Ultrasonic thickness measuring device with temperature compensation

Abstract

An ultrasonic thickness measuring device with temperature compensation relates to the technical field of special equipment inspection, and is used for solving the technical problem that a traditional thickness measuring device does not consider the influence of temperature on sound velocity to cause measuring errors. In the ultrasonic thickness measuring device with temperature compensation, a single-chip microcomputer is connected with an infrared temperature measuring module and a signal transmitting / receiving module, and the signal transmitting / receiving module is connected with an ultrasonic transducer; the single-chip microcomputer is further connected with a data read-write module, a display module, a key module and a power supply module.

Description

Technical Field

[0001] This utility model relates to the field of special equipment inspection technology, and in particular to an ultrasonic thickness measuring device with temperature compensation. Background Technology

[0002] In the industrial field, ultrasonic thickness measurement technology is widely used for thickness measurement of metallic and non-metallic materials, as well as various pipes, containers and other equipment, and is of great significance, especially in the assessment of damage such as corrosion and wear.

[0003] However, the measurement accuracy of ultrasonic thickness gauges is often affected by changes in ambient temperature; temperature fluctuations alter the propagation speed of ultrasonic waves in the medium, leading to measurement errors. Especially in working environments with significant temperature differences, such as in the petrochemical, metallurgical, and chemical industries, traditional ultrasonic thickness gauges often fail to accurately reflect the true thickness of the measured material, thus affecting equipment safety assessments and maintenance decisions.

[0004] To overcome this problem, traditional ultrasonic thickness gauges usually need to be used under specific temperature conditions or rely on external temperature compensation equipment for manual adjustment, which often increases the complexity and workload of the measurement.

[0005] Therefore, how to provide an ultrasonic thickness measuring device with temperature compensation that can automatically compensate for temperature changes and ensure accurate measurement results under different temperature conditions has become a technical problem that urgently needs to be solved by those skilled in the art, and at the same time has important application value and broad market demand. Utility Model Content

[0006] The purpose of this invention is to provide an ultrasonic thickness measuring device with temperature compensation, which solves the technical problem of measurement error caused by the failure of traditional thickness measuring devices to consider the influence of temperature on sound velocity. It can monitor temperature changes in real time and make corresponding corrections to the ultrasonic wave propagation speed, thereby ensuring that the measurement results remain accurate and stable in environments with large temperature variations. It not only improves the application accuracy of ultrasonic thickness measuring technology, but also enhances its adaptability in complex working conditions, and can provide more reliable technical support for the safe inspection and maintenance of equipment.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] An ultrasonic thickness measurement device with temperature compensation includes: a microcontroller connected to an infrared temperature measurement module and a signal transmission / reception module, wherein the signal transmission / reception module is connected to an ultrasonic transducer; the microcontroller is also connected to a data read / write module, a display module, a button module, and a power supply module;

[0009] The microcontroller is responsible for control, signal processing, calculation, and data management, and is used to process received electrical signals to calculate the thickness of the workpiece to be measured.

[0010] The infrared temperature measurement module is used to measure the real-time temperature of the workpiece under test and to provide a basis for the calibration of the ultrasonic velocity.

[0011] The signal transmitting / receiving module is used to generate an electrical signal of a specific frequency, excite the ultrasonic transducer to generate a signal, and receive the electrical signal converted by the ultrasonic transducer.

[0012] The ultrasonic transducer is used to excite and receive ultrasonic signals in different temperature ranges;

[0013] The read function in the data read / write module is used to read the sound velocity of different materials at different temperatures stored in the storage unit of the microcontroller in order to calibrate the measured ultrasonic thickness; the write function in the data read / write module is used to supplement the material sound velocity that is currently missing in the storage unit of the microcontroller, and to save the workpiece thickness measured by the thickness measuring device.

[0014] The display module is used to display the currently measured workpiece material type, the currently measured workpiece temperature, the currently measured workpiece thickness, and the thickness calibration value after temperature compensation.

[0015] The button module is used to trigger the microcontroller to perform corresponding specific functions;

[0016] The power supply module is used to supply power to the microcontroller, the infrared temperature measurement module, the signal transmitting / receiving module, the display module, and the button module.

[0017] In practical applications, the button module is used to trigger the microcontroller to perform corresponding specific functions, including: thickness measurement, temperature measurement, thickness calibration, material selection, saving, deletion, and power switch.

[0018] The ultrasonic transducer includes: a piezoelectric transducer, a high-temperature transducer, and an electromagnetic ultrasonic transducer.

[0019] Specifically, the display module is composed of an LED display screen, and the screen of the display screen is divided into four areas, which are respectively used to display the material type of the workpiece being measured, the temperature of the workpiece being measured, the thickness of the workpiece being measured, and the thickness calibration value after temperature compensation.

[0020] Furthermore, the temperature-compensated ultrasonic thickness measuring device also includes: a housing, which is provided with a display screen, buttons, a signal transmitting interface, a signal receiving interface, and a charging port.

[0021] Furthermore, the buttons include: a power on / off button, a temperature measurement button, a temperature calibration button, a material selection button, a thickness measurement button, a save button, a delete button, a menu bar up sliding button, and a menu bar down sliding button.

