Single-side polishing device for quartz substrate

Abstract

The utility model provides a quartz substrate single-face polishing device, and belongs to the technical field of quartz substrate machining. According to the quartz substrate single-face polishing device, a space ring hole is formed in a wandering star wheel body; the space ring body is arranged in the space ring hole, and a hollow area suitable for placing the quartz substrate is formed on the space ring body; the polishing disc is attached to the polished surface of the quartz substrate; the pressure plate is arranged on the non-polished side of the quartz substrate and embedded in the hollow area; the adsorption pad is arranged between the quartz substrate and the pressure plate, the adsorption pad abuts against the non-polished surface of the quartz substrate, and the pressure plate is suitable for applying pressure to the adsorption pad. According to the quartz substrate single-face polishing device, local pressurization type polishing can be conducted on a specific area on the polished face of the quartz substrate, surface defects are remarkably reduced, and polishing consistency is improved.

Description

Technical Field

[0001] This application belongs to the field of quartz substrate processing technology, specifically relating to a single-sided polishing device for quartz substrates. Background Technology

[0002] In recent years, the rapid development of the semiconductor industry has driven the continuous growth of demand and output of domestic semiconductor components. As an important material for semiconductor substrates, high-precision quartz substrates are facing increasingly stringent requirements in terms of technical indicators.

[0003] In the traditional quartz substrate polishing process, a polishing pad is used to polish the surface of the quartz substrate. However, due to various factors such as uneven pressure between the polishing pad and the polishing surface and the flatness of the contact surface, the polishing degree of the same polishing surface is inconsistent, resulting in more surface defects. It is necessary to perform secondary polishing on specific areas of the polishing surface. However, if processing continues, it is very likely that the polished areas that have already met the standards will be over-grinded or over-polished, thus creating new surface defects. Utility Model Content

[0004] In order to solve at least one of the technical problems existing in the background art, this application provides a single-sided polishing device for quartz substrates, which can perform local pressure polishing on specific areas of the polishing surface of quartz substrates, significantly reducing surface defects and improving polishing consistency.

[0005] The technical solution adopted in this application is as follows:

[0006] This application provides a single-sided polishing apparatus for a quartz substrate, comprising:

[0007] The planetary wheel body has spacer holes formed on it;

[0008] A spacer body is disposed in the spacer hole, and a hollow area suitable for placing a quartz substrate is formed on the spacer body;

[0009] A polishing disc is attached to the polishing surface of the quartz substrate;

[0010] A pressure plate is disposed on the non-polished side of the quartz substrate and embedded in the hollow area;

[0011] An adsorption pad is disposed between the quartz substrate and the pressure plate, the adsorption pad abutting against the unpolished surface of the quartz substrate, and the pressure plate is adapted to apply pressure to the adsorption pad.

[0012] According to the single-sided polishing apparatus for quartz substrates provided in this application embodiment, the planetary wheel body is the basic structure of the entire apparatus, on which multiple spacer holes are formed. These spacer holes are used to fix and position the spacer body. Through the precisely designed spacer holes, it is ensured that the spacer body can be stably installed on the planetary wheel body, thereby providing a stable support platform for the quartz substrate. The hollow area is designed to embed the quartz substrate so that the polishing disc can contact the polishing surface. The polishing disc, through close contact with the polishing surface, uses mechanical friction to remove the uneven parts of the surface, achieving the polishing effect. During the grinding and polishing process, the planetary wheel body revolves and rotates. Simultaneously, the quartz substrate within the spacer also revolves and rotates within the planetary wheel body. A pressure plate applies pressure to the adsorption pad against the non-polished surface of the quartz substrate, causing a localized force to be applied to the area on the quartz substrate where the adsorption pad is attached. This localized force during grinding and polishing increases the adhesion between the corresponding area on the polished surface of the quartz substrate and the polishing disc, as well as the polishing pressure. This increases the amount of material removed from the corresponding area without affecting other parts of the polished surface, thus significantly improving the surface properties of the product. In summary, the single-sided polishing apparatus for quartz substrates provided in this application can perform localized pressure polishing on specific areas of the polished surface of a quartz substrate, significantly reducing surface defects and improving polishing consistency.

