Mobile phone mainboard edge defect detection device

Abstract

The utility model relates to the field of mobile phone mainboard detection, and discloses a mobile phone mainboard edge defect detection device which comprises a mainboard defect detection table, a mainboard placement table fixedly installed at the top of the mainboard defect detection table, a mobile phone mainboard slidably installed at the top of the mainboard placement table, and a portal frame fixedly installed at the top of the mainboard defect detection table. The mobile phone mainboard edge defect detection device further comprises a mainboard edge defect detection assembly, an arranged defect detection plate is matched with a reset spring, the mobile phone mainboard edge defect detection device can automatically adapt to and be clamped into edge defects of a mobile phone mainboard, manual one-by-one detection is not needed, and the detection efficiency is greatly improved; by utilizing a linkage mechanism of the inspection rod and the defect observation rod, when the defect inspection plate is clamped into a defect, the inspection rod can push the defect observation rod to rotate and incline on the pin shaft, and the position and degree of the defect can be accurately judged by observing the inclination, so that the detection accuracy is improved.

Description

Technical Field

[0001] This utility model relates to the field of mobile phone motherboard testing, specifically a mobile phone motherboard edge defect detection device. Background Technology

[0002] With the widespread adoption of smartphones and their ever-improving functionality, the quality and reliability of the motherboard, as a core component of mobile phones, are receiving increasing attention. During the manufacturing process, various factors (such as material defects and manufacturing process flaws) can lead to edge defects in the motherboard, such as chipping, missing pieces, and breakage. These defects not only affect the appearance of the motherboard but can also severely impact its performance and reliability. Therefore, efficient and accurate detection of edge defects in mobile phone motherboards is of great significance. In the production process of mobile phone motherboards, various factors (such as material defects and insufficient manufacturing processes) can cause serious defects such as chipping and missing pieces to appear at the edges. These edge defects not only damage the appearance of the motherboard but can also pose a serious threat to its overall performance and long-term reliability. Therefore, we propose a mobile phone motherboard edge defect detection device. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a mobile phone motherboard edge defect detection device, which solves the aforementioned problems.

[0004] To achieve the above-mentioned objectives, this utility model provides the following technical solution: a mobile phone motherboard edge defect detection device, comprising a motherboard defect detection platform, a motherboard placement platform fixedly installed on the top of the motherboard defect detection platform, a mobile phone motherboard slidably installed on the top of the motherboard placement platform, a gantry fixedly installed on the top of the motherboard defect detection platform, and an L-shaped stabilizing rod slidably installed on the gantry, and further comprising:

[0005] The motherboard edge defect inspection component is mounted on a gantry and is used to inspect for defects on both sides of the motherboard edge.

[0006] Preferably, a movable groove is provided at the top of the motherboard placement platform corresponding to the middle position, and a vertical push plate is slidably installed in the movable groove. A horizontal straight rod is fixed to the side of the push plate away from the motherboard of the mobile phone.

[0007] Preferably, a return spring is fixedly connected to the inner walls of both sides of the gantry frame, and a moving block is fixedly connected to the ends of the two sets of return springs that are close to each other.

[0008] Preferably, one end of each of the two sets of stabilizing rods is fixedly connected to the bottom end of the two sets of moving blocks, and the other end of each set of stabilizing rods slides out of the gantry frame.

[0009] Preferably, the defect inspection component at the edge of the motherboard includes a defect inspection plate, a slide bar, a slide groove, and an inspection rod. The top of the gantry is provided with slide grooves above the two sets of moving blocks respectively. Vertical slide bars are slidably connected in the slide grooves. The bottom end of the slide bar is fixedly connected to the top of the moving block. A defect inspection plate for inspecting motherboard defects is fixedly connected to one side of each set of moving blocks. An inspection rod is fixedly connected to one side of each set of slide bars that are close to each other.

[0010] Preferably, the defect inspection assembly at the edge of the motherboard further includes a comparison plate, a pin, and a defect observation rod. A pair of vertical comparison plates are fixed between the top of the gantry and the two sets of slide grooves. A horizontal pin is fixed between the middle of the pair of comparison plates. A defect observation rod for observing motherboard defects is rotatably sleeved on the outer wall of the pin.

[0011] Preferably, one end of one set of inspection rods is fixed to one side of the slide rod near the middle position, and the other end of the inspection rod is attached to one side of the defect observation rod near the bottom position; the other set of inspection rods is fixed to one side of the slide rod near the top position, and the other end of the inspection rod is attached to the other side of the defect observation rod near the top position.