[0022] Compared with existing technologies, the ultrasonic thickness measuring device with temperature compensation described in this utility model has the following advantages:

[0023] In the ultrasonic thickness measuring device with temperature compensation provided by this utility model, since temperature changes affect the propagation speed of ultrasonic waves in the medium, and thus affect the thickness measurement results, the device with temperature compensation can measure and correct the influence of temperature changes on the propagation speed of ultrasonic waves in real time, thereby effectively improving the measurement accuracy under different temperature conditions and ensuring more accurate measurement results; in addition, based on the temperature of the workpiece to be measured measured by the device, it can provide technical guidance for selecting a suitable ultrasonic probe. Attached Figure Description

[0024] Figure 1 A schematic diagram of the structure of the ultrasonic thickness measuring device with temperature compensation provided in an embodiment of this utility model;

[0025] Figure 2 A schematic diagram of the external appearance of the ultrasonic thickness measuring device with temperature compensation provided in an embodiment of this utility model;

[0026] Figure 3 A schematic diagram of the buttons in the temperature-compensated ultrasonic thickness measuring device provided in this embodiment of the utility model;

[0027] Figure 4 A schematic diagram of the measurement process of the ultrasonic thickness measuring device with temperature compensation provided for an embodiment of this utility model.

[0028] Figure label:

[0029] 1-Microcontroller; 2-Infrared temperature measurement module; 3-Signal transmission / reception module; 4-Ultrasonic transducer; 5-Data read / write module; 6-Display module; 7-Button module; 8-Power supply module;

[0030] 9-Outer casing; 91-Display screen; 92-Buttons; 93-Signal transmitting interface; 94-Signal receiving interface; 95-Charging port;

[0031] 921 - Power On / Off Button; 922 - Temperature Measurement Button; 923 - Temperature Calibration Button; 924 - Material Selection Button; 925 - Thickness Measurement Button; 926 - Save Button; 927 - Delete Button; 928 - Menu Bar Up Slide Button; 929 - Menu Bar Down Slide Button. Detailed Implementation

[0032] For ease of understanding, the ultrasonic thickness measuring device with temperature compensation provided in the embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0033] This utility model embodiment provides an ultrasonic thickness measuring device with temperature compensation, such as... Figure 1 As shown, it includes: a microcontroller 1, which is connected to an infrared temperature measurement module 2 and a signal transmission / reception module 3, and the signal transmission / reception module 3 is connected to an ultrasonic transducer 4; the microcontroller 1 is also connected to a data read / write module 5, a display module 6, a button module 7, and a power supply module 8;

[0034] The microcontroller 1 can be used for control, signal processing, calculation, and data management, and can be used to process received electrical signals to calculate the thickness of the workpiece to be measured.

[0035] The infrared temperature measurement module 2 can be used to measure the real-time temperature of the workpiece under test and provide a basis for the calibration of the ultrasonic velocity.

[0036] The signal transmitting / receiving module 3 can be used to generate electrical signals of a specific frequency and excite the ultrasonic transducer 4 to generate signals, as well as receive electrical signals converted by the ultrasonic transducer 4.

[0037] The ultrasonic transducer 4 can be used to excite and receive ultrasonic signals in different temperature ranges;

[0038] The read function in the data read / write module 5 can be used to read the sound velocity of different materials at different temperatures stored in the storage unit of the microcontroller 1, so as to calibrate the measured ultrasonic thickness; the write function in the data read / write module 5 can be used to supplement the material sound velocity missing in the current storage unit of the microcontroller 1, and to save the workpiece thickness measured by the thickness measuring device.

[0039] The display module 6 can be used to display the currently measured workpiece material type, the currently measured workpiece temperature, the currently measured workpiece thickness, and the thickness calibration value after temperature compensation.

[0040] Button module 7 can be used to trigger microcontroller 1 to perform corresponding specific functions;

[0041] The power supply module 8 can supply power to the microcontroller 1, the infrared temperature measurement module 2, the signal transmission / reception module 3, the display module 6, and the button module 7.

[0042] Compared with the prior art, the ultrasonic thickness measuring device with temperature compensation described in this embodiment of the invention has the following advantages:

[0043] In the ultrasonic thickness measuring device with temperature compensation provided in this embodiment of the invention, since temperature changes affect the propagation speed of ultrasonic waves in the medium, and thus affect the thickness measurement results, the device with temperature compensation can measure and correct the influence of temperature changes on the propagation speed of ultrasonic waves in real time, thereby effectively improving the measurement accuracy under different temperature conditions and ensuring more accurate measurement results; in addition, based on the temperature of the workpiece to be measured measured by the device, it can provide technical guidance for selecting a suitable ultrasonic probe.

[0044] In practical applications, the button module 7 can be used to trigger the microcontroller 1 to perform corresponding specific functions, which may include: thickness measurement, temperature measurement, thickness calibration, material selection, saving, deletion, and power switch.

[0045] The ultrasonic transducer 4 mentioned above may include: a piezoelectric transducer, a high-temperature transducer, and an electromagnetic ultrasonic transducer.