[0013] According to one embodiment of this application, the contact area between the adsorption pad and the quartz substrate is smaller than the area of ​​the unpolished surface.

[0014] According to one embodiment of this application, the adsorption pad is distributed at the corner of the unpolished surface of the quartz substrate, or the adsorption pad is distributed on the outer periphery of the unpolished surface of the quartz substrate, or the adsorption pad is distributed in the central area of ​​the unpolished surface of the quartz substrate.

[0015] According to one embodiment of this application, the sum of the thicknesses of the pressure plate, the adsorption pad, and the quartz substrate is greater than the thickness of the spacer body.

[0016] According to one embodiment of this application, the difference between the sum of the thicknesses of the pressure plate, the adsorption pad, and the quartz substrate and the thickness of the spacer body ranges from 2 mm to 5 mm.

[0017] According to one embodiment of this application, at least two spacer holes are formed on the planetary wheel body;

[0018] The planetary wheel body also has leakage holes.

[0019] According to one embodiment of this application, the pressure plate and the edge of the hollowed-out area have an interference fit structure.

[0020] According to one embodiment of this application, the edge of the adsorption pad has a chamfered structure.

[0021] According to one embodiment of this application, the adsorption pad and the pressure plate are integrally formed.

[0022] According to one embodiment of this application, the adsorption pad is coated with an anti-scratch coating on the side that abuts against the unpolished surface of the quartz substrate. Attached Figure Description

[0023] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0024] Figure 1 A schematic diagram of the structure of the single-sided polishing apparatus for a quartz substrate provided in an embodiment of this application;

[0025] Figure 2 This is a schematic diagram of the structure of the planetary wheel body provided in an embodiment of this application;

[0026] Figure 3 for Figure 2 The diagram shows the AA-cut structure of the planetary wheel body;

[0027] Figure 4 A schematic diagram of the mating structure of the quartz substrate, adsorption pad, and pressure plate provided in the embodiments of this application;

[0028] Figure 5 A schematic diagram of the structure of the adsorption pad on the pressure plate provided in the embodiments of this application. Figure 1 ;

[0029] Figure 6 A schematic diagram of the structure of the adsorption pad on the pressure plate provided in the embodiments of this application. Figure 2 ;

[0030] Figure 7 A schematic diagram of the structure of the adsorption pad on the pressure plate provided in the embodiments of this application. Figure 3 .

[0031] in,

[0032] 11. Planetary wheel body; 111. Spacer hole; 112. Leakage hole; 12. Spacer body; 13. Polishing disc; 14. Pressure plate; 15. Adsorption pad;

[0033] 20. Quartz substrate. Detailed Implementation

[0034] To more clearly illustrate the overall concept of this application, a detailed explanation is provided below with reference to the accompanying drawings.

[0035] Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below. It should be noted that, unless otherwise specified, the embodiments of this application and the features thereof can be combined with each other.

[0036] Furthermore, it should be understood in the description of this application that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0037] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0038] In this application, unless otherwise expressly specified and limited, the "above" or "below" of the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. In the description of this specification, references to terms such as "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples.

[0039] like Figures 1 to 7As shown, this application embodiment provides a single-sided polishing device for a quartz substrate, including: a planetary wheel body 11, on which a spacer hole 111 is formed; a spacer body 12, disposed in the spacer hole 111, on which a hollow area suitable for placing a quartz substrate 20 is formed; a polishing disc 13, which is attached to the polishing surface of the quartz substrate 20; a pressure plate 14, disposed on the non-polished side of the quartz substrate 20 and embedded in the hollow area; and an adsorption pad 15, disposed between the quartz substrate 20 and the pressure plate 14, the adsorption pad 15 abutting against the non-polished surface of the quartz substrate 20, and the pressure plate 14 being adapted to apply pressure to the adsorption pad 15.

