Pickup device and electronic equipment
By installing a buffer at the sound inlet of the pickup device to reduce airflow speed, the problem of diaphragm damage caused by the dual-hole design was solved, achieving good directional recording effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HONOR DEVICE CO LTD
- Filing Date
- 2025-04-14
- Publication Date
- 2026-04-14
AI Technical Summary
In existing electronic devices, the dual-aperture pickup design is prone to damage to the MEMS diaphragm under strong airflow impact, affecting the recording effect.
Buffers are installed at the first and second sound inlets of the pickup device to reduce airflow speed, and a directional recording effect is achieved through a double-hole structure to avoid diaphragm damage.
It effectively reduces the impact of airflow on the diaphragm, improves the directional recording effect, and avoids the problem of diaphragm damage due to strong airflow.
Smart Images
Figure CN224124164U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of audio equipment technology, and in particular to a sound pickup device and electronic device. Background Technology
[0002] To meet users' needs for voice calls, video calls, and recording in their daily lives and work, most electronic devices have call or recording functions, such as mobile phones, tablets, music players, and voice recorders. Generally, electronic devices achieve call or recording functions through an integrated microphone (mic, also known as a microphone). A microphone is an energy conversion device that converts sound signals into electrical signals. When sound vibrations reach the microphone diaphragm, the diaphragm vibrates, causing a change in the capacitance between the diaphragm and the back plate, thus generating a changing electrical signal. This signal is then processed by the sound processing circuitry before being transmitted to the other end of the call or stored, thereby enabling the call or recording.
[0003] However, in order to achieve good far-field directional recording in electronic devices, dual-aperture pickup is usually set up. But the dual-aperture design can cause the diaphragm of the micro-electro-mechanical system (MEMS) to break under the impact of strong airflow, reducing the reliability of air blowing. Utility Model Content
[0004] To address the aforementioned technical problems, embodiments of this application provide a sound pickup device and an electronic device that improve the directional recording effect of the sound pickup device while reducing the impact of airflow on the diaphragm.
[0005] In a first aspect, embodiments of this application provide a sound pickup device, including a pickup housing, a pickup circuit board, a processing module, and a diaphragm. The pickup housing and the pickup circuit board surround a receiving cavity. The pickup circuit board includes a first sound inlet, which corresponds to a sound pickup channel for transmitting sound signals. The diaphragm is disposed within the receiving cavity and faces the first sound inlet. The diaphragm is used to vibrate according to the sound signal to generate a corresponding electrical signal and transmit it to the processing module. The processing module is used to process the electrical signal to complete the acquisition of the sound signal. The sound pickup device also includes a first buffer, which is disposed on the side of the first sound inlet adjacent to the sound pickup channel, and is used to reduce the airflow velocity when the first sound inlet receives the sound signal from the sound pickup channel. By providing a first buffer at the first sound inlet, the airflow velocity at the first sound inlet is effectively reduced, thereby reducing the possibility of damage to the diaphragm by strong airflow.
[0006] Optionally, the pickup device further includes a second sound inlet and a second buffer. The second sound inlet is disposed on the pickup circuit board or the pickup housing, and the second buffer is disposed on the second sound inlet and located outside the receiving cavity, for reducing the airflow velocity at the second sound inlet. By simultaneously setting the first and second sound inlets to form a double-aperture structure on the pickup device, a good far-field directional recording effect can be effectively achieved. However, the double opening further enhances the airflow velocity at the sound inlet. By simultaneously setting the first and second buffers at the first and second sound inlets, the airflow velocity at both sound inlets can be further reduced, avoiding the problem of diaphragm damage caused by the increased airflow velocity due to the double opening.
[0007] Optionally, the second sound inlet and the first sound inlet are arranged side-by-side on the pickup circuit board at a predetermined distance along a first direction. The second sound inlet is located on the side of the processing module away from the diaphragm, and the first direction is parallel to the plane of the pickup circuit board. By simultaneously arranging the first and second sound inlets on the pickup circuit board, space can be saved while reducing the airflow speed between the first and second sound inlets.
[0008] Optionally, the microphone housing includes a first housing and a second housing. The plane of the first housing is parallel to the plane of the microphone circuit board, and the plane of the second housing is perpendicular to the plane of the microphone circuit board. The second sound inlet is disposed in the first housing, and the first sound inlet and the second sound inlet are spaced apart by a preset distance along a first direction. By disposing of the second sound inlet in the first housing, such that the first sound inlet and the second sound inlet face each other, the directional recording effect of the microphone can be improved.
