High-heat-dissipation motor driving board
By linking the main body and the heat dissipation module, and combining the heat dissipation plate, heat conduction block and cooling fan, the problem of insufficient heat dissipation of the motor drive board is solved, achieving efficient heat dissipation and structural stability, and preventing equipment damage.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-08
- Publication Date
- 2026-04-14
AI Technical Summary
Existing motor drive boards have insufficient heat dissipation when handling high power current and voltage, leading to performance degradation or damage to electronic components, which affects the normal operation of the equipment.
The main body and heat dissipation module are designed in conjunction, combining heat dissipation plate, heat conduction block and cooling fan, connected by bolts and supported by mounting bracket to achieve efficient heat dissipation, and shock absorption by spring.
The heat dissipation effect of the motor drive board has been improved, ensuring structural stability and practicality, and preventing performance degradation or damage caused by heat accumulation.
Smart Images

Figure CN224124429U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of driver board technology, specifically relating to a high heat dissipation motor driver board. Background Technology
[0002] With the continuous development of motor technology, motor drive boards are increasingly widely used in various industrial and civilian equipment. Motor drive boards typically need to handle high-power current and voltage, which generates a significant amount of heat during operation. If this heat cannot be dissipated in time, it may lead to a decline in the performance of the drive board, or even damage to electronic components, affecting the normal operation of the equipment. Therefore, improving the heat dissipation performance of motor drive boards is a pressing technical problem that needs to be solved. Utility Model Content
[0003] The main purpose of this utility model is to provide a high heat dissipation motor drive board, which links the main body and the heat dissipation module to efficiently dissipate heat from the main body. It can also connect to an external circuit board through a mounting bracket. It has the advantages of stable structure, good heat dissipation effect and high practicality.
[0004] To achieve the above objectives, this utility model provides a high-heat-dissipation motor drive board, comprising a main body and a heat dissipation module, wherein the heat dissipation module is mounted on the main body, wherein:
[0005] The main body includes a first nut, a second nut, a third nut, a fourth nut, a mounting bracket, an external circuit board, and several connecting ends. The first nut, the second nut, the third nut, and the fourth nut are respectively fixedly installed at the bottom of the four corners of the main body. The mounting bracket is fixedly installed at the bottom of the main body. The mounting bracket includes an integrally formed first component, a second component, and a third component. The first component and the third component are respectively located at both ends of the second component and are vertically arranged. The first component has a first support plate, and the third component has a second support plate. The second component has an external board slot. The external circuit board is inserted into the external board slot, and the two sides of the external circuit board are respectively located on the first support plate and the second support plate.
[0006] The heat dissipation module includes a heat sink, a heat conduction block, and a cooling fan. The heat sink is provided with a first bolt, a second bolt, a third bolt, and a fourth bolt. The first bolt is installed on the first nut, the second bolt is installed on the second nut, the third bolt is installed on the third nut, and the fourth bolt is installed on the fourth nut. The heat conduction block is fixedly installed on the side of the heat sink close to the main body (to conduct the heat from the main chip to the heat sink). The cooling fan is located on the side of the heat sink away from the heat conduction block.
[0007] As a further preferred embodiment of the above technical solution, the heat sink is provided with a plurality of heat sink fins.
[0008] As a further preferred embodiment of the above technical solution, the first bolt, the second bolt, the third bolt, and the fourth bolt are all fitted with springs (for functions such as shock absorption).
[0009] As a further preferred embodiment of the above technical solution, the main body is provided with a main chip.
[0010] As a further preferred embodiment of the above technical solution, the main chip is located on the side of the heat-conducting block away from the heat sink. Attached Figure Description
[0011] Figure 1 This is a schematic diagram of the structure of this utility model.
[0012] Figure 2 This is a schematic diagram of the structure of this utility model.
[0013] Figure 3 This is a schematic diagram of the structure of this utility model.
[0014] Figure 4 This is a structural schematic diagram of the mounting bracket of this utility model.
[0015] The reference numerals in the accompanying drawings include: 100, main body; 110, first nut; 120, second nut; 130, third nut; 140, fourth nut; 150, mounting bracket; 151, first component; 152, second component; 153, third component; 154, first support plate; 155, second support plate; 156, external board slot; 160, external circuit board; 170, connecting end; 200, heat dissipation module; 210, heat dissipation plate; 211, first bolt; 212, second bolt; 213, third bolt; 214, fourth bolt; 215, heat sink; 216, spring; 220, heat-conducting block; 230, cooling fan. Detailed Implementation
[0016] The following description is intended to disclose the present invention so that those skilled in the art can implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art. The basic principles of the present invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.
