Power module and power module group

Abstract

The utility model discloses a power module, and the power module comprises a substrate which comprises a substrate first surface and a substrate side edge, and the substrate first surface is perpendicular to the substrate side edge; the power devices are located on the substrate; the first ends of the power terminals are connected with the side edge of the substrate; the first end of the signal terminal is connected with the first surface of the substrate, the signal terminal is perpendicular to the substrate, and the second end of the signal terminal receives a driving signal of the power device. The signal terminals are led out in the direction perpendicular to the substrate, so that the path of a power device driving loop in the power module is remarkably shortened, and the switching loss of the power device is reduced; according to the power module, stray capacitance and stray inductance of a power loop to a driving loop are reduced, and the problem of working oscillation of a multi-parallel high-switching-frequency power device is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to power semiconductor technical field more particularly, relate to a kind of power module and power module. BACKGROUND

[0002] The signal pin and power pin of the existing epoxy encapsulation type power module are usually led out from the side of the power module, which causes the signal loop to be greatly lengthened, affecting the response speed and power consumption of the power module, and the signal loop and power loop are staggered, so that the signal loop is easily affected by the voltage and current changes in the power loop, leading to unstable signal and affecting the driving power device.

[0003] Therefore, a new type of power module and power module are proposed to improve the above problems. SUMMARY

[0004] The utility model aims at providing a kind of power module, to solve the problem of the existing power module in driving loop and power loop stagger, driving loop is affected by power loop, poor stability, high-frequency drive oscillation etc.

[0005] According to one aspect of the utility model, a power module is provided, comprising: a substrate, the substrate includes a substrate first surface, a substrate side, the substrate first surface and the substrate side are perpendicular;Power device, the power device includes a plurality of upper bridge power devices and a plurality of lower bridge power devices, the power device is located on the first surface of the substrate;Power terminal, the power terminal includes alternating current power terminal, direct current power terminal;Signal terminal, the first end of the signal terminal is connected to the substrate first surface, the signal terminal is perpendicular to the substrate, the second end of the signal terminal leads out of the plastic package, and the signal terminal receives the driving signal of the power device.

[0006] Optionally, the upper bridge power devices are arranged side by side, and the signal terminal corresponding to the upper bridge power device is located between the direct current power terminal and the upper bridge power device;The lower bridge power devices are arranged side by side, and the signal terminal corresponding to the lower bridge power device is located between the alternating current power terminal and the lower bridge power device.

[0007] Optionally, the upper bridge power device is located on a first base island, and the drain electrode of the upper bridge power device is electrically connected to the first base island;The lower bridge power device is located on a second base island, and the drain electrode of the lower bridge power device is electrically connected to the second base island;The source electrode of the upper bridge power device is electrically connected to the second base island;The source electrode of the lower bridge power device is electrically connected to a third base island.

[0008] Optionally, the third base island is arranged around the first base island, the signal terminal comprises a first gate terminal, a first source terminal and a first drain terminal corresponding to the upper bridge power device; the signal terminal further comprises a second gate terminal, a second source terminal corresponding to the lower bridge power device.

[0009] Optionally, the first gate terminal is located on a fourth base island, the first source terminal is located on a fifth base island, the second gate terminal is located on a sixth base island, and the second source terminal is located on a seventh base island.

[0010] Optionally, the power module is a plastic package, the fourth base island is two, the two fourth base islands are respectively located on both sides of the first base island, the two fourth base islands are electrically connected by a bonding wire, the fifth base island is two, the two fifth base islands are respectively located on both sides of the first base island, the two fifth base islands are electrically connected by a bonding wire, the sixth base island is two, the two sixth base islands are respectively located on both sides of the second base island, the two sixth base islands are electrically connected by a bonding wire, and the seventh base island is two, the two seventh base islands are respectively located on both sides of the second base island, and the two seventh base islands are electrically connected by a bonding wire.

[0011] Optionally, the power module is a plastic package, the fourth base island is two, the two fourth base islands are respectively located on both sides of the first base island, the two fourth base islands are electrically connected by a bonding wire, the fifth base island is two, the two fifth base islands are respectively located on both sides of the first base island, the two fifth base islands are electrically connected by a bonding wire, the sixth base island is two, the two sixth base islands are respectively located on both sides of the second base island, the two sixth base islands are electrically connected by a bonding wire, and the seventh base island is two, the two seventh base islands are respectively located on both sides of the second base island, and the two seventh base islands are electrically connected by a bonding wire. Optionally, the power device is a silicon semiconductor field effect transistor or a silicon carbide semiconductor field effect transistor, the upper bridge power device comprises four, and the lower bridge power device comprises four.

