Ejection equipment capable of preventing wafer from deviating and breaking

Abstract

The utility model provides an ejection device capable of preventing a wafer from deviating and being broken, which comprises an electrostatic chuck used for bearing the wafer and provided with at least one ejector pin hole penetrating through a body of the electrostatic chuck; the ejector pin assembly comprises at least one ejector pin and a fixing support, the ejector pins are installed on the fixing support, the positions of the ejector pins correspond to the ejector pin holes one to one, and the ejector pins can be inserted into the ejector pin holes in a lifting and penetrating mode; a sensing device is arranged on the ejector pin; the lifting assembly comprises a transmission unit and a driving unit, the transmission unit is connected with the fixing support, and the driving unit drives the transmission unit to drive the fixing support and the ejector pins on the fixing support to ascend or descend. The equipment is provided with the sensing device for monitoring the lifting condition of the ejector pin in real time, and when the wafer is possibly disengaged abnormally due to factors such as electrostatic adsorption force, the sensing device can detect abnormal force or position change borne by the ejector pin in time.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, especially to a top-out equipment capable of preventing wafer deviation and breakage. BACKGROUND

[0002] In the semiconductor manufacturing process, the electrostatic chuck (ESC) is a key component for fixing and conveying wafers. However, in the actual production process, there is often residual electrostatic force between the wafer and the electrostatic chuck, which is mainly caused by the characteristics of the wafer back film layer structure and the partial electrostatic adsorption force offset by the sheath layer bias during the etching process. When the wafer is conveyed to separate from the electrostatic chuck, the wafer will simultaneously receive the upward thrust force from the ejector pin and the downward suction force caused by the residual electrostatic force. This imbalance of force will cause the wafer to jump and deviate from the center position. SUMMARY

[0003] To solve all or part of the problems of the prior art, the utility model provides a top-out equipment capable of preventing wafer deviation and breakage, which is equipped with a sensing device for real-time monitoring of the lifting of the ejector pin. When the electrostatic adsorption force and other factors may cause the wafer to abnormally separate, the sensing device can timely detect the abnormal force or position change of the ejector pin.

[0004] To achieve the above purpose, the utility model provides the following technical scheme:

[0005] A top-out equipment capable of preventing wafer deviation and breakage, comprising:

[0006] An electrostatic chuck for carrying a wafer, the electrostatic chuck is provided with at least one ejector pin hole penetrating through the body thereof;

[0007] An ejector pin assembly comprising at least one ejector pin and a fixed support, the ejector pin is installed on the fixed support, the position corresponds to the ejector pin hole one by one, and can be lifted and inserted into the ejector pin hole; the ejector pin is provided with a sensing device;

[0008] A lifting assembly comprising a transmission unit and a driving unit, the transmission unit is connected with the fixed support, and the driving unit drives the transmission unit to drive the fixed support and the ejector pin thereon to rise or fall.

[0009] The electrostatic chuck is provided with three ejector pin holes penetrating through the body thereof, the ejector pin assembly comprises three ejector pins matched with the ejector pin holes, and the three ejector pins are uniformly distributed on the circumference with the center of the electrostatic chuck as the center.

[0010] The sensing device is a pressure sensor, which is arranged at the top end of the ejector pin.

[0011] The ejector pin comprises a main body and a top rod, the main body is provided with a slot at the top end, an elastic element is installed in the slot, and the top rod is installed on the elastic element; in the initial state, the bottom end of the top rod is away from the bottom of the slot by a distance L1.

[0012] The inductive device is a displacement sensor, which is arranged on the inner side of the slot and below the top rod.

[0013] The L1 is in the range of 0.05-0.4mm.

[0014] The elastic element is a spring.

[0015] The transmission unit comprises a sliding block and a screw rod module, the screw rod module is connected with the output shaft of the driving unit, and the sliding block is fixed to the bottom of the fixed support and forms a sliding pair with the screw rod module.

[0016] The ejector pin is an electric ejector pin, and the driving unit is a servo motor.

[0017] The device further comprises a controller connected with the driving unit, and an amplifier connected with the inductive device, the amplifier transmits an amplified signal to the controller.

[0018] The device is provided with an inductive device for real-time monitoring of the lifting of the ejector pin. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0020] Figure 1 It is a structural schematic view of the ejecting device for preventing wafer deviation and breakage in the embodiment of the present application.

[0021] Figure 2 It is a structural schematic view of the ejector pin in the ejecting device for preventing wafer deviation and breakage in the embodiment of the present application.

