Solder paste printing device for SMT production

Abstract

The utility model belongs to the technical field of SMT production, and particularly relates to a solder paste printing device for SMT production, which comprises a printing machine body and an operation port, the operation port is arranged on the side wall of the printing machine body, a conveying belt is inserted into the printing machine body in a penetrating manner, and a telescopic cylinder is mounted on the surface of the top of the printing machine body. The end of a piston rod of the telescopic air cylinder is connected with a motor mounting frame, a driving motor is mounted in an inner cavity of the motor mounting frame, the power output end of the driving motor is in transmission connection with a solder paste scraper, a solder paste storage disc is arranged at the bottom of the motor mounting frame, and the solder paste scraper is rotationally arranged in an inner cavity of the solder paste storage disc. The solder paste scraper rotates on the solder paste storage disc, solder paste can quickly penetrate through holes in the printing template to be printed on the surface of a circuit board, the solder paste is printed in a rotating mode through the solder paste scraper all the time, the solder paste arrangement frequency can be reduced, the printing quality of the circuit board is improved, and the printing structure is simplified.

Description

Technical Field

[0001] This utility model relates to the field of SMT production technology, specifically to a solder paste printing device for SMT production. Background Technology

[0002] SMT, or Surface Mount Technology, is a key technology in modern electronics manufacturing and is widely used in the production of electronic products. It significantly improves the density and performance of electronic products by directly mounting components onto the surface of a printed circuit board (PCB).

[0003] The invention patent with publication number CN218920889U discloses a solder paste printing device suitable for SMT assembly lines. By adjusting the telescopic rod connected to the moving mechanism, the printing chamber fixed on the telescopic rod can be controlled and its position moved, ensuring that the solder paste in the printing chamber can move stably and avoiding pollution and waste caused by leakage. This solves the following problems existing in solder paste printing devices: First, during operation, after the solder paste is applied, it needs to wait for a short period of time to cool down. During cooling, insufficient dust prevention can easily cause dust to adhere to the surface of the solder paste, affecting the quality of the produced SMT components. Second, during printing, the solder paste is only on both sides of the brush, which can easily cause solder paste to overflow and be wasted. The high cost of solder paste increases printing costs and is not conducive to resource conservation and green production.

[0004] Existing solder paste printing equipment uses a squeegee to push solder paste back and forth on the surface of the circuit board during printing. Solder paste tends to accumulate at both ends of the printing stencil, requiring frequent cleaning of the solder paste on the printing stencil. In addition, the solder paste printing structure is complex and prone to failure. To solve the above problems, this application proposes a solder paste printing equipment for SMT production. Utility Model Content

[0005] (I) Purpose of the utility model

[0006] To address the technical problems existing in the background art, this utility model proposes a solder paste printing device for SMT production. The solder paste squeegee rotates on the solder paste storage tray, allowing the solder paste to quickly pass through the holes on the printing stencil and be printed onto the surface of the circuit board. The solder paste is always printed by rotating the solder paste squeegee, which can reduce the number of solder paste handling operations, improve the printing quality of the circuit board, and simplify the printing structure, thereby solving the problems mentioned in the background art.

[0007] (II) Technical Solution

[0008] To solve the above-mentioned technical problems, this utility model provides a solder paste printing device for SMT production, including a printing machine body and an operating port. The operating port is opened on the side wall of the printing machine body, and a conveyor belt is inserted through the printing machine body.

[0009] A telescopic cylinder is installed on the top surface of the printing machine body. A motor mounting bracket is connected to the piston rod end of the telescopic cylinder. A drive motor is installed inside the motor mounting bracket. A solder paste scraper is connected to the power output end of the drive motor.

[0010] The motor mounting bracket has a solder paste storage tray at the bottom, and the solder paste scraper is rotatably located inside the solder paste storage tray.

[0011] Preferably, the surface of the conveyor belt is provided with positioning grooves for limiting the circuit board, and the positioning grooves are distributed at equal intervals.

[0012] Preferably, the outer wall of the motor mounting bracket is provided with a connecting bracket, and the bottom of the connecting bracket is connected to the solder paste storage tray.

[0013] Preferably, the bottom of the solder paste storage tray has a through-hole for printing, and the inner wall of the solder paste storage tray is threaded with a retaining ring.

[0014] Preferably, the outer wall of the motor mounting bracket has a heat dissipation vent for cooling the drive motor.

[0015] Preferably, rubber strips are movably installed at both ends of the solder paste scraper, and the rubber strips abut against the inner wall of the solder paste storage tray.

[0016] Preferably, the solder paste scraper has splicing grooves at both ends, and the rubber strip has an integrally formed splicing seat, which is inserted into the splicing groove through the splicing seat.