[0012] Optionally, the first gate terminal and the first source terminal are located in the middle part surrounded by the upper bridge power device; the second gate terminal and the second source terminal are located in the middle part surrounded by the lower bridge power device.

[0013] Optionally, the upper bridge power device is located on a first base island, the drain of the upper bridge power device is electrically connected to the first base island, and the first base island is annular; the lower bridge power device is located on a second base island, the second base island is surrounded by the first base island; the drain of the lower bridge power device is electrically connected to the second base island, the source of the upper bridge power device is electrically connected to the second base island, and the source of the lower bridge power device is electrically connected to a third base island.

[0014] Optionally, the first gate terminal is located on a fourth base island, the first source terminal is located on a second base island, the second gate terminal is located on a sixth base island, and the second source terminal is located on a third base island.

[0015] Optionally, the power module is a plastic package.

[0016] Optionally, the power module is a potting package.

[0017] Optionally, the power module further comprises an encapsulation body, the encapsulation body encapsulates the substrate, the power device on the substrate, the first end of the power terminal and the first end of the signal terminal, and the second end of the power terminal and the second end of the signal terminal are led out from the encapsulation body.

[0018] Optionally, the first end of the signal terminal is a base, the second end of the signal terminal is a connecting pin, the first end of the base is connected to the substrate, the second end of the base is connected to the first end of the connecting pin, and the second end of the connecting pin receives the driving signal of the power device.

[0019] Optionally, the base is a cylinder or a prism with a connecting hole in the middle, the connecting hole is a through hole or a blind hole, and the first end of the connecting pin is connected to the connecting hole of the base through insertion.

[0020] Optionally, the connecting hole is a blind hole, and the distance between the bottom of the connecting hole and the bottom surface outside the base is 0.5-4mm.

[0021] Optionally, the base is a solid cylinder or a prism, and the first end of the connecting pin is connected to the top of the base through welding.

[0022] Optionally, the encapsulation body comprises a first encapsulation body and a second encapsulation body, the first encapsulation body encapsulates the base of the signal terminal, the base is connected to the connecting pin to form the second encapsulation body, and the second encapsulation body is used to fill the gap between the base and the connecting pin and encapsulate the first end of the connecting pin.

[0023] Optionally, the connecting pin is a fish-eye needle, the top area of the fish-eye needle has a connecting part extending perpendicular to the axis direction of the fish-eye needle, and the fish-eye needle is connected to the circuit board outside the power module through crimping of the connecting part.

[0024] Optionally, the connecting pin is a straight pin, the first end of the straight pin is connected to the base through welding, and the second end of the straight pin is connected to the circuit board outside the power module through welding.

[0025] Optionally, the outer diameter of the base is 0.3mm-2.0mm, the height of the base is 2mm-7mm, and the hole diameter of the connecting hole of the base is 0.1mm-1.5mm.

[0026] Optionally, the outer diameter of the base is 1mm-5mm, and the height of the base is 2mm-7mm.

[0027] Optionally, the power module side edge comprises a power module first side edge and a power module second side edge arranged oppositely, and the power terminal comprises a power input terminal and a power output terminal, which are led out from the power module first side edge and the power module second side edge, respectively.

[0028] Optionally, a temperature sensor is further included, and a pin of the temperature sensor is close to the second side edge and perpendicular to the first surface of the substrate.

[0029] According to another aspect of the present application, a power module is provided, comprising at least three power modules as described above, and the three power modules are used for a first phase drive circuit, a second phase drive circuit and a third phase drive circuit, respectively, and the three power modules are on the same bottom plate.

[0030] The power module and the power module provided by the utility model, through leading out the signal terminal in the direction perpendicular to the substrate, the path of the power device drive loop in the power module is shortened obviously, the switching loss of the power device is reduced, the parasitic capacitance and inductance of the power loop to the drive loop are reduced, the working oscillation problem of the multi-parallel and high switching frequency power device is improved, the signal terminal and the power terminal are avoided to be led out on the same side and in the same plane, the electrical and creeping distance between the signal terminal and the power terminal are increased, and the safety hidden danger such as insulation sparking is reduced.

[0031] Further, the base is pre-buried first and then encapsulated, and the connecting needle is inserted after encapsulation, so that the needle in the middle region of the substrate is realized, the problems of the signal terminal and the encapsulation mold cavity being tightly matched to cause the mold cavity to be clamped, the position and perpendicularity of the signal terminal being poor, and the encapsulation overflow between the connecting needle and the encapsulation cavity are solved.

