Modularized multi-sensor data acquisition integration box

By adopting a modular interface and processor motherboard design, combined with standardized interfaces and multi-protocol adaptation mechanisms, the flexibility and stability issues of existing equipment have been resolved. This enables flexible replacement and expansion of multi-sensor data acquisition equipment, and improves the applicability of the equipment in complex environments and the stability of sensor connectors.

CN224121972UActive Publication Date: 2026-04-14HUAAOSI TECH (SHANTOU) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HUAAOSI TECH (SHANTOU) CO LTD
Filing Date
2025-06-11
Publication Date
2026-04-14

AI Technical Summary

Technical Problem

Existing multi-sensor data acquisition equipment suffers from fixed design, making it difficult to flexibly replace or expand. It also lacks multi-protocol compatibility and external interfaces that lack dustproof, waterproof, and limiting measures, affecting the flexibility and stability of the equipment.

Method used

It adopts a modular interface and processor motherboard design, combined with standardized interfaces and multi-protocol adaptation mechanisms, and is equipped with protective limit components and sealing gaskets to achieve rapid access and efficient data acquisition. It has dustproof and waterproof functions, and the stability of the sensor connector is ensured by the card plate and spring structure.

Benefits of technology

It achieves flexibility and scalability of the equipment, improves its applicability in complex environments, ensures the stability and protection of the sensor connector, and meets the needs of multiple scenarios.

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Abstract

The utility model discloses a modularized multi-sensor data acquisition integration box, and relates to the technical field of sensor data acquisition and embedded systems. The device comprises a lower shell and an upper shell installed on the top of the lower shell through screws, modular interfaces are arranged on one side wall of the upper shell from front to back in an array mode, a processor mainboard is installed in the lower shell through screws, and a protection limiting assembly is arranged on the outer wall of the upper shell. Through the modularized interface and the processor mainboard, the modularized multi-sensor data acquisition integrated box is compact in structure, diversified in function and high in compatibility, realizes quick access and efficient acquisition of various sensors, improves the flexibility, expandability and environmental adaptability of equipment, and is suitable for popularization and application. The multi-scene requirements of meteorological monitoring, urban perception, agricultural Internet of Things and the like are met, the protection limiting assembly can be used for achieving dustproof and waterproof effects on the modular interface, and meanwhile the stability of the sensor connector is guaranteed.
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Description

Technical Field

[0001] This utility model belongs to the field of sensor data acquisition and embedded system technology, and in particular relates to a modular multi-sensor data acquisition integration box. Background Technology

[0002] Data acquisition integration equipment that supports sensor access is suitable for scenarios such as environmental monitoring, meteorological observation, and industrial automation. Currently, multi-sensor data acquisition equipment on the market, such as traditional weather station equipment, is bulky, has high deployment costs, and only supports sensor access from specific manufacturers, lacking universality and compatibility.

[0003] However, it still has the following drawbacks in practical use:

[0004] 1. Existing multi-sensor data acquisition devices usually adopt a fixed design, with each sensor interface and communication protocol bound together, making it difficult to flexibly replace or expand. While some portable acquisition terminals are small in size, they have obvious shortcomings in multi-protocol adaptation, edge computing capabilities, and remote communication, which limits their applicability in complex environments.

[0005] 2. Existing multi-sensor data acquisition devices lack dust and water protection measures for their external interfaces, which can easily affect their normal use. Furthermore, the external sensor connectors lack limiting measures, affecting their stability. Therefore, we provide a modular multi-sensor data acquisition integration box to solve the above-mentioned problems. Utility Model Content

[0006] The purpose of this utility model is to provide a modular multi-sensor data acquisition integration box. By setting up modular interfaces and a processor motherboard, this modular multi-sensor data acquisition integration box has a compact structure, diverse functions, and strong compatibility. Through standardized interfaces and multi-protocol adaptation mechanisms, this design realizes rapid access and efficient data acquisition of various sensors, improves the flexibility, scalability, and environmental adaptability of the equipment, and meets the needs of multiple scenarios such as meteorological monitoring, urban sensing, and agricultural IoT. In addition, by using protective limiting components and sealing gaskets, the modular interfaces can be sealed, which can play a role in dustproofing and waterproofing. At the same time, the sensor connectors are limited by the clamping plate to ensure the stability of the sensor connectors.