[0046] Specifically, the aforementioned display module 6 can be composed of an LED display screen, and the screen of the display screen can be divided into four areas, which are respectively used to display the currently measured workpiece material type, the currently measured workpiece temperature, the currently measured workpiece thickness, and the thickness calibration value after temperature compensation.

[0047] Furthermore, such as Figure 2 As shown, the ultrasonic thickness measuring device with temperature compensation provided in this embodiment of the present invention may further include: a housing 9, which may be provided with a display screen 91, buttons 92, a signal transmitting interface 93, a signal receiving interface 94, and a charging port 95.

[0048] Furthermore, such as Figure 3 As shown, the aforementioned button 92 may include: a power on / off button 921, a temperature measurement button 922, a temperature calibration button 923, a material selection button 924, a thickness measurement button 925, a save button 926, a delete button 927, a menu bar up slide button 928, and a menu bar down slide button 929.

[0049] The following uses the appendix Figure 4 The thickness measurement process of the ultrasonic thickness measuring device with temperature compensation provided in this embodiment of the present invention will be described in detail:

[0050] Step S1: Measure the current temperature of the workpiece to be measured: Press the on / off button to turn on the device, the display screen lights up, and the initialization interface is entered; press the temperature measurement button to obtain the current surface temperature of the workpiece to be measured, and press the save button to proceed to the next step;

[0051] Step S2: Select a suitable ultrasonic transducer based on temperature: Connect the selected ultrasonic transducer to the signal transmitting / receiving interface of the device;

[0052] Step S3: Select the current material type to be tested: Press the material selection button, and use the up and down sliding buttons in the menu bar to select the current material to be tested. Press the save button to indicate that the current material is selected. If the material exists, proceed to step S4. If the material does not exist, end directly.

[0053] Step S4: Measure the data and obtain the current workpiece thickness: Press the thickness measurement button to measure the thickness and obtain the thickness of the current workpiece. Pressing the thickness measurement button multiple times can achieve multiple measurements.

[0054] Step S5: Temperature calibration to obtain the calibrated workpiece thickness: Press the temperature calibration button to perform thickness calibration and obtain the calibrated workpiece thickness. Press the save button to save the current measurement results.

[0055] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. An ultrasonic thickness measuring device with temperature compensation, characterized in that, include: The microcontroller is connected to an infrared temperature measurement module and a signal transmission / reception module, and the signal transmission / reception module is connected to an ultrasonic transducer; the microcontroller is also connected to a data read / write module, a display module, a button module, and a power supply module; The microcontroller is responsible for control, signal processing, calculation, and data management, and is used to process received electrical signals to calculate the thickness of the workpiece to be measured. The infrared temperature measurement module is used to measure the real-time temperature of the workpiece under test and to provide a basis for the calibration of the ultrasonic velocity. The signal transmitting / receiving module is used to generate an electrical signal of a specific frequency, excite the ultrasonic transducer to generate a signal, and receive the electrical signal converted by the ultrasonic transducer. The ultrasonic transducer is used to excite and receive ultrasonic signals in different temperature ranges; The read function in the data read / write module is used to read the sound velocity of different materials at different temperatures stored in the storage unit of the microcontroller in order to calibrate the measured ultrasonic thickness; the write function in the data read / write module is used to supplement the material sound velocity that is currently missing in the storage unit of the microcontroller, and to save the workpiece thickness measured by the thickness measuring device. The display module is used to display the currently measured workpiece material type, the currently measured workpiece temperature, the currently measured workpiece thickness, and the thickness calibration value after temperature compensation. The button module is used to trigger the microcontroller to perform corresponding specific functions; The power supply module is used to supply power to the microcontroller, the infrared temperature measurement module, the signal transmitting / receiving module, the display module, and the button module.

2. The ultrasonic thickness measuring device with temperature compensation according to claim 1, characterized in that, The button module is used to trigger the microcontroller to perform corresponding specific functions, including: thickness measurement, temperature measurement, thickness calibration, material selection, saving, deletion, and power switch.

3. The ultrasonic thickness measuring device with temperature compensation according to claim 1, characterized in that, The ultrasonic transducer includes: a piezoelectric transducer, a high-temperature transducer, and an electromagnetic ultrasonic transducer.

4. The ultrasonic thickness measuring device with temperature compensation according to claim 1, characterized in that, The display module consists of an LED display screen, which is divided into four areas, each used to display the currently measured workpiece material type, the currently measured workpiece temperature, the currently measured workpiece thickness, and the thickness calibration value after temperature compensation.

5. The ultrasonic thickness measuring device with temperature compensation according to any one of claims 1-4, characterized in that, Also includes: The housing includes a display screen, buttons, a signal transmitting interface, a signal receiving interface, and a charging port.

6. The ultrasonic thickness measuring device with temperature compensation according to claim 5, characterized in that, The buttons include: a power on / off button, a temperature measurement button, a temperature calibration button, a material selection button, a thickness measurement button, a save button, a delete button, a menu bar up slide button, and a menu bar down slide button.

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