Semiconductor sorting machine

Abstract

The utility model relates to the technical field of automation equipment, and discloses a semiconductor sorting machine which is characterized in that a full Tray feeding area, an empty Tray recycling area, a testing area and a sorting discharging area are divided on a workbench according to processing areas, and then the areas are regulated and controlled to be in linkage fit through manipulators. According to the chip testing and sorting device, the chip feeding, testing and discharging sorting process integration can be achieved, then mechanical and automatic operation of the whole process is achieved, the overall efficiency of chip production can be remarkably improved, the production process is optimized, manpower is saved, and new power is injected to sustainable development of the chip manufacturing industry.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, and in particular to a semiconductor sorting machine. Background Technology

[0002] In the chip manufacturing process before shipment, there is a necessary but tedious step: workers manually place each chip one by one into a specialized testing fixture for thorough electrical performance testing. After this step, workers must manually remove the tested chips and meticulously sort and classify them according to the test results. This entire process is highly dependent on manual labor and is extremely complex, resulting in a significant consumption of human resources. Furthermore, due to the limitations and efficiency bottlenecks of manual operation, overall production efficiency is relatively low.

[0003] Therefore, in order to effectively improve the efficiency of chip testing and sorting processes and reduce excessive reliance on human resources, there is an urgent need to develop an innovative testing device. This device should be able to integrate multiple processes such as chip loading, electrical testing, and unloading and sorting, achieving fully mechanized and automated operation. By introducing such high-tech testing equipment, it is expected to significantly improve the overall efficiency of chip production, optimize the production process, and thus inject new impetus into the sustainable development of the chip manufacturing industry.

[0004] The above information is provided as background information only to aid in understanding this disclosure and does not constitute an assertion or admission that any of the above content can be used as prior art relative to this disclosure. Utility Model Content

[0005] This invention provides a semiconductor sorting machine to solve the problems existing in the prior art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A semiconductor sorting machine includes a worktable, which is divided into a full tray loading area, an empty tray recovery area, a testing area, and a sorting and unloading area according to the processing area.

[0008] The full tray loading area is used to store several trays loaded with chips to be tested;

[0009] A chip transfer robot is provided between the full tray loading area and the testing area. The chip transfer robot is used to transfer the chip in the tray to the testing area.

[0010] The empty Tray recycling area is used to recycle the empty Tray after the chips have been transferred;

[0011] The test area is used to test the transferred chips;

[0012] A sorting robot is provided between the testing area and the sorting and unloading area. The sorting robot is used to transfer the tested chips to the sorting and unloading area.

[0013] The sorting and unloading area is used to store several empty trays, some of which are used to load chips that have passed the test and are considered good, while others are used to load chips that have failed the test.

[0014] Furthermore, in the semiconductor sorting machine, the full tray loading area includes a loading device and a gripping waiting device;

[0015] The feeding device is used to store a plurality of trays loaded with chips to be tested, and the plurality of trays are stacked; and to provide the trays to the gripping and waiting device;

[0016] The gripping and waiting device is used to store the tray provided by the feeding device and to position the tray by pushing it laterally, so as to wait for the chip transfer robot to transfer the chip in the tray to the test area.

[0017] Furthermore, in the semiconductor sorting machine, the feeding device includes a first conveying mechanism, a lifting mechanism, a storage slot, and a clamping mechanism;

[0018] The storage slot is used to store a plurality of stacked Tray disks;

[0019] The lifting mechanism is located at the bottom of the storage slot and is used to move up and down through the storage slot to lift or lower the tray inside the storage slot.

[0020] The clamping mechanism is located on both sides of the storage slot and is used to extend out when the lifting mechanism lifts the Tray disk in the storage slot to clamp the remaining Tray disks except for the bottommost Tray disk.

[0021] The lifting mechanism is also used to lower the bottommost tray and place it onto the first conveying mechanism when the clamping mechanism clamps the trays other than the bottommost tray.

[0022] The first conveying mechanism is used to convey the tray placed thereon to the grasping waiting device.

[0023] Furthermore, in the semiconductor sorting machine, the gripping and waiting device includes a second conveying mechanism, a side-pushing mechanism, and a blocking mechanism;

[0024] The second transmission mechanism is connected to the first transmission mechanism and is used to continue transmitting the Tray disk coming from the first transmission mechanism;

[0025] The side-pushing mechanism is located on one side of the second conveying mechanism and is used to push the tray laterally from the side of the tray to position the tray in the lateral direction, so as to wait for the chip transfer robot to transfer the chip in the tray to the test area.

[0026] The blocking mechanism is located at the end of the second conveying mechanism and is used to prevent the second conveying mechanism from continuing to convey the tray.

[0027] Furthermore, in the semiconductor sorting machine, the gripping and waiting device also includes a positioning gripper mechanism;

[0028] The positioning gripper mechanism is disposed on both sides of the second conveying mechanism and is used to hold the tray disk positioned in the lateral direction.

[0029] Furthermore, the semiconductor sorting machine also includes an empty tray transfer robot;

[0030] The empty Tray transfer robot can move within the full Tray loading area, the empty Tray recycling area, and the sorting and unloading area. It is used to transfer the empty Tray after the transferred chips are loaded from the full Tray loading area to the empty Tray recycling area for recycling and storage. It is also used to transfer the empty Tray after the transferred chips are loaded from the full Tray loading area to the sorting and unloading area to load the tested chips.