[0007] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0008] This utility model is a modular multi-sensor data acquisition integration box, including a lower shell and an upper shell that is installed on top of it by screws. A modular interface is arranged in an array from front to back on one side wall of the upper shell. The processor motherboard is installed inside the lower shell by screws. A protective limiting component is provided on the outer wall of the upper shell.

[0009] The protective limiting assembly includes a pressure plate disposed on the outside of the modular interface and a locking plate fixed at the center of the bottom of the pressure plate.

[0010] The present invention is further configured such that a charging port is provided at the center of the other side wall of the upper shell, and a display panel is provided at the center of the top of the upper shell.

[0011] The present invention is further configured such that a mounting bracket is installed at the top of the inner side of the upper shell by screws, and a lithium battery is installed inside the mounting bracket.

[0012] The present invention is further configured such that a multi-protocol communication module is provided on one end of the surface of the processor motherboard, and the multi-protocol communication module is electrically connected to the adjacent modular interface.

[0013] The present invention is further configured such that sealing gaskets are arrayed and bonded to one side wall of the pressure plate from front to back, and the bottom of the card plate is provided with card slots from front to back.

[0014] The present invention is further configured such that sliders are fixedly provided at the bottom of both the front and rear ends of the pressure plate, and the sliding holes in the sliders are slidably installed on the outer wall of the guide rod, and a first spring is sleeved on the outer wall of the guide rod.

[0015] The present invention is further configured such that the two ends of the guide rod are fixed on the inner wall of the connecting frame, and the first spring is located between the upper surface of the slider and the inner wall of the connecting frame.

[0016] The present invention is further configured such that a telescopic rod is installed in the middle of one side wall of the connecting frame, the other end of the telescopic rod is installed on the outer wall of the upper shell, and a second spring is sleeved on the outer wall of the telescopic rod.

[0017] This utility model has the following beneficial effects:

[0018] 1. This utility model, through the setting of modular interfaces and processor motherboards, features a modular multi-sensor data acquisition integration box with a compact structure, diverse functions, and strong compatibility. Through standardized interfaces and multi-protocol adaptation mechanisms, it enables rapid access and efficient data acquisition from various sensors, improving the flexibility, scalability, and environmental adaptability of the equipment. It meets the needs of multiple scenarios such as meteorological monitoring, urban sensing, and agricultural IoT, and solves the problem that existing multi-sensor data acquisition devices usually adopt a fixed design, with each sensor interface and communication protocol bound together, making it difficult to flexibly replace or expand. While some portable acquisition terminals are small in size, they have obvious shortcomings in multi-protocol adaptation, edge computing capabilities, and remote communication, which limits their applicability in complex environments.

[0019] 2. This utility model, by setting up a protective limiting component, allows the sealing gasket to seal the modular interface, providing dust and water protection. At the same time, under the elastic action of the first and second springs, the positions of the pressure plate and the clamping plate can be adjusted, and the clamping plate is used to limit the sensor connector, ensuring the stability of the sensor connector. This solves the problems of existing multi-sensor data acquisition equipment lacking dust and water protection measures for external interfaces, which easily affects the normal use of the interface, and the lack of limiting measures for external sensor connectors, which affects the stability of the connectors. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic diagram of the structure of a modular multi-sensor data acquisition and integration box. Figure 1 .

[0022] Figure 2 A schematic diagram of the structure of a modular multi-sensor data acquisition and integration box. Figure 2 .

[0023] Figure 3 Disassembly diagram of the lower and upper shells Figure 1 .

[0024] Figure 4 Disassembly diagram of the lower and upper shells Figure 2 .

[0025] Figure 5 A disassembly diagram of the protective limit component.