[0040] The shape and size of the cutout area can be customized according to different specifications of quartz substrates 20 to meet the processing needs of substrates of various sizes and shapes. A pressure plate 14 is embedded and fixed in the cutout area, closely attached to the adsorption pad 15. In this way, the pressure plate 14, adsorption pad 15, and quartz substrate 20 are tightly fitted together. Under the pressing force of the pressure plate 14, the corresponding position on the quartz substrate 20 is pressed against the polishing disc 13, increasing the polishing force at the corresponding position on the polishing disc 13, thereby achieving localized polishing of the corresponding area. The rigidity and elasticity of the pressure plate 14 ensure that it will not deform under pressure.

[0041] According to the single-sided polishing apparatus for quartz substrates provided in this application embodiment, the planetary wheel body 11 is the basic structure of the entire apparatus, on which multiple spacer holes 111 are formed. These spacer holes 111 are used to fix and position the spacer body 12. Through the precisely designed spacer holes 111, it is ensured that the spacer body 12 can be stably installed on the planetary wheel body 11, thereby providing a stable support platform for the quartz substrate 20. The hollow area is designed to embed the quartz substrate 20 so that the polishing disc 13 can contact the polishing surface. The polishing disc 13, through close contact with the polishing surface, uses mechanical friction to remove the uneven parts of the surface, achieving the polishing effect. During the grinding and polishing process, the planetary wheel body 11 revolves and rotates. During this rotation, the quartz substrate 20 within the spacer also revolves and rotates. The pressure plate 14 applies pressure to the adsorption pad 15 abutting the non-polished surface of the quartz substrate 20, causing the position on the quartz substrate 20 that adheres to the adsorption pad 15 to bear a localized force. During the grinding and polishing process, this localized force increases the adhesion and polishing pressure between the corresponding position on the polished surface of the quartz substrate 20 and the polishing disc 13, thereby increasing the amount of material removed from the corresponding position without affecting other parts of the polished surface, thus significantly improving the surface properties of the product. In summary, the single-sided polishing apparatus for quartz substrates provided in this application can perform localized pressure polishing on specific areas of the polished surface of the quartz substrate 20, significantly reducing surface defects and improving polishing consistency.

[0042] like Figures 3 to 4 As shown, in some embodiments of this application, the contact area between the adsorption pad 15 and the quartz substrate 20 is smaller than the area of ​​the unpolished surface. This means that the adsorption pad 15 does not completely cover the entire unpolished surface of the quartz substrate 20. Instead, it only covers specific areas, which are optimized according to processing requirements and pressure distribution. By controlling the contact area of ​​the adsorption pad 15, localized pressure can be applied to specific areas of the quartz substrate 20, rather than applying uniform pressure across the entire surface. This design helps to provide higher pressure in specific areas requiring high-precision polishing, thereby improving material removal efficiency and surface quality. Reducing the coverage area of ​​the adsorption pad 15 avoids applying unnecessary pressure to areas that have already met polishing standards, thus preventing over-grinding or over-polishing in these areas and protecting the overall polishing quality of the substrate.

[0043] like Figures 5 to 7 As shown, in some embodiments of this application, the adsorption pads 15 are distributed at the corners of the unpolished surface of the quartz substrate 20, or the adsorption pads 15 are distributed on the outer periphery of the unpolished surface of the quartz substrate 20, or the adsorption pads 15 are distributed in the central area of ​​the unpolished surface of the quartz substrate 20.