[0031] Furthermore, in the semiconductor sorting machine, the testing area includes a third conveying mechanism, a carrier, a test transfer robot, and a testing mechanism;

[0032] The carrier is mounted on the third conveying mechanism and has a placement position for placing the chip.

[0033] The third conveying mechanism is used to convey the carrier and the chip to be tested located therein to the testing mechanism, and to convey the carrier and the tested chip located therein to the sorting and unloading area;

[0034] The test transfer robot is positioned between the third conveying mechanism and the test mechanism, and is used to transfer the chip between the carrier and the test mechanism;

[0035] The testing apparatus is used to test the chip.

[0036] Furthermore, in the semiconductor sorting machine, there are two third conveying mechanisms;

[0037] The two third transmission mechanisms are arranged side by side on both sides of the test mechanism.

[0038] Furthermore, in the semiconductor sorting machine, the testing area also includes two first photoelectric sensing modules;

[0039] One of the first photoelectric sensing modules is arranged parallel to the third conveying mechanism and is directly facing the placement position in the horizontal direction. It can emit a sensing signal when there is no chip at the placement position or when the chip is placed crookedly.

[0040] Another of the first photoelectric sensing modules is arranged perpendicular to the third conveying mechanism and is directly facing the placement position in the vertical direction. It can emit a sensing signal when there is no chip at the placement position or when the chip is placed crookedly.

[0041] Furthermore, in the semiconductor sorting machine, the chip transfer robot includes a movable mechanism, a mounting frame, several pitch adjustment modules, and several suction heads;

[0042] The active mechanism is used to provide movement in multiple directions;

[0043] The mounting frame is disposed on the movable mechanism and is used to provide a mounting base for the plurality of pitch adjustment modules;

[0044] One of the suction heads is mounted on a pitch adjustment module and can move under the drive of the pitch adjustment module to adjust the distance between the suction heads.

[0045] Compared with the prior art, the present invention has the following beneficial effects:

[0046] This utility model provides a semiconductor sorting machine that divides the worktable into a full tray loading area, an empty tray recovery area, a testing area, and a sorting and unloading area according to the processing area. Then, it controls the linkage between each area through a robotic arm, so as to realize the integration of chip loading, testing, and unloading sorting processes, thereby achieving full-process mechanization and automation. This not only significantly improves the overall efficiency of chip production and optimizes the production process, but also saves manpower, injecting new impetus into the sustainable development of the chip manufacturing industry.

[0047] This invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and the following detailed description, which together serve to explain the particular principles of this invention. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a top view structural schematic diagram of a semiconductor sorting machine provided in an embodiment of the present invention;

[0050] Figure 2 This is one of the (three-dimensional) structural schematic diagrams of a semiconductor sorting machine provided in this embodiment of the present invention;

[0051] Figure 3 This is the second (three-dimensional) structural schematic diagram of a semiconductor sorting machine provided in this embodiment of the present invention;

[0052] Figure 4 This is a three-dimensional structural diagram of the Tray loading area provided in this embodiment of the utility model;

[0053] Figure 5 This is a three-dimensional structural diagram of the feeding device provided in this embodiment of the utility model;

[0054] Figure 6 This is a (partial) structural schematic diagram of the feeding device provided in an embodiment of the present utility model;

[0055] Figure 7 This is a (partial) structural schematic diagram of the feeding device provided in an embodiment of the present utility model;

[0056] Figure 8 This is one of the (three-dimensional) structural schematic diagrams of the grasping and waiting device provided in this embodiment of the utility model;

[0057] Figure 9 This is the second (three-dimensional) structural schematic diagram of the grasping waiting device provided in this embodiment of the utility model;

[0058] Figure 10This is one of the (three-dimensional) structural schematic diagrams of the full Tray loading area, empty Tray recycling area, sorting and unloading area and empty Tray transfer robot provided in this embodiment of the utility model;

[0059] Figure 11 This is the second (three-dimensional) structural schematic diagram of the full Tray loading area, empty Tray recycling area, sorting and unloading area and empty Tray transfer robot provided in this embodiment of the utility model;

[0060] Figure 12 This is a top view structural diagram of the full Tray loading area, empty Tray recycling area, sorting and unloading area, and empty Tray transfer robot provided in this embodiment of the utility model;

[0061] Figure 13 This is one of the (partial) structural schematic diagrams of the test area provided in this embodiment of the utility model;

[0062] Figure 14 This is the second (partial) structural schematic diagram of the test area provided in this embodiment of the utility model;

[0063] Figure 15 This is a schematic diagram of the structure of the two first photoelectric sensing modules provided in this embodiment of the utility model;

[0064] Figure 16 This is a three-dimensional structural diagram of the chip transfer robot provided in this embodiment of the present invention.