[0032] Further, the base can adopt two structures of middle hole or solid, and the middle hole of the base can be a blind hole, so that the problem of the ceramic substrate being cracked due to excessive insertion of the connecting needle is avoided.

[0033] The base and the ceramic substrate, or the needle and the base are connected by ultrasonic welding, so that the connection reliability between the signal terminal and the base, or between the needle cap and the ceramic substrate under the scenes of vibration and thermal expansion is enhanced.

[0034] The base of the connection terminal and the connection pin can be secondarily encapsulated after connection to fill the gap between the two and coat the lower end of the connection pin, thereby improving the moisture and heat resistance and corrosion resistance between the connection pin and the base and the connection strength between the two. BRIEF DESCRIPTION OF DRAWINGS

[0035] The above and other objects, features and advantages of the present application will become more apparent from the following description of the preferred embodiments of the present application with reference to the accompanying drawings.

[0036] Figure 1 A schematic diagram of a prior art power module is shown;

[0037] Figure 2 A schematic diagram of a power module of a first embodiment of the present application is shown;

[0038] Figure 3 A perspective schematic diagram of a power module of a second embodiment of the present application is shown;

[0039] Figure 4 A front view of the power module of the second embodiment of the present application is shown;

[0040] Figure 5 A perspective schematic diagram of a power module of a third embodiment of the present application is shown;

[0041] Figure 6 A front view of the power module of the third embodiment of the present application is shown;

[0042] Figure 7 A schematic diagram of a signal terminal of the power module of the third embodiment of the present application is shown;

[0043] Figure 8 A schematic diagram of a signal terminal of a power module of a fourth embodiment of the present application is shown;

[0044] Figure 9 A schematic diagram of a signal terminal of a power module of a fifth embodiment of the present application is shown;

[0045] Figure 10 A schematic diagram of a signal terminal of a power module of a sixth embodiment of the present application is shown;

[0046] Figure 11 A circuit schematic diagram of a power module of a seventh embodiment of the present application is shown;

[0047] Figure 12 A current flow direction schematic diagram of the power module of the seventh embodiment of the present application is shown;

[0048] Figure 13 A circuit schematic diagram of a power module of an eighth embodiment of the present application is shown;

[0049] Figure 14 The current flow direction schematic diagram of the power module of the eighth embodiment of the utility model is shown. DETAILED DESCRIPTION

[0050] The utility model will be described in more detail below with reference to the drawings. In each drawing, the same elements are denoted by similar reference numerals. For the sake of clarity, the various parts in the drawings are not drawn to scale. Furthermore, certain known parts can not be shown.

[0051] It should be understood that when describing the structure, when one component, one module is referred to as being located "before" another component, another module, it can mean being directly located in front of and abutting against the other component, another module circuit, or other components or modules are contained between it and the other component, another module. And if the position and abutment relationship of the partial module can also be adjusted as needed.

[0052] If in order to describe the case of being directly located before another component, another module, the expression "directly before" or "before and abutting against" will be used in this paper.

[0053] Many specific details of some embodiments of the utility model are described below, such as the specific circuit composition of the module, the model of the component, the number and the connection relationship, so that the utility model can be more clearly understood. But as the skilled in the art can understand, the utility model can be implemented without these specific details.

[0054] The utility model can be presented in various forms, and some examples will be described below.

[0055] Figure 1 The schematic diagram of the existing power module is shown; the power module 100, for example, includes a substrate 110, a power device 120; the power terminal includes an alternating current power terminal 141, a direct current power terminal 142, the alternating current power terminal is located on the upper side of the substrate 110, the direct current power terminal 142 is located on the lower side of the substrate 110, the signal terminal 130 is located on the upper side of the substrate 110, and the signal terminal 130 is divided into two groups and located on the left and right sides of the alternating current power terminal 141, the substrate 110 is also provided with an extraction structure 111, and at least part of the driving signal of the chip power device 120 is extracted to the upper side of the substrate 110 through the extraction structure 111 on the substrate 110 and connected with the outside through the signal terminal 130.

[0056] In the existing power module, the power loop and the signal loop are staggered on the substrate 110, so that the signal in the signal loop is easily affected by the voltage and current change of the power loop, thereby affecting the stability of the signal in the signal loop and causing the driving oscillation of the power device.