[0009] Optionally, the pickup housing includes a first housing and a second housing. The plane of the first housing is parallel to the plane of the pickup circuit board, and the plane of the second housing is perpendicular to the pickup circuit board. The second sound inlet is disposed in the second housing, and the second sound inlet does not coincide with the orthographic projection of the diaphragm along the first direction. By disposing the second sound inlet in the second housing, the airflow speed between the first and second sound inlets can be reduced while maintaining directional recording effects.
[0010] Optionally, the sound pickup device further includes a first pipe and a second pipe, wherein the opening of one end of the first pipe is positioned facing the first sound inlet and covering the first sound inlet, and the opening of one end of the second pipe is positioned facing the second sound inlet and covering the second sound inlet, wherein the sound signal is transmitted to the first sound inlet through the first pipe and to the second sound inlet through the second pipe.
[0011] Optionally, the pickup device further includes a first dustproof component and a second dustproof component. The first dustproof component is disposed inside the first duct and covers the first sound inlet, and the second dustproof component is disposed inside the second duct and covers the second sound inlet. By providing dustproof components at the first and second sound inlets, moisture and dust can be prevented from entering the pickup device through the sound inlets.
[0012] Optionally, the first buffer is disposed inside the first duct and stacked with the first dustproof component, and the second buffer is disposed inside the second duct and stacked with the second dustproof component. By simultaneously providing a buffer and a dustproof component, the dustproof effect and the airflow speed can be further improved.
[0013] Optionally, the first buffer and the second buffer are in the form of a disc, and at least one through hole is provided on the first buffer and the second buffer. The airflow in the first pipe is transmitted to the first sound inlet through the through hole, and the airflow in the second pipe is transmitted to the second sound inlet through the through hole. On the first buffer, the area of the through hole accounts for 1 / 20 to 1 / 9 of the area of the first buffer.
[0014] Secondly, embodiments of this application provide an electronic device, including a housing assembly, a circuit board, and a sound pickup device as described above. The housing assembly includes a middle frame and a rear cover, which enclose a receiving space. The sound pickup device and the circuit board are disposed in the receiving space. The sound pickup device is disposed on the circuit board and electrically connected to the circuit board. The housing assembly has a sound inlet slot that communicates with the receiving space. External sound signals are transmitted to the sound pickup device through the sound inlet slot. The sound pickup device converts the received sound signals into electrical signals and transmits them.
[0015] Compared to existing technologies, this invention effectively reduces airflow speed by providing a first buffer at the first sound inlet, thereby preventing strong airflow from impacting the diaphragm. Furthermore, a second sound inlet is provided, with a corresponding second buffer. The first and second sound inlets form a double-opening structure on the pickup device, which effectively enhances directional recording. At the same time, the first and second buffers reduce the airflow speed between the first and second sound inlets, thus preventing excessive airflow speed caused by the double-opening structure from damaging the diaphragm. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 A schematic diagram of the disassembled structure of an electronic device provided in an embodiment of this application;
[0018] Figure 2 for Figure 1 A schematic diagram of the transmission of sound signals in electronic devices;
[0019] Figure 3 This is a schematic diagram of the cross-sectional structure of a pickup device in related technologies;
[0020] Figure 4 This is a schematic cross-sectional view of a sound pickup device provided in an embodiment of this application;
[0021] Figure 5 for Figure 4 A cross-sectional structural diagram of the first sound inlet in the middle;
[0022] Figure 6 for Figure 4 A schematic diagram of the side structure of the first dustproof component;
[0023] Figure 7 for Figure 4 A schematic diagram of the planar structure of the first buffer component;
[0024] Figure 8 This is a schematic diagram of the planar structure of the first buffer in another embodiment;
[0025] Figure 9 This is a schematic cross-sectional view of a sound pickup device provided in the second embodiment of this application;
[0026] Figure 10 for Figure 9 A schematic diagram of the cross-sectional structure at the first and second sound inlets;
[0027] Figure 11 This is a schematic cross-sectional view of a sound pickup device provided in the third embodiment of this application; Detailed Implementation
[0028] To facilitate a clear description of the technical solutions of this application, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" do not necessarily imply that they are different.
[0029] References to "one embodiment" or "some embodiments" as described in this application specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this application specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.
[0030] Before providing a detailed explanation of the electronic devices provided in the embodiments of this application, the application scenarios of these embodiments will be described first. The embodiments of this application provide an electronic device that is a type of electronic device with a sound pickup device, specifically including handheld devices, vehicle-mounted devices, etc., with sound pickup functionality. For example, some electronic devices include: mobile phones, tablets, PDAs, laptops, mobile internet devices (MIDs), wearable devices, virtual reality (VR) devices, augmented reality (AR) devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical surgery, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, wireless terminals in smart homes, cellular phones, cordless phones, session initiation protocol (SIP) phones, wireless local loop (WLL) stations, personal digital assistants (PDAs), or terminal devices in future public land mobile networks (PLMNs), etc., and the embodiments of this application are not limited to these.