[0065] Figure label:

[0066] Workbench 1, Full Tray Loading Area 2, Empty Tray Recycling Area 3, Testing Area 4, Sorting and Unloading Area 5, Chip Transfer Robot 6, Sorting Robot 7, Tray Tray 8, Empty Tray Transfer Robot 9, First Photoelectric Sensing Module 10;

[0067] Feeding device 201, gripping and waiting device 202;

[0068] First conveying mechanism 2011, lifting mechanism 2012, storage slot 2013, clamping mechanism 2014, second photoelectric sensing module 2015;

[0069] Second conveying mechanism 2021, side pushing mechanism 2022, blocking mechanism 2023, positioning claw mechanism 2024;

[0070] The third conveying mechanism 401, the carrier 402, the test transfer robot 403, the test mechanism 404, and the placement position 405;

[0071] The active mechanism 601, the mounting frame 602, several pitch adjustment modules 603, and several suction heads 604. Detailed Implementation

[0072] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0073] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0074] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0075] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0076] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0077] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0078] In this application, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.

[0079] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0080] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0081] In view of the deficiencies of the existing technology, the applicant, based on years of practical experience and professional knowledge in the design and manufacturing of this field, and in conjunction with the application of theoretical principles, has actively conducted research and innovation in order to create a technology that can solve the deficiencies of the existing technology. After continuous research, design, and repeated prototype production and improvement, this utility model with practical value has finally been created.

[0082] Please refer to Figure 1-3 This utility model provides a semiconductor sorting machine with an ingenious design and comprehensive functions, offering an efficient and automated solution for chip testing and sorting. The sorting machine mainly consists of a workbench 1, which is carefully divided into four main areas according to the processing flow and functional requirements: a full tray loading area 2, an empty tray recovery area 3, a testing area 4, and a sorting and unloading area 5.

[0083] The full tray loading area 2 is the starting point of the chip testing process. It is specifically used to store trays 8 that are already loaded with chips to be tested. These trays 8 are pre-loaded with chips to be tested before being sent to the sorter, ready to enter the next stage of testing.

[0084] Between the full tray loading area 2 and the testing area 4, a chip transfer robot 6 is installed. This robot 6 plays a crucial role, responsible for accurately transferring the chips from the trays 8 in the full tray loading area 2 to the testing area 4, preparing them for subsequent testing.

[0085] The empty Tray recycling area 3 is located to one side of the full Tray loading area 2. Its main function is to recycle the empty Trays 8 that have been transferred out of the chips. Timely recycling and processing can ensure the cleanliness and orderliness of the workbench and improve overall work efficiency.

[0086] Test Area 4 is the core area for chip testing. Equipped with advanced testing equipment and technology, it can perform comprehensive electrical performance testing on the transferred chips. Here, each chip undergoes rigorous inspection to ensure its quality and performance meet established standards.

[0087] Between testing area 4 and sorting / unloading area 5, a sorting robot 7 is installed. The task of this sorting robot 7 is to sort the tested chips according to the test results and transfer them to sorting / unloading area 5. This step is a crucial part of the chip testing process, determining the final destination and fate of the chips.

[0088] The sorting and unloading area 5 is used to store several empty trays 8. These empty trays 8 will be divided into two categories according to the test results: one category is used to load chips that have passed the test, and the other category is used to load chips that have failed the test. This classified storage facilitates further processing and manufacturing of the chips.

[0089] This embodiment successfully integrates, mechanizes, and automates the chip loading, testing, and sorting processes by dividing the workbench into a full tray loading area 2, an empty tray recovery area 3, a testing area 4, and a sorting and unloading area 5. Furthermore, it coordinates these areas closely and efficiently using robotic arms. This innovative design not only significantly improves the overall efficiency of chip production, optimizes the production process, and reduces waste and delays, but also saves substantial labor costs, reduces worker workload and stress. Moreover, it injects new momentum and vitality into the sustainable development of the chip manufacturing industry, driving the progress and development of the entire sector.

[0090] Please refer to this again. Figure 1-3 and in conjunction with references Figure 4 In one embodiment of this example, the full tray loading area 2 includes a loading device 201 and a gripping and waiting device 202; these two parts work together to achieve efficient and automated operation of the chip loading process.

[0091] The loading device 201 is one of the core components of the full tray loading area 2, and it undertakes the important task of storing and providing trays 8 loaded with chips to be tested. Specifically, the loading device 201 is designed to accommodate multiple stacked trays 8. This design greatly improves loading efficiency, reduces the frequency of manual tray replenishment, and makes the entire loading process more continuous and smooth. When a tray 8 needs to be provided to the gripping waiting device 202, the loading device 201 can quickly and accurately deliver the bottom tray 8, preparing for subsequent chip transfer.

[0092] The gripping waiting device 202 is another key component of the full tray loading area 2. It follows immediately after the loading device 201 and is used to store the trays 8 provided by the loading device 201. The gripping waiting device 202 not only stores the trays 8 but also provides lateral positioning for them. This function is designed to ensure the stability and accuracy of the trays 8 during the gripping waiting process, so that the chip transfer robot 6 can accurately and without error grasp the chips in the trays 8. Through the precise positioning of the gripping waiting device 202, the success rate of the chip transfer robot 6 is significantly improved, thereby further enhancing the efficiency and stability of the entire chip testing process.