[0057] Figure 2 、 Figure 5 The utility model discloses a schematic diagram of power module's first embodiment shows, the power module 200 of this first embodiment, the power module includes the substrate 210, and the substrate includes the substrate first surface, the substrate side, and the substrate 210 first surface and the substrate side are perpendicular, power device 220, power device includes a plurality of upper bridge power device and a plurality of lower bridge power device, and power device 120 is located on the first surface of substrate 210, AC power terminal 241, DC power terminal 242, and AC power terminal is located on the upper side of substrate 210, and DC power terminal 242 is located on the lower side of substrate 110, signal terminal 230, the first end of signal terminal 230 is connected the substrate 210 first surface.The substrate 210 is for example ceramic insulating substrate, and power device 220 is bonded on the first surface of substrate 210 by sintering or welding, and power device 220 is for example including silicon device, silicon carbide device etc.

[0058] The first end of signal terminal 230 is connected the substrate 210 first surface, and signal terminal 210 is perpendicular to the substrate 210, and the second end of signal terminal 230 leads out of plastic package, and signal terminal 230 receives the drive signal of power device.The spacing between power terminal and signal terminal is not less than 10mm, and the material of power terminal includes but is not limited to copper and copper alloy.

[0059] The signal terminal of the application is changed from the traditional lead-out from the substrate side to the lead-out on the upper surface of the substrate and perpendicular to the substrate, shortens the path of signal loop in the power module, can effectively reduce the switching loss of power device, reduces the parasitic inductance of power loop to signal loop, improves the oscillation problem of power device, further, since signal terminal 230 is perpendicular to the substrate, avoids the lead-out of signal terminal and power terminal on the same side of the substrate, increases the electrical, creeping distance between signal terminal 230 and power terminal 241, 242, and reduces the safety hazards such as insulation sparking.

[0060] Figure 3 And Figure 4 Respectively show the three-dimensional schematic diagram and front view of the utility model second embodiment power module, for example including three parallelly arranged power module 301 on the bottom plate 360, and there is spacing between adjacent power module 301, and each power module 301 adopts Figure 2The power module 301 comprises a substrate 310, a power device 320, and a signal terminal 330. The substrate 310 is provided with a plurality of power devices 320. Each power module 301 further comprises an encapsulating body 350, which encapsulates the substrate, the power device, and one end of the signal terminal 330. The material of the encapsulating body 350 comprises epoxy resin, silica gel, bismaleimide resin, three-proof paint, etc. One end of the signal terminal 330 is connected to the substrate by ultrasonic welding or reflow soldering before being encapsulated by the encapsulating body 350. The substrate carries the power device and is insulated and separated from the bottom plate 360 by an interfacial connecting material. The bottom plate 360 is, for example, a heat dissipation plate, and the other side surface thereof can be provided with a heat dissipation structure. The substrate is a ceramic substrate, and the material thereof comprises, but is not limited to, AMB-SIN, ALN, DBC-AL2O3, ZrO3, etc. The power device is connected to the substrate by means of tin paste, soldering sheet, sintered Ag, sintered Cu, TLPS, etc. The power device comprises, for example, a plurality of power devices. The plurality of power devices are connected to each other, and the power device and the substrate are connected to each other by, for example, a bonding material. The bonding material bears the current and voltage signal interconnection of the power device. The bonding material comprises aluminum wire, copper wire, copper strip, copper sheet, etc.

[0061] Figure 7 A schematic view of a signal terminal of a power module according to a third embodiment of the utility model is shown. The signal terminal 430 comprises, for example, a base 431 and a connecting needle 432. The signal terminal 430 is mainly used for conducting low-voltage driving signals of the power device and temperature and power loop voltage sampling functions. In particular, in some application scenarios, the signal terminal 430 also bears large current and voltage. The base 431 is located on the substrate 410. The middle of the base 431 is provided with a connecting hole. The bottom of the base 431 is connected to the substrate 410 by ultrasonic welding or reflow soldering. The connecting needle 432 is, for example, a fish eye needle. The connecting needle 432 and the base 431 are designed in a split type. One end of the connecting needle 432 is connected to the connecting hole of the base 431 by insertion. The two are interference fit. The other end of the connecting needle 432 is provided with a connecting part 4321. Through the connecting part 4321, the connecting needle 432 can be connected to the corresponding circuit board (not shown in the figure) by pressure welding, realizing electrical connection. Specifically, the width of the connecting needle 432 is 0.2mm-2mm, the thickness is 0.2-2mm, and the length is 1mm-20mm. The base 431 is made of, for example, conductive materials such as copper, aluminum, copper-molybdenum alloy, etc. The base 431 is made of a solid column (cylinder or prism) with a 0.1mm-1.5mm blind hole or through hole in the center. The outer diameter of the base 431 is 0.3mm-2.0mm, and the height of the base 431 is 2mm-7mm. For example, when the center of the base 431 is a blind hole, the opening bottom of the base 431 will reserve a solid area of 0.5mm-4mm to prevent the substrate 410 from being damaged by stress cracking when the connecting needle 432 is inserted into the base 431. The base 431 is connected to the substrate 410 by ultrasonic welding. For example, the bottom of the base 431 is provided with an annular ultrasonic welding area.