[0031] The electronic devices in the embodiments of this application may also be referred to as: terminal equipment, user equipment (UE), mobile station (MS), mobile terminal (MT), access terminal, user unit, user station, mobile station, mobile station, remote station, remote terminal, mobile device, user terminal, terminal, wireless communication equipment, user agent, or user device, etc.
[0032] Please see Figure 1 , Figure 1 This is a schematic diagram of the disassembled structure of an electronic device provided in an embodiment of this application.
[0033] like Figure 1As shown, the electronic device 1000 includes a housing assembly 100, a microphone 200, and a circuit board 300. The housing assembly 100 has an accommodating space 101, in which the microphone 200 and the circuit board 300 are housed. The microphone 200 can be a microphone.
[0034] Specifically, the housing assembly 100 generally includes a mid-frame 102 and a rear cover 103, which together form the aforementioned accommodating space 101. It is understood that the electronic device 1000 may also generally include a display assembly (not shown), which is located on the side of the mid-frame 102 opposite to the rear cover 103. That is, the mid-frame 102 is used to connect the display assembly and, together with the rear cover 103, forms the aforementioned accommodating space 101.
[0035] The housing assembly 100 has a sound inlet slot 104, which connects to the accommodating space 101. In this embodiment, the sound inlet slot 104 is located on the middle frame 102, allowing external sound signals to be transmitted to the pickup device 200 through the sound inlet slot 104. The pickup device 200 converts the received sound signals into electrical signals and transmits them. The pickup device 200 is mounted on the circuit board 300 and electrically connected to the circuit board 300 for electrical signal transmission.
[0036] See also Figure 2 , Figure 2 for Figure 1 A schematic diagram of the transmission of audio signals in electronic device 1000.
[0037] like Figure 2 As shown, a sound inlet 301 is provided on the circuit board 300, which connects to the acoustic cavity of the pickup device 200. The electronic device 1000's accommodating space 101 contains a pickup channel 105 connecting the sound inlet slot 104 and the sound inlet 301. External sound signals enter through the sound inlet slot 104, pass through the pickup channel 105 and the sound inlet 301, and are then transmitted to the pickup device 200. Understandably, when external sound signals enter the pickup channel 105 from the sound inlet slot 104, external dust or moisture will inevitably enter the pickup channel 105 and flow into the pickup device 200, thus affecting its normal operation.
[0038] Please see Figure 3 , Figure 3 This is a schematic diagram of the cross-sectional structure of the pickup device 200 in the related technology.
[0039] like Figure 3As shown, the sound pickup device 200 includes a pickup housing 21, a pickup circuit board 22, a processing module 23, and a diaphragm 24. The pickup housing 21 and the pickup circuit board 22 form a receiving cavity 201, within which the processing module 23 and the diaphragm 24 are housed. The diaphragm 24 and the processing module 23 are electrically connected. The diaphragm 24 converts the received sound signal into an electrical signal and transmits it to the processing module 23. The processing module 23 processes the received electrical signal and transmits it to the circuit board 300 of the electronic device, thus completing the signal transmission. Additionally, control signals from the electronic device can also be transmitted to the diaphragm 24 via the processing module 23, enabling the diaphragm 24 to perform corresponding functions.
[0040] Specifically, the diaphragm 24 and the processing module 23 are disposed on the pickup circuit board 22, and the processing module 23 and the pickup circuit board 22 are electrically connected. The pickup circuit board 22 is electrically connected to the circuit board 300 of the electronic device. The pickup circuit board 22 has a plurality of spaced-apart pads 221 on one side connected to the circuit board 300, and the processing module 23 can achieve electrical connection with the circuit board 300 of the electronic device via these pads 221.
[0041] Furthermore, the pickup circuit board 22 has a sound inlet 222, which is connected to the sound inlet hole 301. Figure 2 Corresponding settings. That is, the sound inlet 222 connects the pickup channel 105 and the diaphragm 24 so that external sound signals can be transmitted to the diaphragm 24 through the pickup channel 105.
[0042] It should be noted that the microphone 200 is generally mounted on the circuit board 300 of an electronic device using SMT (Surface Mount Technology). This electronic device generally includes mobile phones, tablets, laptops, handheld game consoles, in-vehicle computers, smart wearable devices (including Bluetooth headsets), and smart home appliances. The circuit board 300 can be a conventional printed circuit board (PCB) substrate. It should be noted that the term "circuit board" as used herein refers to any dielectric substrate, PCB, ceramic substrate, or other circuit-carrying structure used to carry signal circuits and electronic components within an electronic device.