[0093] In summary, the full tray loading area 2 in this embodiment achieves efficient and automated chip loading through the ingenious design of the loading device 201 and the gripping and waiting device 202. The loading device 201 can accommodate multiple stacked trays 8, improving loading efficiency; while the gripping and waiting device 202 ensures accurate gripping of the chip transfer robot 6 by precisely positioning the trays 8. The coordinated work of these two parts not only improves the efficiency and stability of the entire chip testing process but also increases the success rate of transfer.

[0094] Please refer to this again. Figure 4 and in conjunction with references Figure 5-6In one specific embodiment of this invention, the feeding device 201 is carefully designed to include four main components: a first conveying mechanism 2011, a lifting mechanism 2012, a storage slot 2013, and a clamping mechanism 2014. These four parts work together to achieve automatic separation and conveying of the Tray 8, significantly improving feeding efficiency and stability.

[0095] The storage slot 2013 is a basic component of the feeding device 201, used to store several stacked trays 8. The size of the storage slot 2013 matches the size of the trays 8, ensuring that it can stably accommodate multiple stacked trays 8 and prevent them from shaking or slipping during storage.

[0096] The lifting mechanism 2012, located at the bottom of the storage slot 2013, is a key component for the automatic separation of the tray 8. The lifting mechanism 2012 can move up and down through the storage slot 2013 to lift or lower the tray 8 within it. Specifically, the lifting mechanism 2012 can be a cylinder- or motor-driven lifting platform, capable of precisely controlling the lifting height to ensure the tray 8 remains stable during lifting or lowering.

[0097] The clamping mechanism 2014 is located on both sides of the storage slot 2013. It extends when the lifting mechanism 2012 lifts the tray 8 into the storage slot 2013 to clamp the trays 8 except for the bottom tray 8. The clamping mechanism 2014 can be a pneumatic gripper with adjustable clamping force, which can firmly clamp the trays 8 and prevent them from slipping or tilting during the lifting process.

[0098] While the clamping mechanism 2014 clamps all the trays 8 except the bottom one, the lifting mechanism 2012 continues to lower the bottom tray 8, separating it from the stacked trays 8 and placing it on the first conveying mechanism 2011. This cooperative working method ensures the smooth separation of the trays 8, avoiding collisions or damage during the separation process.

[0099] The first conveying mechanism 2011 is responsible for conveying the tray 8 placed on it to the grasping waiting device 202. The first conveying mechanism 2011 can adopt a belt conveyor structure, and its conveying speed is adjustable, which can smoothly convey the tray 8 to the designated position.

[0100] In summary, the feeding device 201 in this embodiment, through the ingenious design of the storage slot 2013, lifting mechanism 2012, clamping mechanism 2014, and first conveying mechanism 2011, achieves automatic separation and conveying of the Tray disk 8. This structural design not only improves feeding efficiency and stability but also provides reliable assurance for subsequent chip testing processes.

[0101] Please refer to this again. Figure 5 and in conjunction with references Figure 7 In one specific embodiment of this example, the feeding device 201 cleverly incorporates a second photoelectric sensing module 2015 on the basis of its original structure. This addition greatly enhances the intelligence and automation level of the device.

[0102] The second photoelectric sensing module 2015 is carefully positioned at the top of the storage slot 2013, and its location ensures accurate and reliable sensing of the stacking height of the trays 8 within the storage slot 2013. Photoelectric sensing technology, with its high sensitivity and non-contact measurement capabilities, plays a crucial role in this application.

[0103] Specifically, the second photoelectric sensing module 2015 monitors the stacking status of the trays 8 in the storage slot 2013 in real time by emitting and receiving light signals. When the stacking height of the trays 8 changes, such as when a tray 8 is added or removed, the photoelectric sensing module can quickly detect this change and transmit the signal to the control system.

[0104] Based on the received signals, the control system can adjust the working status of the lifting mechanism 2012 in real time to ensure that the lifting height matches the current stacking height of the trays 8. This not only avoids collisions or damage to the trays 8 that may be caused by improper lifting height, but also improves the stability and reliability of the entire loading process.

[0105] In summary, the feeding device 201 in this embodiment, by incorporating a second photoelectric sensing module 2015, achieves real-time monitoring and intelligent adjustment of the stacking height of the Tray disks 8.

[0106] Please refer to this again. Figure 4 and in conjunction with references Figure 8-9 In one embodiment of this invention, the grasping waiting device 202 is carefully designed to include three main components: a second conveying mechanism 2021, a side-pushing mechanism 2022, and a blocking mechanism 2023. These three parts work together to achieve precise positioning of the Tray 8, providing a stable and reliable foundation for the grasping operation of the chip transfer robot 6.

[0107] The second conveying mechanism 2021 is the starting part of the gripping and waiting device 202, and is connected to the first conveying mechanism 2011 to continue conveying the tray 8 from the first conveying mechanism 2011. To ensure the smoothness of the tray 8 during the conveying process, the second conveying mechanism 2021 can adopt the same conveying structure as the first conveying mechanism 2011, such as a belt conveyor structure. This design not only ensures the smooth conveying of the tray 8, but also simplifies the maintenance and operation of the equipment.