[0062] The encapsulation body 450 is formed by using an encapsulation material such as an epoxy resin, a silica gel, a bismaleimide resin, a three-protection paint, etc., and the base 431 is connected to the substrate 410 before encapsulation; further, the thickness of the encapsulation body 450 is greater than the height of the base 431, and the top of the base 431 needs to be sealed during encapsulation to prevent overflow of the base 431 inside or on the top surface, which affects the assembly of the connecting needle 432 and the base 431. Further, secondary encapsulation can be performed after the connecting needle 432 and the base 431 are assembled to fill the part between the connecting needle 432 and the base 431 to prevent water vapor from invading and electrochemical corrosion.

[0063] Figure 8 A schematic diagram of a signal terminal of a power module according to a fourth embodiment of the present application is shown; the fourth embodiment is similar to the third embodiment, and the difference is that the connecting needle 432 in the signal terminal of the fourth embodiment is a cylindrical straight needle, and the base 431 is connected to the substrate 410 by ultrasonic welding or reflow soldering; one end of the connecting needle 432 of the fourth embodiment is connected to the base 431 in a plug-in manner, and the two are in interference fit; the other end of the connecting needle 432 is connected to the corresponding circuit board (not shown in the figure) by welding.

[0064] Figure 9 A schematic diagram of a signal terminal of a power module according to a fifth embodiment of the present application is shown; the fifth embodiment is similar to the third embodiment, and the difference is that the base 431 in the signal terminal of the fifth embodiment is a solid cylindrical block, and the base 431 is connected and fixed to the substrate 410 by reflow soldering; the connecting needle 432 is an integral fisheye needle, one end of the connecting needle 432 is connected to the base 431 by ultrasonic welding, and the other end of the connecting needle 432 is connected to the corresponding circuit board (not shown in the figure) by crimping.

[0065] Figure 10 A schematic diagram of a signal terminal of a power module according to a sixth embodiment of the present application is shown; the sixth embodiment is similar to the fifth embodiment, and the difference is that the connecting needle 432 in the signal terminal of the sixth embodiment is an integral cylindrical straight needle, one end of the connecting needle 432 is connected to the base 431 by ultrasonic welding, and the other end of the connecting needle 432 is connected to the corresponding circuit board (not shown in the figure) by welding.

[0066] Figure 11 And Figure 12 A circuit schematic diagram and a current flow direction schematic diagram of a power module according to a seventh embodiment of the present application are shown respectively; the current path of the power module is shown by the dashed arrows in Figure 12 , wherein the red color is the current flow direction of the upper bridge power device, and the blue color is the current flow direction of the lower bridge power device; the current flows from one DC power terminal DC+ (i.e. Figure 2242, Figure 3 342, Figure 4 342 and Figure 5 The intermediate terminal in 442, Figure 6 The current flows into the drain of the four parallel upper-bridge power devices (from the middle terminal of 442), and then out from the source of the upper-bridge power devices. The current flows out through the bonding wire to the AC power terminal (i.e., ...). Figure 2 241, Figure 3 341, Figure 4 341, Figure 5 441, Figure 6 (441), the current then flows from the AC power terminal AC into the drain of the four parallel lower bridge power devices, and the current flows out from the source of the lower bridge power devices, and the current flows out through the bond wire to the two DC power terminals DC- (i.e. Figure 2 242, Figure 3 342, Figure 4 342 and Figure 5 The two terminals of 442, Figure 6 (442, terminals on both sides).

[0067] The power devices on the upper bridge are arranged side by side. The following description uses four power devices as an example, but this application is not limited to four power devices. The four power devices are arranged side by side, and the corresponding signal terminals of the power devices (i.e....) Figure 2 230, Figure 3 330, Figure 4 330, Figure 5 430 Figure 6 430, Figure 12 G1, D1, and S1 are located between the DC power terminals DC+ and DC- and the upper bridge power device; the lower bridge power devices are arranged side by side. The following description uses four lower bridge power devices as an example, but this application is not limited to four lower bridge power devices. The signal terminals corresponding to the lower bridge power devices (i.e., Figure 2 230, Figure 3 330, Figure 4 330, Figure 5 430 Figure 6 430, Figure 12 G2 and S2 are located between the AC power terminal AC and the lower bridge power device.

[0068] The two temperature signal terminals corresponding to the temperature sensor are Figure 12 T1 and T2 are marked.