[0044] Specifically, the adsorption pads 15 are distributed at the corners of the unpolished surface of the quartz substrate 20. This is typically used when fine control and high-precision polishing of the edges and corners of the polished surface of the quartz substrate 20 are required. Applying pressure only at the corners avoids over-polishing of other already-perfected areas, protecting the overall polishing quality of the substrate. In this case, the adsorption pads 15 at the corners can be discontinuous. For example, taking a square quartz substrate 20 as an example, the adsorption pads 15 are distributed at the four corners, with each adsorption pad 15 being triangular in shape.

[0045] The adsorption pads 15 are distributed on the outer periphery of the non-polished surface of the quartz substrate 20, which is suitable for situations where the outer periphery of the polished surface of the quartz substrate 20 needs to be treated in detail. In this case, the adsorption pads 15 at the corners can be continuous. For example, taking the quartz substrate 20 as a square, the adsorption pads 15 are distributed on the outer periphery of the substrate in a ring shape.

[0046] The adsorption pads 15 are distributed in the central area of ​​the unpolished surface of the quartz substrate 20, and are typically used in situations where special treatment is required for the central area of ​​the substrate. For example, when the central area of ​​the substrate has high flatness requirements or requires fine polishing. In this case, taking a square quartz substrate 20 as an example, the adsorption pads 15 are distributed in the central area of ​​the substrate, and the whole piece can be in the shape of a disc, a square, or other shapes.

[0047] In addition, in some complex application scenarios, the adsorption pad 15 can be distributed in multiple areas according to actual needs, such as being distributed in the corners and outer perimeter areas at the same time, in order to achieve high-precision polishing in all directions.

[0048] like Figure 3 As shown, in some embodiments of this application, the sum of the thicknesses of the pressure plate 14, the adsorption pad 15, and the quartz substrate 20 is greater than the thickness of the spacer body 12. By precisely controlling the thickness difference, local overpressure or underpressure caused by uneven pressure can be avoided.

[0049] Furthermore, in some embodiments of this application, the difference between the sum of the thicknesses of the pressure plate 14, the adsorption pad 15, and the quartz substrate 20 and the thickness of the spacer body 12 ranges from 2 mm to 5 mm.

[0050] like Figures 1 to 2 As shown, in some embodiments of this application, at least two spacer holes 111 are formed on the planetary wheel body 11; a leakage hole 112 is also formed on the planetary wheel body 11. The presence of at least two spacer holes 111 means that the planetary wheel body 11 can simultaneously accommodate multiple spacer bodies 12, and each spacer body 12 can hold one quartz substrate 20. In this way, multiple quartz substrates 20 can be processed simultaneously in the same equipment, significantly improving production efficiency.

[0051] The design of the drain hole 112 is to allow the polishing fluid or coolant to flow smoothly during the polishing process, ensuring that the liquid is evenly distributed throughout the polishing area and that waste liquid is discharged in time to avoid local overheating or other problems caused by liquid accumulation.

[0052] In some embodiments of this application, the pressure plate 14 and the edge of the hollowed-out area have an interference fit structure. During high-speed rotation and high-precision polishing, any slight displacement can lead to processing defects. The interference fit structure can effectively prevent the pressure plate 14 from loosening or shifting during operation, ensuring that it is always in the correct position, maintaining pressure on the adsorption pad 15, preventing uneven pressure caused by the loosening of the pressure plate 14, and reducing the generation of new surface defects.

[0053] The amount of interference should be moderate, ensuring sufficient tightening while avoiding excessive interference that could lead to assembly difficulties or damage to components. Generally, an interference allowance between 0.01 mm and 0.1 mm is suitable.

[0054] In some embodiments of this application, the edges of the adsorption pad 15 are chamfered. A chamfered edge means that the edges of the adsorption pad 15 are treated to form a beveled or rounded transition, rather than a right-angled edge. This design reduces stress concentration, prevents damage to the quartz substrate 20, and improves the reliability of the overall assembly.

