Circuit board electroplating device

Abstract

The utility model provides a circuit board electroplating device which comprises an electroplating tank, metal rods which are uniformly distributed at the bottom end in the electroplating tank, a bracket arranged on the rear side of the upper surface of the electroplating tank, a sliding cylinder arranged at the upper end of the bracket, a sliding rod arranged in the sliding cylinder in a sliding manner, and a movable table arranged at the bottom end of the sliding rod, symmetrically-distributed sliding seats are slidably arranged in guide sliding grooves formed in the lower surface of the movable table, rotating shafts are rotatably arranged on the lower sides of the sliding seats, rotating plates are arranged at the bottom ends of the rotating shafts, and evenly-distributed hooks are arranged on the lower surfaces of the rotating plates. According to the circuit board electroplating device disclosed by the utility model, the electroplating liquid can be quickly and fully contacted with the circuit board when the circuit board is electroplated, so that the electroplating speed and the electroplating uniformity can be effectively improved, and the electroplating quality is improved.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board processing technology, and specifically relates to a circuit board electroplating device. Background Technology

[0002] Circuit boards are an indispensable part of electronic devices. They not only provide mechanical support for electronic components, but also realize electrical connections between components through conductive paths. Circuit board electroplating equipment is used to deposit metal layers on the surface or in the holes of printed circuit boards (PCBs). This process is crucial for ensuring the reliability of electrical connections and improving conductivity. Electroplating can be applied to copper foil, through holes, and other areas that require enhanced conductivity or a protective coating.

[0003] Existing circuit board electroplating equipment works by hanging the circuit board to be electroplated on a rack, then activating an electric pusher to place the circuit board into the electroplating tank. The electroplating tank contains an electroplating solution and an anode (usually a pure metal rod) inside. A voltage is applied between the anode and the circuit board (cathode). By energizing the anode (metal rod), the circuit board (cathode) is electroplated, thus achieving the electroplating of the circuit board. However, in actual use, the electroplating solution in the tank remains static, and the parts are statically immersed in the solution. When the pure metal rod (anode) and the circuit board (cathode) work together for electroplating, the electroplating speed is slow, affecting the overall electroplating speed and the processing efficiency of the circuit board. Utility Model Content

[0004] In view of this, the present invention addresses the shortcomings of the prior art by providing a circuit board electroplating device that enables the electroplating solution to make rapid and sufficient contact with the circuit board during electroplating, thereby effectively improving the electroplating speed and uniformity, and enhancing the electroplating quality.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: a circuit board electroplating device, including an electroplating tank, with uniformly distributed metal rods arranged at the bottom of the electroplating tank, a support arranged on the rear side of the upper surface of the electroplating tank, a slide cylinder arranged at the upper end of the support, a slide rod slidably arranged inside the slide cylinder, a movable platform arranged at the bottom end of the slide rod, symmetrically distributed sliding seats slidably arranged in a guide groove opened on the lower surface of the movable platform, a rotating shaft rotatably arranged on the lower side of each sliding seat, a rotating plate arranged at the bottom end of each rotating shaft, and uniformly distributed hooks arranged on the lower surface of the rotating plate; uniformly distributed support feet arranged on the lower surface of the electroplating tank, and rubber pads are glued and fixed to the lower surface of each support foot.

[0006] As a further improvement of this utility model, the upper end of the bracket is provided with symmetrically distributed electric push rods, and the telescopic ends of the electric push rods are respectively connected and fixed to the movable platform.

[0007] As a further improvement of this utility model, driven gears are fixedly sleeved on the upper side of the outer arc surface of the rotating shaft, and a rack plate is provided inside the movable table. The driven gears are all meshed with the rack plate. A connecting frame is provided between the sliding seats, and an adjusting screw is rotatably provided inside the movable table. The connecting frame is threadedly connected to the adjusting screw. A motor is provided on the outer side of the movable table, and the output shaft of the motor is fixed to the adjusting screw through a coupling.

[0008] As a further improvement of this utility model, the lower surface of the electroplating tank is provided with evenly distributed support legs, and rubber pads are glued and fixed to the lower surface of each support leg.

[0009] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0010] Firstly,

[0011] Secondly,

[0012] Thirdly,

[0013] Fourthly, Attached Figure Description

[0014] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the internal cross-sectional structure of this utility model;

[0017] Figure 3 This is an enlarged structural diagram of point A in this utility model;

[0018] Figure 4 This is a schematic diagram of the planar structure of this utility model.

[0019] In the diagram: 101, electroplating tank; 102, support leg; 103, bracket; 104, slide cylinder; 105, movable table; 106, electric push rod; 107, metal rod; 201, guide groove; 202, sliding seat; 203, rotating plate; 204, hook; 205, driven gear; 206, rack plate; 207, adjusting screw; 208, connecting frame; 209, motor; 301, control board. Detailed Implementation

[0020] To better understand this utility model, the following embodiments further illustrate its content, but the scope of protection of this utility model is not limited to the embodiments described below. Numerous specific details are set forth in the following description to provide a more thorough understanding of this utility model. However, it will be apparent to those skilled in the art that this utility model can be practiced without one or more of these details.

[0021] like Figure 1 , 4 As shown, the electroplating tank includes an electroplating tank 101. The bottom of the electroplating tank 101 is provided with uniformly distributed metal rods 107. A support 103 is provided on the rear side of the upper surface of the electroplating tank 101. A slide cylinder 104 is provided at the upper end of the support 103. A slide rod is slidably arranged inside the slide cylinder 104. A movable platform 105 is provided at the bottom end of the slide rod. Symmetrically distributed sliding seats 202 are slidably arranged in a guide groove 201 opened on the lower surface of the movable platform 105. A rotating shaft is rotatably arranged on the lower side of each sliding seat 202. A rotating plate 203 is provided at the bottom end of each rotating shaft. Hooks 204 are uniformly distributed on the lower surface of the rotating plate 203.