[0012] Compared with the prior art, this utility model provides a mobile phone motherboard edge defect detection device, which has the following beneficial effects:

[0013] 1. This mobile phone motherboard edge defect detection device, through the cooperation of the defect inspection plate and the reset spring, can automatically adapt to and lock into the edge defects of the mobile phone motherboard, eliminating the need for manual inspection and greatly improving detection efficiency.

[0014] 2. This mobile phone motherboard edge defect detection device utilizes a linkage mechanism between an inspection rod and a defect observation rod. When the defect inspection board is inserted into the defect, the inspection rod will push the defect observation rod to rotate and tilt on the pin shaft. By observing the tilt, the location and extent of the defect can be accurately determined, thus improving the accuracy of the detection.

[0015] 3. This mobile phone motherboard edge defect detection device is applicable to the detection of edge defects of mobile phone motherboards of different sizes and shapes. By adjusting the position of the push plate and the defect inspection plate, it can adapt to the detection needs of motherboards of different specifications. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the defect inspection board of this utility model;

[0018] Figure 3 for Figure 2 A magnified view of part A in the diagram.

[0019] In the diagram: 1. Motherboard defect inspection station; 2. Motherboard placement station; 3. Mobile phone motherboard; 4. Moving slot; 5. Push plate; 6. Straight rod; 7. Gantry frame; 8. Return spring; 9. Moving block; 10. Defect inspection plate; 11. Stabilizing rod; 12. Sliding rod; 13. Inspection rod; 14. Comparison plate; 15. Pin shaft; 16. Defect observation rod; 17. Sliding slot. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-3 A mobile phone motherboard edge defect detection device includes a motherboard defect detection platform 1, a motherboard placement platform 2 fixedly mounted on the top of the motherboard defect detection platform 1, a mobile phone motherboard 3 slidably mounted on the top of the motherboard placement platform 2, a gantry frame 7 fixedly mounted on the top of the motherboard defect detection platform 1, and an L-shaped stabilizing rod 11 slidably mounted on the gantry frame 7. The device also includes:

[0022] The motherboard edge defect inspection component is mounted on the gantry 7 and is used to inspect defects on both sides of the motherboard edge.

[0023] A movable groove 4 is provided at the top center of the motherboard placement platform 2. A vertical push plate 5 is slidably installed in the movable groove 4. A horizontal straight rod 6 is fixed to the side of the push plate 5 away from the mobile phone motherboard 3. The mobile phone motherboard 3 is pushed between the two sets of defect inspection plates 10, so that one end of the mobile phone motherboard 3 is completely in contact with the side of the push plate 5. The push plate 5 is pushed by the straight rod 6, so that the push plate 5 slides on the movable groove 4 while the mobile phone motherboard 3 slides between the two sets of defect inspection plates 10.

[0024] Both sides of the inner wall of the gantry 7 are fixed with return springs 8. The ends of the two sets of return springs 8 that are close to each other are fixed with moving blocks 9. When in use, first place the mobile phone motherboard 3 on the top of the motherboard placement platform 2, and then pull the two sets of moving blocks 9 in opposite directions so that the slide bar 12 slides in the slide groove 17. The stabilizing rod 11 slides synchronously with the moving blocks 9. The return spring 8 is compressed and shortened by the sliding of the moving blocks 9.

[0025] One end of each of the two sets of stabilizing rods 11 is fixed to the bottom of the two sets of moving blocks 9 respectively. The other ends of the two sets of stabilizing rods 11 extend out of the gantry 7. When in use, first place the mobile phone motherboard 3 on the top of the motherboard placement platform 2, and then pull the two sets of moving blocks 9 in opposite directions so that the slide bar 12 slides in the slide groove 17. The stabilizing rod 11 slides synchronously with the moving block 9 to ensure the stability of the moving block 9 when it slides.

[0026] The defect inspection assembly at the edge of the motherboard includes a defect inspection plate 10, a slide bar 12, a slide groove 17, and an inspection rod 13. The top of the gantry 7 is provided with slide grooves 17 above the two sets of moving blocks 9 respectively. Vertical slide bars 12 are slidably connected in the slide grooves 17. The bottom end of the slide bar 12 is fixedly connected to the top of the moving block 9. The defect inspection plate 10 for inspecting motherboard defects is fixedly connected to one side of each set of moving blocks 9. The inspection rod 13 is fixedly connected to one side of each set of slide bars 12 that are close to each other. When the defect of the mobile phone motherboard 3 comes into contact with the defect inspection plate 10, the defect inspection plate 10 is pressed into the defect by the squeezing force of the return spring 8. The slide bar 12 slides in the slide groove 17 by the movement of the moving block 9. The slide bar 12 pushes the inspection rod 13 when it slides.

