[0090] In some embodiments, referring to Figures 2 to 5 As shown in the figures, the upright flat pipe-expanding capillary structure 164 and the upright flat main capillary structure 162 form a pipe-expanding angle, such as the pipe-expanding angles 202, 302, 402, and 502 in the figures, which is preferably greater than 0.5 degrees and less than 90 degrees, such as 1 degree, 5 degrees, 10 degrees, 15 degrees, 25 degrees, 30 degrees, 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 85 degrees, or 89 degrees, without departing from the concept and protection scope of the present application.

[0091] In some embodiments, it is worth noting that the upper housing 120 further comprises a joint flange 126 connected to the raised joint 124 for jointing to the expanded tube joint 134 of the upright flat heat dissipation housing 130. In some embodiments, the inner diameter of the joint flange 126 is about equal to the outer diameter of the upright flat heat dissipation body 132, for example, greater than 2 mm, to effectively transfer the heat dissipation fluid and improve work efficiency.

[0092] In addition, in some embodiments, the upright flat expanded tube capillary structure 164 of the upright flat capillary structure 160 is connected to the upper housing raised capillary structure 154 of the upper housing capillary structure 150 in a full circumferential connection, for example, in a ring-shaped full circumferential connection, to increase the heat dissipation efficiency.

[0093] In some embodiments, the upright flat expanded tube capillary structure 164 of the upright flat capillary structure 160 is not connected to the upper housing raised capillary structure 154 of the upper housing capillary structure 150 in a full circumferential connection, in other words, only part of the upright flat expanded tube capillary structure 164 of the upright flat capillary structure 160 is connected to the upper housing raised capillary structure 154 of the upper housing capillary structure 150, that is, only part of the upright flat expanded tube capillary structure 164 of the upright flat capillary structure 160 is connected to the upper housing raised capillary structure 154 of the upper housing capillary structure 150, to facilitate the production of the three-dimensional vapor chamber 100 and also to increase the heat dissipation efficiency of the three-dimensional vapor chamber 100.

[0094] In some embodiments, the upright flat expanded tube capillary structure 164 and the upper housing raised capillary structure 154 can be single or multiple point connections, line connections, surface connections, end surface connections, or overlapping connections, or full circumferential connections, all of which do not deviate from the concept and protection scope of the present application.

[0095] In some embodiments, the upright flat capillary structure 160 and the upper housing capillary structure 150 comprise but are not limited to porous capillary structures, powder sintered capillary structures, fine groove capillary structures, woven mesh capillary structures, or woven strip capillary structures, or any combination of the above composite capillary structures, all of which do not deviate from the concept and protection scope of the present application.

[0096] Therefore, according to the architecture of the embodiments of the three-dimensional vapor chamber of the present application, the three-dimensional vapor chamber of the present application can use the upright flat pipe expansion capillary structure part of the upright flat capillary structure or the upper housing protrusion capillary structure of the annular connection upper housing capillary structure to increase the flow efficiency of the heat dissipation fluid, thereby increasing the heat dissipation efficiency of the three-dimensional vapor chamber. In addition, the three-dimensional vapor chamber of the present application uses the upright flat heat dissipation module, which increases the surface area of the upright flat heat dissipation module under the same vapor chamber module area, thereby increasing the contact area of the upright flat heat dissipation module and the vapor chamber module to improve the overall heat dissipation area of the three-dimensional vapor chamber, effectively improve the heat dissipation efficiency of the three-dimensional vapor chamber of the present application, and improve the connection strength of the upright flat heat dissipation module and the vapor chamber module. In addition, the parallel arrangement of the upright flat heat dissipation module can guide the heat dissipation gas through the outer surface of the three-dimensional vapor chamber of the present application to further improve the heat dissipation efficiency of the three-dimensional vapor chamber.

[0097] Finally, the above-mentioned embodiments are not intended to limit the present application, and any person skilled in the art can make various modifications and improvements without departing from the concept and scope of the present application, which are protected by the present application. Therefore, the protection scope of the present application is subject to the definition of the claims.

Claims

1. A three-dimensional uniform temperature plate, characterized by, The heat spreader module is fixed to the vapor chamber module and is in communication with the vapor chamber module, wherein the heat spreader module comprises a heat spreader body fixed to the upper housing and a heat spreader capillary structure formed in the heat spreader body and connected to the upper housing capillary structure. The heat spreader module has a thickness greater than 0.5 mm and a width greater than 8 mm. The heat spreader module has a width-to-thickness ratio greater than 10:

1.

2. The three-dimensional uniform temperature plate according to claim 1, wherein The upper housing comprises:

3. The three-dimensional uniform temperature plate according to claim 2, wherein an upper housing body; and 4. The three-dimensional uniform temperature plate according to claim 1, wherein a raised joint formed in the upper housing body, and the heat spreader body is inserted into the raised joint. The heat spreader body comprises: a heat spreader body; and 5. The three-dimensional uniform temperature plate according to claim 4, wherein an expanded tube joint connected to the heat spreader body and engaged with the raised joint of the upper housing. The upper housing capillary structure comprises: an upper housing main capillary structure formed on the inner surface of the upper housing body; and 6. The three-dimensional uniform temperature plate of claim 5, wherein, an upper housing raised capillary structure connected to the upper housing main capillary structure and formed on the inner side of the raised joint. The heat spreader capillary structure comprises: a heat spreader main capillary structure formed on the inner surface of the heat spreader body; and 7. The three-dimensional uniform temperature plate according to claim 6, wherein a heat spreader expanded tube capillary structure connected to the heat spreader main capillary structure and formed on the inner side of the expanded tube joint. The end surface of the upper housing raised capillary structure is connected to the end surface of the heat spreader expanded tube capillary structure and the expanded tube joint. The heat spreader expanded tube capillary structure is embedded in the upper housing raised capillary structure. The heat spreader expanded tube capillary structure is engaged between the upper housing raised capillary structure and the expanded tube joint.

8. The three-dimensional uniform temperature plate according to claim 7, wherein The upper housing raised capillary structure is engaged between the heat spreader expanded tube capillary structure and the raised joint.

9. The three-dimensional uniform temperature plate of claim 7, wherein, The upper housing further comprises:

10. The three-dimensional uniform temperature plate of claim 7, wherein, a joint flange connected to the raised joint to engage the expanded tube joint of the heat spreader body.

11. The three-dimensional uniform temperature plate of claim 7, wherein, The heat spreader expanded tube capillary structure of the heat spreader capillary structure is connected to the upper housing raised capillary structure.

12. The three-dimensional uniform temperature plate of claim 7, wherein, The vapor chamber module further comprises: a lower housing structure tightly connected to the upper housing structure, wherein the lower housing structure comprises a lower housing and a lower housing capillary structure formed on the inner surface of the lower housing, and the periphery of the upper housing capillary structure is connected to the lower housing capillary structure.

13. The three-dimensional uniform temperature plate of claim 7, wherein, ​ 14. The three-dimensional uniform heat plate of claim 1, wherein, ​ ​

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