[0108] The side-pushing mechanism 2022, located on one side of the second conveying mechanism 2021, is a key component for achieving precise positioning of the tray 8. The side-pushing mechanism 2022 is used to push the tray 8 laterally from its side to position it in the lateral direction. Specifically, the side-pushing mechanism 2022 can employ a cylinder-driven pusher plate. By precisely controlling the stroke and thrust of the cylinder, the tray 8 can be pushed to a precise position. This design ensures that the chip transfer robot 6 can accurately align the chip in the tray 8 when grasping the chip, improving the success rate and stability of the grasping process.

[0109] A blocking mechanism 2023 is located at the end of the second conveying mechanism 2021 to prevent the second conveying mechanism 2021 from continuing to convey the tray 8. In this embodiment, the blocking mechanism 2023 can be designed as a baffle that is always raised to ensure that the tray 8 can stay stably after reaching the designated position. Of course, depending on actual needs, the blocking mechanism 2023 can also adopt a cylinder-driven baffle design so that it can be raised to block the tray 8 when needed and lowered to allow the tray 8 to pass when not needed. This flexible design meets the needs of different production scenarios.

[0110] In summary, the grasping and waiting device 202 in this embodiment achieves precise positioning and stable dwell of the Tray 8 through the ingenious design of the second conveying mechanism 2021, the side pushing mechanism 2022, and the blocking mechanism 2023. This structural design not only provides a reliable foundation for the grasping operation of the chip transfer robot 6, but also improves the efficiency and stability of the entire chip testing process.

[0111] Please refer to this again. Figure 8-9 In one specific embodiment of this example, the gripping waiting device 202 adds a positioning gripper mechanism 2024 to the original structure. This addition greatly improves the stability and accuracy of the Tray disk 8 in the positioning process.

[0112] The positioning gripper mechanism 2024 is carefully positioned on both sides of the second conveying mechanism 2021, and its position selection ensures accurate and effective gripping of the Tray disk 8, which is positioned in the lateral direction. Cylinder drive technology, with its fast response speed and high control precision, plays an important role in this application.

[0113] Specifically, the positioning gripper mechanism 2024 can adopt a cylinder-driven gripper design. When the tray 8 is pushed to the lateral positioning position by the side-pushing mechanism 2022, the cylinder of the positioning gripper mechanism 2024 is activated, driving the grippers to press down simultaneously or sequentially from both sides of the tray 8, firmly pressing it onto the second conveying mechanism 2021. This holding method not only improves the stability of the tray 8 during the positioning process but also further ensures the accuracy of its position.

[0114] By adding a positioning gripper mechanism 2024, the gripping waiting device 202 in this embodiment achieves a more secure positioning of the tray 8. This design ensures that the tray 8 remains absolutely stable when the chip transfer robot 6 grips the chip, and will not undergo slight displacement due to external factors (such as airflow, vibration, etc.), thereby improving the success rate and accuracy of gripping.

[0115] In summary, the gripping waiting device 202 in this embodiment achieves more secure and precise positioning of the Tray disk 8 by adding a positioning gripper mechanism 2024.

[0116] Please refer to Figure 10-12 In one specific embodiment of this invention, the semiconductor sorting machine innovatively introduces an empty tray transfer robot 9 based on its original structure. This new component greatly improves the automation level and production efficiency of the semiconductor sorting machine, realizing the automatic transfer and reuse of empty trays 8.

[0117] The empty tray transfer robot 9 is designed to move freely within the full tray loading area 2, the empty tray recovery area 3, and the sorting and unloading area 5. Its multi-axis robot structure gives it the ability to move flexibly in three-dimensional space, enabling it to accurately grasp and place trays 8.

[0118] Specifically, after completing its task in the full Tray loading area 2, the empty Tray transfer robot 9 will pick up the empty Tray disks 8 after the chips have been transferred and accurately transfer them to the empty Tray recycling area 3. In the empty Tray recycling area 3, these empty Tray disks 8 will be recycled and stored for later reuse.

[0119] Meanwhile, the empty tray transfer robot 9 also has the function of transferring empty trays 8 from the full tray loading area 2 to the sorting and unloading area 5. In the sorting and unloading area 5, these empty trays 8 will be used to load the tested chips, thereby realizing the chip sorting and unloading process.

[0120] It is worth noting that the multi-axis robotic arm structure of the empty tray transfer robot 9 is key to its ability to flexibly and accurately complete the aforementioned tasks. This structure not only ensures the stability and accuracy of the tray 8 during the transfer process, but also improves the automation level and production efficiency of the entire semiconductor sorting machine.

[0121] By incorporating an empty tray transfer robot 9, the semiconductor sorting machine in this embodiment achieves automatic transfer and reuse of empty trays 8, reducing manual intervention and improving production efficiency and automation levels. This innovative design not only meets the semiconductor industry's demand for efficient and automated production but also provides new ideas and directions for the future development of semiconductor sorting machines.

[0122] Please refer to Figure 3 and in conjunction with references Figure 13-14 In one specific embodiment of this invention, the test area 4 is carefully designed to include four main components: a third transfer mechanism 401, a carrier 402, a test transfer robot 403, and a test mechanism 404. These four parts work together to achieve automatic chip transfer, testing, and result recording, greatly improving the efficiency and accuracy of the test.