[0027] The defect inspection assembly at the edge of the motherboard also includes a comparison plate 14, a pin 15, and a defect observation rod 16. A pair of vertical comparison plates 14 are fixedly installed on the top of the gantry 7 between two sets of slide grooves 17. A horizontal pin 15 is fixedly connected between the middle of the pair of comparison plates 14. The outer wall of the pin 15 is rotatably sleeved with a defect observation rod 16 for observing defects on the motherboard. Since the end of the inspection rod 13 away from the slide rod 12 is in contact with the defect observation rod 16, the inspection rod 13 pushes the defect observation rod 16 when it moves, causing the defect observation rod 16 to rotate and tilt on the pin 15.

[0028] One end of one set of inspection rods 13 is fixed to one side of the slide rod 12 near the middle position, and the other end of the inspection rod 13 is attached to one side of the defect observation rod 16 near the bottom position. The other end of the inspection rod 13 is fixed to one side of the slide rod 12 near the top position, and the other end of the inspection rod 13 is attached to the other side of the defect observation rod 16 near the top position. By comparing the tilt of the two sets of comparison plates 14 with the defect observation rod 16, defects can be viewed on the mobile phone motherboard 3.

[0029] Structural Description: Mainboard Defect Inspection Station 1: Serves as the basic support platform for the entire inspection device, used to place and fix other components to ensure the stability of the inspection;

[0030] Motherboard placement platform 2: Fixed on top of motherboard defect detection platform 1, used to place the mobile phone motherboard 3 to be inspected, so as to facilitate the detection of edge defects;

[0031] Mobile phone motherboard 3: Placed on motherboard placement platform 2, it is the object of inspection. The quality and reliability of the motherboard are evaluated by inspecting its edge defects.

[0032] Motion slot 4: Located on top of the motherboard defect detection station 1 or related components, it allows the push plate 5 to slide within it to push the mobile phone motherboard 3 to adjust its position;

[0033] Push plate 5: Slidably installed in the moving slot 4, it slides on the mobile phone motherboard 3 by being pushed by the straight rod 6, which helps to adjust the position of the motherboard for better testing;

[0034] Straight rod 6: Fixed to one side of push plate 5, used to provide pushing force so that push plate 5 slides in moving groove 4;

[0035] Gantry 7: Fixed to the top of the motherboard defect inspection station 1, serving as a support frame for the inspection components and ensuring the relative stability of each component;

[0036] Return spring 8: It is fixed between the inner walls on both sides of the gantry 7 and the moving block 9, and is used to provide the necessary elastic restoring force during the inspection process to help the defect inspection plate 10 snap into and adapt to the defects on the edge of the main board;

[0037] Moving block 9: Slidingly mounted on gantry 7, connected to return spring 8 and defect inspection plate 10, and moved by pulling or pushing to move the position of defect inspection plate 10;

[0038] Defect inspection plate 10: It is fixed to one side of the moving block 9 and is used to directly contact and detect edge defects of the mobile phone motherboard 3. It is inserted into the defect by the squeezing force of the reset spring 8.

[0039] Stabilizer bar 11: L-shaped, slidably mounted on gantry 7, connected to moving block 9, used to enhance the stability of moving block 9 when it slides;

[0040] Slide rod 12: Fixed to the top of the moving block 9 and connected to the inspection rod 13, used to transmit the sliding power of the moving block 9 to the inspection rod 13;

[0041] Inspection rod 13: One end is fixed to the slide rod 12, and the other end is attached to the defect observation rod 16, which is used to push the defect observation rod 16 to rotate when the moving block 9 slides;

[0042] Comparison plate 14: Fixed to the top of the gantry 7, serving as a reference for the rotation of the defect observation rod 16, and helping to determine the degree of tilt of the defect;

[0043] Pin 15: Fixed between the comparison plates 14, serving as the rotation axis of the defect observation rod 16, allowing the defect observation rod 16 to rotate freely on it;

[0044] Defect observation rod 16: Rotatably sleeved on pin 15, it rotates by the push of inspection rod 13, and its tilt reflects the edge defects of the mobile phone motherboard 3.