[0022] like Figure 1 , 2 As shown, the upper end of the bracket 103 is provided with symmetrically distributed electric push rods 106, and the telescopic ends of the electric push rods 106 are respectively connected and fixed to the movable platform 105.

[0023] like Figure 2 , 3 As shown, driven gears 205 are fixedly sleeved on the upper side of the outer arc surface of the rotating shaft. A rack plate 206 is provided inside the movable table 105, and the driven gears 205 are all meshed with the rack plate 206. A connecting frame 208 is provided between the sliding seats 202. An adjusting screw 207 is rotatably provided inside the movable table 105, and the connecting frame 208 is threadedly connected to the adjusting screw 207. A motor 209 is provided on the outer side of the movable table 105, and the output shaft of the motor 209 is fixed to the adjusting screw 207 by a coupling.

[0024] like Figure 1 , 2 As shown, a control board 301 is provided on the front side of the electroplating tank 101, and the metal rod 107, electric push rod 106 and motor 209 are all electrically connected to the control board 301.

[0025] When in use, pour an appropriate amount of electroplating solution into the electroplating tank 101, then hang the circuit board to be electroplated on the hook 204. The control board 301 controls the operation of the electric push rod 106, so that the output shaft of the electric push rod 106 drives the movable table 105 connected to it to move vertically downward under the guidance of the slide cylinder 104 and the slide rod, so that the circuit board is submerged in the electroplating solution.

[0026] The control board 301 regulates the operation of the metal rod 107, the electric push rod 106, and the motor 209, causing the metal rod 107 to discharge, the telescopic end of the electric push rod 106 to move back and forth, and the electric push rod 106 to drive the circuit board under the hook 204 to move up and down, causing the circuit board to move up and down in the electroplating solution; the output shaft of the motor 209 drives the adjusting screw 207 connected to it to rotate back and forth, and by adjusting the thread relationship between the screw 207 and the connecting frame 208, the connecting frame 208 is driven to move horizontally back and forth, thereby driving the sliding seat 20 2. The lower circuit board moves horizontally back and forth. During the horizontal back and forth movement of the sliding seat 202, the driven gear 205 and the rack plate 206 are meshed together, causing the shaft where the driven gear 205 is located to rotate. This causes the rotating plate 203 to rotate while driving the circuit board to move horizontally back and forth. By coordinating the up-and-down back and forth movement, horizontal back and forth movement and rotation of the circuit board, the electroplating solution can quickly and fully contact the circuit board during electroplating, which can effectively improve the electroplating speed and the uniformity of electroplating, and improve the electroplating quality.

[0027] According to another embodiment of the present invention, such as Figure 1 , 4 As shown, the lower surface of the electroplating tank 101 is provided with evenly distributed support legs 102, and rubber pads are glued and fixed to the lower surface of each support leg 102. During use, the rubber pads glued and fixed to the lower surface of the support legs 102 can effectively increase the friction between the support legs 102 and the ground, which can effectively prevent the position of the electroplating tank 101 from easily moving during use.

[0028] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model, as long as they do not depart from the spirit and scope of the technical solution of this utility model, should be covered within the scope of the claims of this utility model.

Claims

1. A circuit board electroplating apparatus, comprising an electroplating tank (101), wherein uniformly distributed metal rods (107) are disposed at the bottom of the interior of the electroplating tank (101), characterized in that: A support (103) is provided on the rear side of the upper surface of the electroplating tank (101). A slide cylinder (104) is provided at the upper end of the support (103). A slide rod is slidably provided inside the slide cylinder (104). A movable platform (105) is provided at the bottom end of the slide rod. A symmetrically distributed sliding seat (202) is slidably provided in the guide groove (201) opened on the lower surface of the movable platform (105). A rotating shaft is rotatably provided on the lower side of each sliding seat (202). A rotating plate (203) is provided at the bottom end of each rotating shaft. Hooks (204) are evenly distributed on the lower surface of the rotating plate (203).

2. The circuit board electroplating apparatus as described in claim 1, characterized in that: The upper end of the bracket (103) is provided with symmetrically distributed electric push rods (106), and the telescopic ends of the electric push rods (106) are respectively connected and fixed to the movable platform (105).

3. The circuit board electroplating apparatus as described in claim 1, characterized in that: Driven gears (205) are fixedly sleeved on the upper side of the outer arc surface of the rotating shaft, and rack plates (206) are provided inside the movable table (105). Driven gears (205) are meshed with rack plates (206).

4. The circuit board electroplating apparatus as described in claim 2, characterized in that: A connecting frame (208) is provided between the sliding seats (202), and an adjusting screw (207) is rotatably provided inside the movable table (105). The connecting frame (208) is threadedly connected to the adjusting screw (207).

5. The circuit board electroplating apparatus as described in claim 4, characterized in that: A motor (209) is provided on the outside of the movable platform (105), and the output shaft of the motor (209) is fixed to the adjusting screw (207) by a coupling.

6. The circuit board electroplating apparatus as described in claim 5, characterized in that: A control board (301) is provided on the front side of the electroplating tank (101), and the metal rod (107), electric push rod (106) and motor (209) are all electrically connected to the control board (301).

7. The circuit board electroplating apparatus as described in claim 1, characterized in that: The lower surface of the electroplating tank (101) is provided with evenly distributed support legs (102), and the lower surface of each support leg (102) is bonded with a rubber pad.

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