[0123] The carrier 402 is a key component in test area 4. It is mounted on the third conveyor mechanism 401 and has placement positions 405 for placing chips. To meet the requirements of the high-temperature testing environment, the carrier 402 can be made of high-temperature resistant materials to ensure that it will not deform or be damaged due to high temperatures during use. At the same time, the surface of the carrier 402 has multiple precisely machined placement positions 405. These placement positions 405 are carefully designed to stably place the chip to be tested, ensuring the accuracy and stability of the chip's position during the testing process.

[0124] The third conveying mechanism 401 is responsible for conveying the carrier 402 and the chip to be tested located within it to the testing mechanism 404, and for conveying the tested chip and carrier 402 to the sorting and unloading area 5. To achieve smooth and precise conveying, the third conveying mechanism 401 can employ a precision conveyor belt structure. This structure not only ensures the stability of the carrier 402 during conveying but also allows for flexible adjustment of the conveying speed and direction according to the requirements of the testing process.

[0125] The test transfer robot 403 is positioned between the third conveying mechanism 401 and the testing mechanism 404, playing a crucial role in transferring the chip between the carrier 402 and the testing mechanism 404. To ensure the safety and accuracy of the chip during the transfer process, the test transfer robot 403 can employ a precision robot structure. This structure can accurately grasp and place the chip, avoiding damage or positional displacement during the transfer process.

[0126] Test assembly 404 is the core component of test area 4, responsible for performing various performance tests on the chip. Test assembly 404 may include components such as test sockets, test probes, and test circuitry. The test sockets are used to hold the chip in place, ensuring its stability during testing; the test probes contact the chip's pins to transmit test signals; and the test circuitry is responsible for receiving and processing the test signals and recording the test results. Through the coordinated work of these components, test assembly 404 can comprehensively and accurately evaluate the chip's performance, providing reliable data support for subsequent chip sorting and packaging.

[0127] In summary, the test area 4 in this embodiment, through the ingenious design of the third transfer mechanism 401, the carrier 402, the test transfer robot 403, and the test mechanism 404, achieves automatic chip transfer, testing, and result recording. This structural design not only improves the efficiency and accuracy of testing but also provides strong support for automated production in the semiconductor industry.

[0128] Please refer to this again. Figure 13-14 In one specific embodiment of this invention, the test area 4 is further optimized, wherein the number of third transmission mechanisms 401 is increased to two. These two third transmission mechanisms 401 are arranged side by side on both sides of the test mechanism 404, forming a highly efficient and parallel chip test processing system.

[0129] It should be noted that these two third transmission mechanisms 401 are identical in structure and function, both possessing the ability to smoothly and accurately transmit the carrier 402 and the chip. By being arranged in parallel, these two third transmission mechanisms 401 can operate simultaneously without interfering with each other, thereby greatly improving the overall working efficiency of the test area 4.

[0130] By setting up two parallel third transfer mechanisms 401, the test area 4 in this embodiment achieves parallel processing of chip testing. Specifically, while a chip on one third transfer mechanism 401 is being tested in the test mechanism 404, the other third transfer mechanism 401 can simultaneously perform chip loading or unloading operations. This parallel processing method not only reduces the idle time of the test mechanism 404, but also improves the continuity and smoothness of the entire testing process.

[0131] Furthermore, this parallel arrangement of the third transmission mechanism 401 facilitates future expansion of the test area 4. If further improvements in testing efficiency are required, this can be achieved by adding more third transmission mechanisms 401 and test mechanisms 404, thereby forming a larger and more efficient chip testing system.

[0132] In summary, the test area 4 in this embodiment achieves parallel processing of chip testing by setting up two parallel third transmission mechanisms 401, further improving testing efficiency. This design not only meets the semiconductor industry's demand for efficient and automated testing, but also provides ample room for future expansion and upgrades of the test area 4.

[0133] Please refer to this again. Figure 13-14 and in conjunction with references Figure 15 In one specific embodiment of this invention, the design of the test area 4 has been further improved by adding two first photoelectric sensing modules 10. These two first photoelectric sensing modules 10 are cleverly arranged within the test area 4 to achieve comprehensive and accurate monitoring of the chip placement status.

[0134] One of the first photoelectric sensing modules 10 is positioned parallel to the third conveying mechanism 401. Horizontally, it faces the placement position 405 on the carrier 402. The main function of this first photoelectric sensing module 10 is to detect whether a chip is present in the placement position 405 and whether the chip is placed correctly and without misalignment. When the placement position 405 is empty or the chip is improperly placed, the first photoelectric sensing module 10 will immediately emit a sensing signal to indicate that there is an abnormality in the system.

[0135] Another first photoelectric sensing module 10 is positioned perpendicular to the third conveying mechanism 401. Vertically, it also faces the placement position 405. This first photoelectric sensing module 10 monitors the chip's placement status from another angle. It can not only detect the presence of the chip but also further confirm whether the chip is securely placed in the placement position 405 without tilting or falling out. Similarly, when an abnormality is detected, this first photoelectric sensing module 10 will promptly emit a sensing signal.