[0026] The attached diagram lists the components represented by each number as follows:

[0027] 100-Lower shell, 101-Upper shell, 101a-Charging port, 101b-Display board, 102-Mounting bracket, 102a-Lithium battery, 200-Modular interface, 300-Processor motherboard, 301-Multi-protocol communication module, 400-Protective limit component, 401-Pressure plate, 402-Sealing gasket, 403-Card plate, 403a-Card slot, 404-Slider, 405-Guide rod, 405a-First spring, 406-Connecting frame, 407-Telescopic rod, 407a-Second spring. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model. Example 1

[0029] Please see Figures 1 to 4 This utility model is a modular multi-sensor data acquisition integration box, including a lower shell 100 and an upper shell 101 mounted on top of it by screws. A modular interface 200 is arrayed on one side wall of the upper shell 101 from front to back. A processor motherboard 300 is mounted inside the lower shell 100 by screws.

[0030] Specifically, a charging port 101a is provided at the center of the other side wall of the upper shell 101, and a display panel 101b is provided at the center of the top of the upper shell 101; a mounting bracket 102 is installed inside the top of the upper shell 101 by screws, and a lithium battery 102a is installed inside the mounting bracket 102; a multi-protocol communication module 301 is provided on one end of the surface of the processor motherboard 300, and the multi-protocol communication module 301 is electrically connected to the adjacent modular interface 200.

[0031] Furthermore, the outer casing assembly consists of a lower shell 100 and an upper shell 101, made of lightweight engineering plastic or aluminum alloy, with dimensions of 155mm × 90mm × 43mm, and an IP65 protection rating. The main control unit is the processor motherboard 300, equipped with a high-performance embedded processor (such as ARM). The Cortex-M3 processor is responsible for data acquisition, processing, and scheduling. The modular interface 200 has multiple built-in standard slots or connectors, supporting users to connect various sensor modules such as temperature and humidity, air pressure, wind speed, and PM2.5 as needed. The multi-protocol communication module 301 integrates physical interfaces such as RS485, I2C, SPI, and CAN, and supports communication protocols such as Modbus, MQTT, HTTP, and CoAP. It can automatically identify or manually configure protocol parameters according to the sensor type. The processor motherboard 300 has a wireless communication unit that includes multiple communication methods such as 4G / 5G, Wi-Fi, and NB-IoT, supporting data upload to the cloud or local server. The power management system supports external power supply, solar panel power supply, and 102a lithium battery power supply modes, and has a low-power sleep mechanism. The software platform has a built-in edge computing engine, supporting functions such as data filtering, anomaly detection, and alarm threshold setting. It can be configured and debugged via Bluetooth / Wi-Fi connection to a mobile app or PC.

[0032] The operation process of this embodiment is as follows: The integrated box is only 1 / 10 of that of a conventional weather station device, weighs less than 400g, is easy to carry and deploy quickly, supports more than 20 common sensor protocols, has a wide range of compatibility, a data acquisition frequency of up to 1kHz, fast response speed, and a battery life of more than 7 days in typical application scenarios. It can operate stably in environments from 0℃ to +60℃, adapts to complex outdoor conditions, supports OTA remote upgrades and parameter configuration, is easy to maintain, and its modular design allows users to flexibly replace or add sensor modules as needed, improving the equipment reuse rate. Example 2

[0033] Please see Figure 2 and Figure 5 Based on Embodiment 1, the difference from the first embodiment is that a protective limiting component 400 is provided. The protective limiting component 400 includes a pressure plate 401 disposed on the outside of the modular interface 200, and a clamping plate 403 fixed at the bottom center of the pressure plate 401. This solves the problem that the external interface of the existing multi-sensor data acquisition equipment lacks dustproof and waterproof measures, which can easily affect the normal use of the interface. At the same time, the external sensor connector lacks limiting measures, which affects the stability of the connector.

[0034] Specifically, a sealing gasket 402 is arrayed and bonded to one side wall of the pressure plate 401 from front to back, and a slot 403a is provided on the bottom of the clamping plate 403 from front to back; sliders 404 are fixedly provided at the bottom of both the front and rear ends of the pressure plate 401, and the sliding holes in the sliders 404 are slidably installed on the outer wall of the guide rod 405. A first spring 405a is sleeved on the outer wall of the guide rod 405; the two ends of the guide rod 405 are fixed on the inner wall of the connecting frame 406, and the first spring 405a is located between the upper surface of the slider 404 and the inner wall of the connecting frame 406; a telescopic rod 407 is installed in the middle of one side wall of the connecting frame 406, and the other end of the telescopic rod 407 is installed on the outer wall of the upper shell 101. A second spring 407a is sleeved on the outer wall of the telescopic rod 407.