[0022] Label: 1, electrostatic chuck; 2, ejector pin assembly; 201, ejector pin; 2011, main body; 2012, ejector rod; 2013, elastic piece; 202, fixed support; 203, induction device; 3, lifting assembly; 301, transmission unit; 3011, sliding block; 3012, screw module; 302, driving unit; 4, controller; 5, amplifier; 6, wafer. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0024] The implementation of the present application will be described in detail below in combination with specific embodiments.

[0025] In the embodiments of the present application, in combination with reference Figure 1 As shown in the figure, a kind of ejecting equipment capable of preventing wafer deviation and broken piece is provided, which mainly includes electrostatic chuck 1, ejector pin assembly 2 and lifting assembly 3 these key parts, each part works cooperatively, and realizes stable and accurate lifting operation of wafer 6.

[0026] Electrostatic chuck 1 is the basic bearing component of the whole device, and its main function is to stably bear wafer 6. At least one ejector pin hole is arranged through the body of electrostatic chuck 1. The layout and number of these ejector pin holes are optimized, which provides accurate and reliable channels for the subsequent insertion operation of ejector pin 201. For example, in the present embodiment, three ejector pin holes are arranged through the body of electrostatic chuck 1 along the center of the circle, and this layout helps to make the stress more uniform when lifting wafer 6, so as to avoid damage to wafer 6 due to excessive local stress.

[0027] The top pin assembly 2, as a direct execution component for realizing the lifting action of the wafer 6, is composed of at least one top pin 201 and a fixed support 202. The top pin 201 is installed on the fixed support 202, and its position is in one-to-one correspondence with the top pin hole on the electrostatic chuck 1. The top pin 201 adopts the design of an electric top pin, has higher control accuracy and response speed, and ensures that the top pin 201 can be accurately inserted into the top pin hole, thereby realizing the lifting or lowering operation of the wafer 6. Preferably, the top pin 201 is further provided with a sensing device 203. In the embodiment, the sensing device 203 adopts a pressure sensor and is arranged at the top end of the top pin 201. The pressure sensor can sense the lifting state of the top pin 201 and other related information. For example, during the lifting of the wafer 6 by the top pin 201, the pressure sensor can monitor the pressure change between the top pin 201 and the wafer 6 in real time. When the electrostatic adsorption force and other factors may cause the wafer 6 to abnormally separate, the pressure signal detected by the pressure sensor will change accordingly, thereby providing key information for the operator or the controller 4 to make timely adjustments and prevent the wafer 6 from separating abnormally.

[0028] The lifting assembly 3 plays a role in power transmission and driving during the entire lifting process of the wafer 6, and includes a transmission unit 301 and a driving unit 302. The transmission unit 301 is connected with the fixed support 202, and the driving unit 302 is specially used for driving the transmission unit 301. The transmission unit 301 in the embodiment includes a sliding block 3011 and a screw module 3012. The screw module 3012 is connected with the output shaft of the driving unit 302, and this connection mode enables the driving unit 302 to efficiently transmit power to the screw module 3012. The sliding block 3011 is fixed to the bottom of the fixed support 202 and forms a sliding pair with the screw module 3012. When the driving unit 302 starts to work, the output shaft drives the screw module 3012 to rotate, and the rotary motion of the screw module 3012 promotes the sliding block 3011 to move along the axial direction of the screw. Since the fixed support 202 is connected with the sliding block 3011, the fixed support 202 and the top pin 201 thereon can be driven to realize the lifting or lowering action, thereby completing the lifting operation of the wafer 6.

[0029] In this embodiment, the drive unit 302 employs a high-performance servo motor. Servo motors offer advantages such as high precision, high reliability, and excellent dynamic response performance, enabling precise control of the lifting and lowering motion of the ejector pin 201. Furthermore, to further optimize the overall control performance of the device, it is also equipped with a controller 4 and an amplifier 5. The controller 4 is closely connected to the drive unit 302, serving as the core control unit of the entire device, responsible for controlling the operation of the drive unit 302 based on various preset parameters and actual operating conditions. The amplifier 5 is connected to the sensing device 203 (i.e., the pressure sensor). The signals detected by the sensing device 203 are typically weak and may be subject to noise interference. The amplifier 5 amplifies these weak signals and performs filtering and other optimization processes during amplification before transmitting the amplified signals to the controller 4. Upon receiving these processed signals, the controller 4 performs precise control and adjustment based on its internal control algorithm, ensuring the stability and accuracy of the wafer 6 lifting and lowering process, thereby meeting the extremely high precision requirements of semiconductor manufacturing and other processes involving wafer 6 processing.