[0136] By setting up two first photoelectric sensing modules 10 in different directions, the test area 4 in this embodiment achieves comprehensive, three-dimensional monitoring of the chip placement status. This design ensures the accuracy and reliability of the testing process and effectively avoids test failures or equipment damage caused by improper chip placement.

[0137] When the first photoelectric sensing module 10 detects an abnormality, the system immediately receives an alarm signal and can take corresponding corrective measures. For example, the system can pause the testing process, prompting the operator to check and adjust the chip placement; or, the system can automatically adjust the position of the conveyor mechanism to correct chip placement deviations. These measures collectively ensure the smooth progress of the testing process and improve testing efficiency and accuracy.

[0138] In summary, the test area 4 in this embodiment achieves comprehensive monitoring of the chip placement status by adding two first photoelectric sensing modules 10 in different directions.

[0139] Please refer to Figure 16 In one specific embodiment of this invention, the chip transfer robot 6 is meticulously designed to include four main components: a moving mechanism 601, a mounting frame 602, several pitch adjustment modules 603, and several suction heads 604. These four parts work together to achieve flexible transfer and precise placement of the chip in three-dimensional space.

[0140] The moving mechanism 601 is the core power source of the chip transfer robot 6, responsible for providing multi-directional movement capabilities. To achieve this function, the moving mechanism 601 can adopt a multi-axis mechanical structure. This structure not only allows for flexible movement in three-dimensional space but also ensures the accuracy and stability of the chip during the transfer process. By precisely controlling the movement trajectory and speed of the moving mechanism 601, the chip transfer robot 6 can accurately grasp and place chips, meeting various complex production needs.

[0141] The mounting frame 602 is mounted on the movable mechanism 601, providing a solid mounting base for several pitch adjustment modules 603. To ensure the lightweight and stability of the mounting frame 602, it can be made of lightweight materials while maintaining sufficient rigidity. In this way, the mounting frame 602 can reduce the weight of the entire chip transfer robot 6, while ensuring the secure mounting and stable operation of the pitch adjustment modules 603 and the suction head 604.

[0142] The variable-pitch adjustment module 603 is a key component of the chip transfer robot 6. It is responsible for driving the suction heads 604 to move and adjust the distance between them. To achieve this function, the variable-pitch adjustment module 603 can employ a precision slide rail and drive motor structure. This structure not only precisely controls the position of the suction heads 604 but also ensures the smoothness and accuracy of their movement. By adjusting the distance between the suction heads 604, the chip transfer robot 6 can accommodate chips of different sizes, improving the adaptability and flexibility of the equipment.

[0143] The suction head 604 is the component of the chip transfer robot 6 that directly contacts the chip, responsible for safely gripping and placing the chip. To achieve this function, the suction head 604 can employ a vacuum suction structure. This structure generates sufficient suction force to ensure that the chip does not detach or become damaged during the transfer process. Simultaneously, the design of the suction head 604 also considers the contact method and force with the chip surface to ensure that the chip is not damaged during gripping and placement.

[0144] In summary, the chip transfer robot 6 in this embodiment, through the ingenious design of the movable mechanism 601, mounting frame 602, variable pitch adjustment module 603, and suction head 604, achieves flexible transfer and precise placement of chips in three-dimensional space. This design improves the efficiency and accuracy of chip transfer.

[0145] It should be noted that other robotic arms can also adopt the same structural design. Furthermore, in practical applications, this structural design can be appropriately modified and optimized according to specific needs and scenarios to meet the automated production requirements of different fields.

[0146] Although this application uses terms such as "workbench" and "robotic arm" frequently, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this utility model; interpreting them as any additional limitation would contradict the spirit of this utility model.

[0147] This utility model provides a semiconductor sorting machine that divides the worktable into a full tray loading area, an empty tray recovery area, a testing area, and a sorting and unloading area according to the processing area. Then, it controls the linkage between each area through a robotic arm, so as to realize the integration of chip loading, testing, and unloading sorting processes, thereby achieving full-process mechanization and automation. This not only significantly improves the overall efficiency of chip production and optimizes the production process, but also saves manpower, injecting new impetus into the sustainable development of the chip manufacturing industry.

[0148] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A semiconductor sorting machine, characterized in that, The workbench (1) is divided into a full Tray loading area (2), an empty Tray recycling area (3), a testing area (4), and a sorting and unloading area (5) according to the processing area. The full Tray loading area (2) is used to store several Tray disks (8) loaded with chips to be tested. A chip transfer robot (6) is provided between the full tray loading area (2) and the test area (4). The chip transfer robot (6) is used to transfer the chip in the tray (8) to the test area (4). The empty Tray recycling area (3) is used to recycle the empty Tray disk (8) after the transferred chip is removed; The test area (4) is used to test the transferred chip; A sorting robot (7) is provided between the test area (4) and the sorting and unloading area (5). The sorting robot (7) is used to transfer the tested chips to the sorting and unloading area (5). The sorting and unloading area (5) is used to store several empty trays (8), some of which are empty trays (8) for loading chips that have passed the test and are of good quality, and the other part of the empty trays (8) for loading chips that have failed the test.