[0045] Working principle: In use, first place the mobile phone motherboard 3 on top of the motherboard placement platform 2, then pull the two sets of moving blocks 9 in opposite directions, causing the slide bar 12 to slide within the slide groove 17. The stabilizing rod 11 slides synchronously with the moving block 9 to ensure the stability of the moving block 9 during sliding. The return spring 8 is compressed and shortened by the sliding of the moving block 9. Then, push the mobile phone motherboard 3 between the two sets of defect inspection plates 10, so that one end of the mobile phone motherboard 3 is completely in contact with the side of the push plate 5. Use the straight rod 6 to push the push plate 5, so that the push plate 5 slides on the moving groove 4 while the mobile phone motherboard 3 slides on the two sets of defect inspection plates 10. The inspection plates 10 slide between each other. When the defect of the mobile phone motherboard 3 comes into contact with the defect inspection plate 10, the defect inspection plate 10 is pressed into the defect by the extrusion force of the return spring 8. The movement of the moving block 9 causes the slide rod 12 to slide in the slide groove 17. When the slide rod 12 slides, it pushes the inspection rod 13. Since the end of the inspection rod 13 away from the slide rod 12 is in contact with the defect observation rod 16, the inspection rod 13 pushes the defect observation rod 16 when it moves, causing the defect observation rod 16 to rotate and tilt on the pin 15. By comparing the tilt with the defect observation rod 16 using two sets of comparison plates 14, the defect of the mobile phone motherboard 3 can be viewed.

[0046] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A device for detecting edge defects on a mobile phone motherboard, comprising a motherboard defect detection platform (1), characterized in that: The motherboard defect detection platform (1) is fixedly mounted on top of a motherboard placement platform (2), and a mobile phone motherboard (3) is slidably mounted on top of the motherboard placement platform (2). A gantry frame (7) is fixedly mounted on top of the motherboard defect detection platform (1), and an L-shaped stabilizing rod (11) is slidably mounted on the gantry frame (7). The platform also includes: The motherboard edge defect inspection component is set on the gantry (7) and is used to inspect defects on both sides of the motherboard edge.

2. The mobile phone motherboard edge defect detection device according to claim 1, characterized in that: The top of the motherboard placement platform (2) is provided with a moving groove (4) corresponding to the middle position. A vertical push plate (5) is slidably installed in the moving groove (4). A horizontal straight rod (6) is fixed to the side of the push plate (5) away from the mobile phone motherboard (3).

3. The mobile phone motherboard edge defect detection device according to claim 1, characterized in that: Both sides of the inner wall of the gantry frame (7) are fixed with return springs (8), and the ends of the two sets of return springs (8) that are close to each other are fixed with moving blocks (9).

4. The mobile phone motherboard edge defect detection device according to claim 3, characterized in that: One end of each of the two sets of stabilizer bars (11) is fixed to the bottom of the two sets of moving blocks (9), and the other end of each set of stabilizer bars (11) slides out of the gantry frame (7).

5. The mobile phone motherboard edge defect detection device according to claim 4, characterized in that: The defect inspection assembly at the edge of the motherboard includes a defect inspection plate (10), a slide bar (12), a slide groove (17), and an inspection rod (13). The top of the gantry (7) is provided with a slide groove (17) above each of the two sets of moving blocks (9). A vertical slide bar (12) is slidably connected in the slide groove (17). The bottom end of the slide bar (12) is fixedly connected to the top of the moving block (9). A defect inspection plate (10) for inspecting motherboard defects is fixedly connected to one side of each of the two sets of moving blocks (9). An inspection rod (13) is fixedly connected to one side of each of the two sets of slide bars (12) that are close to each other.

6. The mobile phone motherboard edge defect detection device according to claim 5, characterized in that: The defect inspection assembly at the edge of the motherboard also includes a comparison plate (14), a pin (15), and a defect observation rod (16). A pair of vertical comparison plates (14) are fixed between the top of the gantry (7) and the two sets of slides (17). A horizontal pin (15) is fixed between the middle of the pair of comparison plates (14). The outer wall of the pin (15) is rotatably sleeved with a defect observation rod (16) for observing defects on the motherboard.

7. The mobile phone motherboard edge defect detection device according to claim 6, characterized in that: One end of one set of inspection rods (13) is fixed to one side of the slide rod (12) near the middle position, and the other end of the inspection rod (13) is attached to one side of the defect observation rod (16) near the bottom position. The other set of inspection rods (13) is fixed to one side of the slide rod (12) near the top position, and the other end of the inspection rod (13) is attached to the other side of the defect observation rod (16) near the top position.

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