[0017] This utility model discloses a high heat dissipation motor drive board. The specific embodiments of the utility model will be further described below with reference to preferred embodiments.
[0018] In the embodiments of this utility model, those skilled in the art will note that the main chip and other components involved in this utility model can be considered as prior art.
[0019] Preferred embodiment.
[0020] like Figure 1-4 As shown, this utility model provides a high heat dissipation motor drive board, including a main body 100 and a heat dissipation module 200, wherein the heat dissipation module 200 is mounted on the main body 100, wherein:
[0021] The main body 100 includes a first nut 110, a second nut 120, a third nut 130, a fourth nut 140, a mounting bracket 150, an external circuit board 160, and several connecting ends 170. The first nut 110, the second nut 120, the third nut 130, and the fourth nut 140 are respectively fixedly installed at the bottom of the four corners of the main body 110. The mounting bracket 150 is fixedly installed at the bottom of the main body 100, and the mounting bracket 150 includes an integrally formed first component 151, a second component 152, and a third component. 153, the first component 151 and the third component 153 are respectively located at both ends of the second component 152 and are vertically arranged. The first component 151 is provided with a first support plate 154 and the third component 153 is provided with a second support plate 155. The second component 152 is provided with an external board slot 155. The external circuit board 160 is inserted into the external board slot 155 and the two sides of the external circuit board 160 are respectively located on the first support plate 154 and the second support plate 155 (supported by the support plates to improve structural stability).
[0022] The heat dissipation module 200 includes a heat sink 210, a heat-conducting block 220, and a cooling fan 230. The heat sink 210 is provided with a first bolt 211, a second bolt 212, a third bolt 213, and a fourth bolt 214. The first bolt 211 is installed on the first nut 110, the second bolt 212 is installed on the second nut 120, the third bolt 213 is installed on the third nut 130, and the fourth bolt 214 is installed on the fourth nut 140. The heat-conducting block 220 is fixedly installed on the side of the heat sink 210 close to the main body 100 (to conduct the heat from the main chip to the heat sink). The cooling fan 230 is located on the side of the heat sink 210 away from the heat-conducting block 220 (to dissipate heat through the cooling fan).
[0023] Specifically, the heat sink 210 is provided with a plurality of heat sinks 215.
[0024] More specifically, the first bolt 211, the second bolt 212, the third bolt 213 and the fourth bolt 214 are all fitted with springs 216 (for functions such as shock absorption).
[0025] Furthermore, the main body 100 is equipped with a main chip (not shown).
[0026] Furthermore, the main chip is located on the side of the heat-conducting block 220 away from the heat sink 210.
[0027] It is worth mentioning that the technical features such as the main chip involved in this utility model patent application should be regarded as prior art. The specific structure, working principle and possible control method and spatial arrangement of these technical features can be adopted by conventional choices in the field and should not be regarded as the inventive point of this utility model patent. This utility model patent will not be further elaborated in detail.
[0028] For those skilled in the art, modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A high-heat-dissipation motor drive board, characterized in that, It includes a main body and a heat dissipation module, wherein the heat dissipation module is installed in the main body, wherein: The main body includes a first nut, a second nut, a third nut, a fourth nut, a mounting bracket, an external circuit board, and several connecting ends. The first nut, the second nut, the third nut, and the fourth nut are respectively fixedly installed at the bottom of the four corners of the main body. The mounting bracket is fixedly installed at the bottom of the main body. The mounting bracket includes an integrally formed first component, a second component, and a third component. The first component and the third component are respectively located at both ends of the second component and are vertically arranged. The first component has a first support plate, and the third component has a second support plate. The second component has an external board slot. The external circuit board is inserted into the external board slot, and the two sides of the external circuit board are respectively located on the first support plate and the second support plate. The heat dissipation module includes a heat sink, a heat conduction block, and a cooling fan. The heat sink is provided with a first bolt, a second bolt, a third bolt, and a fourth bolt. The first bolt is installed on the first nut, the second bolt is installed on the second nut, the third bolt is installed on the third nut, and the fourth bolt is installed on the fourth nut. The heat conduction block is fixedly installed on the side of the heat sink close to the main body, and the cooling fan is located on the side of the heat sink away from the heat conduction block.
2. The high heat dissipation motor drive board according to claim 1, characterized in that, The heat sink is provided with several heat sink fins.
3. The high heat dissipation motor drive board according to claim 1, characterized in that, The first bolt, the second bolt, the third bolt, and the fourth bolt are all fitted with springs.
4. The high heat dissipation motor drive board according to claim 1, characterized in that, The main body is equipped with a main chip.
5. A high-heat-dissipation motor drive board according to claim 4, characterized in that, The main chip is located on the side of the heat-conducting block away from the heat sink.