[0043] The pickup device 200 converts sound into electrical signals through an acoustic cavity. The acoustic cavity can affect the audio performance of the pickup device 200, and thus the audio performance of the audio system including the pickup device 200. For example, the acoustic cavity can affect the frequency response, speech intelligibility, background noise suppression, efficiency, signal-to-noise ratio, and sound quality of the audio system.
[0044] Understandably, when an internal microphone (e.g., a microphone mounted inside an electronic device via SMT) is subjected to EMI (Electro-Magnetic Interference) from internal or external sources (such as power amplifiers, RF subsystems, antennas, digital circuits, clock circuits, etc.), it may affect the audio system including the microphone. Therefore, in this embodiment, the housing 21 is generally made of metal and is fixedly connected to the pickup circuit board 22 to form an acoustic cavity. The housing 21 is electrically connected to a portion of the pads 221 so that, after the pickup device 200 is assembled into the electronic device, these pads 221 are used to connect to the ground of the circuit board 300 on the electronic device, grounding the housing 21 to prevent RF energy emitted by the antenna from interfering with the internal circuitry of the pickup device 200.
[0045] It should be noted that the processing module 23 can be an ASIC chip (Application Specific Integrated Circuit). The output pins and ground pins of the processing module 23 are connected to the pickup circuit board 22 through wires, solder joints, etc.
[0046] For example, taking a MEMS (Micro-Electro-Mechanical-System) microphone as an example, external sound signals can be transmitted to the back cavity of the MEMS device diaphragm 24 via the pickup channel 105 to drive the diaphragm on the front of the MEMS device to vibrate and generate an electrical signal corresponding to the sound signal. The MEMS device is connected to the processing module 23 via gold wires, realizing signal communication between the MEMS device and the processing module 23. This allows the processing module 23 to receive the aforementioned electrical signal and output it to the circuit board 300 of the electronic device via the aforementioned pad 221, thereby enabling the electronic device to collect the user's input sound.
[0047] In related technologies, a single sound inlet 222 is typically used for sound acquisition. However, the far-field directional recording effect of single-hole sound pickup is poor. Based on this, this application provides a sound pickup device that can effectively improve the far-field directional recording effect.
[0048] Please see Figure 4 , Figure 4 This is a cross-sectional structural diagram of a sound pickup device provided in an embodiment of this application.
[0049] like Figure 4As shown, the sound pickup device 200 includes a pickup housing 21, a pickup circuit board 22, a processing module 23, and a diaphragm 24. The pickup housing 21 and the pickup circuit board 22 form a receiving cavity 201, within which the processing module 23 and the diaphragm 24 are disposed. The diaphragm 24 is electrically connected to the processing module 23. The diaphragm 24 converts the received sound into an electrical signal and transmits it to the processing module 23. The processing module 23 processes the received electrical signal and transmits it to the circuit board 300 of the electronic device, thus completing the acquisition and transmission of the sound signal. Additionally, control signals from the electronic device can also be transmitted to the diaphragm 24 via the processing module 23, enabling the diaphragm 24 to perform corresponding functions.
[0050] The pickup circuit board 22 includes a first sound inlet 222a, which corresponds to the sound pickup channel 105 for transmitting sound signals. A diaphragm 24 is disposed in the receiving cavity 201 and faces the first sound inlet 222a. The diaphragm 24 is used to generate vibrations according to the sound signal to generate a corresponding electrical signal and transmit it to the processing module 23. The processing module 23 is used to process the electrical signal to complete the acquisition of the sound signal. The pickup device 200 also includes a first buffer 27a, which is disposed on the side of the first sound inlet 222a adjacent to the sound pickup channel 105 and is used to reduce the airflow speed when the first sound inlet 222a receives the sound signal from the sound pickup channel 105.
[0051] Furthermore, the pickup device 200 also includes a second sound inlet 222b, wherein the second sound inlet 222b is formed on the pickup housing 21, wherein the pickup housing 21 includes a first housing 211 and a second housing 212, wherein the plane of the first housing 211 is parallel to the pickup circuit board 22, and the plane of the second housing 212 is perpendicular to the pickup circuit board 22, and the second sound inlet 222b is disposed on the first housing 211, that is, the second sound inlet 222b is disposed on the housing of the pickup housing 21 parallel to the pickup circuit board 22.
[0052] The pickup device 200 also includes a first conduit 25a and a second conduit 25b. The first conduit 25a is configured to correspond to a first sound inlet 222a, and the second conduit 25b is configured to correspond to a second sound inlet 222b. One end of the first conduit 25a faces the first sound inlet 222a, and one end of the second conduit 25b faces the second sound inlet 222b. External sound signals are transmitted through the first conduit 25a to the first sound inlet 222a and through the second conduit 25b to the second sound inlet 222b. The first conduit 25a and the second conduit 25b constitute the pickup channel 105. Figure 2 ).