[0055] In some embodiments of this application, the adsorption pad 15 and the pressure plate 14 are integrally molded. Integral molding refers to manufacturing multiple components into a single structure using molds or other manufacturing processes. This method reduces the number of parts, simplifies the assembly process, and improves the overall strength and stability of the structure. Since the adsorption pad 15 and the pressure plate 14 are integrated, they do not require separate installation and adjustment, greatly simplifying the assembly process and reducing assembly time and costs. The integral molding structure also avoids problems caused by loosening or displacement between multiple components, improving the stability and reliability of the overall device, especially in high-speed rotation and high-precision polishing processes. The integral molding design allows for better control of the contact surface between the pressure plate 14 and the adsorption pad 15, ensuring uniform pressure distribution throughout the polishing process, thereby improving polishing quality and consistency.

[0056] Of course, the adsorption pad 15 can also be a separate part, which makes it easy to replace different models of adsorption pad 15, improves applicability, and facilitates maintenance.

[0057] In some embodiments of this application, the side of the adsorption pad 15 that abuts against the unpolished surface of the quartz substrate 20 is coated with an anti-scratch coating. The anti-scratch coating effectively prevents the adsorption pad 15 from causing scratches or other damage to the unpolished surface of the quartz substrate 20 when pressure is applied, ensuring the integrity and smoothness of the substrate surface. The anti-scratch coating not only protects the quartz substrate 20 but also reduces wear on the adsorption pad 15 itself, extending its service life and reducing maintenance costs.

[0058] For any parts not mentioned in this application, existing technologies may be used or referenced.

[0059] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0060] The above description is merely an embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A single-sided polishing device for quartz substrates, characterized in that, include: The planetary wheel body has spacer holes formed on it; A spacer body is disposed in the spacer hole, and a hollow area suitable for placing a quartz substrate is formed on the spacer body; A polishing disc is attached to the polishing surface of the quartz substrate; A pressure plate is disposed on the non-polished side of the quartz substrate and embedded in the hollow area; An adsorption pad is disposed between the quartz substrate and the pressure plate, the adsorption pad abutting against the unpolished surface of the quartz substrate, and the pressure plate is adapted to apply pressure to the adsorption pad.

2. The single-sided polishing apparatus for quartz substrates according to claim 1, characterized in that, The contact area between the adsorption pad and the quartz substrate is smaller than the area of ​​the unpolished surface.

3. The single-sided polishing apparatus for quartz substrates according to claim 2, characterized in that, The adsorption pads are distributed at the corners of the unpolished surface of the quartz substrate, or the adsorption pads are distributed on the outer periphery of the unpolished surface of the quartz substrate, or the adsorption pads are distributed in the central area of ​​the unpolished surface of the quartz substrate.

4. The single-sided polishing apparatus for quartz substrates according to claim 1, characterized in that, The sum of the thicknesses of the pressure plate, the adsorption pad, and the quartz substrate is greater than the thickness of the spacer body.

5. The single-sided polishing apparatus for quartz substrates according to claim 4, characterized in that, The difference between the sum of the thicknesses of the pressure plate, the adsorption pad, and the quartz substrate and the thickness of the spacer body is in the range of 2 mm to 5 mm.

6. The single-sided polishing apparatus for quartz substrates according to claim 1, characterized in that, At least two spacer holes are formed on the planetary wheel body; The planetary wheel body also has leakage holes.

7. The single-sided polishing apparatus for quartz substrates according to claim 1, characterized in that, The pressure plate and the edge of the hollow area have an interference fit structure.

8. The single-sided polishing apparatus for quartz substrates according to claim 1, characterized in that, The edges of the adsorption pad are chamfered.

9. The single-sided polishing apparatus for quartz substrates according to any one of claims 1 to 8, characterized in that, The adsorption pad and the pressure plate are integrally formed.

10. The single-sided polishing apparatus for quartz substrates according to any one of claims 1 to 8, characterized in that, The adsorption pad has a scratch-resistant coating on the side that abuts against the non-polished surface of the quartz substrate.

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