2. The semiconductor sorting machine according to claim 1, characterized in that, The full tray loading area (2) includes a loading device (201) and a gripping and waiting device (202). The loading device (201) is used to store a plurality of trays (8) loaded with chips to be tested, the plurality of trays (8) being stacked; and to provide the trays (8) to the gripping waiting device (202). The gripping waiting device (202) is used to store the tray (8) provided by the feeding device (201) and to perform side-push positioning on the tray (8) to wait for the chip transfer robot (6) to transfer the chip in the tray (8) to the test area (4).

3. The semiconductor sorting machine according to claim 2, characterized in that, The feeding device (201) includes a first conveying mechanism (2011), a lifting mechanism (2012), a storage tank (2013), and a clamping mechanism (2014). The storage slot (2013) is used to store several stacked Tray disks (8); The lifting mechanism (2012) is located at the bottom of the storage slot (2013) and is used to move up and down through the storage slot (2013) to lift or lower the tray (8) in the storage slot (2013); The clamping mechanism (2014) is located on both sides of the storage slot (2013) and is used to extend out when the lifting mechanism (2012) lifts the Tray disk (8) in the storage slot (2013) to clamp the remaining Tray disks (8) except for the bottommost Tray disk (8); The lifting mechanism (2012) is also used to lower the bottom Tray disk (8) to place it onto the first conveying mechanism (2011) when the clamping mechanism (2014) clamps the remaining Tray disks (8) except for the bottommost Tray disk (8). The first conveying mechanism (2011) is used to convey the Tray (8) placed thereon to the grab waiting device (202).

4. The semiconductor sorting machine according to claim 3, characterized in that, The grabbing waiting device (202) includes a second conveying mechanism (2021), a side pushing mechanism (2022), and a blocking mechanism (2023). The second transmission mechanism (2021) is connected to the first transmission mechanism (2011) and is used to continue transmitting the Tray disk (8) from the first transmission mechanism (2011). The side-pushing mechanism (2022) is located on one side of the second conveying mechanism (2021) and is used to push the Tray (8) laterally from the side of the Tray (8) to position the Tray (8) in the lateral direction so as to wait for the chip transfer robot (6) to transfer the chip in the Tray (8) to the test area (4). The blocking mechanism (2023) is located at the end of the second transmission mechanism (2021) and is used to block the second transmission mechanism (2021) from continuing to transmit the Tray disk (8).

5. The semiconductor sorting machine according to claim 4, characterized in that, The grasping waiting device (202) also includes a positioning pressure claw mechanism (2024). The positioning gripper mechanism (2024) is disposed on both sides of the second conveying mechanism (2021) and is used to press the Tray disk (8) positioned in the lateral direction.

6. The semiconductor sorting machine according to claim 1, characterized in that, It also includes an empty Tray transfer robot (9); The empty Tray transfer robot (9) can move within the full Tray loading area (2), the empty Tray recycling area (3), and the sorting and unloading area (5) to transfer the empty Tray disk (8) after the transferred chip from the full Tray loading area (2) to the empty Tray recycling area (3) for recycling and storage; and to transfer the empty Tray disk (8) after the transferred chip from the full Tray loading area (2) to the sorting and unloading area (5) to load the tested chip.

7. The semiconductor sorting machine according to claim 1, characterized in that, The test area (4) includes a third conveying mechanism (401), a carrier (402), a test transfer robot (403), and a test mechanism (404). The carrier (402) is mounted on the third transmission mechanism (401) and has a placement position (405) for placing the chip. The third conveying mechanism (401) is used to convey the carrier (402) and the chip to be tested located therein to the testing mechanism (404), and to convey the carrier (402) and the tested chip located therein to the sorting and unloading area (5). The test transfer robot (403) is disposed between the third transfer mechanism (401) and the test mechanism (404) for transferring chips between the carrier (402) and the test mechanism (404); The test mechanism (404) is used to test the chip.

8. The semiconductor sorting machine according to claim 7, characterized in that, There are two of the third transmission mechanisms (401); The two third transmission mechanisms (401) are arranged side by side on both sides of the test mechanism (404).

9. The semiconductor sorting machine according to claim 7, characterized in that, The test area (4) also includes two first photoelectric sensing modules (10); One of the first photoelectric sensing modules (10) is arranged parallel to the third transmission mechanism (401), and is directly opposite the placement position (405) in the horizontal direction. It can emit a sensing signal when there is no chip on the placement position (405) or the chip is placed crookedly. Another first photoelectric sensing module (10) is arranged perpendicular to the third transmission mechanism (401) and is directly opposite the placement position (405) in the vertical direction. It can emit a sensing signal when there is no chip on the placement position (405) or the chip is placed crookedly.

10. The semiconductor sorting machine according to claim 1, characterized in that, The chip transfer robot (6) includes a moving mechanism (601), a mounting frame (602), several pitch adjustment modules (603), and several suction heads (604). The active mechanism (601) is used to provide movement in multiple directions; The mounting frame (602) is disposed on the movable mechanism (601) and is used to provide a mounting base for the plurality of the pitch adjustment modules (603); One of the suction heads (604) is disposed on a pitch adjustment module (603) and can be moved under the drive of the pitch adjustment module (603) to adjust the distance between the suction heads (604).

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