[0035] Furthermore, the sealing gasket 402 will be placed on the outer wall of the modular interface 200 to seal against dust and water. The slider 404 can slide up and down along the outer wall of the guide rod 405. When it moves up, it will compress the first spring 405a. The telescopic rod 407 will limit the second spring 407a. The second spring 407a mainly plays a stretching role when the connecting frame 406 moves.

[0036] The operation process of this embodiment is as follows: When the integrated box is not in use, the pressure plate 401 is pressed against the outside of the modular interface 200. The sealing gasket 402 is located on the outside of the modular interface 200 to prevent dust and water. When it is necessary to connect an external sensor, the pressure plate 401 is pulled outward first. The pressure plate 401 is subjected to force and moves the connecting frame 406 outward through the slider 404, and stretches the telescopic rod 407 and the second spring 407a. Then, the pressure plate 401 is pulled upward. The pressure plate 401 is subjected to force and moves upward under the action of the slider 404 and the guide rod 405, and squeezes the first spring 405a. At this time, the pressure plate 401 can be moved out of the outside of the modular interface 200. Then, the sensor connector can be inserted into the modular interface 200. Then, the force applied to the pressure plate 401 is stopped, so that the slot 403a on the card plate 403 is locked on the outer wall of the sensor connector, which plays a limiting role and ensures the stability of the sensor connector.

[0037] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A modular multi-sensor data acquisition integration box, comprising a lower shell (100) and an upper shell (101) mounted on top of it by screws, characterized in that: The upper shell (101) has modular interfaces (200) arranged in an array from front to back on one side wall. The processor motherboard (300) is installed inside the lower shell (100) by screws. The upper shell (101) has protective limiting components (400) on its outer wall. The protective limiting component (400) includes a pressure plate (401) disposed on the outside of the modular interface (200) and a clamping plate (403) fixed at the bottom center of the pressure plate (401).

2. The modular multi-sensor data acquisition integration box according to claim 1, characterized in that, A charging port (101a) is provided at the center of the other side wall of the upper shell (101), and a display panel (101b) is provided at the center of the top of the upper shell (101).

3. The modular multi-sensor data acquisition integration box according to claim 2, characterized in that, The upper shell (101) has a mounting bracket (102) installed inside the top of the interior by screws, and a lithium battery (102a) is installed inside the mounting bracket (102).

4. The modular multi-sensor data acquisition integration box according to claim 1, characterized in that, A multi-protocol communication module (301) is provided on one end of the surface of the processor motherboard (300), and the multi-protocol communication module (301) is electrically connected to the adjacent modular interface (200).

5. A modular multi-sensor data acquisition integration box according to claim 1, characterized in that, The pressure plate (401) has sealing gaskets (402) attached in an array from front to back on one side wall, and the bottom of the card plate (403) has card slots (403a) from front to back.

6. A modular multi-sensor data acquisition integration box according to claim 5, characterized in that, The front and rear ends of the pressure plate (401) are both fixed with sliders (404), and the sliding holes in the sliders (404) are slidably installed on the outer wall of the guide rod (405). A first spring (405a) is sleeved on the outer wall of the guide rod (405).

7. A modular multi-sensor data acquisition integration box according to claim 6, characterized in that, The two ends of the guide rod (405) are fixed on the inner wall of the connecting frame (406), and the first spring (405a) is located between the upper surface of the slider (404) and the inner wall of the connecting frame (406).

8. A modular multi-sensor data acquisition integration box according to claim 7, characterized in that, A telescopic rod (407) is installed in the middle of one side wall of the connecting frame (406), and the other end of the telescopic rod (407) is installed on the outer wall of the upper shell (101). A second spring (407a) is sleeved on the outer wall of the telescopic rod (407).