[0069] like Figure 12As shown, the upper bridge power device is located at the first base island 1, and the drain of the upper bridge power device is electrically connected to the first base island 1; the lower bridge power device is located at the second base island 2, and the drain of the lower bridge power device is electrically connected to the second base island 2; the source of the upper bridge power device is electrically connected to the second base island 2; and the source of the lower bridge power device is electrically connected to the third base island 3.

[0070] The third base island 3 is arranged around the first base island 1, and the signal terminal includes a first gate terminal G1, a first source terminal S1 and a first drain terminal D1 corresponding to the upper bridge power device; and the signal terminal further includes a second gate terminal G2 and a second source terminal S2 corresponding to the lower bridge power device.

[0071] The first gate terminal G1 is located at the fourth base island 4, the first source terminal S1 is located at the fifth base island 5, the second gate terminal G2 is located at the sixth base island 6, and the second source terminal S2 is located at the seventh base island 7.

[0072] If the power module is packaged by a plastic package, the fourth base island is two, the two fourth base islands 4 are respectively located at two sides of the first base island 1, the two fourth base islands 4 are electrically connected through a bonding wire, the fifth base island 5 is two, the two fifth base islands 5 are respectively located at two sides of the first base island 1, the two fifth base islands 5 are electrically connected through a bonding wire, the sixth base island 6 is two, the two sixth base islands 6 are respectively located at two sides of the second base island 2, the sixth base island 6 is electrically connected through a bonding wire, and the seventh base island 7 is two, the two seventh base islands 7 are respectively located at two sides of the second base island 2, and the two seventh base islands 7 are electrically connected through a bonding wire.

[0073] If the power module is packaged by a plastic package, the fourth base island is two, the two fourth base islands 4 are respectively located at two sides of the first base island 1, the two fourth base islands 4 are electrically connected through a bonding wire, the fifth base island 5 is two, the two fifth base islands 5 are respectively located at two sides of the first base island 1, the two fifth base islands 5 are electrically connected through a bonding wire, the sixth base island 6 is two, the two sixth base islands 6 are respectively located at two sides of the second base island 2, the sixth base island 6 is electrically connected through a bonding wire, and the seventh base island 7 is two, the two seventh base islands 7 are respectively located at two sides of the second base island 2, and the two seventh base islands 7 are electrically connected through a bonding wire

[0074] Each of the above power devices is, for example, a silicon semiconductor field effect transistor or a silicon carbide semiconductor field effect transistor, the upper bridge power device includes four, and the lower bridge power device includes four.

[0075] Figure 13 And Figure 14 The circuit schematic diagram and the current flow direction schematic diagram of the power module are respectively shown; the current path of the power module is as shown in the figure Figure 14The current flows from the two DC power terminals DC+ (i.e. 241 of Figure 2 242 of Figure 3 342 of Figure 4 342 and Figure 5 442, the two terminals of Figure 6 442, the two terminals of) into the drain of the four upper bridge power devices in parallel, and then flows out from the source of the upper bridge power devices, and then flows out to the AC power terminal AC (i.e. 241 of Figure 2 242 of Figure 3 341 of Figure 4 341, Figure 5 441 of Figure 6 441) through the bonding wires; and then flows into the drain of the four lower bridge power devices in parallel from the AC power terminal AC, and then flows out from the source of the lower bridge power devices, and then flows out to one DC power terminal DC- (i.e. 242 of Figure 2 342 of Figure 3 342 and Figure 4 442, the middle terminal of Figure 5 442, the middle terminal of) through the bonding wires. Figure 6

[0076] Figure 13 and Figure 14 The first gate terminal G1 and the first source terminal S1 are located in the middle part surrounded by the upper bridge power devices; and the second gate terminal G2 and the second source terminal S2 are located in the middle part surrounded by the lower bridge power devices.

[0077] As shown in Figure 14 , the upper bridge power devices are located on the first base island 1, the drain of the upper bridge power devices is electrically connected to the first base island 1, and the first base island 1 is annular; the lower bridge power devices are located on the second base island 2, the second base island 2 is surrounded by the first base island 1; the drain of the lower bridge power devices is electrically connected to the second base island 2, the source of the upper bridge power devices is electrically connected to the second base island 2, and the source of the lower bridge power devices is electrically connected to the third base island 3.

[0078] The first gate terminal G1 is located on the fourth base island 4, the first source terminal S1 is located on the second base island 2, the second gate terminal G2 is located on the sixth base island 6, and the second source terminal S2 is located on the third base island 3.

[0079] The power module is a plastic package.