[0053] In this embodiment, taking a Micro-Electro-Mechanical-System (MEMS) microphone as an example, external sound signals can be transmitted to the back cavity of the MEMS device diaphragm 24 via the pickup channels 105 (first channel 25a, second channel 25b) to drive the diaphragm on the front of the MEMS device to vibrate and generate an electrical signal corresponding to the sound signal. The MEMS device is connected to the processing module 23 via gold wires, realizing signal communication between the MEMS device and the processing module 23, so that the processing module 23 receives the above-mentioned electrical signal and outputs the electrical signal to the circuit board 300 of the electronic device through the above-mentioned pads 221, thereby realizing the electronic device to collect the user's input sound.
[0054] Furthermore, the pickup device 200 also includes a first dustproof component 26a and a second dustproof component 26b, wherein the first dustproof component 26a is disposed in the first conduit 25a and adjacent to the first sound inlet 222a, and the second dustproof component 26b is disposed in the second conduit 25b and adjacent to the second sound inlet 222b. The first dustproof component 26a and the second dustproof component 26b are used to prevent external dust or moisture from entering the pickup device 200.
[0055] like Figure 5 and Figure 6 As shown, Figure 5 for Figure 4 A cross-sectional structural diagram of the first sound inlet. Figure 6 for Figure 4 A side view of the first dustproof component 26a. The first duct 25a is correspondingly arranged with the first sound inlet 222a. One end of the first duct 25a is open and covers the first sound inlet 222a. The first dustproof component 26a is arranged on the side of the first sound inlet 222a adjacent to the first duct 25a, and is used to filter dust, water vapor, etc., and also to reduce the airflow speed entering the first sound inlet 222a.
[0056] Specifically, the first dustproof component 26a includes a first structural layer 261, a second structural layer 262, and an adhesive layer 263 stacked together. The adhesive layer 263 is disposed between the first structural layer 261 and the second structural layer 262 for bonding and fixing the first structural layer 261 and the second structural layer 262. For example, the first structural layer 261 can be a dustproof mesh, and the second structural layer 262 can be windproof cotton. The density of the pores on the windproof cotton can be 20-200 ppi, and the thickness can be 0.2-3 mm.
[0057] The pickup device 200 also includes a second buffer 27b, which is stacked on top of the second sound inlet 222b and the second dustproof component 26b. The first buffer 27a is stacked on top of the first dustproof component 26a. Specifically, the first buffer 27a can be disposed on the side of the first dustproof component 26a away from the pickup circuit board 22, and the second buffer 27b can be disposed on the side of the second dustproof component 26b away from the pickup housing 21.
[0058] like Figure 7 and Figure 8 As shown, Figure 7 for Figure 4 A schematic diagram of the planar structure of the first buffer component 27a. Figure 8 This is a schematic diagram of the planar structure of the first buffer 27a in another embodiment. The second buffer 27b has the same structure as the first buffer 27a. Both the first and second buffers are disc-shaped, with at least one through-hole for airflow. The opening of the first buffer 27a is directly opposite the first sound inlet 222a, meaning the first buffer 27a is parallel to the first sound inlet 222a. The opening of the second buffer 27b is directly opposite the second sound inlet 222b, meaning the second buffer 27b is parallel to the second sound inlet 222b. In this embodiment, the first buffer 27a has four circular through-holes. However, other shapes and numbers can be used depending on specific needs. For example, the through-holes can be configured as... Figure 8 The shape of the object is not limited in this application.
[0059] The area of the through-hole on the first buffer 27a is between 1 / 20 and 1 / 9 of the total area of the first buffer. By setting the area of the through-hole within this range, the sound quality can be maintained while reducing the airflow speed.
[0060] The first buffer 27a and the second buffer 27b are used to prevent airflow from passing directly through the sound inlet, thereby slowing down the airflow speed at the first sound inlet 222a and the second sound inlet 222b, which also slows down the airflow speed transmitted to the diaphragm 24, thus preventing the diaphragm 24 from being damaged by the impact of strong airflow due to the double-hole design.
[0061] In other embodiments, only the first dustproof component 26a or the first buffer component 27a may be provided in the first sound inlet 222a, and the second dustproof component 26b or the second buffer component 27b may be provided in the second sound inlet 222b. That is, either the first dustproof component 26a or the first buffer component 27a may be provided, or both may be provided in the first sound inlet 222a. Similarly, either the second dustproof component 26b or the second buffer component 27b may be provided, or both may be provided in the second sound inlet 222b. The configuration can be made according to specific needs, and this application does not impose any restrictions on this.