[0030] In other specific implementations, in conjunction with the reference Figure 2 As shown, the structure of the ejector pin 201 has been designed in greater detail. The ejector pin 201 consists of two parts: a main body 2011 and an ejector rod 2012. The main body 2011 serves as the structural foundation for support and positioning, and its top end is carefully designed with a slot. An elastic element 2013, preferably a spring, is installed inside the slot. Springs have good elasticity and fatigue resistance, and can maintain stable elasticity and performance during repeated lifting and lowering movements. The ejector rod 2012 is installed on the elastic element 2013. The ejector rod 2012 is tightly connected to the elastic element 2013 and can move up and down accordingly with the elastic deformation of the elastic element 2013. In the initial state, that is, before the ejector pin 201 starts working and the wafer 6 is not subjected to lifting force, the bottom end of the ejector rod 2012 is L1 from the bottom of the slot, and this distance is limited to the range of 0.05-0.4mm. By controlling L1 within this range, it can be ensured that the height difference between the three ejector pins in the initial state remains within a reasonable range, thereby avoiding the risk of wafer displacement due to uneven force on the ejector pins when lifting the wafer.

[0031] In order to monitor the lifting displacement of the top pin 201 in real time, the inductive device 203 adopts a displacement sensor, which is arranged on the inner side of the slot and below the top rod 2012. The displacement sensor can directly detect the displacement change of the top rod 2012 relative to the bottom of the slot. When the top pin 201 starts to work, the top rod 2012 moves with the fixed support 202 under the action of the elastic member 2013, the displacement sensor can monitor the up-down movement distance of the top rod 2012, and convert the displacement signal into an electric signal and transmit it to the controller 4. When the electrostatic adsorption force and other factors may cause the wafer 6 to abnormally separate, the controller 4 can accurately analyze and process these displacement signals, and adjust the related parameters in real time and effectively, so as to prevent the wafer 6 from separating or breaking and other abnormal conditions.

[0032] It should be noted that, for those skilled in the art, without departing from the principles of the present application, the present application can be improved and modified in many ways, and these improvements and modifications also fall within the scope of protection of the present application.

Claims

1. An ejection device for preventing wafer misalignment and breakage, characterized in that, The utility model relates to an electrostatic chuck (1) for carrying a wafer (6), the electrostatic chuck (1) is provided with at least one pinhole through its body, a pin assembly (2) including at least one pin (201) and a fixed support (202), the pin (201) is installed on the fixed support (202), the position is corresponding with the pinhole one to one, and the pin (201) is liftable and is inserted in the pinhole, the pin (201) is provided with a sensing device (203), a lifting assembly (3) including a transmission unit (301) and a drive unit (302), the transmission unit (301) is connected with the fixed support (202), and the drive unit (302) drives the transmission unit (301) to drive the fixed support (202) and the pin (201) thereon to ascend or descend. The electrostatic chuck (1) is provided with three pinholes through its body, the pin assembly (2) includes three pins (201) matched with the pinholes, and the three pins (201) are uniformly distributed on a circumference with the center of the electrostatic chuck (1) as the center. The sensing device (203) is a pressure sensor arranged at the top end of the pin (201). The pin (201) includes a main body (2011) and a top rod (2012), the main body (2011) is provided with a slot at the top end, the slot is installed with an elastic element (2013), the top rod (2012) is installed on the elastic element (2013), and the bottom end of the top rod (2012) is away from the bottom of the slot by L1 in the initial state.

2. The apparatus of claim 1, wherein, The sensing device (203) is a displacement sensor arranged on the inner side of the slot and below the top rod (2012).

3. The apparatus of claim 1, wherein, The L1 is in the range of 0.05-0.4mm.

4. The apparatus of claim 1, wherein, The elastic element (2013) is a spring.

5. The apparatus of claim 4, wherein, The transmission unit (301) includes a sliding block (3011) and a lead screw module (3012), the lead screw module (3012) is connected with the output shaft of the drive unit (302), the sliding block (3011) is fixed to the bottom of the fixed support (202) and forms a sliding pair with the lead screw module (3012).

6. The apparatus of claim 4, wherein, The pin (201) is an electric pin, and the drive unit (302) is a servo motor.

7. The apparatus of claim 4, wherein, Further including a controller (4) connected with the drive unit (302), and an amplifier (5) connected with the sensing device (203), the amplifier (5) transmits an amplified signal to the controller (4).

8. The apparatus of claim 1, wherein, ​ 9. The apparatus of claim 1, wherein, ​ 10. The apparatus of claim 1, wherein, ​

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