[0080] The power module is a potting package

[0081] ​The power module provided by the utility model, through leading out the signal terminal in the direction perpendicular to the base plate, the path of the power device driving circuit in the power module is shortened obviously, the power device switching loss is reduced, the parasitic capacitance of the power circuit to the driving circuit is reduced, the working oscillation problem of the multi-parallel and high switching frequency power device is improved, the signal terminal and the power terminal are avoided to be led out on the same side and in the same plane, the electrical and creepage distance between the signal terminal and the power terminal is increased, and the safety hidden danger such as insulation sparking is reduced.

[0082] Further, the signal terminal is led out from the middle region of the base plate by pre-embedding the base plate and then performing encapsulation, and the connection pin is inserted after encapsulation, so that the problem that the signal terminal is clamped in the mold cavity due to the close fit between the signal terminal and the encapsulation mold cavity is solved, the position and perpendicularity of the signal terminal are improved, and the problem that the encapsulation overflow exists between the connection pin and the encapsulation cavity is solved.

[0083] Further, the base plate can adopt two structures of middle hole or solid, and the middle hole of the base plate can be a blind hole, so that the problem that the ceramic base plate is cracked due to excessive insertion of the connection pin is avoided.

[0084] The base plate and the ceramic base plate, or the connection pin and the base plate are connected by ultrasonic welding, so that the connection reliability between the signal terminal and the base plate, or between the needle cap and the ceramic base plate under the vibration and thermal expansion scene is improved.

[0085] The base plate and the connection pin can be encapsulated again after being connected, so as to fill the gap between the two, improve the moisture resistance, corrosion resistance and connection strength between the connection pin and the base plate. In the above description, the position combination, connection mode and other technical details of each component are not described in detail. However, those skilled in the art should understand that the required connection relationship can be formed by various technical means. In addition, in order to have the same function, those skilled in the art can also design structures different from the above description. In addition, although each embodiment is described above, it does not mean that the measures in each embodiment cannot be used advantageously.

[0086] The embodiments of the utility model are described above. However, these embodiments are only for illustrative purposes, and not for limiting the scope of the utility model. The scope of the utility model is limited by the appended claims and their equivalents. Without departing from the scope of the utility model, those skilled in the art can make various substitutions and modifications, which should fall within the scope of the utility model.

Claims

1. A power module, characterized by The application relates to a power module. The power module comprises: a substrate, the substrate comprising a substrate first surface and substrate side edges, the substrate first surface and the substrate side edges being perpendicular; power devices, the power devices comprising a plurality of upper bridge power devices and a plurality of lower bridge power devices, the power devices being located on the first surface of the substrate; power terminals, the power terminals comprising alternating current power terminals and direct current power terminals; 2. The power module of claim 1, wherein, signal terminals, the signal terminals being connected to the substrate first surface, the signal terminals being perpendicular to the substrate, second ends of the signal terminals being led out of a plastic package, the signal terminals receiving driving signals of the power devices.

3. The power module of claim 2, wherein, The upper bridge power devices are arranged side by side, the signal terminals corresponding to the upper bridge power devices being located between the direct current power terminals and the upper bridge power devices; the lower bridge power devices are arranged side by side, the signal terminals corresponding to the lower bridge power devices being located between the alternating current power terminals and the lower bridge power devices.

4. The power module of claim 3, wherein, The upper bridge power devices are located on a first base island, drain electrodes of the upper bridge power devices being electrically connected to the first base island; the lower bridge power devices are located on a second base island, drain electrodes of the lower bridge power devices being electrically connected to the second base island; source electrodes of the upper bridge power devices are electrically connected to the second base island; source electrodes of the lower bridge power devices are electrically connected to a third base island.

5. The power module of claim 4, wherein, The third base island surrounds the first base island, the signal terminals comprising first gate terminals, first source terminals and first drain terminals corresponding to the upper bridge power devices; the signal terminals further comprise second gate terminals and second source terminals corresponding to the lower bridge power devices.

6. The power module of claim 5, wherein, The first gate terminals are located on a fourth base island, the first source terminals are located on a fifth base island, the second gate terminals are located on a sixth base island, and the second source terminals are located on a seventh base island.