[0062] It should be noted that, in this embodiment, the microphone 200 is generally mounted on the circuit board 300 of the electronic device using SMT (Surface Mount Technology). This electronic device generally includes mobile phones, tablets, laptops, handheld game consoles, in-vehicle computers, smart wearable devices (including Bluetooth headsets), and smart home appliances. The circuit board 300 can be a conventional printed circuit board (PCB) substrate. It should be noted that, as used herein, the term "circuit board" refers to any dielectric substrate, PCB, ceramic substrate, or other circuit-carrying structure used to carry signal circuits and electronic components within an electronic device.
[0063] The pickup device 200 converts sound into electrical signals through an acoustic cavity. The acoustic cavity can affect the audio performance of the pickup device 200, and thus the audio performance of the audio system including the pickup device 200. For example, the acoustic cavity can affect the frequency response, speech intelligibility, background noise suppression, efficiency, signal-to-noise ratio, and sound quality of the audio system.
[0064] Understandably, when an internal microphone (e.g., a microphone mounted inside an electronic device via SMT) is subjected to EMI (Electro-Magnetic Interference) from internal or external sources (such as power amplifiers, RF subsystems, antennas, digital circuits, clock circuits, etc.), it may affect the audio system including the microphone. Therefore, in this embodiment, the housing 21 is generally made of metal and is fixedly connected to the pickup circuit board 22 to form an acoustic cavity. The housing 21 is electrically connected to a portion of the pads 221 so that, after the pickup device 200 is assembled into the electronic device, these pads 221 are used to connect to the ground of the circuit board 300 on the electronic device, grounding the housing 21 to prevent RF energy emitted by the antenna from interfering with the internal circuitry of the pickup device 200.
[0065] It should be noted that the processing module 23 can be an ASIC chip (Application Specific Integrated Circuit). The output pins and ground pins of the processing module 23 are connected to the pickup circuit board 22 through wires, solder joints, etc.
[0066] Please see Figure 9 , Figure 9 This is a cross-sectional structural diagram of a pickup device provided in the second embodiment of this application.
[0067] like Figure 9As shown, the sound pickup device 200 includes a pickup housing 21, a pickup circuit board 22, a processing module 23, and a diaphragm 24. The pickup housing 21 and the pickup circuit board 22 form a receiving cavity 201, within which the processing module 23 and the diaphragm 24 are disposed. The diaphragm 24 is electrically connected to the processing module 23. The diaphragm 24 converts the received sound into an electrical signal and transmits it to the processing module 23. The processing module 23 processes the received electrical signal and transmits it to the circuit board 300 of the electronic device, thus completing the acquisition and transmission of the sound signal. Additionally, control signals from the electronic device can also be transmitted to the diaphragm 24 via the processing module 23, enabling the diaphragm 24 to perform corresponding functions.
[0068] Furthermore, the pickup device 200 also includes a first sound inlet 222a and a second sound inlet 222b. The first sound inlet 222a is located on the pickup circuit board 22, and the diaphragm 24 is positioned opposite to and covers the first sound inlet 222a. The second sound inlet 222b is located on the pickup housing 21. The pickup housing 21 includes a first housing 211 and a second housing 212. The plane of the first housing 211 is parallel to the pickup circuit board 22, and the plane of the second housing 212 is perpendicular to the pickup circuit board 22. The second sound inlet 222b is located on the second housing 212, that is, the second sound inlet 222b is located on one side of the pickup housing 21 perpendicular to the pickup circuit board 22.
[0069] The pickup device 200 also includes a first conduit 25a and a second conduit 25b. The first conduit 25a is configured to correspond to a first sound inlet 222a, and the second conduit 25b is configured to correspond to a second sound inlet 222b. One end of the first conduit 25a faces the first sound inlet 222a, and one end of the second conduit 25b faces the second sound inlet 222b. External sound signals are transmitted through the first conduit 25a to the first sound inlet 222a and through the second conduit 25b to the second sound inlet 222b. The first conduit 25a and the second conduit 25b constitute the pickup channel 105. Figure 2 ).
[0070] In this embodiment, taking a Micro-Electro-Mechanical-System (MEMS) microphone as an example, external sound signals can be transmitted to the back cavity of the MEMS device diaphragm 24 via the pickup channels 105 (first channel 25a, second channel 25b) to drive the diaphragm on the front of the MEMS device to vibrate and generate an electrical signal corresponding to the sound signal. The MEMS device is connected to the processing module 23 via gold wires, realizing signal communication between the MEMS device and the processing module 23, so that the processing module 23 receives the above-mentioned electrical signal and outputs the electrical signal to the circuit board 300 of the electronic device through the above-mentioned pads 221, thereby realizing the electronic device to collect the user's input sound.