[0017] The above-mentioned technical solution of this utility model has the following beneficial technical effects:

[0018] 1. In this utility model, a drive motor drives a solder paste scraper, which rotates on a solder paste storage tray, allowing the solder paste to quickly pass through the holes in the printing stencil and be printed onto the surface of the circuit board. At the same time, rubber strips at both ends of the solder paste scraper can scrape off the solder paste adhering to the inner wall of the solder paste storage tray. The solder paste is always printed by rotating the solder paste scraper, which can reduce the number of solder paste preparations, improve the printing quality of the circuit board, and simplify the printing structure.

[0019] 2. In this utility model, the printing template is installed at the bottom of the inner cavity of the solder paste storage tray, and the fixing ring is threadedly connected to the solder paste storage tray. The fixing ring presses on the edge of the printing template to fix the printing template, which can facilitate the quick replacement of the printing template. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of a solder paste printing device for SMT production according to the present invention.

[0021] Figure 2 This is a cross-sectional structural diagram of a solder paste printing device for SMT production according to the present invention;

[0022] Figure 3 This is a schematic diagram of the printing lifting and scraper drive structure of a solder paste printing device for SMT production according to the present invention.

[0023] Figure 4 This is a schematic diagram of the solder paste storage tray structure of a solder paste printing device for SMT production according to the present invention;

[0024] Figure 5 This is a schematic diagram of the solder paste scraper structure of a solder paste printing device for SMT production according to the present invention.

[0025] Figure label:

[0026] 1. Printing machine body; 2. Operating port; 3. Conveyor belt; 4. Positioning groove; 5. Telescopic cylinder; 6. Motor mounting bracket; 7. Drive motor; 8. Solder paste scraper; 9. Solder paste storage tray; 10. Printing through hole; 11. Fixing ring; 12. Connecting bracket; 13. Rubber strip; 14. Splicing seat; 15. Splicing groove. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this utility model. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of this utility model.

[0028] like Figure 1-5 As shown, the present invention proposes a solder paste printing device for SMT production, including a printing machine body 1 and an operation port 2. The operation port 2 is opened on the side wall of the printing machine body 1, and a conveyor belt 3 is inserted through the printing machine body 1.

[0029] A telescopic cylinder 5 is installed on the top surface of the printing machine body 1. A motor mounting bracket 6 is connected to the piston rod end of the telescopic cylinder 5. A drive motor 7 is installed in the inner cavity of the motor mounting bracket 6. A solder paste scraper 8 is connected to the power output end of the drive motor 7.

[0030] The motor mounting bracket 6 has a solder paste storage tray 9 at its bottom, and the solder paste scraper 8 is rotatably disposed in the inner cavity of the solder paste storage tray 9.

[0031] It should be noted that the solder paste is added into the solder paste storage tray 9, and the circuit board is fixed to the conveyor belt 3 by the positioning groove 4. The conveyor belt 3 transports the circuit board at a fixed distance, allowing the circuit board to move to the bottom of the solder paste storage tray 9 and stop rotating. The telescopic cylinder 5 pushes the solder paste storage tray 9 down, and the lower surface of the solder paste storage tray 9 is placed against the surface of the circuit board. The drive motor 7 drives the solder paste scraper 8. The solder paste scraper 8 rotates in the solder paste storage tray 9, which allows the solder paste to quickly pass through the holes on the printing stencil and be printed on the surface of the circuit board. At the same time, the ends of the solder paste scraper 8 can be scraped off by the rubber strips 13 to remove the solder paste adhering to the inner wall of the solder paste storage tray 9. The solder paste is always printed by the solder paste scraper 8 in a rotating manner, which can reduce the number of solder paste handling times, improve the printing quality of the circuit board, and simplify the printing structure.

[0032] In this embodiment, as Figure 1 As shown, the surface of the conveyor belt 3 is provided with positioning grooves 4 for limiting the circuit board, and the positioning grooves 4 are distributed at equal intervals.

[0033] It should be noted that the positioning slot 4 can facilitate the positioning of the circuit board.

[0034] In this embodiment, as Figure 3 As shown, the outer wall of the motor mounting bracket 6 is provided with a connecting bracket 12, and the bottom of the connecting bracket 12 is connected to the solder paste storage tray 9.

[0035] It should be noted that the connecting bracket 12 can fix the solder paste storage tray 9 under the motor mounting bracket 6.

[0036] In this embodiment, as Figure 4 As shown, a printed through hole 10 is provided at the bottom of the solder paste storage tray 9, and a retaining ring 11 is threadedly connected to the inner wall of the solder paste storage tray 9.

[0037] It should be noted that the retaining ring 11 can easily fix the printing template.

[0038] In this embodiment, as Figure 3 As shown, the outer wall of the motor mounting bracket 6 has a heat dissipation vent for cooling the drive motor 7.

