Solder paste printing device for SMT production
By rotating a solder paste scraper within the solder paste storage tray and scraping off adhering solder paste with a rubber strip, the problems of insufficient solder paste cooling and overflow waste are solved, achieving a highly efficient solder paste printing effect, simplifying the printing structure, and improving the quality and production efficiency of SMT assembly.
CN224124487UActive Publication Date: 2026-04-14FUZHOU CHUANGGAO ELECTRONIC TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202520814348.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-27
- Publication Date
- 2026-04-14
- Estimated Expiration
- 2035-04-27
AI Technical Summary
Technical Problem
Existing solder paste printing equipment suffers from problems such as insufficient solder paste cooling leading to dust adhesion, solder paste overflow and waste, and complex printing structures that are prone to failure, affecting SMT placement quality and cost.
Method used
A solder paste squeegee rotates within a solder paste storage tray, and printing is performed by rotation. A rubber strip scrapes off any adhering solder paste, simplifying the printing structure and improving printing quality.
Benefits of technology
Reduce the number of solder paste finishing steps, improve printing quality, simplify printing structure, reduce costs and increase production efficiency.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model belongs to the technical field of SMT production, and particularly relates to a solder paste printing device for SMT production, which comprises a printing machine body and an operation port, the operation port is arranged on the side wall of the printing machine body, a conveying belt is inserted into the printing machine body in a penetrating manner, and a telescopic cylinder is mounted on the surface of the top of the printing machine body. The end of a piston rod of the telescopic air cylinder is connected with a motor mounting frame, a driving motor is mounted in an inner cavity of the motor mounting frame, the power output end of the driving motor is in transmission connection with a solder paste scraper, a solder paste storage disc is arranged at the bottom of the motor mounting frame, and the solder paste scraper is rotationally arranged in an inner cavity of the solder paste storage disc. The solder paste scraper rotates on the solder paste storage disc, solder paste can quickly penetrate through holes in the printing template to be printed on the surface of a circuit board, the solder paste is printed in a rotating mode through the solder paste scraper all the time, the solder paste arrangement frequency can be reduced, the printing quality of the circuit board is improved, and the printing structure is simplified.
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