[0071] The pickup device 200 also includes a first dustproof component 26a and a second dustproof component 26b. The first dustproof component 26a is disposed in the first conduit 25a and adjacent to the first sound inlet 222a, and the second dustproof component 26b is disposed in the second conduit 25b and adjacent to the second sound inlet 222b. The first dustproof component 26a and the second dustproof component 26b are used to prevent external dust or moisture from entering the pickup device 200.
[0072] The pickup device 200 may also include a first buffer 27a and a second buffer 27b. The first buffer 27a is positioned opposite the first sound inlet 222a, and the second buffer 27b is positioned opposite the second sound inlet 222b. The first buffer 27a is positioned on the side of the first dustproof component 26a away from the pickup circuit board 22, and the second buffer 27b is positioned on the side of the second dustproof component 26b away from the pickup housing 21.
[0073] like Figure 10 As shown, Figure 10 for Figure 9 A cross-sectional structural diagram of the first and second sound inlets is shown. The sound signal enters from the first sound inlet 222a and is transmitted through the second sound inlet 222b. By setting the first buffer 27a and the second buffer 27b at the first sound inlet 222a and the second sound inlet 222b, the airflow speed can be reduced. The second buffer 27b is set at the second sound inlet 222b, that is, between the second sound inlet 222b and the electronic device casing.
[0074] Please see Figure 11 , Figure 11 This is a cross-sectional structural diagram of a pickup device provided in the third embodiment of this application.
[0075] like Figure 11As shown, the sound pickup device 200 includes a pickup housing 21, a pickup circuit board 22, a processing module 23, and a diaphragm 24. The pickup housing 21 and the pickup circuit board 22 form a receiving cavity 201, within which the processing module 23 and the diaphragm 24 are disposed. The diaphragm 24 is electrically connected to the processing module 23. The diaphragm 24 converts the received sound into an electrical signal and transmits it to the processing module 23. The processing module 23 processes the received electrical signal and transmits it to the circuit board 300 of the electronic device, thus completing the acquisition and transmission of the sound signal. Additionally, control signals from the electronic device can also be transmitted to the diaphragm 24 via the processing module 23, enabling the diaphragm 24 to perform corresponding functions.
[0076] Furthermore, the pickup device 200 also includes a first sound inlet 222a and a second sound inlet 222b, wherein the first sound inlet 222a and the second sound inlet 222b are disposed on the pickup circuit board 22 at a predetermined distance. A diaphragm 24 is positioned opposite and covering the first sound inlet 222a. The diaphragm 24 is used for the built-in diaphragm to collect external sound signals.
[0077] The pickup device 200 also includes a first conduit 25a and a second conduit 25b, wherein the first conduit 25a is configured to correspond to the first sound inlet 222a, and the second conduit 25b is configured to correspond to the second sound inlet 222b. External sound signals are transmitted through the first conduit 25a to the first sound inlet 222a and through the second conduit 25b to the second sound inlet 222b. The first conduit 25a and the second conduit 25b constitute the pickup channel 105. Figure 2 ).
[0078] In an exemplary embodiment, the first sound inlet 222a and the second sound inlet 222b can also be connected to the same pipe, that is, the first sound inlet 222a and the second sound inlet 222b both receive sound signals through the same pipe.
[0079] In this embodiment, taking a MEMS (Micro-Electro-Mechanical-System) microphone as an example, the external sound signal can be transmitted to the back cavity of the MEMS device diaphragm 24 through the pickup channel 105 to drive the diaphragm on the front of the MEMS device to vibrate and generate an electrical signal corresponding to the sound signal. The MEMS device is connected to the processing module 23 through gold wires, realizing signal communication between the MEMS device and the processing module 23, so that the processing module 23 receives the above-mentioned electrical signal and outputs the electrical signal to the circuit board 300 of the electronic device through the above-mentioned pad 221, thereby realizing the electronic device to collect the user's input sound.
[0080] Furthermore, the pickup device 200 also includes a first dustproof component 26a and a second dustproof component 26b. The first dustproof component 26a and the second dustproof component 26b are respectively disposed corresponding to the first sound inlet 222a and the second sound inlet 222b. The first dustproof component 26a is disposed on the side of the first sound inlet 222a away from the pickup housing 21, and the second dustproof component 26b is disposed on the side of the second sound inlet 222b away from the pickup housing 21.
[0081] The pickup device 200 also includes a first buffer 27a and a second buffer 27b. The first buffer 27a is positioned opposite the first sound inlet 222a, and the second buffer 27b is positioned opposite the second sound inlet 222b. The first buffer 27a is located on the side of the first dustproof member 26a away from the pickup circuit board 22, and the second buffer 27b is located on the side of the second dustproof member 26b away from the pickup circuit board 22. For example, the first buffer 27a and the second buffer 27b have a disc-shaped structure, and at least one opening is provided on the disc for airflow.