[0039] It should be noted that the heat dissipation vents are beneficial for the heat dissipation of the drive motor 7.

[0040] In this embodiment, as Figure 5 As shown, rubber strips 13 are movably installed at both ends of the solder paste scraper 8. The rubber strips 13 abut against the inner wall of the solder paste storage tray 9. Splicing grooves 15 are provided at both ends of the solder paste scraper 8. A splicing seat 14 is integrally formed on the rubber strip 13. The rubber strip 13 is inserted into the splicing groove 15 through the splicing seat 14.

[0041] It should be noted that the solder paste scraper 8 can scrape off the solder paste adhering to the inner wall of the solder paste storage tray 9 through the rubber strips 13 at both ends. The rubber strips 13 can be easily replaced by inserting the splicing base 14 into the splicing groove 15.

[0042] The working principle and usage process of this utility model are as follows: Solder paste is added into the solder paste storage tray 9. The circuit board is fixed on the conveyor belt 3 through the positioning groove 4. The conveyor belt 3 transports the circuit board at a fixed distance, allowing the circuit board to move to the bottom of the solder paste storage tray 9 and stop rotating. The telescopic cylinder 5 pushes the solder paste storage tray 9 down, and the lower surface of the solder paste storage tray 9 is attached to the surface of the circuit board. The drive motor 7 drives the solder paste scraper 8. The solder paste scraper 8 rotates in the solder paste storage tray 9, allowing the solder paste to quickly pass through the holes on the printing template and be printed on the surface of the circuit board. At the same time, the ends of the solder paste scraper 8 can be scraped off the solder paste adhering to the inner wall of the solder paste storage tray 9 through the rubber strips 13. The solder paste is always printed by the solder paste scraper 8 in a rotating manner, which can reduce the number of times the solder paste is cleaned, improve the printing quality of the circuit board, and simplify the printing structure. The printing template is installed at the bottom of the inner cavity of the solder paste storage tray 9. The fixing ring 11 is threadedly connected to the solder paste storage tray 9. The fixing ring 11 presses against the edge of the printing template to fix the printing template, which can facilitate the quick replacement of the printing template.

[0043] It should be understood that the above-described specific embodiments of this utility model are merely illustrative or explanatory of the principles of this utility model and do not constitute a limitation thereof. Therefore, any modifications, equivalent substitutions, improvements, etc., made without departing from the spirit and scope of this utility model should be included within the protection scope of this utility model. Furthermore, the appended claims are intended to cover all variations and modifications falling within the scope and boundaries of the appended claims or their equivalents.

Claims

1. A solder paste printing apparatus for SMT production, comprising a printing body (1) and an operating port (2), wherein the operating port (2) is formed on the side wall of the printing body (1), characterized in that, The printing press body (1) is connected to a conveyor belt (3); The top surface of the printing machine body (1) is equipped with a telescopic cylinder (5), the piston rod end of the telescopic cylinder (5) is connected to a motor mounting bracket (6), the inner cavity of the motor mounting bracket (6) is equipped with a drive motor (7), and the power output end of the drive motor (7) is connected to a solder paste scraper (8). The motor mounting bracket (6) has a solder paste storage tray (9) at its bottom, and the solder paste scraper (8) is rotatably located inside the solder paste storage tray (9).

2. The solder paste printing apparatus for SMT production according to claim 1, characterized in that, The surface of the conveyor belt (3) is provided with positioning grooves (4) for limiting the circuit board, and the positioning grooves (4) are distributed at equal intervals.

3. The solder paste printing apparatus for SMT production according to claim 2, characterized in that, The outer wall of the motor mounting bracket (6) is provided with a connecting bracket (12), and the bottom of the connecting bracket (12) is connected to the solder paste storage tray (9).

4. The solder paste printing apparatus for SMT production according to claim 3, characterized in that, The solder paste storage tray (9) has a through-hole (10) at the bottom and a retaining ring (11) is threaded onto the inner wall of the solder paste storage tray (9).

5. A solder paste printing apparatus for SMT production according to claim 4, characterized in that, The outer wall of the motor mounting bracket (6) is provided with a heat dissipation port for cooling the drive motor (7).

6. A solder paste printing apparatus for SMT production according to claim 5, characterized in that, Rubber strips (13) are movably installed at both ends of the solder paste scraper (8), and the rubber strips (13) abut against the inner wall of the solder paste storage tray (9).

7. A solder paste printing apparatus for SMT production according to claim 6, characterized in that, The solder paste scraper (8) has splicing grooves (15) at both ends, and the rubber strip (13) has a splicing seat (14) integrally formed on it. The rubber strip (13) is inserted into the splicing groove (15) through the splicing seat (14).

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