7. The power module of claim 5, wherein, The power module is a plastic package, the fourth base island is two, the two fourth base islands are located on two sides of the first base island, the two fourth base islands are electrically connected by bonding wires, the fifth base island is two, the two fifth base islands are located on two sides of the first base island, the two fifth base islands are electrically connected by bonding wires, the sixth base island is two, the two sixth base islands are located on two sides of the second base island, the two sixth base islands are electrically connected by bonding wires, and the seventh base island is two, the two seventh base islands are located on two sides of the second base island, and the two seventh base islands are electrically connected by bonding wires. The power module is a plastic package, the fourth base island is two, the two fourth base islands are located on two sides of the first base island, the two fourth base islands are electrically connected by bonding wires, the fifth base island is two, the two fifth base islands are located on two sides of the first base island, the two fifth base islands are electrically connected by bonding wires, the sixth base island is two, the two sixth base islands are located on two sides of the second base island, the two sixth base islands are electrically connected by bonding wires, and the seventh base island is two, the two seventh base islands are located on two sides of the second base island, and the two seventh base islands are electrically connected by bonding wires.

8. The power module of claim 1, wherein, The power device is a silicon semiconductor field effect transistor or a silicon carbide semiconductor field effect transistor, the upper bridge power device includes four, and the lower bridge power device includes four.

9. The power module of claim 4, wherein, The first gate terminal and the first source terminal are located in the middle part surrounded by the upper bridge power device; and the second gate terminal and the second source terminal are located in the middle part surrounded by the lower bridge power device.

10. The power module of claim 9, wherein, The upper bridge power device is located in a first base island, the drain of the upper bridge power device is electrically connected to the first base island, and the first base island is annular; the lower bridge power device is located in a second base island, the second base island is surrounded by the first base island; the drain of the lower bridge power device is electrically connected to the second base island, the source of the upper bridge power device is electrically connected to the second base island, and the source of the lower bridge power device is electrically connected to a third base island.

11. The power module of claim 10, wherein, The first gate terminal is located in a fourth base island, the first source terminal is located in the second base island, the second gate terminal is located in a sixth base island, and the second source terminal is located in the third base island.

12. The power module of claim 11, wherein, The power module is a plastic package.

13. The power module of claim 5, wherein, The power module is a potting package.

14. The power module of claim 1, wherein, The power module further includes an encapsulation body, the encapsulation body encapsulates the substrate, the power device on the substrate, the first end of the power terminal and the first end of the signal terminal, and the second end of the power terminal and the second end of the signal terminal are led out from the encapsulation body.

15. The power module of claim 14, wherein, The first end of the signal terminal is a base, the second end of the signal terminal is a connecting pin, the first end of the base is connected to the substrate, the second end of the base is connected to the first end of the connecting pin, and the second end of the connecting pin receives a driving signal of the power device.

16. The power module of claim 15, wherein, The base is a cylinder or a prism with a connecting hole in the middle, the connecting hole is a through hole or a blind hole, and the first end of the connecting pin is connected to the connecting hole of the base through insertion.

17. The power module of claim 16, wherein, The connecting hole is a blind hole, and the distance between the bottom of the connecting hole and the bottom surface outside the base is 0.5mm-4mm.

18. The power module of claim 17, wherein, The base is a solid cylinder or a prism, and the first end of the connecting pin is connected to the top of the base through welding.

19. The power module of claim 15, wherein, The encapsulation body includes a first encapsulation body and a second encapsulation body, the first encapsulation body encapsulates the base of the signal terminal, the base is connected to the connecting pin, and then the second encapsulation body is formed, the second encapsulation body is used to fill the gap between the base and the connecting pin and encapsulate the first end of the connecting pin.

20. The power module of claim 15, wherein, The connecting pin is a fish-eye needle, the top region of the fish-eye needle has a connecting part extending perpendicular to the axis direction of the fish-eye needle, and the fish-eye needle is connected to the circuit board outside the power module through crimping of the connecting part.

21. The power module of claim 15, wherein, The connecting pin is a straight pin, the first end of the straight pin is connected to the base through welding, and the second end of the straight pin is connected to the circuit board outside the power module through welding.

22. The power module of claim 15, wherein, The outer diameter of the base is 0.3mm-2.0mm, the height of the base is 2mm-7mm, and the hole diameter of the connecting hole of the base is 0.1mm-1.5mm.

23. The power module of claim 15, wherein, The outer diameter of the base is 1mm-5mm, and the height of the base is 2mm-7mm.

24. The power module of claim 14, wherein, The power module side edges include a power module first side edge and a power module second side edge disposed opposite each other, and the DC power terminals and the AC power terminals are led out from the power module first side edge and the power module second side edge respectively.

25. The power module of claim 24, wherein, A temperature sensor is also included, with a pin of the temperature sensor being proximate to the second side edge and perpendicular to the first surface of the substrate.

26. A power module, comprising: The power module includes at least three power modules as claimed in any one of claims 1-25, three power modules being used for a first phase drive circuit, a second phase drive circuit and a third phase drive circuit respectively, and the three power modules being on a same base plate.

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