[0082] The structures of the first dustproof component 26a, the second dustproof component 26b, the first buffer component 27a, and the second buffer component 27b are the same as those in the first embodiment, and will not be described in detail here.
[0083] This application embodiment improves the far-field directional recording effect by setting two sound inlets, and sets a buffer layer at the sound inlets to effectively slow down the flow rate at the diaphragm. While ensuring the sound signal strength, it can effectively prevent the MEMS diaphragm from being damaged by strong airflow impact caused by the double-hole design.
[0084] The above-disclosed embodiments are merely some of the embodiments of this application, and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments, and equivalent changes made in accordance with the claims of this application, still fall within the scope of this application.
Claims
1. A pickup device, characterized in that The pickup device comprises a pickup shell, a pickup circuit board, a processing module and a diaphragm, and the pickup shell and the pickup circuit board form a receiving cavity. The pickup circuit board comprises a first sound inlet, the first sound inlet corresponds to a pickup channel for transmitting a sound signal, the diaphragm is arranged in the receiving cavity and faces the first sound inlet, the diaphragm is used to generate vibration according to the sound signal to generate a corresponding electric signal and transmit the electric signal to the processing module, and the processing module is used to process the electric signal to complete the collection of the sound signal. The pickup device further comprises a first buffer, the first buffer is arranged on one side of the first sound inlet adjacent to the pickup channel, and is used to reduce the airflow speed when the first sound inlet receives the sound signal from the pickup channel.
2. The pickup device of claim 1, wherein The pickup device further comprises a second sound inlet and a second buffer, the second sound inlet is arranged on the pickup circuit board or the pickup shell, and the second buffer is arranged on the second sound inlet and located outside the receiving cavity, and is used to reduce the airflow speed at the second sound inlet.
3. The pickup device as described in claim 2, characterized in that, The second sound inlet and the first sound inlet are arranged side by side on the pickup circuit board at a preset distance along a first direction, the second sound inlet is located on a side of the processing module away from the diaphragm, and the first direction is parallel to the plane on which the pickup circuit board is arranged.
4. The pickup device of claim 2, wherein The pickup shell comprises a first shell and a second shell, the plane on which the first shell is arranged is parallel to the plane on which the pickup circuit board is arranged, the plane on which the second shell is arranged is perpendicular to the pickup circuit board, the second sound inlet is arranged on the first shell, and the first sound inlet and the second sound inlet are arranged at a preset distance along the first direction.
5. The pickup device of claim 2, wherein The pickup shell comprises a first shell and a second shell, the plane on which the first shell is arranged is parallel to the plane on which the pickup circuit board is arranged, the plane on which the second shell is arranged is perpendicular to the pickup circuit board, the second sound inlet is arranged on the second shell, and the second sound inlet and the diaphragm do not coincide in the orthogonal projection along the first direction.
6. A device as claimed in any one of claims 2 to 5, wherein the device is a pick-up device for a stringed musical instrument. The pickup device further comprises a first pipe and a second pipe, a pipe opening of one end of the first pipe is arranged opposite to and covers the first sound inlet, a pipe opening of one end of the second pipe is arranged opposite to and covers the second sound inlet, the sound signal is transmitted to the first sound inlet through the first pipe, and the sound signal is transmitted to the second sound inlet through the second pipe.
7. The pickup device as described in claim 6, characterized in that, The pickup device further comprises a first dustproof member and a second dustproof member, the first dustproof member is arranged in the first pipe and covers the first sound inlet, and the second dustproof member is arranged in the second pipe and covers the second sound inlet.
8. The pickup device of claim 7, wherein The first buffer is arranged in the first pipe and stacked with the first dustproof member, and the second buffer is arranged in the second pipe and stacked with the second dustproof member.
9. The pickup device of claim 8, wherein The first buffer and the second buffer are disc-shaped structures, and at least one through hole is arranged on the first buffer and the second buffer, the gas flow in the first pipeline is transmitted to the first sound inlet through the through hole, the gas flow in the second pipeline is transmitted to the second sound inlet through the through hole, and the area of the through hole accounts for 1 / 20-1 / 9 of the area of the first buffer.
10. An electronic device, comprising: The pickup device comprises a shell assembly, a circuit board and the pickup device according to any one of claims 1-9, the shell assembly comprises a middle frame and a back cover, the middle frame and the back cover surround to form a containing space, the pickup device and the circuit board are arranged in the containing space, the pickup device is arranged on the circuit board and electrically connected with the circuit board, the shell assembly is provided with a sound inlet groove, the sound inlet groove is communicated with the containing space, external sound signals are transmitted to the pickup device through the sound inlet groove, and the pickup device converts the received sound signals into electric signals and transmits the electric signals.